CN112735815B - High-efficient liquid cooling's resonant capacitor - Google Patents
High-efficient liquid cooling's resonant capacitor Download PDFInfo
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- CN112735815B CN112735815B CN202011642404.2A CN202011642404A CN112735815B CN 112735815 B CN112735815 B CN 112735815B CN 202011642404 A CN202011642404 A CN 202011642404A CN 112735815 B CN112735815 B CN 112735815B
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- 238000001816 cooling Methods 0.000 title claims abstract description 93
- 239000003990 capacitor Substances 0.000 title claims abstract description 90
- 239000007788 liquid Substances 0.000 title 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 163
- 238000007789 sealing Methods 0.000 claims abstract description 61
- 239000000872 buffer Substances 0.000 claims abstract description 21
- 230000017525 heat dissipation Effects 0.000 claims abstract description 18
- 210000001503 joint Anatomy 0.000 claims abstract description 8
- 230000002093 peripheral effect Effects 0.000 claims description 22
- 238000007599 discharging Methods 0.000 claims description 4
- 239000000498 cooling water Substances 0.000 abstract description 16
- 238000010521 absorption reaction Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000010445 mica Substances 0.000 description 7
- 229910052618 mica group Inorganic materials 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 230000003139 buffering effect Effects 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000003116 impacting effect Effects 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
- H01G2/103—Sealings, e.g. for lead-in wires; Covers
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inverter Devices (AREA)
Abstract
The invention relates to the technical field of capacitors and discloses a resonant capacitor with efficient water-cooling heat dissipation, which comprises a capacitor core, a first cover plate, a second cover plate and a sealing cover plate, wherein the capacitor core is arranged on the first cover plate; the sealing cover plate is connected with the first cover plate to form a cooling piece; one end of the capacitor core is in butt joint with the cooling piece, and the other end of the capacitor core is in butt joint with the second cover plate; a water cooling space is formed between the sealing cover plate and the first cover plate, and a water inlet and a water outlet are formed in the sealing cover plate; and a water inlet buffer structure is arranged in the water cooling space and communicated with the water inlet. In the invention, the water cooling space is formed by the sealing cover plate and the first cover plate, so that the water cooling space and the resonance capacitor are integrated, and a water cooling device is not required to be additionally arranged, thereby being convenient for users to use. The water inlet buffer structure enables cooling water to be buffered after entering the water cooling space, so that the cooling water fully participates in heat absorption of the resonant capacitor, and the water cooling heat dissipation efficiency of the resonant capacitor is improved.
Description
Technical Field
The invention relates to the technical field of capacitors, in particular to a resonant capacitor with efficient water-cooling heat dissipation.
Background
The resonant capacitor is an electronic component with a wide application range, is an important power device in high-frequency induction heating equipment, and is matched with other electronic components in a circuit to generate resonant current to drive a heating device to heat. In the working process of the resonant capacitor, the frequency is very high, and the heat productivity is very large. The quality and operating life of the resonant capacitor often directly determine the reliability and service life of the induction heating device. The resonant capacitor has a large amount of heat generation due to a large current and a high frequency in the working process. If measures are not taken in time to take away heat, once heat accumulation is serious in the working process, the temperature of the capacitor is excessively high, and the service life of the capacitor can be seriously shortened.
In the prior art, the resonant capacitor is often cooled by an external water cooling device, and the water cooling device takes away heat from the water in the serpentine pipeline through arranging the serpentine pipeline. However, the cooling effect of the water flow in the serpentine pipeline is difficult to be fully exerted, and only a small amount of water can participate in the heat dissipation and cooling of the resonant capacitor in some parts, so that the overall cooling effect is poor.
Disclosure of Invention
The invention aims to provide a resonant capacitor with efficient water-cooling heat dissipation, and aims to solve the problem that a water-cooling device of the resonant capacitor is poor in heat dissipation effect in the prior art.
