CN214205941U - Printed circuit board - Google Patents
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- CN214205941U CN214205941U CN202022591434.7U CN202022591434U CN214205941U CN 214205941 U CN214205941 U CN 214205941U CN 202022591434 U CN202022591434 U CN 202022591434U CN 214205941 U CN214205941 U CN 214205941U
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Abstract
The utility model provides a printed circuit board, from interior to exterior includes base plate, conducting wire layer and circuit board solder mask in proper order, the circuit board solder mask hinders the region including the non-and hinders the region, first hinder the region and the second hinders and welds the region, the non-hinders the region and runs through the circuit board solder mask with the conducting wire layer is connected, first hinder the region encircle in the non-hinders region week side, the second hinders the region and encircles first hinder the at least one side of hindering the region, first hinder the reflectivity that the region is 430 and the light of 700nm for the wavelength is less than or equal to the second hinders the reflectivity of region for 430 and 700 nm's light of wavelength. The utility model provides a printed circuit board has different reflectivity, can help LED to realize better luminous effect.
Description
Technical Field
The utility model belongs to printed circuit board preparation field, concretely relates to printed circuit board.
Background
Printed Circuit Boards (PCBs) are substrates for mounting and connecting various electronic components in modern electronic devices, and are the largest industry in the electronic industry, and the production value and the sales amount account for 16% of the total production value and the total sales amount of electronic components in the world. In recent years, the development speed of the PCB industry in China is steadily increased, the output value and the yield already account for the 1 st position in the world, and the annual increment rate reaches 18 percent.
Solder resist ink is one of important materials required in the manufacture of Printed Circuit Boards (PCBs), is a special coat covering the outer layer of the PCB, is used for preventing short Circuit between lines when various elements are welded, simultaneously adjusts the adhesion amount of soldering tin, reduces the dissolution pollution of copper in welding lines, and finally achieves the purposes of saving soldering tin materials, increasing insulation degree, adapting to high density of wiring, avoiding rosin joint, protecting circuits from oxidation scratch, improving inspection speed and the like.
The LED backlight module needs to use a PCB carrier plate made of white photosensitive solder resist ink, and has higher and higher requirements on the reflectivity of a solder resist layer formed by the white photosensitive solder resist ink along with the development of the technology.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art, the utility model provides a printed circuit board has different reflectivity, can help LED to realize better luminous effect.
The utility model provides a printed circuit board, from interior to exterior includes base plate, conducting wire layer and circuit board solder mask in proper order, the circuit board solder mask hinders the region including the non-and hinders the region, first hinder the region and the second hinders and welds the region, the non-hinders the region and runs through the circuit board solder mask with the conducting wire layer is connected, first hinder the region encircle in the non-hinders region week side, the second hinders the region and encircles first hinder the at least one side of hindering the region, first hinder the reflectivity that the region is 430 and the light of 700nm for the wavelength is less than or equal to the second hinders the reflectivity of region for 430 and 700 nm's light of wavelength.
Preferably, the reflectivity of the first solder mask area to light with the wavelength of 430-700nm is 80% -88%; the reflectivity of the second solder mask area to light with the wavelength of 430-700nm is 90-94%.
Preferably, the average thickness of the first solder resist area is less than the average thickness of the second solder resist area.
Preferably, the average thickness of the first solder mask area is 15-40um, and the average thickness of the second solder mask area is 30-80 um.
Preferably, the first solder resist area has N layers in a thickness direction, the second solder resist area has M layers in the thickness direction, and N is smaller than M.
Preferably, the circuit board solder mask includes first white sensitization solder mask and the white sensitization solder mask of second, first white sensitization solder mask and the white sensitization solder mask of second from interior to exterior setting, first white sensitization solder mask encircles regional week side formation is hindered to the non-first resistance welds the region, second white sensitization solder mask cover in first resistance welds on the first white sensitization solder mask of the at least one side of regional week side, forms the region is hindered to the second.
Preferably, the first white photosensitive solder resist layer and the second white photosensitive solder resist layer are each formed of an alkali development type photosensitive resin composition.
