CN214256730U - Double-sided circuit board with multiple heat dissipation mechanism - Google Patents
Double-sided circuit board with multiple heat dissipation mechanism Download PDFInfo
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- CN214256730U CN214256730U CN202120317147.9U CN202120317147U CN214256730U CN 214256730 U CN214256730 U CN 214256730U CN 202120317147 U CN202120317147 U CN 202120317147U CN 214256730 U CN214256730 U CN 214256730U
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- heat dissipation
- circuit board
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- sided circuit
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Abstract
The utility model discloses a double-sided circuit board with multiple heat dissipation mechanisms, which comprises a double-sided circuit board main body and a heat dissipation mechanism, wherein one side of the double-sided circuit board main body is provided with a heat dissipation area; through the design of the structures such as the heat dissipation mechanism, the heat conduction piece, the through hole and the like, the first heat dissipation piece, the second heat dissipation piece and the bottom heat dissipation piece of the heat dissipation mechanism are respectively arranged at the upper part and the bottom part of the double-sided circuit board so as to realize simultaneous heat conduction and heat dissipation on two sides of the main body of the double-sided circuit board, the heat conduction piece can conduct heat of the bottom heat dissipation piece so as to conduct the heat to the first heat dissipation piece and the second heat dissipation piece, and then the heat dissipation mechanism is subjected to heat dissipation in an air cooling mode through the heat dissipation fan, so that multiple efficient heat dissipation on the double-sided circuit board is realized; in addition, the damping rubber nails are adopted in the installation of the heat dissipation fan, the assembly nails and the assembly nail buttons are adopted in the installation between the heat dissipation pieces, and the integral installation mode is simple.
Description
Technical Field
The utility model relates to a double-sided circuit board technical field specifically is a double-sided circuit board with multiple heat dissipation mechanism.
Background
In the development of high technology, people need electronic products with high performance, small volume and multiple functions, so that the manufacture of the printed circuit board is promoted to be light, thin, short and small, the printed circuit board has limited space, more functions are realized, the wiring density is increased, and the aperture is smaller; from 1995 to 2005, the minimum hole diameter of mechanical drilling batch capacity was reduced from 0.4mm to 0.2mm, and even smaller; the diameter of the metallized hole is smaller and smaller, the metallized hole which is depended on by interconnection among layers, and the quality is directly related to the reliability of the printed board.
The double-sided circuit board has higher heat productivity compared with the single-sided circuit board due to higher integration level, the conventional heat dissipation mechanism applied to the double-sided circuit board has more limited heat dissipation effect, and the heat on the circuit board cannot be dissipated timely, so that the operation of the circuit board is influenced; however, the addition of too many single-sided heat dissipation structures requires more heat dissipation assemblies, and the mounting manner is relatively complicated, so that a double-sided circuit board with multiple heat dissipation mechanisms is required.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a double-sided circuit board with multiple heat dissipation mechanisms, the heat dissipation effect obtained by applying the conventional heat dissipation mechanism on the double-sided circuit board is relatively limited, and the heat on the circuit board which can not be dissipated in time can affect the operation of the circuit board; the addition of too many single-sided heat dissipation structures requires more heat dissipation assemblies, and the mounting manner is relatively complicated, so as to solve the problems in the background art.
In order to achieve the above object, the utility model provides a following technical scheme: a double-sided circuit board with multiple heat dissipation mechanisms comprises a double-sided circuit board main body and a heat dissipation mechanism, wherein one side of the double-sided circuit board main body is provided with a heat dissipation area, the upper part of the double-sided circuit board main body is fixedly provided with a fan base and a heat dissipation fan, and the heat dissipation fan is fixedly arranged on the upper part of the fan base;
the heat dissipation mechanism comprises a first heat dissipation part, a second heat dissipation part and a bottom heat dissipation part, one ends of the first heat dissipation part and the second heat dissipation part are respectively inserted into two sides of the fan base, the first heat dissipation part and the second heat dissipation part are arranged on the upper portion of the double-sided circuit board main body, the bottom heat dissipation part is arranged at the bottom of the double-sided circuit board main body, assembly nails penetrate through the first heat dissipation part and the second heat dissipation part, the first heat dissipation part and the second heat dissipation part are arranged at two ends of the upper portion of the bottom heat dissipation part through the assembly nails, heat conduction parts are fixedly connected to the bottoms of the first heat dissipation part and the second heat dissipation part, and the heat conduction parts at the bottoms of the first heat dissipation part and the second heat dissipation part are connected to the bottom heat dissipation part.
Preferably, four corners and the central position of the double-sided circuit board main body are provided with fixing holes, and the fixing holes are threaded through holes.
Preferably, the cooling fan is provided with a damping rubber nail, a rubber nail clamping hole matched with the damping rubber nail is formed in the fan base, and the cooling fan is fixedly installed on the fan base through the matching of the damping rubber nail and the rubber nail clamping hole.
