CN214254363U - Semiconductor wafer cleaning device - Google Patents

Abstract

The utility model discloses a semiconductor wafer belt cleaning device belongs to semiconductor technical field. A semiconductor wafer cleaning device comprises a liquid supplementing cabinet and a cleaning cabinet, wherein the liquid supplementing cabinet is connected to the top of the cleaning cabinet, a clamping assembly and a cleaning mechanism are arranged inside the cleaning cabinet, the bottom wall of the cleaning cabinet is connected with a bottom plate, first holes are formed in the bottom plate and the top wall of the liquid supplementing cabinet and communicated with each other, lead screws are connected to the top of the bottom plate and provided with four groups, the outer walls of the four groups of lead screws are connected with lifting plates, a rotating assembly is connected to the inner walls of the lifting plates, slide bars are connected to the inner walls of the cleaning cabinet, slide blocks are slidably connected to the outer walls of the slide bars, the clamping assembly is connected to the outer walls of the slide blocks, and the output ends of the clamping assembly are connected with wafers; the utility model discloses the washing liquid medicine that is particularly useful for multiunit wafer remains to can prevent effectively that the water smoke from splashing and adhering to again on the wafer surface when wasing, effectively increase cleaning performance and cleaning efficiency, increase the wafer yield.

Description

Semiconductor wafer cleaning device

Technical Field

The utility model relates to the field of semiconductor technology, especially, relate to a semiconductor wafer belt cleaning device.

Background

The semiconductor industry is the core of modern electronic industry, the basis of the semiconductor industry is silicon material industry, the original material of the wafer is silicon, the pollutants on the surface of the wafer can seriously affect the performance, reliability and yield of devices, with the rapid development of microelectronic technology and the improvement of requirements of people, the influence of the pollutants on the devices is more prominent, in the process manufacturing process of the wafer, the pollution of dust, metal, organic matters and inorganic matters can not be avoided, the pollution can easily cause surface defects and dirt in holes, emission points, black points, dark spots and the like are generated, the yield of the wafer is reduced, the quality of the wafer is unstable to be invalid, and therefore, the removal of the pollutants on the surface of the wafer in the manufacturing process of the wafer is very important.

The current commonly used device for cleaning wafers is a tank type cleaning machine, which adopts pure water, alkaline or weakly acidic water-based solvent and the like as cleaning liquid, is combined with cleaning modes such as spraying, jet flow, hot dipping, bubbling and the like for use, and is matched with a proper product drying mode to form cleaning equipment. Before the groove type cleaning machine is used for cleaning the wafer, chemical agents are required to be mixed according to a certain proportion and then injected into a process groove of the groove type cleaning machine, and then the wafer is conveyed to a specific position in the process groove through a mechanical arm. Generally, in order to simultaneously clean a plurality of wafers, the plurality of wafers are vertically placed on a wafer bearing device in a process tank at the same time, and then are placed in the tank to be cleaned by soaking in a chemical solution.