Preferably, the circuit board solder mask layer comprises a plurality of non-solder mask areas and a plurality of first solder mask areas, in a top view direction of the printed circuit board, the plurality of first solder mask areas are arranged at intervals in the first direction in the second solder mask area, and the second solder mask area surrounds two sides of each first solder mask area in the first direction; the plurality of non-solder-resisting areas are respectively arranged in the plurality of first solder-resisting areas, the plurality of first solder-resisting areas respectively surround the periphery of the plurality of non-solder-resisting areas, and the plurality of non-solder-resisting areas are separated by the first solder-resisting areas;
or each first solder mask area is provided with a plurality of non-solder mask areas, the non-solder mask areas are arranged in each first solder mask area at intervals along the second direction, the first solder mask areas surround the periphery of each non-solder mask area, and the first direction is perpendicular to the second direction;
or, a plurality of first resistance welding areas are distributed in a plurality of rows and columns at intervals in the second resistance welding area, adjacent first resistance welding areas are separated by the second resistance welding area, a plurality of non-resistance welding areas are respectively located in the first resistance welding area, and a plurality of non-resistance welding areas are separated by the first resistance welding area and the second resistance welding area.
Preferably, a plurality of mounting positions are circumferentially arranged on the periphery side of the non-solder-resisting area, and the mounting positions are positioned in the first solder-resisting area;
the printed circuit board further comprises a light-emitting element and a light distribution component, wherein the light-emitting element is mounted in the non-solder-resisting area and is connected with the conductive circuit board; the mounting position is used for mounting the light distribution component.
Preferably, the light distribution member is a lens, the lens covers the light emitting element, and the lens covers the first solder resist area.
The utility model provides a printed circuit board has different reflectivity, can help LED to realize better luminous effect.
Drawings
The foregoing and other objects, features and advantages of the invention will be apparent from the following more particular description of preferred embodiments of the invention, as illustrated in the accompanying drawings. Like reference numerals refer to like parts throughout the drawings, and the drawings are not intended to be drawn to scale in actual dimensions, emphasis instead being placed upon illustrating the principles of the invention.
Fig. 1 is a schematic top view of a printed circuit board according to embodiment 1 of the present invention.
Fig. 2 is a schematic top view of a printed circuit board according to embodiment 2 of the present invention.
Fig. 3 is a schematic top view of a printed circuit board according to embodiment 3 of the present invention.
Fig. 4 is a schematic side view of a printed circuit board according to an embodiment of the present invention.
Wherein: 10. a substrate; 20. a light emitting element; 31 a first solder resist area; 32. a second solder resist area; 33. A non-solder-resist region; 41. a first white photosensitive solder resist layer; 42. a second white photosensitive solder resist layer; 50. a conductive circuit layer; 60. a light distribution member; 61. mounting position; a. a first direction; b. a second direction.
Detailed Description
The technical solution of the present invention is further described in detail with reference to the following embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not limited to the present invention.
Referring to fig. 1-4, the utility model provides a printed circuit board, from interior to exterior includes base plate 10, conducting wire layer 50 and circuit board solder mask in proper order, look down from printed circuit board overlook the direction, circuit board solder mask includes that the non-hinders welds regional 33, first hinders and welds regional 31 and second and hinders and weld regional 32, the non-hinders and welds regional 33 and run through circuit board solder mask and be connected with conducting wire layer 50, first hinder and weld regional 31 and encircle and weld regional 33 week side at the non-, the second hinders regional 32 and encircles first at least one side of hindering regional 31 of hindering, for example encircle first one side, relative both sides, three sides or week side of hindering regional 31, first hinder and weld regional 31 and be less than or equal to the second and hinder the reflectance of regional 32 to the wavelength of the light of 430 and 700 nm.
In the printed circuit board provided by this embodiment, the first solder resist region 31 is disposed around the non-solder resist region 33, and the second solder resist region 32 is disposed away from the non-solder resist region 33, the non-solder resist region 33 in this embodiment can be used to mount the light emitting element 20, and the reflectance of the first solder resist region 31 is lower than that of the second solder resist region 32, so that the obtained printed circuit board has different emissivity, and different dimming effects can be achieved.
In a preferred embodiment, the first solder resist region 31 has a reflectivity of 80% -88% for light with a wavelength of 430-700 nm; the second solder resist region 42 has a reflectivity of 90-94% for light having a wavelength of 430-700 nm.
The reflectance in this example was measured using a spectrocolorimeter CM-26 d.
Referring to fig. 4, in a preferred embodiment, the average thickness of first solder resist area 31 is less than the average thickness of second solder resist area 32.
Referring to fig. 4, in a preferred embodiment, first solder resist region 31 has an average thickness of 15-40um and second solder resist region 32 has an average thickness of 30-80 um.