Preferably, a first through hole is formed in the double-sided circuit board main body, second through holes are formed in the first radiating piece, the second radiating piece and the bottom radiating piece, the assembly nail penetrates through the first through hole and the second through hole, and the bottom of the assembly nail is connected with the assembly nail buckle.
Preferably, four groups of second through holes are formed in the first heat dissipation member and the second heat dissipation member, and eight groups of second through holes are formed in the bottom heat dissipation member.
Preferably, the bottom of the heat conducting piece is integrally formed with a butt joint block, the bottom heat radiating piece is provided with a butt joint groove, and the butt joint block is inserted into the butt joint groove.
Compared with the prior art, the beneficial effects of the utility model are that:
through the design of the structures such as the heat dissipation mechanism, the heat conduction piece, the through hole and the like, the first heat dissipation piece, the second heat dissipation piece and the bottom heat dissipation piece of the heat dissipation mechanism are respectively arranged at the upper part and the bottom part of the double-sided circuit board so as to realize simultaneous heat conduction and heat dissipation on two sides of the main body of the double-sided circuit board, the heat conduction piece can conduct heat of the bottom heat dissipation piece so as to conduct the heat to the first heat dissipation piece and the second heat dissipation piece, and then the heat dissipation mechanism is subjected to heat dissipation in an air cooling mode through the heat dissipation fan, so that multiple efficient heat dissipation on the double-sided circuit board is realized; in addition, the damping rubber nails are adopted in the installation of the heat dissipation fan, the assembly nails and the assembly nail buttons are adopted in the installation between the heat dissipation pieces, and the integral installation mode is simple.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of the present invention;
fig. 3 is an enlarged schematic view of a portion a of fig. 2 according to the present invention;
fig. 4 is a schematic view of a part of the structure of the first heat sink and the bottom heat sink of the present invention.
In the figure: 1. a double-sided circuit board main body; 2. a heat dissipation area; 3. a heat radiation fan; 4. a fan base; 5. assembling nails; 6. a fixing hole; 7. a heat conductive member; 8. a through hole; 9. a first heat sink; 10. a second heat sink; 11. assembling a button; 12. a bottom heat sink; 13. a first through hole; 14. a second through hole; 15. a butt joint block; 16. a butt joint groove; 17. shock attenuation glue nail.
Detailed Description
The same reference numbers in different drawings identify the same or similar elements; it should be further understood that terms such as "first," "second," "third," "upper," "lower," "front," "rear," "inner," "outer," "end," "portion," "section," "width," "thickness," "zone," and the like, may be used solely for convenience in reference to the figures and to aid in describing the invention, and are not intended to limit the invention.
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution:
a double-sided circuit board with multiple heat dissipation mechanisms comprises a double-sided circuit board main body 1 and a heat dissipation mechanism, wherein a heat dissipation area 2 is arranged on one side of the double-sided circuit board main body 1, a fan base 4 and a heat dissipation fan 3 are fixedly mounted on the upper portion of the double-sided circuit board main body 1, and the heat dissipation fan 3 is fixedly mounted on the upper portion of the fan base 4;
the heat dissipation mechanism comprises a first heat dissipation piece 9, a second heat dissipation piece 10 and a bottom heat dissipation piece 12, one ends of the first heat dissipation piece 9 and the second heat dissipation piece 10 are respectively inserted into two sides of the fan base 4, the first heat dissipation piece 9 and the second heat dissipation piece 10 are arranged on the upper portion of the double-sided circuit board main body 1, the bottom heat dissipation piece 12 is arranged at the bottom of the double-sided circuit board main body 1, assembly nails 5 penetrate through the first heat dissipation piece 9 and the second heat dissipation piece 10, the first heat dissipation piece 9 and the second heat dissipation piece 10 are arranged at two ends of the upper portion of the bottom heat dissipation piece 12 through the assembly nails 5, heat conduction pieces 7 are fixedly connected to the bottoms of the first heat dissipation piece 9 and the second heat dissipation piece 10, and the heat conduction pieces 7 at the bottoms of the first heat dissipation piece 9 and the second heat dissipation piece 10 are connected to the bottom heat dissipation piece 12.
A first through hole 13 is formed in the double-sided circuit board main body 1, second through holes 14 are formed in the first radiating piece 9, the second radiating piece 10 and the bottom radiating piece 12, the assembling nail 5 penetrates through the first through hole 13 and the second through hole 14, and the bottom of the assembling nail 5 is connected with an assembling nail buckle 11; four sets of second through holes 14 are formed in the first heat dissipation member 9 and the second heat dissipation member 10, and eight sets of second through holes 14 are formed in the bottom heat dissipation member 12.
The bottom of the heat conducting element 7 is integrally formed with a butt joint block 15, the bottom heat radiating element 12 is provided with a butt joint groove 16, and the butt joint block 15 is inserted into the butt joint groove 16.
