CN214279811U - High-efficiency water-cooling radiating resonant capacitor - Google Patents
High-efficiency water-cooling radiating resonant capacitor Download PDFInfo
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- CN214279811U CN214279811U CN202023325250.2U CN202023325250U CN214279811U CN 214279811 U CN214279811 U CN 214279811U CN 202023325250 U CN202023325250 U CN 202023325250U CN 214279811 U CN214279811 U CN 214279811U
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Abstract
The utility model relates to the technical field of capacitors, and discloses a resonance capacitor with high-efficiency water-cooling heat dissipation, which comprises a capacitor core, a first cover plate, a second cover plate and a sealing cover plate; the sealing cover plate is connected with the first cover plate to form a cooling part, a water cooling space is formed between the sealing cover plate and the first cover plate, and a water inlet through which water enters the water cooling space and a water outlet through which water is discharged out of the water cooling space are formed in the cooling part; one end of the capacitor core is in butt joint with the cooling piece, and the other end of the capacitor core is in butt joint with the second cover plate. The utility model discloses in, form the water-cooling space through closing cap board and first apron for the water-cooling space is integrative with resonance capacitor, does not need additionally to increase water cooling plant, and convenience of customers uses the user not need to remove to dispose suitable cooling device from the action resonance capacitor.
Description
Technical Field
The utility model discloses a technical field of condenser particularly, relates to high-efficient water-cooling radiating resonance capacitor.
Background
The resonant capacitor is an electronic component with a wide application range, is an important power device in high-frequency induction heating equipment, and is matched with other electronic components in a circuit to generate resonant current to drive a heating device to heat. In the working process of the resonant capacitor, the frequency is very high, and the heat productivity is very large. The quality and operating life of the resonant capacitor often directly determine the reliability and service life of the induction heating device. The resonant capacitor has a large amount of heat generation due to a large current and a high frequency in the working process. If measures are not taken in time to take away heat, once heat accumulation is serious in the working process, the temperature of the capacitor is excessively high, and the service life of the capacitor can be seriously shortened.
In the prior art, often come for the resonance capacitor heat dissipation through external water cooling plant, water cooling plant is usually through arranging serpentine pipe, takes away the heat by the water in the serpentine pipe. However, the cooling effect of the water flow in the serpentine pipeline is difficult to be fully exerted, and only a small amount of water can participate in the heat dissipation and cooling of the resonant capacitor in some parts, so that the overall cooling effect is poor.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high-efficient water-cooling's resonance capacitor aims at solving prior art, needs external water cooling plant to carry out radiating problem to resonance capacitor.
The utility model is realized in such a way that the high-efficiency water-cooling resonance capacitor comprises a capacitor core, a first cover plate, a second cover plate and a sealing cover plate;
the sealing cover plate is connected with the first cover plate to form a cooling part, a water cooling space is formed between the sealing cover plate and the first cover plate, and a water inlet through which water enters the water cooling space and a water outlet through which water is discharged out of the water cooling space are formed in the cooling part;
one end of the capacitor core is in butt joint with the cooling piece, and the other end of the capacitor core is in butt joint with the second cover plate.
And the other end of the capacitor core is butted with the other cooling piece.
Furthermore, a water inlet buffer structure and a water discharge buffer structure are arranged in the water cooling space, the water inlet buffer structure is communicated with the water inlet, the water discharge buffer structure is communicated with the water outlet, and the water inlet buffer structure is communicated with the water discharge buffer structure.
Furthermore, the water inlet buffer structure is an arc-shaped groove, the water discharge buffer structure is an annular groove, and the arc-shaped groove and the annular groove are both arranged on the sealing cover plate.
Furthermore, a peripheral groove is also formed in the sealing cover plate, and the arc-shaped groove is communicated with the annular groove through the peripheral groove; the depth of the peripheral groove is smaller than that of the arc-shaped groove, and the depth of the peripheral groove is smaller than that of the annular groove.
Further, the arc recess includes first end and second end, first end with the water inlet intercommunication, the second end is kept away from the water inlet, the degree of depth of second end is greater than the degree of depth of first end.
Furthermore, the cover sealing plate is further provided with a first sealing groove, the first sealing groove surrounds the water cooling space, and a sealing ring is arranged in the first sealing groove, so that the water cooling space is a sealed space.
Furthermore, the capacitor further comprises a through hole which penetrates through the second cover plate, the capacitor core, the sealing cover plate and the first cover plate.