Referring to fig. 4, in a preferred embodiment, first solder resist area 31 has N layers in the thickness direction and second solder resist area 32 has M layers in the thickness direction, N being less than M. N and M are positive integers in this embodiment, and for example, the first solder resist area 31 has 1 layer in the thickness direction, and the second solder resist area 32 has 2 layers in the thickness direction. The difference in the reflectance of the first solder resist area 31 and the second solder resist area 32 can be achieved by the difference in the number of layers of the applied ink in this embodiment.
Referring to fig. 4, in a preferred embodiment, the circuit board solder mask layer includes a first white photosensitive solder mask layer 41 and a second white photosensitive solder mask layer 42, the first white photosensitive solder mask layer 41 and the second white photosensitive solder mask layer 42 are disposed from inside to outside, the first white photosensitive solder mask layer 41 surrounds the non-solder mask region 33 to form a first solder mask region 31, and the second white photosensitive solder mask layer 42 covers the first white photosensitive solder mask layer 41 on at least one side of the first solder mask region 31 to form a second solder mask region 32.
In a preferred embodiment, the first white photosensitive solder resist layer 41 and the second white photosensitive solder resist layer 42 are each formed of an alkali development type photosensitive resin composition.
Referring to fig. 4, in a preferred embodiment, the printed circuit board further includes a light emitting element 20 and a light distribution member 60, the light emitting element 20 being mounted in the non-solder-resist region 33 in connection with the conductive wiring layer 50; the light distribution member is mounted in the first solder resist area 31 and covers the first solder resist area 31. The output light angle is adjusted to a certain value by using a light distribution device 60 such as a reflector, a condenser, a lens or a prism according to the effect requirement.
Referring to fig. 4, in a preferred embodiment, the light distribution member 60 is a lens, which covers the light emitting element 20, and which covers the first solder resist area 31. In this embodiment, the lens may cover the first solder resist area 31 completely, but not the second solder resist area 32. It is however also possible that part of the lens covers the second solder resist area 32.
Referring to fig. 4, in a preferred embodiment, the circuit board solder mask layer includes a non-solder-resist area 33, a first solder-resist area 31, a second solder-resist area 32, the non-solder-resist area 33 is connected with the conductive circuit layer 50 through the first white photosensitive solder-resist layer 41 and the second white photosensitive solder-resist layer 42 in the thickness direction, the first white photosensitive solder-resist layer 41 of the first solder-resist area 31 is not covered by the second white photosensitive solder-resist layer 42 and is exposed to the air; the first white photosensitive solder resist layer 41 of the second solder resist area 32 is covered by the second white photosensitive solder resist layer 42.
Referring to fig. 2, in a preferred embodiment, the circuit board solder mask layer includes a plurality of non-solder resist areas 33 and a plurality of first solder resist areas 31, the plurality of first solder resist areas 31 are arranged at intervals in a first direction a in a second solder resist area 32 in a top view direction of the printed circuit board, the second solder resist area 32 surrounds both sides of each first solder resist area 31 in the first direction a; the plurality of non-solder resist areas 33 are respectively provided in the plurality of first solder resist areas 31, the plurality of first solder resist areas 31 are respectively surrounded on the periphery side of the plurality of non-solder resist areas 33, and the plurality of non-solder resist areas 33 are divided by the first solder resist areas 31.
Referring to fig. 3, in another preferred embodiment, a plurality of non-solder-resist areas 33 are disposed in each first solder-resist area 31, the plurality of non-solder-resist areas 33 are arranged at intervals in the second direction b in each first solder-resist area 31, the first solder-resist area 31 surrounds the periphery of each non-solder-resist area 33, and the first direction a is perpendicular to the second direction b.
Referring to fig. 1, in another preferred embodiment, a plurality of first solder resist areas 31 are distributed in a plurality of rows and columns in the second solder resist area 32, adjacent first solder resist areas 31 are separated by the second solder resist area 32, a plurality of non-solder resist areas 33 are respectively located in the first solder resist areas 31, and a plurality of non-solder resist areas 33 are separated by the first solder resist areas 31 and the second solder resist areas 32.