The patent with the publication number of CN111640692A, a cleaning auxiliary device and a cleaning device for wafers, wherein the cleaning auxiliary device comprises a plurality of rotatable wafer bearing devices, which are symmetrically arranged along the vertical center line of the wafer and used for bearing a plurality of wafers; the first driving mechanism is connected with the plurality of wafer bearing devices and is used for driving the wafer bearing devices positioned on one side of the vertical center line of the wafer and the wafer bearing devices positioned on the other side to rotate in the opposite directions, and when the wafer bearing devices rotate, the lower ends of the wafer bearing devices rotate towards the direction close to the vertical center line of the wafer; the second driving mechanism is connected with the support for supporting the plurality of wafer bearing devices so as to drive the wafer to move along the vertical direction; the device cleaning efficiency is lower when using, and water smoke rebounds easily and reattaches on the wafer surface during the clearance, causes the cleaning performance relatively poor, reduces the condition of wafer yield even.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving prior art cleaning efficiency when using lower, and water smoke rebounds easily when just clearing up and adheres to on the wafer surface again, causes the cleaning performance relatively poor, reduces the condition problem of wafer yield even, and the semiconductor wafer belt cleaning device who provides.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a semiconductor wafer cleaning device comprises a liquid supplementing cabinet and a cleaning cabinet, wherein the liquid supplementing cabinet is connected to the bottom of the cleaning cabinet, a water storage tank is connected to the inside of the cleaning cabinet, a clamping assembly and a cleaning mechanism are arranged inside the cleaning cabinet, the clamping assembly is matched with the cleaning mechanism, the cleaning mechanism comprises a spraying assembly, a rotating assembly and an adsorption assembly, the spraying assembly and the adsorption assembly are matched with the rotating assembly, the bottom wall of the cleaning cabinet is connected with a bottom plate, the bottom plate and the top wall of the liquid supplementing cabinet are respectively provided with a first hole for communication, the top of the bottom plate is connected with a lead screw, the lead screws are provided with four groups, the outer walls of the four groups of lead screws are connected with lifting plates, the rotating assembly is connected to the inner wall of the lifting plate, the inner wall of the cleaning cabinet is connected with a sliding rod, the output end of the clamping assembly is connected with a wafer.

Preferably, the runner assembly is including rotating motor, the three driven pulleys of group of driving pulley, it connects in the lifter plate lateral wall to rotate the motor, it is connected with first gear to rotate the motor output, first gear engagement is connected with the second gear, driving pulley connects in the second gear roof, driving pulley and three driven pulleys of group all rotate to be connected in the lifter plate diapire, driving pulley and second gear all rotate to be connected in the lead screw outer wall, driving pulley and second gear all are provided with the screw thread and cooperate with the lead screw.

Preferably, driving pulley outer wall connection has the belt, driving pulley is connected with three sets of driven pulleys through the belt, driving pulley and three sets of driven pulleys all pass the lifter plate roof and upwards extend, driving pulley and three sets of driven pulley extend the end and all are connected with the live-rollers, live-rollers and driven pulley all cooperate with the lead screw, live-rollers and driven pulley all are provided with the screw thread and cooperate with the lead screw.

Preferably, the top wall of the lifting plate is provided with a second hole, the inner wall of the second hole is rotatably connected with a rotating ring, the outer wall of the rotating ring is provided with a rotating groove, and the four groups of rotating rollers are matched with the rotating groove.

Preferably, the side wall of the lifting plate is connected with a water pump, the water pumping end of the water pump is communicated with the water storage tank, the inner wall of the rotating ring is provided with two groups of spray heads, the spray heads are communicated with the water delivery end of the water pump, the bottom of the lifting plate is detachably connected with a water receiving barrel, and the water receiving barrel is matched with the first hole and the rotating ring.

Preferably, the side wall of the lifting plate is connected with a negative pressure pump, the inner wall of the rotating ring is provided with an adsorption port, the top wall and the bottom wall of the rotating ring are provided with adsorption holes, the adsorption ports are matched with the two groups of spray headers, and the adsorption holes and the adsorption ports are communicated with the negative pressure pump.

Preferably, press from both sides dress subassembly and include cylinder and link, the cylinder is connected in the link top, the link is connected in the sliding block outer wall, the cylinder output passes link and sliding block diapire and downwardly extending, the cylinder extends the end and is connected with the pinion rack, the cylinder output cooperatees with the sliding block.

Preferably, the pinion rack meshing is connected with the semi-gear, the semi-gear rotates and connects in the link inner wall, the semi-gear lateral wall is connected with the head rod, the link bottom rotates and is connected with the second connecting rod, the one end that the link was kept away from to head rod and second connecting rod rotates and is connected with the dwang, the one end that the second connecting rod was kept away from to the dwang is connected with the clamping bar, the semi-gear symmetry is provided with two sets ofly, the clamping bar lateral wall is connected with holds the piece device, hold and be loaded with 10-20 wafer in the piece device.