Furthermore, the middle position of the cover sealing plate is provided with a double-layer flange, the double-layer flange comprises an inner-layer flange and an outer-layer flange, the through hole is provided in the middle of the inner-layer flange, a third sealing groove is formed between the inner-layer flange and the outer-layer flange, and another sealing ring is arranged in the third sealing groove, so that the water cooling space keeps sealed.
Further, the first cover plate, the second cover plate and the cover sealing plate are all made of copper, copper alloy or aluminum alloy materials.
Compared with the prior art, the utility model provides a high-efficient water-cooling's resonance capacitor forms the water-cooling space through closing cap board and first apron for the water-cooling space is integrative with resonance capacitor, does not need additionally to increase water cooling plant, and convenience of customers uses, and the user does not need to remove to dispose suitable cooling device from the action resonance capacitor.
Drawings
Fig. 1 is a schematic perspective view of a resonant capacitor with high efficiency water cooling provided by the present invention;
fig. 2 is a schematic perspective view of a cover plate of the resonant capacitor with high efficiency water cooling.
Description of reference numerals:
100-capacitor core;
210-a first cover plate, 220-a second cover plate, 221-a mounting hole;
300-sealing plate, 310-water inlet, 311-water inlet joint; 320-water outlet, 321-water outlet joint;
330-arc groove, 331-first end, 332-second end;
340-annular groove, 341-first side, 342-second side;
350-peripheral groove, 351-upper peripheral groove, 352-lower peripheral groove;
360-a first seal groove;
370-third seal groove, 371-outer flange, 372-inner flange;
380-fixing holes;
400-through hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The following describes the implementation of the present invention in detail with reference to specific embodiments.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present invention, it should be understood that if there are the terms "upper", "lower", "left", "right", etc. indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of the description, but it is not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore the terms describing the positional relationship in the drawings are only for illustrative purposes and are not to be construed as limitations of the present patent, and those skilled in the art can understand the specific meanings of the terms according to specific situations.
Referring to fig. 1-2, the preferred embodiment of the present invention is shown.
The high-efficiency water-cooling radiating resonant capacitor comprises a capacitor core 100, a first cover plate 210, a second cover plate 220 and a cover plate 300;
the cover plate 300 is connected with the first cover plate 210 to form a cooling part, a water cooling space is formed between the cover plate 300 and the first cover plate 210, and the cooling part is provided with a water inlet 310 for supplying water into the water cooling space and a water outlet 320 for discharging water out of the water cooling space;
one end of the capacitor core 100 is butted against the cooling member, and the other end of the capacitor core 100 is butted against the second cover plate 220.
The high-efficient water-cooling radiating resonant capacitor that this embodiment provided forms the water-cooling space through closing apron 300 and first apron 210 for the water-cooling space is integrative with resonant capacitor, does not need additionally to increase water cooling plant, and convenience of customers uses the user and need not self-act resonant capacitor and remove the suitable cooling device of configuration.
The cooling element is provided with a water inlet 310 and a water outlet 320, wherein the water inlet 310 and the water outlet 320 can be arranged on the cover plate 300 or the first cover plate 210, preferably on the cover plate 300.
One end of the capacitor core 100 is butted with a water cooling device, and the capacitor core can be divided into:
one end of the capacitor core 100 is butted against the cover plate 300, and the first cover plate 210 is covered on the cover plate 300;
alternatively, one end of the capacitor element 100 is butted against the first cover 210, and the capping plate 300 is covered on the first cover 210.
As an extension, both ends of the capacitor core 100 may be provided with cooling elements: the resonance capacitor includes another cover plate connected with the second cover plate 220 to form another cooling member, and the other end of the capacitor core 100 is butted against the other cooling member. Obviously, the efficiency of water-cooling heat dissipation of the resonant capacitor is improved when the capacitor core 100 is provided with cooling members at both ends.
In this embodiment, the resonant capacitor with high efficiency of water cooling includes a capacitor core 100, a first cover plate 210, a second cover plate 220 and a cover plate 300. The top end of the capacitor core 100 is connected to the cover plate 300, the first cover plate 210 covers the cover plate 300, the bottom end of the capacitor core 100 is connected to the second cover plate 220, and the first cover plate 210 and the second cover plate 220 may be metal plates with good heat conductivity, such as copper plates, copper alloy plates or aluminum alloy plates, etc., wherein the copper plates have good electric conductivity, heat conductivity and machinability, and are good choices. The capacitor core 100 is cylindrical, the cover plates 300 and the second cover plates 220 are respectively arranged at two ends of the cylindrical capacitor core 100 and fully contact with the capacitor core 100, the area of the cover plates 300 and the second cover plates 220 is larger than the area of the end faces of the capacitor core 100, and the capacitor core 100 is clamped in the middle.