The invention is realized in this way, the high-efficient water-cooling radiating resonant capacitor, including the electric capacity core, first cover plate, second cover plate and cover plate;
the cover plate is connected with the first cover plate to form a cooling piece;
one end of the capacitor core is in butt joint with the cooling piece, and the other end of the capacitor core is in butt joint with the second cover plate;
a water cooling space is formed between the sealing cover plate and the first cover plate, and a water inlet for supplying water into the water cooling space and a water outlet for discharging the water from the water cooling space are formed in the sealing cover plate; and a water inlet buffer structure is arranged in the water cooling space and communicated with the water inlet.
Furthermore, one end of the capacitor core is butted with the cover plate, and the first cover plate covers the cover plate; or one end of the capacitor core is in butt joint with the first cover plate, and the sealing cover plate covers the first cover plate.
Furthermore, the water inlet buffer structure is an arc-shaped groove, and the arc-shaped groove is formed in the sealing cover plate.
Further, the arc recess includes first end and second end, first end with the water inlet intercommunication, the second end is kept away from the water inlet, the degree of depth of second end is greater than the degree of depth of first end.
Furthermore, the water cooling space is also provided with a water drainage buffer structure, and the water drainage buffer structure is communicated with the water outlet.
Furthermore, the drainage buffer structure is an annular groove, and the annular groove is arranged on the sealing cover plate.
Furthermore, the arc-shaped groove is communicated with the annular groove through a peripheral groove, the depth of the peripheral groove is smaller than that of the arc-shaped groove, and the depth of the peripheral groove is smaller than that of the annular groove.
Furthermore, the cover sealing plate is further provided with a first sealing groove, the first sealing groove surrounds the water cooling space, and a sealing ring is arranged in the first sealing groove, so that the water cooling space is a sealed space.
Furthermore, a second sealing groove is formed in the first cover plate, the second sealing groove corresponds to the first sealing groove, and the sealing ring is located between the first sealing groove and the second sealing groove.
Further, the sealing cover plate is connected with the first cover plate through a stud nut.
Compared with the prior art, the high-efficiency water-cooling radiating resonant capacitor provided by the invention has the advantages that the water-cooling space is formed by the sealing cover plate and the first cover plate, so that the water-cooling space and the resonant capacitor are integrated, no additional water-cooling device is required, and the use by a user is facilitated. The water inlet buffer structure enables cooling water to be buffered after entering the water cooling space, so that the cooling water fully participates in heat absorption of the resonant capacitor, and the water cooling heat dissipation efficiency of the resonant capacitor is improved.
Drawings
Fig. 1 is a schematic perspective view of a resonant capacitor with high efficiency water cooling provided by the present invention;
fig. 2 is a schematic perspective view of a cover plate of the resonant capacitor with high efficiency water-cooling heat dissipation provided by the present invention.
Description of the reference numerals:
100-capacitor core;
210-a first cover plate, 220-a second cover plate, 221-a mounting hole;
300-sealing plate, 310-water inlet, 311-water inlet joint; 320-water outlet, 321-water outlet joint; 330-arc groove, 331-first end, 332-second end;
340-annular groove, 341-first side, 342-second side;
350-peripheral groove, 351-upper peripheral groove, 352-lower peripheral groove;
360-a first seal groove;
370-third seal groove, 371-outer flange, 372-inner flange;
380-fixing hole;
400-through hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The following detailed description of implementations of the invention refers to specific embodiments.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present invention, it should be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of describing the present invention and simplifying the description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and are not to be construed as limiting the present patent, and the specific meaning of the terms may be understood by those skilled in the art according to specific circumstances.
Referring to fig. 1-2, a preferred embodiment of the present invention is shown.
The high-efficiency water-cooling radiating resonant capacitor comprises a capacitor core 100, a first cover plate 210, a second cover plate 220 and a cover plate 300;
the cover plate 300 is connected with the first cover plate 210 to form a cooling piece;
one end of the capacitor core 100 is butted with the cooling member, and the other end of the capacitor core 100 is butted with the second cover plate 220;
a water cooling space is formed between the sealing cover plate 300 and the first cover plate 210, and the sealing cover plate 300 is provided with a water inlet 310 for supplying water into the water cooling space and a water outlet 320 for discharging the water from the water cooling space; a water inlet buffer structure is arranged in the water cooling space and is communicated with the water inlet 310.
