CN114395287A - Solder resist ink, solder resist layer and Mini-LED printed circuit board - Google Patents

Solder resist ink, solder resist layer and Mini-LED printed circuit board Download PDF

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Publication number
CN114395287A
CN114395287A CN202111654528.7A CN202111654528A CN114395287A CN 114395287 A CN114395287 A CN 114395287A CN 202111654528 A CN202111654528 A CN 202111654528A CN 114395287 A CN114395287 A CN 114395287A
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parts
weight
solder resist
photoinitiator
resist ink
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王昌华
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Guangzhou Starley Electronic Materials Co ltd
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Guangzhou Starley Electronic Materials Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability

Abstract

The invention provides solder resist ink which comprises alkali-developable photosensitive resin, titanium dioxide and a photoinitiator, wherein the weight average molecular weight of the alkali-developable photosensitive resin is 15000-25000, and the acid value of the solid component of the alkali-developable photosensitive resin is 65-85 mgKOH/g. 40-50 parts of alkali development type photosensitive resin, 30-80 parts of titanium dioxide and 2-6 parts of photoinitiator. The solder resist ink, the solder resist layer and the Mini-LED printed circuit board provided by the invention have the advantages of smaller side etching and higher resolution.

Description

Solder resist ink, solder resist layer and Mini-LED printed circuit board
Technical Field
The invention belongs to the field of printed circuit board preparation, and particularly relates to solder resist ink, a solder resist layer and a Mini-LED printed circuit board.
Background
With the rapid development of LED display technology, especially the miniaturization of LEDs, 100 micrometer (Mini-LED) and even micrometer scale LEDs (Micro-LED) have been manufactured, making the manufacture of high resolution LED displays possible, since Mini-LED and Micro-LED are active light emitting, but unlike the current mass production Organic Light Emitting Display (OLED), it does not rely on organic compounds to emit light, theoretically, it is as bright as OLED but has no aging problem and is cheaper than OLED in the long run, and Mini-LED and Micro-LED can be directly attached on a PCB circuit board to manufacture the display, the manufacturing process is very simple, but it puts new technical requirements on the PCB board.
The bottom of the existing solder resist ink may be incompletely cured in the photosensitive curing process, and the bottom of the solder resist layer is etched towards two sides during development, so that the resolution is low. The resolution can only be 400 mu m multiplied by 400 mu m, so that the existing solder resist ink can not be well applied to LED printed circuit boards, especially Mini-LED printed circuit boards.
The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides solder resist ink, a solder resist layer and a Mini-LED printed circuit board which have smaller side etching and higher resolution.
The invention provides solder resist ink which comprises alkali-developable photosensitive resin, titanium dioxide and a photoinitiator, wherein the weight average molecular weight of the alkali-developable photosensitive resin is 15000-25000, and the acid value of the solid component of the alkali-developable photosensitive resin is 65-85 mgKOH/g.
Preferably, 40-50 parts of alkali development type photosensitive resin, 30-80 parts of titanium dioxide and 2-6 parts of photoinitiator.
Preferably, the total content of nitrogen, phosphorus and sulfur in the solder resist ink is less than 2000 ppm.
Preferably, the photoinitiator has a phosphorus content of less than 1500 ppm.
Preferably, the sulfur content of the titanium dioxide is less than 50 ppm.
Preferably, the nitrogen content of the alkali-developable photosensitive resin is less than 500 ppm.
Preferably, the photoinitiator comprises one or more of photoinitiator TPO, photoinitiator 819 and photoinitiator 784.
Preferably, the alkali-developable photosensitive resin comprises 40-50 parts of polyacrylic acid photoetching resin, 30-80 parts of titanium dioxide, 2-6 parts of a photoinitiator, 30-50 parts of an epoxy compound and 15-25 parts of an acrylic monomer.