Referring to fig. 2 and 3, in a preferred embodiment, each non-solder resist area 33 is circumferentially provided with a plurality of mounting locations 61, the mounting locations 61 being disposed within the first solder resist area 31. In the embodiment, 4 mounting positions 61 are circumferentially arranged on the periphery of each non-solder-resisting area 33, the non-solder-resisting area 33 is used for mounting a light-emitting element, the mounting positions are used for mounting the optical component 60, and the optical component 60 can better coat the light-emitting element. The light distribution member 60 in this embodiment is made of a transparent material, and can allow light of the light emitting element to penetrate therethrough.
Referring to fig. 1-4, the embodiment of the present invention provides a circuit board solder mask, including first white sensitization solder mask 41 and second white sensitization solder mask 42 that range upon range of setting, second white sensitization solder mask 42 sets up in the top of first white sensitization solder mask 41, and first white sensitization solder mask 41 and second white sensitization solder mask 42 are formed by alkali development type photosensitive resin composition, and alkali development type photosensitive resin composition includes lithography resin, photoinitiator and titanium oxide. Titanium oxide in this example can be obtained using titanium dioxide. The utility model provides a photoetching resin is the resin that can realize exposure and development process.
The utility model discloses a two-layer sensitization is range upon range of adding in the coating and is realized that the solder mask has higher reflectivity. The utility model discloses the people discovers that the solder mask that the coating of sensitization printing ink obtained also is difficult to promote its reflectivity even increase coating thickness, the utility model discloses a two-layer sensitization is range upon range of to be added and to realize that the solder mask has higher reflectivity, the utility model provides a solder mask reflectivity is greater than 92%.
In a preferred embodiment, the circuit board solder mask is formed by laminating a first white photosensitive solder mask layer 41 and a second white photosensitive solder mask layer 42.
In a preferred embodiment, the reflectivity of the first white photosensitive solder mask layer 41 to light with the wavelength of 430-700nm is 80% -88%; the reflectivity of the second white photosensitive solder mask layer 42 to light with the wavelength of 430-700nm is 90-94%.
In a preferred embodiment, the reflectivity of the first white photosensitive solder mask layer 41 to the light with the wavelength of 430-700nm is less than or equal to the reflectivity of the second white photosensitive solder mask layer 42 to the light with the wavelength of 430-700 nm. The reflectivity of the solder mask obtained by covering the first white photosensitive solder mask layer 41 and the second white photosensitive solder mask layer 42 together is high, and the reflectivity of the solder mask covered by only the first white photosensitive solder mask layer 41 is low. When the circuit board solder mask is applied to the circuit board with the light-emitting element 20, the peripheral reflectivity of the light-emitting element 20 can be lower, and the area far away from the light-emitting element 20 can have very high reflectivity, so that a better display effect is realized. The utility model component that indicates in this embodiment is the LED lamp. In this embodiment, the difference in reflectivity can be adjusted by adjusting the dosage ratio of the titanium oxide and the polyacrylic acid photolithographic resin, the difference in reflectivity can be adjusted by adjusting the coating thickness, and the difference in reflectivity can be adjusted by adjusting the number of layers of the coating.
In a preferred embodiment, the coated area of the first white photosensitive solder resist layer 41 is larger than the coated area of the second white photosensitive solder resist layer 42, the second white photosensitive solder resist layer 42 covers a part of the first white photosensitive solder resist layer 41, and another part of the first white photosensitive solder resist layer 41 is exposed to the air. The circuit board has the advantage that different positions on the solder mask layer of the circuit board can have different reflectivity.
In a preferred embodiment, the circuit board solder mask layer is formed with a plurality of spaced apart non-solder mask regions 33 penetrating the first white photosensitive solder mask layer 41 and the second white photosensitive solder mask layer 42 in the thickness direction, the plurality of non-solder mask regions 33 are separated by the first white photosensitive solder mask layer 41, and at least a part of the first white photosensitive solder mask layer 41 on the peripheral side of the non-solder mask regions 33 is not covered by the second white photosensitive solder mask layer 42 and is exposed to the air. The non-solder-resist region 33 penetrates the second white photosensitive solder resist layer 42 in this embodiment, and should not be limited to the second white photosensitive solder resist layer 42 surrounding the non-solder-resist region 33 on the periphery side, and it is also possible that the second white photosensitive solder resist layer 42 surrounds the non-solder-resist region 33 on opposite sides. In the present embodiment, at least a part of the first white photosensitive solder resist layer 41 on the peripheral side of the non-solder resist region 33 is not covered with the second white photosensitive solder resist layer 42 and is exposed to the air. The non-solder resist area 33 in the present embodiment can be used for mounting the light emitting element 20.