The high-efficient water-cooling radiating resonant capacitor that this embodiment provided forms the water-cooling space through closing apron 300 and first apron 210 for the water-cooling space is integrative with resonant capacitor, need not additionally increase water cooling plant, and convenience of customers uses. The water inlet buffer structure enables cooling water to be buffered after entering the water cooling space, so that the cooling water fully participates in heat absorption of the resonant capacitor, and the water cooling heat dissipation efficiency of the resonant capacitor is improved.
One end of the capacitor core 100 is butted with a water cooling device, and the capacitor core can be divided into:
one end of the capacitor core 100 is butted against the cover plate 300, and the first cover plate 210 is covered on the cover plate 300;
alternatively, one end of the capacitor element 100 is butted against the first cover 210, and the capping plate 300 is covered on the first cover 210.
As an extension, both ends of the capacitor core 100 may be provided with cooling elements: the resonance capacitor includes another cover plate connected to the second cover plate 220 to form another cooling member, and the other end of the capacitor core 100 is butted against the other cooling member. Obviously, the efficiency of water-cooling heat dissipation of the resonant capacitor is improved when the capacitor core 100 is provided with cooling members at both ends.
In this embodiment, the resonant capacitor with high efficiency of water cooling includes a capacitor core 100, a first cover plate 210, a second cover plate 220 and a cover plate 300. The top end of the capacitor core 100 is abutted to the cover plate 300, the first cover plate 210 covers the cover plate 300, the bottom end of the capacitor core 100 is abutted to the second cover plate 220, and the first cover plate 210 and the second cover plate 220 can be made of metal plates with good heat conduction performance, such as copper plates, copper alloy plates or aluminum alloy plates, and the like, wherein the copper plates have good electric conduction performance, heat conduction performance and machining performance, and are excellent choices. The capacitor core 100 is cylindrical, the cover plates 300 and the second cover plates 220 are respectively arranged at two ends of the cylindrical capacitor core 100 and are fully contacted with the capacitor core 100, and the areas of the cover plates 300 and the second cover plates 220 are larger than the area of the end faces of the capacitor core 100, so that the capacitor core 100 is clamped in the middle.
In a resonant capacitor with a large current (e.g. a current range of 400-500 a), a mica sheet is stacked between two adjacent copper foils in the resonant capacitor, and the mica sheet is used as the capacitor core 100. Because the manufacturing process of the mica sheet involves complicated working procedures for silver baking, the cost is higher, and in order to overcome the defect, a certain amount of copper foils and mica paper can be adopted, the copper foils and the mica paper are alternately laminated to form a layered structure, one mica paper is arranged between two adjacent copper foils, the layered structure can be used as a capacitor core 100, and the mica paper does not need to be silver baked, so the cost is greatly reduced.
The first cover plate 210 covers the cover plate 300, and a water cooling space is formed between the cover plate 300 and the first cover plate 210, so that the water cooling space and the resonant capacitor are integrated, and a water cooling device is not required to be additionally arranged, thereby facilitating the use of a user.
The cover 300 is made of a material with good thermal conductivity, such as copper, copper alloy or aluminum alloy.
A water inlet 310 through which water is supplied into the water-cooled space and a water outlet 320 through which the water is discharged from the water-cooled space are formed in the cover plate 300; the heat of the resonant capacitor is taken away through water circulation, and the effect of water cooling is achieved. The outer ends of the water inlet 310 and the water outlet 320 are respectively provided with a water inlet joint 311 and a water outlet joint 321, which are convenient for connecting with a common water inlet pipe and a common water outlet pipe.
A water inlet buffer structure is arranged in the water cooling space and is communicated with the water inlet 310. The water inlet buffer structure enables cooling water to be buffered after entering the water cooling space, so that the cooling water fully participates in heat absorption of the resonant capacitor, and the water cooling heat dissipation efficiency of the resonant capacitor is improved.
In particular embodiments, the intake buffering structure includes, but is not limited to, the following structures.