The invention also provides solder resist ink which comprises a main agent and a curing agent, wherein the main agent comprises 35-55 parts by weight of polyacrylic acid photoetching resin, 25-55 parts by weight of titanium oxide, 2-10 parts by weight of photoinitiator and 0.1-15 parts by weight of other additives, and the curing agent comprises 25-55 parts by weight of epoxy resin, 10-30 parts by weight of polyfunctional group acrylic monomer, 15-35 parts by weight of titanium oxide, 0.1-5 parts by weight of melamine, 0.5-4 parts by weight of auxiliary agent and 5-20 parts by weight of solvent;
the weight average molecular weight of the polyacrylic acid photo-etching resin is 15000-25000, and the acid value of the solid component of the polyacrylic acid photo-etching resin is 65-85 mgKOH/g.
The invention also provides a printed circuit board solder mask layer which comprises a solder mask layer and a silica gel layer, wherein the silica gel layer is coated on the outer surface of the solder mask layer, and the solder mask layer is prepared from the solder mask ink.
The invention also provides a Mini-LED printed circuit board which sequentially comprises a substrate layer, a circuit layer, a solder mask layer and a silica gel layer from inside to outside, wherein the solder mask layer is prepared from the solder mask ink, and the total content of nitrogen, phosphorus and sulfur in the solder mask layer is less than 2000 ppm.
The solder resist ink, the solder resist layer and the Mini-LED printed circuit board provided by the invention have the advantages of smaller side etching and higher resolution.
Drawings
The foregoing and other objects, features and advantages of the invention will be apparent from the following more particular description of preferred embodiments of the invention, as illustrated in the accompanying drawings. Like reference numerals refer to like parts throughout the drawings, and the drawings are not intended to be drawn to scale in actual dimensions, emphasis instead being placed upon illustrating the principles of the invention.
Fig. 1 is a schematic diagram of a printed circuit board structure according to an embodiment of the present invention.
Wherein: 1-a layer of material; 2-a line layer; 3-a solder mask layer; 4-silica gel layer.
Detailed Description
The technical solutions of the present invention are further described in detail with reference to specific examples so that those skilled in the art can better understand the present invention and can implement the present invention, but the examples are not intended to limit the present invention.
Referring to fig. 1, an embodiment of the present invention provides a solder resist ink, including an alkali-developable photosensitive resin, titanium dioxide, and a photoinitiator, where the weight average molecular weight of the alkali-developable photosensitive resin is 15000-25000, and the acid value of the solid component of the alkali-developable photosensitive resin is 65-85 mgKOH/g. The acid number of the resin in this example refers to the number of milligrams of KOH consumed per gram of acid content of the sample.
In the solder resist ink provided by the embodiment, the alkali-developable photosensitive resin with the weight average molecular weight and the acid value in a certain range is selected, so that the alkali-developable photosensitive resin has moderate solubility in the developing solution, thereby reducing the side etching of the solder resist ink, improving the resolution of a solder resist layer, and realizing the solder resist ink with the resolution of 100 micrometers multiplied by 100 micrometers.
Meanwhile, the reflectivity of the solder resist ink provided by the embodiment to light with the wavelength of 430-700nm can reach more than 85%, and the reflectivity to light with the wavelength of more than 500nm can reach 90%. The solder resist ink provided by the embodiment also has the advantages of gold resistance, no redness and the like.
In a preferred embodiment, since the present embodiment provides the solder resist ink, the total content of nitrogen, phosphorus and sulfur is less than 2000 ppm. Therefore, the solder resist ink can be well applied to preparation of a Mini-LED printed circuit board, and the phenomenon of silica gel poisoning caused by over-standard total content of nitrogen, phosphorus and sulfur can be avoided.
In a preferred embodiment, the photoinitiator has a phosphorus content of less than 1000 ppm. In the embodiment, the photoinitiator containing no phosphorus is selected as much as possible, so that the problems that the solder resist ink contains more phosphorus, the silica gel is poisoned when the silica gel is matched with the photoinitiator, and the silica gel is difficult to cure are avoided. The silica gel poisoning referred to in this example means that the catalytic curing agent in the silica gel coating liquid is ineffective, and the coated silica gel is difficult to cure.