In a preferred embodiment, in the alkali-developable photosensitive resin composition, the weight ratio of the photolithographic resin to the titanium oxide is 1: (1-2). In this embodiment, the solder mask layer has a very high reflectivity at the position covered by both the first white photosensitive solder mask layer 41 and the second white photosensitive solder mask layer 42, which is achieved by a reasonable weight ratio of the polyacrylic acid photo-etching resin to the titanium oxide.
In a preferred embodiment, the circuit board solder mask layer comprises a non-solder mask area 33, a first solder mask area 31 and a second solder mask area 32, the first white photosensitive solder mask layer 41 is a single layer to obtain the first solder mask area 31, and the first white photosensitive solder mask layer 41 and the second white photosensitive solder mask layer 42 are a stack to obtain the second solder mask area 32. In the present embodiment, the non-solder-resist region 33 penetrates through the first white photosensitive solder resist layer and the second white photosensitive solder resist layer in the thickness direction, the first solder resist region 31 surrounds the periphery of the non-solder-resist region 33, the second solder resist region 32 surrounds at least one side of the first solder resist region 31, preferably the two sides of the first solder resist region 31, which are oppositely disposed, and the thickness of the first solder resist region 31 is smaller than that of the second solder resist region 32. In the present embodiment, the thickness of the first solder resist area 31 is specifically the thickness of the first white photosensitive solder resist layer 41, and the thickness of the second solder resist area 32 is the sum of the thicknesses of the first white photosensitive solder resist layer and the second white photosensitive solder resist layer.
In a preferred embodiment, the average thickness of the first white photosensitive solder mask layer is 15-40um, and the average thickness of the second white photosensitive solder mask layer is 15-40 um.
In a preferred embodiment, the alkali developable photosensitive resin composition has titanium oxide in the range of 20% to 45% of the total composition ingredients. The double-layer photosensitive layer can ensure the processes of exposure, development and the like, and has stronger reflectivity after being superposed.
In a preferred embodiment, the photoresist resin comprises polyacrylic acid photoresist resin, and the alkali-developable photosensitive resin composition further comprises epoxy resin and polyfunctional acrylic monomer, wherein the polyacrylic acid photoresist resin comprises 35-55 parts by weight, the photoinitiator comprises 2-10 parts by weight, the titanium oxide comprises 45-85 parts by weight, the epoxy resin comprises 25-55 parts by weight, and the polyfunctional acrylic monomer comprises 15-30 parts by weight. In this embodiment, the solder mask layer with a very high reflectivity at the position covered by the first white photosensitive solder mask layer 41 and the second white photosensitive solder mask layer 42 is obtained by reasonably matching the polyacrylic acid photo-etching resin, the photoinitiator, the titanium oxide, the epoxy resin and the multifunctional acrylic monomer.
In a preferred embodiment, the alkali-developable photosensitive resin composition comprises, by weight, 35 to 55 parts of polyacrylic acid photoresist resin, 2 to 10 parts of photoinitiator, 45 to 85 parts of titanium oxide, 25 to 55 parts of epoxy resin, and 15 to 30 parts of polyfunctional acrylic monomer. In a further preferred embodiment, the acrylic acid photo-etching resin comprises 40-50 parts by weight of polyacrylic acid photo-etching resin, 2-8 parts by weight of photoinitiator, 50-80 parts by weight of titanium oxide, 30-50 parts by weight of epoxy resin and 16-24 parts by weight of polyfunctional acrylic monomer.
In a preferred embodiment, the alkali development type photosensitive resin composition comprises a main agent and a curing agent, wherein the main agent comprises 35-55 parts by weight of polyacrylic acid photoetching resin, 25-55 parts by weight of titanium oxide, 2-10 parts by weight of photoinitiator and 0.1-15 parts by weight of other auxiliary agents, and the curing agent comprises 25-55 parts by weight of epoxy resin, 10-30 parts by weight of polyfunctional group acrylic monomer, 15-35 parts by weight of titanium oxide, 0.1-5 parts by weight of melamine, 0.5-4 parts by weight of auxiliary agent and 5-20 parts by weight of solvent.