The water inlet buffering structure can be an arc-shaped groove 330 arranged on the cover plate 300, when water enters the water cooling space, the water is firstly blocked and buffered by an arc-shaped groove wall of the arc-shaped groove 330, water flow is guided to the end part of the arc-shaped groove 330 and returns after impacting the groove wall at the end part of the arc-shaped groove 330, and in the impacting process of the water flow back and forth, cooling water and the cover plate 300 are fully subjected to heat transfer, and the heat of the resonant capacitor is taken away through the water flow.
The arcuate recess 330 may be provided in the first cover plate 210, but is preferably provided in the cover plate 300, avoiding excessive adjustment of the structure of the resonant capacitor itself to increase the cost.
The arc-shaped groove 330 includes a first end 331 and a second end 332, the first end 331 is communicated with the water inlet 310, the second end 332 is far away from the water inlet 310, the arc-shaped groove 330 can be at the same depth, and preferably, the depth of the second end 332 is greater than that of the first end 331. When water enters from the first end 331 of the arc-shaped groove 330 and flows along the arc-shaped groove 330 to the second end 332, the water flow is slower as the second end 332 approaches the second end 332 due to the depth of the second end 332 is larger than that of the first end 331, and the flow of the water returning from the second end 332 is facilitated.
In the process of extending from the first end 331 to the second end 332 of the arc-shaped groove 330, smooth transition can be achieved, or a plurality of steps are arranged at the bottom of the groove for transition, and the arrangement of the steps increases the buffering of cooling water, thereby being beneficial to improving the heat dissipation effect.
The water cooling space is further provided with a water discharge buffering structure, and the water discharge buffering structure is communicated with the water discharge port 320. The water discharging buffer structure enables cooling water to be discharged after being buffered again in the water cooling space, so that the cooling water can more fully participate in heat absorption of the resonant capacitor, and the water cooling heat dissipation efficiency of the resonant capacitor is improved.
In particular embodiments, the drainage buffer structure includes, but is not limited to, the following structures.
The drainage buffer structure is an annular groove 340, and the annular groove 340 is disposed on the sealing cover plate 300. The water in the water cooling space is guided by the annular groove 340 to flow around the annular groove 340, which not only increases the contact area between the water and the capping plate 300, but also effectively buffers the cooling water by forming a circular flow by the arrangement of the annular groove 340, so that the cooling water and the capping plate 300 can be more sufficiently heat-transferred to take away the heat of the resonant capacitor through the water flow.
The annular recess 340 may be formed in the first cap plate 210, but is preferably formed in the cap plate 300, thereby avoiding the need to adjust the structure of the resonant capacitor itself to increase the cost.
The annular groove 340 includes a first side 341 and a second side 342, the first side 341 communicating with the drain port 320, the second side 342 being away from the drain port 320, the annular groove 340 may be of the same depth, and preferably, the depth of the second side 342 of the annular groove 340 is greater than the depth of the first side 341. When water enters from the first side 341 of the annular groove 340 and flows along the annular groove 340 to the second side 342, since the depth of the second side 342 is greater than the first side, the water flow is slower as the water flow approaches the second side 342, and the water returning from the second side 342 flows out from the water outlet 320 of the first side 341 more easily.
The arc-shaped groove 330 is communicated with the annular groove 340 through a peripheral groove 350, the depth of the peripheral groove 350 is less than that of the arc-shaped groove 330, and the depth of the peripheral groove 350 is less than that of the annular groove 340. The provision of the peripheral groove 350 allows more contact between the water and the first cover plate 210, and more loop and circulation of the water in the cooling space, so that the cooling water is more buffered and is more fully heat-transferred to the first cover plate 210, and the heat of the resonant capacitor is taken away.