In a resonant capacitor with a large current (e.g. a current range of 400-500 a), a mica sheet is stacked between two adjacent copper foils in the resonant capacitor, and the mica sheet is used as the capacitor core 100. In order to overcome the defect that the cost is high because the manufacturing process of the mica sheet involves a complicated procedure of silver baking, a certain amount of copper foils and mica paper can be adopted, the copper foils and the mica paper are alternately laminated to form a layered structure, one mica paper is arranged between two adjacent copper foils, the layered structure can be used as a capacitor core 100, the mica paper does not need to be silver baked, and the cost is greatly reduced.
The first cover plate 210 covers the cover plate 300, and a water cooling space is formed between the cover plate 300 and the first cover plate 210, so that the water cooling space and the resonant capacitor are integrated, and a water cooling device is not required to be additionally arranged, thereby facilitating the use of a user.
The cover 300 is made of a material with good thermal conductivity, such as copper, copper alloy or aluminum alloy.
A water inlet 310 through which water is supplied into the water-cooled space and a water outlet 320 through which water is discharged from the water-cooled space are provided on the capping plate 300; the heat of the resonant capacitor is taken away through water circulation, and the effect of water cooling is achieved. The outer ends of the water inlet 310 and the water outlet 320 are respectively provided with a water inlet joint 311 and a water outlet joint 321, which are convenient for connecting with a common water inlet pipe and a common water outlet pipe.
A water inlet buffer structure is arranged in the water cooling space and is communicated with the water inlet 310. The water inlet buffer structure enables cooling water to be buffered after entering the water cooling space, so that the cooling water fully participates in heat absorption of the resonant capacitor, and the water cooling heat dissipation efficiency of the resonant capacitor is improved.
In particular embodiments, the intake buffering structure includes, but is not limited to, the following structures.
The water inlet buffering structure can be an arc-shaped groove 330 arranged on the cover plate 300, when water enters the water cooling space, the water is firstly blocked and buffered by the arc-shaped groove wall of the arc-shaped groove 330, water flow is guided to the end part of the arc-shaped groove 330, the water flow impacts the groove wall at the end part of the arc-shaped groove 330 and then returns, and in the impact process of the water flow back and forth, the cooling water and the cover plate 300 are subjected to heat transfer fully, and the heat of the resonant capacitor is taken away through the water flow.
The arcuate recess 330 may be provided in the first cover plate 210, but is preferably provided in the cover plate 300, avoiding excessive adjustment of the structure of the resonant capacitor itself to increase the cost.
The arc-shaped groove 330 includes a first end 331 and a second end 332, the first end 331 is communicated with the water inlet 310, the second end 332 is far away from the water inlet 310, the arc-shaped groove 330 may have the same depth, and preferably, the depth of the second end 332 is greater than that of the first end 331. When water enters from the first end 331 of the arc-shaped groove 330 and flows along the arc-shaped groove 330 to the second end 332, the water flow is slower as the second end 332 approaches the second end 332 due to the depth of the second end 332 is larger than that of the first end 331, and the flow of the water returning from the second end 332 is facilitated.
In the process of extending from the first end 331 to the second end 332 of the arc-shaped groove 330, smooth transition can be achieved, or a plurality of steps are arranged at the bottom of the groove for transition, and the arrangement of the steps increases the buffering of cooling water, thereby being beneficial to improving the heat dissipation effect.
The water cooling space is further provided with a water discharge buffering structure, and the water discharge buffering structure is communicated with the water discharge port 320. The water drainage buffer structure enables cooling water to be discharged after being buffered again in the water cooling space, so that the cooling water can sufficiently participate in heat absorption of the resonant capacitor, and the water cooling heat dissipation efficiency of the resonant capacitor is improved.
In particular embodiments, the drainage buffer structure includes, but is not limited to, the following structures.
The drainage buffer structure is an annular groove 340, and the annular groove 340 is disposed on the cover plate 300. The water in the water cooling space is guided by the annular groove 340 to flow around the annular groove 340, which not only increases the contact area between the water and the capping plate 300, but also effectively buffers the cooling water by forming a circular flow by the arrangement of the annular groove 340, so that the cooling water and the capping plate 300 can be more sufficiently heat-transferred to take away the heat of the resonant capacitor through the water flow.