In the embodiment, the photoinitiator with the smaller phosphorus content is selected and matched with the alkali development type photosensitive resin with the appropriate molecular weight and the appropriate acid value, so that the solder resist ink can still realize a better photocuring effect under the action of the photoinitiator with the smaller phosphorus content.
In a further preferred embodiment, the photoinitiator comprises one or more of photoinitiator TPO, photoinitiator 819, and photoinitiator 784. In a preferred embodiment, the photoinitiator comprises photoinitiator TPO, photoinitiator 819 and photoinitiator 784, wherein the weight ratio of photoinitiator TPO, photoinitiator 819 and photoinitiator 784 is (0.5-5): (0.5-5): (0.01-0.1).
In a preferred embodiment, the sulfur content of the titanium dioxide is less than 50 ppm. In the embodiment, proper titanium dioxide is selected, and titanium dioxide with low sulfur content is selected, so that the problems that solder resist ink has high phosphorus content and is poisoned by silica gel when being matched with the silica gel are avoided.
In a preferred embodiment, the nitrogen content of the alkali-developable photosensitive resin is less than 500ppm, and the nitrogen content of the alkali-developable photosensitive resin is controlled to better avoid the occurrence of silica gel poisoning when the alkali-developable photosensitive resin is matched with silica gel. In a further preferred embodiment, the nitrogen content of the catalyst used in the synthesis of the alkali developable photosensitive resin is less than 200 ppm. The nitrogen content of the alkali development type photosensitive resin is controlled by controlling the nitrogen content of a catalyst in the synthetic process of synthesizing the alkali development type photosensitive resin.
In a preferred embodiment, 40-50 parts of alkali development type photosensitive resin, 30-80 parts of titanium dioxide and 2-6 parts of photoinitiator. In the embodiment, the solder resist ink prepared by the method has high reflectivity through reasonable raw material proportion.
In a preferred embodiment, the alkali-developable photosensitive resin comprises 40-50 parts of polyacrylic acid photoetching resin, 30-80 parts of titanium dioxide, 2-6 parts of photoinitiator, 30-50 parts of epoxy compound and 15-25 parts of acrylic acid monomer. In the embodiment, the solder resist ink prepared by the method has high reflectivity through reasonable raw material proportion.
The embodiment also provides solder resist ink which comprises a main agent and a curing agent, wherein the main agent comprises 35-55 parts by weight of polyacrylic acid photoetching resin, 25-55 parts by weight of titanium oxide, 2-10 parts by weight of photoinitiator and 0.1-15 parts by weight of other additives, and the curing agent comprises 25-55 parts by weight of epoxy resin, 10-30 parts by weight of polyfunctional group acrylic monomer, 15-35 parts by weight of titanium oxide, 0.1-5 parts by weight of melamine, 0.5-4 parts by weight of auxiliary agent and 5-20 parts by weight of solvent.
In a preferred embodiment, the alkali development type photosensitive resin composition is obtained by mixing a main agent and a curing agent, wherein the main agent comprises 35-55 parts by weight of polyacrylic acid photoetching resin, 25-55 parts by weight of titanium oxide, 2-10 parts by weight of photoinitiator and 0.1-15 parts by weight of other auxiliary agents, and the curing agent comprises 25-55 parts by weight of epoxy resin, 10-30 parts by weight of polyfunctional group acrylic monomer, 15-35 parts by weight of titanium oxide, 0.1-5 parts by weight of melamine, 0.5-4 parts by weight of auxiliary agent and 5-20 parts by weight of solvent.
