CN214206003U - Dysmorphism printing board embedment frock - Google Patents
Dysmorphism printing board embedment frock Download PDFInfo
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- CN214206003U CN214206003U CN202023030838.5U CN202023030838U CN214206003U CN 214206003 U CN214206003 U CN 214206003U CN 202023030838 U CN202023030838 U CN 202023030838U CN 214206003 U CN214206003 U CN 214206003U
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Abstract
The utility model discloses a special-shaped printed board filling and sealing tool, which comprises a first upper board and a lower board, wherein the first upper board is provided with at least one first through groove, and the lower board is provided with at least one second through groove; during encapsulation, the first upper plate is abutted to the upper surface of the printed board, devices on the upper surface of the printed board penetrate through the first through groove, the lower plate is abutted to the lower surface of the printed board, and the devices on the lower surface of the printed board penetrate through the second through groove. Utilize the utility model discloses when the embedment is gone into to the printing board, the position that does not have the installation device on printing board surface can with first upper plate and hypoplastron butt to can avoid the printing board to need not embedment department glue solution overflow, solve the problem of follow-up clear glue difficulty.
Description
Technical Field
The utility model belongs to the technical field of experimental engineering, concretely relates to dysmorphism printing board embedment frock.
Background
In the production process of high-reliability electronic equipment, in order to ensure the whole internal environmental force of a product, the printed board assembly welded in the equipment needs to be automatically encapsulated. In the process of encapsulating the printed board, because the printed board is irregular in appearance, devices need to be encapsulated on the front side and the back side, the heights of the devices on the printed board are not uniform, and the encapsulation glue solution cannot be completely isolated by the conventional partition. Meanwhile, the south large 704 glue used for encapsulation has fluidity and long curing time, so that glue solution overflows everywhere, glue solution is left at the position where the encapsulation is not needed even for the printed board, subsequent glue cleaning is very difficult, and devices on the printed board can be damaged.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a dysmorphism printing board embedment frock to solve the problem that printing board embedment in-process glue solution overflows.
For the above-mentioned problem of technique, the utility model discloses a technical scheme is: a special-shaped printed board filling and sealing tool comprises a first upper board and a lower board, wherein at least one first through groove is formed in the first upper board, and at least one second through groove is formed in the lower board; during encapsulation, the first upper plate is abutted to the upper surface of the printed board, devices on the upper surface of the printed board penetrate through the first through groove, the lower plate is abutted to the lower surface of the printed board, and the devices on the lower surface of the printed board penetrate through the second through groove.
When the printed board is encapsulated, the part of the surface of the printed board without the mounted device is abutted against the first upper board and the lower board, so that glue solution can be prevented from overflowing at the part of the printed board which does not need encapsulation.
Preferably, the device further comprises a second upper board, the second upper board is provided with at least one third through groove, and when the second upper board is connected with the first upper board, the device part on the upper surface of the printed board penetrates through the third through groove.
Because the height of the devices on the printed board is not uniform, after the first encapsulation is completed, the second upper board is additionally arranged above the first upper board, so that the devices with higher height can pass through the third through groove, and the encapsulation requirement of the devices with higher height can be met.
Preferably, the first upper plate, the second upper plate and the lower plate are all made of polytetrafluoroethylene, so that subsequent glue cleaning is facilitated.
Preferably, the first upper plate, the second upper plate and the lower plate are all provided with threaded holes.
The utility model has the advantages that: the utility model can prevent the damage of printed board devices caused by glue solution overflow and subsequent glue cleaning, ensure the encapsulating quality of the printed board, improve the production efficiency and reduce the production cost; the utility model discloses can satisfy the embedment requirement of unidimensional printing board subassembly, the embedment requirement of not co-altitude device can be satisfied in the stack of multilayer upper plate.
Drawings
Fig. 1 is a schematic structural view of a first upper plate in the present invention;
fig. 2 is a schematic structural view of the middle-lower plate of the present invention;
fig. 3 is a schematic structural view of a second upper plate in the present invention;
fig. 4 is an assembly view of the present invention.
Detailed Description
As shown in fig. 1 to 4, the special-shaped printed board potting tool comprises a first upper board 1, a lower board 2 and a second upper board 3. The first upper plate 1 is provided with at least one first through groove 1A, and the lower plate 2 is provided with at least one second through groove 2A; the second upper plate 3 is provided with at least one third through groove 3A. Threaded holes are formed in the first upper plate 1, the second upper plate 3 and the lower plate 2.
When the printed board is encapsulated, the first upper board 1 is abutted to the upper surface of the printed board and ensures that devices on the upper surface of the printed board pass through the first through groove 1A, the first upper board 1 is fastened on the printed board through screws, the lower board 2 is abutted to the lower surface of the printed board and ensures that devices on the lower surface of the printed board pass through the second through groove 2A, and then the lower board 2 is fastened on the printed board through screws. And finally, placing the printed board into a filling and sealing machine for first filling and sealing.
If a device with a higher height is designed on the upper surface of the printed board, the second upper board 3 is fixed on the first upper board 1 through screws, the device with the higher height is ensured to pass through the third through groove 3A, and then the printed board is placed into a filling and sealing machine for secondary filling and sealing, so that filling and sealing of the devices with different heights are realized.
First upper plate 1, hypoplastron 2 and second upper plate 3 all adopt polytetrafluoroethylene material preparation in this embedment frock for follow-up clear glue is simple good operation because polytetrafluoroethylene and casting glue are peeled off well.
Claims (4)
1. The special-shaped printed board encapsulating tool is characterized by comprising a first upper board (1) and a lower board (2), wherein the first upper board (1) is provided with at least one first through groove (1A), and the lower board (2) is provided with at least one second through groove (2A); during encapsulation, the first upper plate (1) is abutted to the upper surface of the printed board, devices on the upper surface of the printed board penetrate through the first through groove (1A), the lower plate (2) is abutted to the lower surface of the printed board, and the devices on the lower surface of the printed board penetrate through the second through groove (2A).
2. The special-shaped printed board potting tool according to claim 1, further comprising a second upper board (3), wherein the second upper board (3) is provided with at least one third through groove (3A), and when the second upper board (3) is connected with the first upper board (1), a device part on the upper surface of the printed board passes through the third through groove (3A).
3. The special-shaped printed board potting tool according to claim 2, wherein the first upper board (1), the second upper board (3) and the lower board (2) are all made of polytetrafluoroethylene.
4. The special-shaped printed board potting tool according to claim 2, wherein the first upper board (1), the second upper board (3) and the lower board (2) are provided with threaded holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023030838.5U CN214206003U (en) | 2020-12-16 | 2020-12-16 | Dysmorphism printing board embedment frock |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023030838.5U CN214206003U (en) | 2020-12-16 | 2020-12-16 | Dysmorphism printing board embedment frock |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214206003U true CN214206003U (en) | 2021-09-14 |
Family
ID=77652957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023030838.5U Active CN214206003U (en) | 2020-12-16 | 2020-12-16 | Dysmorphism printing board embedment frock |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214206003U (en) |
-
2020
- 2020-12-16 CN CN202023030838.5U patent/CN214206003U/en active Active
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