Preferably, the side wall of the cleaning cabinet is provided with an observation window, and the top of the cleaning cabinet is provided with an alarm lamp.

A method for using a semiconductor wafer cleaning device comprises the following steps:

s1: filling pure water into a water storage tank in the liquid supplementing cabinet, removing a water receiving barrel, pouring liquid in the water receiving barrel, and clamping a wafer bearing device in a cleaning cabinet;

s2: the air cylinder is started, the output end of the air cylinder contracts to drive the toothed plate to ascend, the toothed plate ascends to be meshed with and drive the half gear to rotate, the half gear rotates to drive the first connecting rod to rotate, when the first connecting rod rotates, the second connecting rod is matched to drive the rotating rod to move inwards, and further the clamping rods are driven to move, and the two groups of clamping rods are matched to clamp the wafer bearing device, so that the wafer bearing device and the wafer inside the wafer bearing device are prevented from moving during cleaning;

s3: when the water pump is started, the water pump pumps water from the water storage tank and then sprays pure water to the surface of the wafer through the spray header on the inner wall of the rotating ring, the spray header is provided with an angle which can spray the top and the bottom of the wafer simultaneously so as to start to wash the wafer, and when the negative pressure pump is started, the negative pressure pump absorbs rebounded water mist sprayed to the wafer through the absorption hole and the absorption port, so that the washed liquid medicine is prevented from washing and attaching to the surface of the wafer, and the washing effect is effectively improved;

s4: after clamping is finished, a cabinet door of the cleaning cabinet is closed, a rotating motor, a water pump and a negative pressure pump are started, when the rotating motor rotates, an output end can drive a first gear to rotate, the first gear can be meshed to drive a second gear to rotate, when the second gear rotates, a driving pulley can be driven to rotate, the driving pulley can drive three groups of driven pulleys to rotate through a belt, when the driving pulley and the three groups of driven pulleys rotate, four groups of rotating rollers can be driven to rotate, the rotating rollers can drive a rotating ring to rotate through a rotating groove, and meanwhile, as the driving pulley, the driven pulleys and the rotating rollers are matched with a lead screw through threads, a lifting plate can be driven to move up or down away from the lead screw during rotation, so that the cleaning effect on wafers with different heights can be good during rotation cleaning, the cleaning device is very suitable for cleaning of multiple groups, and the cleaning efficiency is greatly increased;

s5: the cleaning state is observed through the observation window in cooperation with the alarm lamp during cleaning, whether the cleaning is finished or not is checked, and whether the cleaning state is abnormal or not is observed.

Compared with the prior art, the utility model provides a semiconductor wafer belt cleaning device possesses following beneficial effect:

1. this semiconductor wafer cleaning device through set up spray assembly cooperation adsorption component at the rotating ring, can start spray assembly and carry out abluent while to the wafer, carries out effectual absorption to the anti-water smoke that rebounds of wafer, prevents to have the water smoke of liquid medicine to adhere to again on the wafer surface, causes secondary pollution, reduces the yield of wafer.

2. This semiconductor wafer belt cleaning device through setting up runner assembly cooperation spray assembly and adsorption component, can also reciprocate when rotating the multi-angle and carrying out abluent to also can have fine cleaning performance to the wafer of co-altitude not when rotating the washing, be applicable to very much that the multiunit washs, very big increase the cleaning efficiency.

3. According to the semiconductor wafer cleaning device, the clamping assembly is arranged on the inner wall of the cleaning cabinet and matched with the cleaning mechanism, so that the wafer bearing device with the wafer can be fixed, and the wafer bearing device and the wafer inside the wafer are prevented from moving during cleaning and damaging the surface of the wafer.