In a further preferred embodiment, the other auxiliary agents are a dispersing agent, a leveling agent, an antioxidant, a defoaming agent and fumed silica; the auxiliary agents are a dispersing agent and gas phase silicon dioxide; in a further preferred embodiment, the main agent consists of 40-50 parts of polyacrylic acid photoetching resin, 30-50 parts of titanium oxide, 2-8 parts of photoinitiator, 0.2-0.8 part of dispersant, 0.1-0.4 part of flatting agent, 0.2-1 part of antioxidant, 0.5-2 parts of defoaming agent and 0.5-2 parts of fumed silica; the curing agent consists of 30 to 50 parts of epoxy resin, 16 to 24 parts of polyfunctional group acrylic monomer, 20 to 30 parts of titanium dioxide, 0.5 to 2 parts of melamine, 5 to 15 parts of solvent, 0.2 to 0.8 part of dispersant and 0.5 to 2 parts of fumed silica.
In a preferred embodiment, the weight ratio of the main agent to the curing agent is (1-2): (1-2).
In a preferred embodiment, the multifunctional acrylic monomer comprises a trifunctional acrylic monomer and/or a difunctional acrylic monomer, and the trifunctional acrylic monomer comprises one or more of tris (2-hydroxyethyl) isocyanurate triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, trimethylolpropane triacrylate, and ethoxylated trimethylolpropane triacrylate; the bifunctional acrylic monomer comprises one or more of hexanediol diacrylate, dipropylene glycol diacrylate, neopentyl glycol diacrylate, MPGDA and 2-hydroxyethyl methacrylate phosphate.
The embodiment of the invention also provides a printed circuit board solder mask layer, which comprises a solder mask layer and a silica gel layer, wherein the silica gel layer is coated on the outer surface of the solder mask layer, and the solder mask layer is prepared from the solder mask ink of any one embodiment. The solder mask provided by the embodiment has the total content of nitrogen, phosphorus and sulfur less than 2000ppm, and when the silica gel is coated on the outer surface of the solder mask, the silica gel poisoning can be better avoided, and the silica gel can be better cured after being coated.
Referring to fig. 1, a Mini-LED printed circuit board according to an embodiment of the present invention includes, in order from inside to outside, a substrate layer 1, a circuit layer 2, a solder mask layer 3, and a silica gel layer 4, where the solder mask layer 4 is prepared from the solder mask ink according to any one of the above embodiments, and the total content of nitrogen, phosphorus, and sulfur in the solder mask layer 4 is less than 2000 ppm. The Mini-LED printed circuit board provided by the embodiment can better avoid silica gel poisoning, realize better silica gel curing effect, improve the yield of printed circuit board preparation, and simultaneously has stronger resolving power, higher reflectivity and gold resistance without redness.
The invention also provides a preparation method of the solder resist ink, which comprises the following steps:
preparation of the main agent:
(1) adding the components of the main agent into a dispersing barrel according to a proportion;
(2) dispersing at high speed in a high-speed dispersion machine;
(3) grinding for 2-5 times with three-roller machine or grinding with sand mill until the particle diameter is below 20 μm;
(4) adding a diluent to adjust the viscosity to 200-400P;
(5) then filtering with filter cloth to obtain a main agent;
preparation of the curing agent:
(1) adding the curing agent components into a dispersing barrel according to a proportion;
(2) dispersing at high speed in a high-speed dispersion machine;
(3) grinding for 2-5 times with a three-roller machine or grinding with a sand mill until the particle size is below 20 μm;
(4) adding diluent to adjust the viscosity to 50-200P;
(5) then filtering with filter cloth to obtain a curing agent;
in order that the technical solutions of the present invention may be further understood and appreciated, several preferred embodiments are now described in detail. The formulations of solder mask ink 1 and solder mask ink 2 are shown in table 1:
TABLE 1
Figure BDA0003445511190000061
Figure BDA0003445511190000071
The solder resist ink 1 and the solder resist ink 2 are prepared according to the following preparation method by using the formula of the solder resist ink 1 and the formula of the solder resist ink 2.