For example, after entering from the water inlet 310, the water reaches the first end 331 of the arc-shaped groove 330, and flows toward the second end 332 under the guidance of the arc-shaped groove 330, and meanwhile, part of the water flows into the upper peripheral groove 351; the water is buffered by the influence of the arc-shaped groove 330, is buffered again after the second end 332 of the arc-shaped groove 330 returns, and then enters the upper peripheral groove 351; the water flows into the first side 341 of the annular groove from the upper peripheral groove 351, one part of the water is discharged from the water discharge port 320, the other part of the water is guided by the annular groove to form a circular flow, and the circular flow is subjected to sufficient heat transfer with the cover plate 300 and is discharged from the water discharge port 320 when returning to the first side 341 through the circular flow; the water flowing out of the upper peripheral groove 351 and returning from the ring-shaped groove partially enter the lower peripheral groove 352 and flow toward the first ends 331 of the arc-shaped grooves 330 to form a large loop, so that the water can sufficiently exchange heat with the cover plate 300, thereby improving the water-cooling heat dissipation efficiency of the resonant capacitor.
Still be equipped with first seal groove 360 on closing cap plate 300, first seal groove 360 is equipped with the sealing washer around the water-cooling space arrangement in the first seal groove 360 for the water-cooling space is the confined space. A second sealing groove is formed in the first cover plate 210, the second sealing groove corresponds to the first sealing groove 360, and the sealing ring is located between the first sealing groove 360 and the second sealing groove. The sealing groove is used for preventing the sealing ring from deviating and ensuring the sealing effect of the water cooling space. When the cover plate 300 covers the first cover plate 210, a closed space is formed in the water cooling space due to the sealing ring and the sealing groove, so that the leakage of cooling water is avoided, and the stability of the heat dissipation effect is ensured.
The cover plate 300 is detachably connected with the first cover plate 210, for example, by a stud nut. A plurality of fixing holes 380 are disposed at corresponding positions on the cover plate 300 and the first cover plate 210, and the fixing holes 380 are through holes or screw holes, for example, a plurality of through holes are uniformly disposed around the peripheries of the cover plate 300 and the first cover plate 210, and the cover plate 300 is fixed on the first cover plate 210 by using stud nuts, so that the stress is uniform in all directions, thereby stably ensuring the tightness of the water cooling space.
A through hole 400 is formed in the center of the resonant capacitor, and the through hole 400 sequentially penetrates the second cover 220, the capacitor element 100, the cover 300, and the first cover 210 at intermediate positions thereof, thereby facilitating the extraction of electrodes and the mounting and fixing. In order to prevent the water-cooling space from leaking water due to the influence of the through-hole 400, the cover plate 300 is provided with a double-layer flange in which the through-hole 400 passes through the middle of the inner flange 372, a third seal groove 370 is formed between the inner flange 372 and the outer flange 371, and a seal ring is also provided in the third seal groove 370. An annular receiving groove and an annular protrusion are provided at corresponding positions on the first cover plate 210, and the through hole 400 passes through the middle of the annular protrusion. When the cover plate 300 is covered on the first cover plate 210, the outer layer flange 371 on the cover plate 300 is inserted into the annular receiving groove on the first cover plate 210, and the annular protrusion on the first cover plate 210 abuts against the sealing ring in the third sealing groove 370, so that the through hole 400 does not affect the normal operation of the water cooling space. Preferably, a sealing gasket is arranged at the bottom of the annular receiving groove of the first cover plate 210, and the outer layer flange 371 abuts against the sealing gasket at the bottom of the receiving groove, so as to further ensure the sealing effect of the water cooling space.
A plurality of mounting holes 221 are uniformly arranged at the periphery of the second cover plate 300, and the mounting holes 221 are in the form of counterbores for facilitating the mounting and fixing of the resonance capacitor at a desired position.
The above description is intended to be illustrative of the preferred embodiment of the present invention and should not be taken as limiting the invention, but rather, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.