In a preferred embodiment, the alkali development type photosensitive resin composition is obtained by mixing a main agent and a curing agent, wherein the main agent comprises 35-55 parts by weight of polyacrylic acid photoetching resin, 25-55 parts by weight of titanium oxide, 2-10 parts by weight of photoinitiator and 0.1-15 parts by weight of other auxiliary agents, and the curing agent comprises 25-55 parts by weight of epoxy resin, 10-30 parts by weight of polyfunctional group acrylic monomer, 15-35 parts by weight of titanium oxide, 0.1-5 parts by weight of melamine, 0.5-4 parts by weight of auxiliary agent and 5-20 parts by weight of solvent.
In a further preferred embodiment, the other auxiliary agents are a dispersing agent, a leveling agent, an antioxidant, a defoaming agent and fumed silica; the auxiliary agents are a dispersing agent and gas phase silicon dioxide; the main agent consists of 35 to 55 parts of polyacrylic acid photoetching resin, 25 to 55 parts of titanium oxide, 2 to 10 parts of photoinitiator, 0.1 to 1.5 parts of dispersant, 0.05 to 0.8 part of flatting agent, 0.1 to 3 parts of antioxidant, 0.1 to 5 parts of defoaming agent and 0.1 to 4 parts of fumed silica; the curing agent consists of 25 to 55 parts of epoxy resin, 10 to 30 parts of polyfunctional group acrylic monomer, 15 to 35 parts of titanium dioxide, 0.1 to 5 parts of melamine, 5 to 20 parts of solvent, 0.1 to 1.5 parts of dispersant and 0.1 to 5 parts of fumed silica.
In a further preferred embodiment, the main agent consists of 40-50 parts of polyacrylic acid photoetching resin, 30-50 parts of titanium oxide, 2-8 parts of photoinitiator, 0.2-0.8 part of dispersant, 0.1-0.4 part of flatting agent, 0.2-1 part of antioxidant, 0.5-2 parts of defoaming agent and 0.5-2 parts of fumed silica; the curing agent consists of 30 to 50 parts of epoxy resin, 16 to 24 parts of polyfunctional group acrylic monomer, 20 to 30 parts of titanium dioxide, 0.5 to 2 parts of melamine, 5 to 15 parts of solvent, 0.2 to 0.8 part of dispersant and 0.5 to 2 parts of fumed silica.
In a preferred embodiment, the weight ratio of the main agent to the curing agent is (1-2): (1-2).
In a preferred embodiment, the photoinitiator comprises photoinitiator TPO, photoinitiator 819 and photoinitiator 784, and the weight ratio of the photoinitiator TPO, the photoinitiator 819 and the photoinitiator 784 is (0.5-5): (0.5-5): (0.01-0.1).
In a preferred embodiment, the multifunctional acrylic monomer comprises a trifunctional acrylic monomer and/or a difunctional acrylic monomer, and the trifunctional acrylic monomer comprises one or more of tris (2-hydroxyethyl) isocyanurate triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, trimethylolpropane triacrylate, and ethoxylated trimethylolpropane triacrylate; the bifunctional acrylic monomer comprises one or more of hexanediol diacrylate, dipropylene glycol diacrylate, neopentyl glycol diacrylate, MPGDA and 2-hydroxyethyl methacrylate phosphate.
Referring to fig. 1-3, the utility model also provides a printed circuit board, from interior to exterior include base plate, conducting wire layer 50 and circuit board solder mask in proper order, first white sensitization solder mask and the white sensitization solder mask of second from interior to exterior setting. The outer side is the side visible to the user, and the side view of the printed circuit board can be referred to from inside to outside in this embodiment, as shown in fig. 3.
Referring to fig. 1-3, in a preferred embodiment, the area of the first white photosensitive solder resist layer covering the conductive trace layer 50 is larger than the area of the second white photosensitive solder resist layer covering the trace layer. The coverage area referred to in this embodiment is an area obtained from a top view of the printed circuit board.
Referring to fig. 1 to 4, in a preferred embodiment, the printed circuit board further includes a light emitting element connected to the conductive wiring layer 50 through the first white photosensitive solder resist layer and the second white photosensitive solder resist layer in a thickness direction of the solder resist layer of the circuit board (refer to fig. 3). The first white photosensitive solder resist layer is surrounded on the light emitting element peripheral side from the second white photosensitive solder resist layer, for example, the second white photosensitive solder resist layer is surrounded on one side, both sides, three sides or the peripheral side of the light emitting element, as viewed from the top of the printed circuit board (refer to fig. 1-2). At least part of the first white photosensitive solder resist layer on the light emitting element peripheral side is not covered by the second white photosensitive solder resist layer and is exposed to the air. The area of the peripheral side of the light-emitting element, which is not covered by the second white photosensitive solder mask layer, is only provided with the first white photosensitive solder mask layer, so that the reflectivity is reduced.