Preparation of the main agent:
(1) adding the components of the main agent into a dispersing barrel according to a proportion;
(2) dispersing at high speed in a high-speed dispersion machine;
(3) grinding for 2-5 times with three-roller machine or grinding with sand mill until the particle diameter is below 20 μm;
(4) adding a diluent to adjust the viscosity to 200-400P;
(5) then filtering with filter cloth to obtain a main agent;
preparation of the curing agent:
(1) adding the curing agent components into a dispersing barrel according to a proportion;
(2) dispersing at high speed in a high-speed dispersion machine;
(3) grinding for 2-5 times with a three-roller machine or grinding with a sand mill until the particle size is below 20 μm;
(4) adding diluent to adjust the viscosity to 50-200P;
(5) then filtering with filter cloth to obtain a curing agent;
the main agent and the curing agent are mixed according to the proportion of 2: 1.
Solder resist inks of examples and comparative examples were prepared according to the following table (table 2).
TABLE 2
Figure BDA0003445511190000072
Figure BDA0003445511190000081
In the tables above, the molecular weight of the polyacrylic acid photoresist is weight average molecular weight, as measured by Gel Permeation Chromatography (GPC).
The test pieces prepared in examples and comparative examples were subjected to the following tests, respectively.
Test 1: test for lateral erosion
The substrates (glass epoxy substrate, "FR 4", Cu thickness 25 μm) were surface-treated with dilute sulfuric acid (5 mass%), and then the solder resist inks of examples and comparative examples prepared as described above were applied by screen printing, respectively. After coating, pre-drying was carried out in a BOX furnace at 80 ℃ for 20 minutes. After the predrying, exposure was performed under the exposure conditions of an exposure machine, and after the exposure, development was performed using a 1 mass% sodium carbonate aqueous solution at a development temperature of 30 ℃ under a spray pressure of 0.2 MPa. After the development, post-curing was performed at 150 ℃ for 60 minutes in a BOX furnace, thereby forming a cured coating film on the substrate. The thickness of the cured coating is 20 to 23 μm.
Respectively slicing the sample wafer, observing the lateral erosion condition of the sample wafer from the side surface, and judging the standard as follows: 1. the lateral erosion is serious when the lateral erosion depth of the single side is more than 20 mu m; 2. the unilateral lateral erosion depth is between 10 and 20 mu m, and the unilateral lateral erosion is slight lateral erosion; 3. the one-side undercut depth is less than 10 μm.
And (3) testing 2: resolution test
The substrates (glass epoxy substrate, "FR 4", Cu thickness 25 μm) were surface-treated with dilute sulfuric acid (5 mass%), and then the solder resist inks of examples and comparative examples prepared as described above were applied by screen printing, respectively. Each window of the screen printing was rectangular with dimensions of 200 μm by 200 μm. After coating, pre-drying was carried out in a BOX furnace at 80 ℃ for 20 minutes. After the predrying, exposure was performed under the exposure conditions of an exposure machine, and after the exposure, development was performed using a 1 mass% sodium carbonate aqueous solution at a development temperature of 30 ℃ under a spray pressure of 0.2 MPa. After the development, post-curing was performed at 150 ℃ for 60 minutes in a BOX furnace, thereby forming a cured coating film on the substrate. The thickness of the cured coating is 20 to 23 μm.
Observing the condition that each window is covered by the solder resist ink after the development by using a microscope after the development, wherein the judgment standard is as follows: 1. the maximum width of the window covered by the solder resist ink after development is more than 20 μm, and the resolution is judged to be poor; 2. the maximum width of the window covered by the solder resist ink after development is 10-20 μm, and the resolution is judged to be normal; 3. the window after development was not substantially covered with the solder resist ink, and the size was maintained at 200. mu. m.times.200. mu.m (measurement error was not more than 10 μm), and the resolution was judged to be good.
The results obtained in tests 1 and 2 above are shown in table 3.
TABLE 3
Figure BDA0003445511190000091
And (3) testing: reflectance test
The solder resist inks prepared in examples and comparative examples were coated on glass substrates, respectively, and after completion of curing, a reflectance test was performed using a spectrocolorimeter CM-26 d. The conditions of the primary reflow soldering are as follows: 260 ℃ + 270 ℃ for 6 minutes, and the secondary reflow soldering conditions are as follows: the 260 ℃, & 270 ℃ 6 min volume data is shown in table 4.