The part that does not relate to among the device all is the same with prior art or can adopt prior art to realize, the utility model discloses the washing liquid medicine that is applicable to very much the multiunit wafer remains to can effectively prevent that the water smoke from splashing and adhering to again on the wafer surface when wasing, effectively increase cleaning performance and cleaning efficiency, increase the wafer yield.

Drawings

Fig. 1 is a schematic structural diagram of a semiconductor wafer cleaning apparatus according to the present invention;

fig. 2 is a first schematic structural diagram of a cleaning cabinet of a semiconductor wafer cleaning apparatus according to the present invention;

fig. 3 is a schematic structural diagram of a cleaning cabinet of a semiconductor wafer cleaning apparatus according to the present invention;

fig. 4 is a first schematic structural diagram of a cleaning mechanism of a semiconductor wafer cleaning apparatus according to the present invention;

fig. 5 is a schematic structural diagram of a cleaning mechanism of a semiconductor wafer cleaning apparatus according to the present invention;

fig. 6 is a third schematic structural view of a cleaning mechanism of a semiconductor wafer cleaning apparatus according to the present invention;

fig. 7 is a fourth schematic structural view of a cleaning mechanism of a semiconductor wafer cleaning apparatus according to the present invention;

fig. 8 is a first schematic structural view of a clamping assembly of a semiconductor wafer cleaning apparatus according to the present invention;

fig. 9 is a schematic structural diagram of a clamping assembly of the semiconductor wafer cleaning apparatus according to the present invention.

In the figure: 1. a base plate; 101. a lifting plate; 102. a fluid infusion cabinet; 103. cleaning the cabinet; 104. an observation window; 105. an alarm lamp; 106. a slide bar; 107. rotating the motor; 108. a negative pressure pump; 109. a water pump; 110. A first hole; 111. a water receiving barrel; 2. a first gear; 201. a second gear; 202. a driving pulley; 203. a belt; 204. a driven pulley; 205. a rotating roller; 206. a screw rod; 207. a rotating ring; 208. A shower head; 209. an adsorption port; 210. an adsorption hole; 3. a cylinder; 301. a connecting frame; 302. a slider; 303. a toothed plate; 304. a half gear; 305. a first connecting rod; 306. a second connecting rod; 307. Rotating the rod; 308. a clamping lever; 309. a sheet holding device; 310. and (5) a wafer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Example (b):

referring to fig. 1-9, a semiconductor wafer cleaning device comprises a fluid infusion tank 102 and a cleaning tank 103, wherein the fluid infusion tank 102 is connected to the bottom of the cleaning tank 103, the cleaning tank 103 is internally connected with a water storage tank, a clamping assembly and a cleaning mechanism are arranged inside the cleaning tank 103, the clamping assembly is matched with the cleaning mechanism, the cleaning mechanism comprises a spraying assembly, a rotating assembly and an adsorption assembly, the spraying assembly and the adsorption assembly are matched with the rotating assembly, the bottom wall of the cleaning tank 103 is connected with a bottom plate 1, the top walls of the bottom plate 1 and the fluid infusion tank 102 are respectively provided with a first hole 110 for communication, the top of the bottom plate 1 is connected with a lead screw 206, the lead screw 206 is provided with four groups, the outer walls of the four groups of lead screws 206 are connected with a lifting plate 101, the rotating assembly is connected to the inner wall of the lifting plate 101, the inner wall of the cleaning tank 103 is connected with a slide bar 106, the outer wall of the slide bar 106 is slidably connected with a slide block 302, and the clamping assembly is connected to the outer wall of the slide block 302, the output of the clamping assembly is connected to a wafer 310.

The rotating assembly comprises a rotating motor 107, three groups of driven pulleys 204 of a driving pulley 202, the rotating motor 107 is connected to the side wall of the lifting plate 101, the output end of the rotating motor 107 is connected with a first gear 2, the first gear 2 is meshed with a second gear 201, the driving pulley 202 is connected to the top wall of the second gear 201, the driving pulley 202 and the three groups of driven pulleys 204 are connected to the bottom wall of the lifting plate 101 in a rotating mode, the driving pulley 202 and the second gear 201 are connected to the outer wall of a screw rod 206 in a rotating mode, and the driving pulley 202 and the second gear 201 are provided with threads and matched with the screw rod 206.