In a preferred embodiment, the printed circuit board further comprises a light distribution member 60, the light distribution member 60 is connected with the first white photosensitive solder resist layer through the second white photosensitive solder resist layer; that is, the light distribution member 60 is mounted on the first white photosensitive solder resist layer, and the light distribution member 60 may cover the first white photosensitive solder resist layer which is not covered with the second white photosensitive solder resist layer and is exposed to the air on the light emitting element peripheral side. The second white photosensitive solder mask covers the first white photosensitive solder mask on at least one side of the peripheral side of the light distribution component 60, that is, the second white photosensitive solder mask covers the first white photosensitive solder mask on one side, two sides or three sides of the light distribution component 60.
In a preferred embodiment, the light distribution member 60 is a lens, the lens covers the light emitting element, and at least a part of the first white photosensitive solder resist layer on the periphery side of the light emitting element is not covered by the second white photosensitive solder resist layer and is covered by the lens, the part being exposed to the air.
In a preferred embodiment, the printed circuit board comprises a plurality of light emitting elements separated by a first white photosensitive solder resist layer. The light emitting element in this embodiment is an LED.
The embodiment of the utility model provides a still provide a preparation method of printed circuit board, include following step:
covering a circuit board solder mask on the outer surface of the substrate with the conductive circuit layer 50, wherein the first white photosensitive solder mask and the second white photosensitive solder mask are arranged from inside to outside; in a specific manufacturing process, the first white photosensitive solder mask layer may be coated first, and the conductive circuit layer 50 is exposed by etching, so as to obtain a soldering area, that is, the non-solder mask area 33 in this embodiment. And then coating the first white photosensitive solder mask layer by screen printing to obtain a second white photosensitive solder mask layer, wherein at least one part of the first white photosensitive solder mask layer on the periphery of the non-solder-mask region 33 is not covered by the second white photosensitive solder mask layer.
Mounting a light-emitting element in a non-welding area, enabling the light-emitting element to penetrate through a first white photosensitive solder mask and a second white photosensitive solder mask to be connected with the conducting circuit layer 50, enabling the first white photosensitive solder mask to surround the periphery of the light-emitting element, enabling the second white photosensitive solder mask to surround at least one side of the light-emitting element, and enabling at least part of the first white photosensitive solder mask on the periphery of the light-emitting element not to be covered by the second white photosensitive solder mask and to be exposed in the air;
the light-distributing member 60 is mounted such that the light-distributing member 60 is mounted on the first white photosensitive solder resist layer not covered with the second white photosensitive solder resist layer surrounding at least one side of the light-distributing member 60.
The utility model also provides a preparation method of alkali development type photosensitive resin composition, including the following step:
preparation of the main agent:
(1) adding the components of the main agent into a dispersing barrel according to a proportion;
(2) dispersing at high speed in a high-speed dispersion machine;
(3) grinding for 2-5 times with three-roller machine or grinding with sand mill until the particle diameter is below 20 μm;
(4) adding a diluent to adjust the viscosity to 200-400P;
(5) then filtering with filter cloth to obtain a main agent;
preparation of the curing agent:
(1) adding the curing agent components into a dispersing barrel according to a proportion;
(2) dispersing at high speed in a high-speed dispersion machine;
(3) grinding for 2-5 times with a three-roller machine or grinding with a sand mill until the particle size is below 20 μm;
(4) adding diluent to adjust the viscosity to 50-200P;
(5) then filtering with filter cloth to obtain a curing agent;
the above is only the preferred embodiment of the present invention, and not the scope of the present invention, all the equivalent structures or equivalent processes that the present invention is used for are changed, or directly or indirectly used in other related technical fields, and all the same principles are included in the protection scope of the present invention.
Claims (10)
1. A printed circuit board is characterized by comprising a substrate, a conducting circuit layer and a circuit board solder mask layer in sequence from inside to outside, wherein the circuit board solder mask layer comprises a non-solder-resisting area, a first solder-resisting area and a second solder-resisting area, the non-solder-resisting area penetrates through the circuit board solder mask layer to be connected with the conducting circuit layer, the first solder-resisting area surrounds the periphery of the non-solder-resisting area, the second solder-resisting area surrounds at least one side of the first solder-resisting area, and the reflectivity of the first solder-resisting area to light with the wavelength of 430-containing 700nm is smaller than or equal to the reflectivity of the second solder-resisting area to light with the wavelength of 430-containing 700 nm.