The annular recess 340 may be formed in the first cap plate 210, but is preferably formed in the cap plate 300, thereby avoiding the need to adjust the structure of the resonant capacitor itself to increase the cost.
The annular groove 340 includes a first side 341 and a second side 342, the first side 341 is in communication with the drain port 320, the second side 342 is away from the drain port 320, the annular groove 340 may have the same depth, and preferably, the depth of the second side 342 of the annular groove 340 is greater than the depth of the first side 341. When water enters from the first side 341 of the annular groove 340 and flows along the annular groove 340 toward the second side 342, since the depth of the second side 342 is greater than that of the first side, the water flow is more gradual as the water flow approaches the second side 342, and the water returning from the second side 342 flows out from the water outlet 320 of the first side 341 more easily.
The arc-shaped groove 330 is communicated with the annular groove 340 through a peripheral groove 350, the depth of the peripheral groove 350 is less than that of the arc-shaped groove 330, and the depth of the peripheral groove 350 is less than that of the annular groove 340. The provision of the peripheral groove 350 allows more contact between the water and the first cover plate 210, and more loop and circulation of the water in the cooling space, so that the cooling water is more buffered and is more fully heat-transferred to the first cover plate 210, and the heat of the resonant capacitor is taken away.
For example, after entering from the water inlet 310, the water reaches the first end 331 of the arc-shaped groove 330, and flows toward the second end 332 under the guidance of the arc-shaped groove 330, and meanwhile, part of the water flows into the upper peripheral groove 351; the water is buffered by the influence of the arc groove 330, is buffered again after the second end 332 of the arc groove 330 returns, and then enters the upper peripheral groove 351; the water flows into the first side 341 of the annular groove from the upper peripheral groove 351, one part of the water is discharged from the water discharge port 320, the other part of the water is guided by the annular groove to form a circular flow, and the circular flow is subjected to sufficient heat transfer with the cover plate 300 and is discharged from the water discharge port 320 when returning to the first side 341 through the circular flow; the water flowing out of the upper circumferential groove 351 and returning from the ring groove may partially enter the lower circumferential groove 352 to flow toward the first end 331 of the arc groove 330, forming a large loop, so that the water can be sufficiently heat-exchanged with the capping plate 300, thereby improving the water-cooling heat dissipation efficiency of the resonant capacitor.
Still be equipped with first seal groove 360 on closing cap plate 300, first seal groove 360 is equipped with the sealing washer around the water-cooling space arrangement in the first seal groove 360 for the water-cooling space is the confined space. A second sealing groove is formed in the first cover plate 210, the second sealing groove corresponds to the first sealing groove 360, and the sealing ring is located between the first sealing groove 360 and the second sealing groove. The sealing groove is used for preventing the sealing ring from deviating and ensuring the sealing effect of the water cooling space. When the cover plate 300 covers the first cover plate 210, the water cooling space forms a closed space due to the sealing ring and the sealing groove, thereby preventing cooling water from leaking and ensuring the stability of the heat dissipation effect.
The sealing cover plate 300 is detachably connected with the first cover plate 210, for example, by a stud nut. A plurality of fixing holes 380 are formed in corresponding positions of the cover plate 300 and the first cover plate 210, the fixing holes 380 are through holes or screw holes, for example, a plurality of through holes are uniformly arranged around the peripheries of the cover plate 300 and the first cover plate 210, the cover plate 300 is fixed on the first cover plate 210 through stud nuts, and stress is uniform in all directions, so that the tightness of the water cooling space is stably ensured.
A through hole 400 is formed in the center of the resonant capacitor, and the through hole 400 sequentially penetrates through the second cover 220, the capacitor core 100, the cover plate 300, and the first cover 210 at intermediate positions thereof, thereby facilitating the extraction of the electrodes and the mounting and fixing. In order to prevent the water-cooling space from leaking water due to the influence of the through-hole 400, the cover plate 300 is provided with a double-layer flange in which the through-hole 400 passes through the middle of the inner flange 372, a third seal groove 370 is formed between the inner flange 372 and the outer flange 371, and a seal ring is also provided in the third seal groove 370. An annular receiving groove and an annular protrusion are provided at corresponding positions on the first cover plate 210, and the through hole 400 passes through the middle of the annular protrusion. When the cover plate 300 covers the first cover plate 210, the outer flange 371 of the cover plate 300 is inserted into the annular receiving groove of the first cover plate 210, and the annular protrusion of the first cover plate 210 abuts against the sealing ring in the third sealing groove 370, so that the through hole 400 does not affect the normal operation of the water cooling space. Preferably, a sealing gasket is arranged at the bottom of the annular receiving groove of the first cover plate 210, and the outer layer flange 371 abuts against the sealing gasket at the bottom of the receiving groove, so as to further ensure the sealing effect of the water cooling space.