Claims (5)
1. The resonant capacitor with high-efficiency water-cooling heat dissipation is characterized by comprising a capacitor core, a first cover plate, a second cover plate and a sealing cover plate;
the sealing cover plate is connected with the first cover plate to form a cooling piece;
one end of the capacitor core is in butt joint with the cooling piece, and the other end of the capacitor core is in butt joint with the second cover plate;
a water cooling space is formed between the sealing cover plate and the first cover plate, and a water inlet for supplying water into the water cooling space and a water outlet for discharging the water from the water cooling space are formed in the sealing cover plate; a water inlet buffer structure is arranged in the water cooling space and communicated with the water inlet;
the water inlet buffer structure is an arc-shaped groove, and the arc-shaped groove is formed in the sealing cover plate; the arc-shaped groove comprises a first end and a second end, the first end is communicated with the water inlet, the second end is far away from the water inlet, and the depth of the second end is greater than that of the first end;
the water cooling space is also provided with a water drainage buffer structure, and the water drainage buffer structure is communicated with the water drainage port; the drainage buffer structure is an annular groove, and the annular groove is arranged on the sealing cover plate; the annular groove comprises a first side and a second side, the first side is communicated with the water outlet, and the second side is far away from the water outlet; the depth of the second side of the annular groove is greater than that of the first side;
the arc-shaped groove is communicated with the annular groove through a peripheral groove, the depth of the peripheral groove is smaller than that of the arc-shaped groove, and the depth of the peripheral groove is smaller than that of the annular groove;
when water enters from the water inlet, the water firstly reaches the first end of the arc-shaped groove, flows to the second end under the guidance of the arc-shaped groove, and meanwhile, part of the water can enter the peripheral groove at the upper part to flow; the water is buffered under the influence of the arc-shaped groove, is buffered again after returning from the second end of the arc-shaped groove, and then enters the upper peripheral groove; the water flows into the first side of the annular groove from the upper peripheral groove, one part of water is discharged from the water outlet, the other part of water is guided by the annular groove to form a circular flow, and the circular flow is in sufficient heat transfer with the sealing cover plate and is discharged from the water outlet when returning to the first side through the circular flow; the water flowing out of the upper peripheral groove and returning from the annular groove partially enters the lower peripheral groove and flows to the first ends of the arc-shaped grooves to form a large return ring, so that the water and the sealing cover plate are subjected to heat exchange fully.
2. The efficient water-cooled radiating resonant capacitor as recited in claim 1, wherein one end of said capacitor core is abutted against said cover plate, and said first cover plate is covered on said cover plate; or one end of the capacitor core is in butt joint with the first cover plate, and the sealing cover plate covers the first cover plate.
3. The resonant capacitor with high efficiency of water cooling heat dissipation as recited in any one of claims 1-2, wherein the cover plate further has a first sealing groove disposed around the water cooling space, and a sealing ring is disposed in the first sealing groove, so that the water cooling space is a sealed space.
4. The resonant capacitor with high efficiency of water cooling and heat dissipation as recited in claim 3, wherein said first cover plate has a second sealing groove corresponding to said first sealing groove, and said sealing ring is located between said first sealing groove and said second sealing groove.
5. An efficient water-cooling radiating resonant capacitor as claimed in any one of claims 1-2, wherein said cover plate is connected with said first cover plate by means of stud nut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011642404.2A CN112735815B (en) | 2020-12-31 | 2020-12-31 | High-efficient liquid cooling's resonant capacitor |
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| CN202011642404.2A CN112735815B (en) | 2020-12-31 | 2020-12-31 | High-efficient liquid cooling's resonant capacitor |
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| CN112735815A CN112735815A (en) | 2021-04-30 |
| CN112735815B true CN112735815B (en) | 2022-07-22 |
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| CN113889339B (en) * | 2021-08-27 | 2023-05-02 | 深圳东佳电子有限公司 | Capacitor with good heat dispersion |
| CN114979848A (en) | 2022-04-07 | 2022-08-30 | 瑞声光电科技(常州)有限公司 | Loudspeaker module |
| CN114979847B (en) | 2022-04-07 | 2023-03-14 | 瑞声光电科技(常州)有限公司 | Loudspeaker module |
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| CN205122392U (en) * | 2015-12-07 | 2016-03-30 | 成都光大电力电子研究所 | Two cold type high frequency induction heating condensers that inductive heating tool used |
| US20190373768A1 (en) * | 2018-05-31 | 2019-12-05 | Hanon Systems | Electronics cold plate |
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