The working principle is as follows: through the design of the structures of the heat dissipation mechanism, the heat conduction piece 7, the through hole 8 and the like, the first heat dissipation piece 9, the second heat dissipation piece 10 and the bottom heat dissipation piece 12 of the heat dissipation mechanism are respectively arranged at the upper part and the bottom part of the double-sided circuit board, so that the simultaneous heat conduction and heat dissipation of two sides of the double-sided circuit board main body 1 are realized, the heat conduction piece 7 can conduct heat of the bottom heat dissipation piece 12, the heat is conducted to the first heat dissipation piece 9 and the second heat dissipation piece 10, and then the heat dissipation mechanism is dissipated in an air cooling mode through the heat dissipation fan 3, so that multiple efficient heat dissipation of the double-sided circuit board is realized; in addition, the damping rubber nails 17 are adopted in the installation of the heat radiation fan 3, the assembly nails 5 and the assembly nail buttons 11 are adopted in the installation between the heat radiation pieces, and the integral installation mode of the radiator is simple.
The control mode of the present application document is automatically controlled by a controller, and the control circuit of the controller can be realized by simple programming of a person skilled in the art, which belongs to the common knowledge in the field, and the present application document is mainly used for protecting a mechanical device, so the present application document does not explain the control mode and the circuit connection in detail, and the device supplies power by an external power supply.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a double-sided circuit board with multiple heat dissipation mechanism, includes double-sided circuit board main part (1) and heat dissipation mechanism, one side of double-sided circuit board main part (1) sets up to heat dissipation area (2), its characterized in that: a fan base (4) and a heat radiation fan (3) are fixedly arranged on the upper part of the double-sided circuit board main body (1), and the heat radiation fan (3) is fixedly arranged on the upper part of the fan base (4);
the heat dissipation mechanism comprises a first heat dissipation piece (9), a second heat dissipation piece (10) and a bottom heat dissipation piece (12), one end of the first heat dissipation member (9) and one end of the second heat dissipation member (10) are respectively inserted into the two sides of the fan base (4), the first heat dissipation piece (9) and the second heat dissipation piece (10) are arranged at the upper part of the double-sided circuit board main body (1), the bottom heat dissipation piece (12) is arranged at the bottom of the double-sided circuit board main body (1), the first heat dissipation element (9) and the second heat dissipation element (10) are both provided with assembly nails (5) in a penetrating way, the first heat dissipation piece (9) and the second heat dissipation piece (10) are arranged at the two ends above the bottom heat dissipation piece (12) through assembly nails (5), the bottoms of the first heat dissipation element (9) and the second heat dissipation element (10) are fixedly connected with heat conduction elements (7), the heat conducting pieces (7) at the bottoms of the first heat radiating piece (9) and the second heat radiating piece (10) are connected to the bottom heat radiating piece (12).
2. The double-sided circuit board with multiple heat dissipation mechanisms of claim 1, wherein: four corners and the central position of double-sided circuit board main part (1) are provided with fixed orifices (6), fixed orifices (6) set up to the screw thread through-hole.
3. The double-sided circuit board with multiple heat dissipation mechanisms of claim 1, wherein: the cooling fan is characterized in that a damping rubber nail (17) penetrates through the cooling fan (3), a rubber nail clamping hole matched with the damping rubber nail (17) is formed in the fan base (4), and the cooling fan (3) is fixedly installed on the fan base (4) through the matching of the damping rubber nail (17) and the rubber nail clamping hole.
4. The double-sided circuit board with multiple heat dissipation mechanisms of claim 1, wherein: first through-hole (13) have been seted up on double-sided circuit board main part (1), second through-hole (14) have all been seted up on first radiating piece (9), second radiating piece (10) and bottom radiating piece (12), assembly nail (5) run through in first through-hole (13) and second through-hole (14), the bottom of assembly nail (5) is connected with assembly nail and detains (11).
5. The double-sided circuit board with multiple heat dissipation mechanisms of claim 4, wherein: four groups of second through holes (14) are formed in the first heat dissipation element (9) and the second heat dissipation element (10), and eight groups of second through holes (14) are formed in the bottom heat dissipation element (12).
6. The double-sided circuit board with multiple heat dissipation mechanisms of claim 1, wherein: the heat-conducting piece is characterized in that a butt joint block (15) is integrally formed at the bottom of the heat-conducting piece (7), a butt joint groove (16) is formed in the bottom heat-radiating piece (12), and the butt joint block (15) is inserted into the butt joint groove (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120317147.9U CN214256730U (en) | 2021-02-04 | 2021-02-04 | Double-sided circuit board with multiple heat dissipation mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120317147.9U CN214256730U (en) | 2021-02-04 | 2021-02-04 | Double-sided circuit board with multiple heat dissipation mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214256730U true CN214256730U (en) | 2021-09-21 |
Family
ID=77796228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120317147.9U Active CN214256730U (en) | 2021-02-04 | 2021-02-04 | Double-sided circuit board with multiple heat dissipation mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214256730U (en) |
-
2021
- 2021-02-04 CN CN202120317147.9U patent/CN214256730U/en active Active
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