The outer wall of the driving pulley 202 is connected with a belt 203, the driving pulley 202 is connected with three groups of driven pulleys 204 through the belt 203, the driving pulley 202 and the three groups of driven pulleys 204 all penetrate through the top wall of the lifting plate 101 and extend upwards, the extending ends of the driving pulley 202 and the three groups of driven pulleys 204 are all connected with a rotating roller 205, the rotating roller 205 and the driven pulleys 204 are all matched with a screw rod 206, and the rotating roller 205 and the driven pulleys 204 are all provided with threads to be matched with the screw rod 206.

The top wall of the lifting plate 101 is provided with a second hole, the inner wall of the second hole is rotatably connected with a rotating ring 207, the outer wall of the rotating ring 207 is provided with a rotating groove, and the four groups of rotating rollers 205 are matched with the rotating groove.

The side wall of the lifting plate 101 is connected with a water pump 109, the water pumping end of the water pump 109 is communicated with a water storage tank, the inner wall of the rotating ring 207 is provided with two groups of spray heads 208, the spray heads 208 are communicated with the water delivery end of the water pump 109, the bottom of the lifting plate 101 is detachably connected with a water receiving barrel 111, and the water receiving barrel 111 is matched with the first hole 110 and the rotating ring 207.

The lifter plate 101 lateral wall is connected with negative pressure pump 108, and the absorption mouth 209 has been seted up to swivel ring 207 inner wall, and absorption hole 210 has all been seted up to swivel ring 207 roof and diapire, and absorption mouth 209 cooperatees with two sets of shower heads 208, and absorption hole 210 and absorption mouth 209 all are linked together with negative pressure pump 108.

Press from both sides dress subassembly and include cylinder 3 and link 301, cylinder 3 connects in link 301 top, and link 301 connects in sliding block 302 outer wall, and link 301 and sliding block 302 diapire and downwardly extending are passed to cylinder 3 output, and cylinder 3 extends the end and is connected with toothed plate 303, and cylinder 3 output cooperatees with sliding block 302.

The toothed plate 303 is engaged with a half gear 304, the half gear 304 is rotatably connected to the inner wall of the connecting frame 301, the side wall of the half gear 304 is connected with a first connecting rod 305, the bottom of the connecting frame 301 is rotatably connected with a second connecting rod 306, one ends, far away from the connecting frame 301, of the first connecting rod 305 and the second connecting rod 306 are rotatably connected with a rotating rod 307, one end, far away from the second connecting rod 306, of the rotating rod 307 is connected with clamping rods 308, the half gears 304 are symmetrically provided with two groups, the side wall of the clamping rod 308 is connected with a wafer bearing device 309, and 10-20 wafers 310 are loaded in the wafer bearing device 309.

An observation window 104 is arranged on the side wall of the cleaning cabinet 103, and an alarm lamp 105 is arranged at the top of the cleaning cabinet 103.

When the utility model is used, firstly, the water storage tank in the liquid supplementing cabinet 102 is filled with pure water, the water receiving barrel 111 is removed, the liquid in the water receiving barrel 111 is poured, and the wafer bearing device 309 provided with the wafer 310 is clamped in the cleaning cabinet 103;

the air cylinder 3 is started, the output end of the air cylinder 3 contracts to drive the toothed plate 303 to ascend, the toothed plate 303 ascends to be meshed with and drive the half gear 304 to rotate, the half gear 304 rotates to drive the first connecting rod 305 to rotate, when the first connecting rod 305 rotates, the second connecting rod 306 is matched to drive the rotating rod 307 to move inwards, and then the clamping rods 308 are driven to move, the two groups of clamping rods 308 are matched to clamp the wafer bearing device 309, and therefore the wafer bearing device 309 and the wafer 310 inside the wafer bearing device 309 are prevented from moving during cleaning;