2. The printed circuit board of claim 1, wherein the first solder resist area has a reflectivity of 80% -88% for light having a wavelength of 430-700 nm; the reflectivity of the second solder mask area to light with the wavelength of 430-700nm is 90-94%.
3. The printed circuit board of claim 1, wherein an average thickness of the first solder resist area is less than an average thickness of the second solder resist area.
4. The printed circuit board of claim 1, wherein the first solder resist area has an average thickness of 15-40um and the second solder resist area has an average thickness of 30-80 um.
5. The printed circuit board of claim 1, wherein the first solder resist area has N layers in a thickness direction, the second solder resist area has M layers in the thickness direction, and N is less than M.
6. The printed circuit board of claim 1, wherein the circuit board solder mask layer comprises a first white photosensitive solder mask layer and a second white photosensitive solder mask layer, the first white photosensitive solder mask layer and the second white photosensitive solder mask layer are arranged from inside to outside, the first white photosensitive solder mask layer surrounds the non-solder-mask region periphery side to form the first solder-mask region, and the second white photosensitive solder mask layer covers the first white photosensitive solder mask layer on at least one side of the first solder-mask region periphery side to form the second solder-mask region.
7. The printed circuit board of claim 6, wherein the first white photosensitive solder resist layer and the second white photosensitive solder resist layer are each formed of an alkali development type photosensitive resin composition.
8. The printed circuit board of claim 1, wherein the circuit board solder resist layer includes a plurality of non-solder resist areas and a plurality of first solder resist areas, the plurality of first solder resist areas being arranged at intervals in the first direction in the second solder resist area in a plan view direction of the printed circuit board, the second solder resist area surrounding both sides in the first direction of each first solder resist area; the plurality of non-solder-resisting areas are respectively arranged in the plurality of first solder-resisting areas, the plurality of first solder-resisting areas respectively surround the periphery of the plurality of non-solder-resisting areas, and the plurality of non-solder-resisting areas are separated by the first solder-resisting areas;
or each first solder mask area is provided with a plurality of non-solder mask areas, the non-solder mask areas are arranged in each first solder mask area at intervals along the second direction, the first solder mask areas surround the periphery of each non-solder mask area, and the first direction is perpendicular to the second direction;
or, a plurality of first resistance welding areas are distributed in a plurality of rows and columns at intervals in the second resistance welding area, adjacent first resistance welding areas are separated by the second resistance welding area, a plurality of non-resistance welding areas are respectively located in the first resistance welding area, and a plurality of non-resistance welding areas are separated by the first resistance welding area and the second resistance welding area.
9. The printed circuit board according to claim 1, wherein a plurality of mounting positions are provided circumferentially around the non-solder-resist region in a plan view of the printed circuit board, the mounting positions being located in the first solder-resist region;
the printed circuit board further comprises a light-emitting element and a light distribution component, wherein the light-emitting element is mounted in the non-solder-resisting area and is connected with the conductive circuit board; the mounting position is used for mounting the light distribution component.
10. The printed circuit board of claim 9, wherein the light distribution member is a lens, the lens covers the light emitting element, and the lens covers the first solder resist area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022591434.7U CN214205941U (en) | 2020-11-10 | 2020-11-10 | Printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022591434.7U CN214205941U (en) | 2020-11-10 | 2020-11-10 | Printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN214205941U true CN214205941U (en) | 2021-09-14 |
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| CN202022591434.7U Active CN214205941U (en) | 2020-11-10 | 2020-11-10 | Printed circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114900952A (en) * | 2020-11-10 | 2022-08-12 | 广东高仕电研科技有限公司 | Circuit board solder mask, printed circuit board and printed circuit board preparation method |
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2020
- 2020-11-10 CN CN202022591434.7U patent/CN214205941U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114900952A (en) * | 2020-11-10 | 2022-08-12 | 广东高仕电研科技有限公司 | Circuit board solder mask, printed circuit board and printed circuit board preparation method |
| CN114900952B (en) * | 2020-11-10 | 2024-04-02 | 广东高仕电研科技有限公司 | Circuit board solder mask layer, printed circuit board and printed circuit board preparation method |
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