A plurality of mounting holes 221 are uniformly arranged at the periphery of the second capping plate 300, and the mounting holes 221 are in the form of counterbores to facilitate mounting and fixing the resonance capacitor at a desired position.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. The resonant capacitor with high-efficiency water-cooling heat dissipation is characterized by comprising a capacitor core, a first cover plate, a second cover plate and a sealing cover plate;
the sealing cover plate is connected with the first cover plate to form a cooling part, a water cooling space is formed between the sealing cover plate and the first cover plate, and a water inlet through which water enters the water cooling space and a water outlet through which water is discharged out of the water cooling space are formed in the cooling part;
one end of the capacitor core is in butt joint with the cooling piece, and the other end of the capacitor core is in butt joint with the second cover plate.
2. The resonant capacitor with high efficiency of water cooling and heat dissipation as recited in claim 1, further comprising another cover plate connected to the second cover plate to form another cooling member, wherein the other end of the capacitor core is abutted against the other cooling member.
3. The resonant capacitor with high efficiency of water cooling and heat dissipation as recited in claim 1, wherein a water inlet buffer structure and a water outlet buffer structure are disposed in the water cooling space, the water inlet buffer structure is communicated with the water inlet, the water outlet buffer structure is communicated with the water outlet, and the water inlet buffer structure is communicated with the water outlet buffer structure.
4. The resonant capacitor with high efficiency of water cooling and heat dissipation as recited in claim 3, wherein the water inlet buffering structure is an arc-shaped groove, the water outlet buffering structure is an annular groove, and the arc-shaped groove and the annular groove are both disposed on the cover plate.
5. The resonant capacitor with the efficient water-cooling heat dissipation function as recited in claim 4, wherein the cover plate is further provided with a peripheral groove, and the arc-shaped groove and the annular groove are communicated through the peripheral groove; the depth of the peripheral groove is smaller than that of the arc-shaped groove, and the depth of the peripheral groove is smaller than that of the annular groove.
6. The resonant capacitor with efficient water cooling and heat dissipation as recited in claim 5, wherein the arc-shaped groove comprises a first end and a second end, the first end is communicated with the water inlet, the second end is far away from the water inlet, and the depth of the second end is greater than that of the first end.
7. The resonant capacitor with high efficiency of water cooling and heat dissipation as recited in claim 6, wherein the cover plate further comprises a first sealing groove, the first sealing groove is disposed around the water cooling space, and a sealing ring is disposed in the first sealing groove, so that the water cooling space is a sealed space.
8. The resonant capacitor with high efficiency water-cooling heat dissipation of any one of claims 1-7, further comprising a through hole passing through the second cover plate, the capacitor core, the cover plate and the first cover plate.
9. The resonant capacitor with high efficiency of water cooling and heat dissipation as recited in claim 8, wherein a double-layer flange is disposed at a middle position of the cover plate, the double-layer flange comprises an inner-layer flange and an outer-layer flange, the through hole is provided at a middle portion of the inner-layer flange, a third sealing groove is formed between the inner-layer flange and the outer-layer flange, and another sealing ring is disposed in the third sealing groove, so that the water cooling space is kept sealed.
10. The resonant capacitor with high efficiency water cooling as claimed in any one of claims 1 to 7, wherein the first cover plate, the second cover plate and the cover plate are made of copper, copper alloy or aluminum alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023325250.2U CN214279811U (en) | 2020-12-31 | 2020-12-31 | High-efficiency water-cooling radiating resonant capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023325250.2U CN214279811U (en) | 2020-12-31 | 2020-12-31 | High-efficiency water-cooling radiating resonant capacitor |
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| Publication Number | Publication Date |
|---|---|
| CN214279811U true CN214279811U (en) | 2021-09-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023325250.2U Active CN214279811U (en) | 2020-12-31 | 2020-12-31 | High-efficiency water-cooling radiating resonant capacitor |
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| Country | Link |
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| CN (1) | CN214279811U (en) |
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- 2020-12-31 CN CN202023325250.2U patent/CN214279811U/en active Active
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