when the water pump 109 is started, the water pump 109 pumps water from the water storage tank and then sprays pure water to the surface of the wafer 310 through the spray head 208 on the inner wall of the rotating ring 207, the spray head 208 is provided with an angle which can spray the top and the bottom of the wafer 310 at the same time, so that the wafer 310 is washed, when the negative pressure pump 108 is started, the negative pressure pump 108 absorbs rebounded water mist sprayed to the wafer 310 through the absorption hole 210 and the absorption port 209, the washed liquid medicine is prevented from washing and attaching to the surface of the wafer 310, and the washing effect is effectively improved;

after clamping is finished, the cabinet door of the cleaning cabinet 103 is closed, the rotating motor 107, the water pump 109 and the negative pressure pump 108 are started, when the rotating motor 107 rotates, the output end drives the first gear 2 to rotate, the first gear 2 is meshed with the second gear 201 to drive the second gear 201 to rotate, when the second gear 201 rotates, the driving pulley 202 drives the three groups of driven pulleys 204 to rotate through the belt 203, when the driving pulley 202 and the three groups of driven pulleys 204 rotate, the four groups of rotating rollers 205 are driven to rotate, the rotating rollers 205 drive the rotating ring 207 to rotate through the rotating groove, meanwhile, as the driving pulley 202, the driven pulleys 204 and the rotating rollers 205 are matched with the screw rod 206 through threads, the lifting plate 101 is driven to move up or down far away from the screw rod 206 during rotation, thereby having good cleaning effect on the wafer 310 with different heights during rotation cleaning, the cleaning machine is very suitable for cleaning multiple groups, and the cleaning efficiency is greatly improved;

during cleaning, the cleaning state is observed through the observation window 104 and the alarm lamp 105, and whether cleaning is finished and whether the cleaning state is abnormal is observed; the utility model discloses the washing liquid medicine that is particularly useful for multiunit wafer remains to can prevent effectively that the water smoke from splashing and adhering to again on the wafer surface when wasing, effectively increase cleaning performance and cleaning efficiency, increase the wafer yield.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims (9)

1. A semiconductor wafer cleaning device comprises a liquid supplementing cabinet (102) and a cleaning cabinet (103), and is characterized in that the liquid supplementing cabinet (102) is connected to the bottom of the cleaning cabinet (103), a water storage tank is connected to the interior of the cleaning cabinet (103), a clamping assembly and a cleaning mechanism are arranged in the cleaning cabinet (103), the clamping assembly is matched with the cleaning mechanism, the cleaning mechanism comprises a spraying assembly, a rotating assembly and an adsorption assembly, the spraying assembly and the adsorption assembly are matched with the rotating assembly, the bottom wall of the cleaning cabinet (103) is connected with a bottom plate (1), first holes (110) are formed in the top walls of the bottom plate (1) and the liquid supplementing cabinet (102) and communicated with each other, lead screws (206) are connected to the top of the bottom plate (1), four groups of the lead screws (206) are arranged, and lifting plates (101) are connected to the outer walls of the four groups of the lead screws (206), the rotating assembly is connected to the inner wall of the lifting plate (101), the inner wall of the cleaning cabinet (103) is connected with a sliding rod (106), the outer wall of the sliding rod (106) is connected with a sliding block (302) in a sliding mode, the clamping assembly is connected to the outer wall of the sliding block (302), and the output end of the clamping assembly is connected with a wafer (310).

2. The semiconductor wafer cleaning device according to claim 1, wherein the rotating assembly comprises a rotating motor (107) and three sets of driven pulleys (204) of a driving pulley (202), the rotating motor (107) is connected to a side wall of the lifting plate (101), the output end of the rotating motor (107) is connected with a first gear (2), the first gear (2) is connected with a second gear (201) in a meshing manner, the driving pulley (202) is connected to a top wall of the second gear (201), the driving pulley (202) and the three sets of driven pulleys (204) are both rotatably connected to a bottom wall of the lifting plate (101), the driving pulley (202) and the second gear (201) are both rotatably connected to an outer wall of the lead screw (206), and the driving pulley (202) and the second gear (201) are both provided with threads to be matched with the lead screw (206).

3. The semiconductor wafer cleaning device according to claim 2, wherein a belt (203) is connected to an outer wall of the driving pulley (202), the driving pulley (202) is connected to the three sets of driven pulleys (204) through the belt (203), the driving pulley (202) and the three sets of driven pulleys (204) both penetrate through a top wall of the lifting plate (101) and extend upwards, the extending ends of the driving pulley (202) and the three sets of driven pulleys (204) are connected to a rotating roller (205), the rotating roller (205) and the driven pulleys (204) both cooperate with the lead screw (206), and the rotating roller (205) and the driven pulleys (204) both have threads to cooperate with the lead screw (206).

4. The semiconductor wafer cleaning device according to claim 3, wherein a second hole is formed in the top wall of the lifting plate (101), a rotating ring (207) is rotatably connected to the inner wall of the second hole, a rotating groove is formed in the outer wall of the rotating ring (207), and four sets of the rotating rollers (205) are matched with the rotating groove.

5. The semiconductor wafer cleaning device according to claim 4, wherein the side wall of the lifting plate (101) is connected with a water pump (109), the water pumping end of the water pump (109) is communicated with the water storage tank, the inner wall of the rotating ring (207) is provided with two groups of spray heads (208), the spray heads (208) are communicated with the water delivery end of the water pump (109), the bottom of the lifting plate (101) is detachably connected with a water receiving barrel (111), and the water receiving barrel (111) is matched with the first hole (110) and the rotating ring (207).

6. The semiconductor wafer cleaning device according to claim 5, wherein a negative pressure pump (108) is connected to a side wall of the lifting plate (101), an absorption port (209) is formed in an inner wall of the rotating ring (207), absorption holes (210) are formed in both a top wall and a bottom wall of the rotating ring (207), the absorption port (209) is matched with the two groups of shower heads (208), and the absorption holes (210) and the absorption port (209) are communicated with the negative pressure pump (108).

7. The semiconductor wafer cleaning device according to claim 6, wherein the clamping assembly comprises a cylinder (3) and a connecting frame (301), the cylinder (3) is connected to the top of the connecting frame (301), the connecting frame (301) is connected to the outer wall of the sliding block (302), the output end of the cylinder (3) penetrates through the bottom walls of the connecting frame (301) and the sliding block (302) and extends downwards, the extending end of the cylinder (3) is connected with a toothed plate (303), and the output end of the cylinder (3) is matched with the sliding block (302).

8. The semiconductor wafer cleaning device according to claim 7, wherein the toothed plate (303) is engaged with a half gear (304), the half gear (304) is rotatably connected to the inner wall of the connecting frame (301), the side wall of the half gear (304) is connected with a first connecting rod (305), the bottom of the connecting frame (301) is rotatably connected with a second connecting rod (306), one ends of the first connecting rod (305) and the second connecting rod (306) far away from the connecting frame (301) are rotatably connected with a rotating rod (307), one ends of the rotating rod (307) far away from the second connecting rod (306) are connected with clamping rods (308), the half gears (304) are symmetrically provided with two groups, the side wall of the clamping rods (308) is connected with a wafer bearing device (309), and 10-20 wafers (310) are loaded in the wafer bearing device (309).

9. The semiconductor wafer cleaning device according to claim 8, wherein the side wall of the cleaning cabinet (103) is provided with an observation window (104), and the top of the cleaning cabinet (103) is provided with an alarm lamp (105).

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