TABLE 4
Figure BDA0003445511190000092
Figure BDA0003445511190000101
Figure BDA0003445511190000111
In Table 4, the reflectance is Y, L is black > white, and A is green > red; the B value is green > yellow.
The data in table 3 can show that the solder resist ink provided in the embodiment 1 and the embodiment 2 has better anti-lateral erosion effect and better resolution, can realize the preparation of the circuit size of 100 μm × 100 μm, and can realize better application to the Mini-LED printed circuit board.
In comparative example 1 and comparative example 2, the molecular weight of polyacrylic acid photo-etching resin is respectively reduced and increased so as to be out of the scope of the invention, and the polyacrylic acid photo-etching resin with the acid value of 70KOH/g is matched, the obtained ink still has slight lateral erosion and poor resolution, the circuit size of 100 Mum multiplied by 100 Mum can not be prepared, and the preparation of a fine circuit board is difficult to meet.
In comparative example 3, the acid value was adjusted to 100KOH/g so as not to fall within the range of the present invention, the resulting ink still had slight undercut and poor resolution, and it was not possible to achieve the production of a circuit size of 100. mu. m.times.100. mu.m, which was difficult to satisfy the production of a fine wiring board.
In conclusion, the polyacrylic acid photoetching resin has reasonable limits on molecular weight and acid value, the obtained solder resist ink can better prevent the side etching, has better resolving power, and can meet the preparation of circuits with the size of 100 microns multiplied by 100 microns.
As can be seen from the data in Table 4, the solder resist inks provided in examples 1 and 2 have high reflectivity, the values of the resins passing through the reflow oven are stable, and the A value is about 1.3, and the color of the solder resist layer is not red. While the values of A of comparative examples 1 to 3 show that the values are around 1.5 and even up to 3, the solder resist color is slightly reddish.
In conclusion, the molecular weight and the acid value of the polyacrylic acid photoetching resin are reasonably limited, the obtained solder resist ink can not have a redness phenomenon after being cured, the over-reflow soldering value is stable, and a solder resist layer does not have redness. So that the white solder resist ink has a good color effect.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by the present specification, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (10)

1. The solder resist ink is characterized by comprising alkali-developable photosensitive resin, titanium dioxide and a photoinitiator, wherein the weight average molecular weight of the alkali-developable photosensitive resin is 15000-25000, and the acid value of the solid component of the alkali-developable photosensitive resin is 65-85 mgKOH/g.
2. The solder resist ink according to claim 1, wherein the alkali-developable photosensitive resin is 40 to 50 parts by weight, the titanium dioxide powder is 30 to 80 parts by weight, and the photoinitiator is 2 to 6 parts by weight.
3. Solder resist ink according to claim 1, characterized in that the total content of nitrogen, phosphorus and sulphur in the solder resist ink is less than 2000 ppm.
4. Solder resist ink according to claim 1, characterized in that the photoinitiator has a phosphorus content of less than 1500 ppm.
5. Solder mask ink according to claim 1, characterized in that the sulphur content of the titanium dioxide is less than 50 ppm.
6. The solder resist ink of claim 1, wherein the nitrogen content of the alkali developable photosensitive resin is less than 500 ppm.
7. The solder resist ink according to claim 1, wherein the photoinitiator comprises one or more of photoinitiator TPO, photoinitiator 819 and photoinitiator 784;
the solder resist ink further comprises epoxy resin and acrylic acid monomers, wherein the alkali development type photosensitive resin comprises polyacrylic acid photo-etching resin, and the alkali development type photosensitive resin comprises 40-50 parts by weight of polyacrylic acid photo-etching resin, 30-80 parts by weight of titanium dioxide, 2-6 parts by weight of photoinitiator, 30-50 parts by weight of epoxy resin and 15-25 parts by weight of acrylic acid monomers.
8. The solder resist ink is characterized by comprising a main agent and a curing agent, wherein the main agent comprises 35-55 parts by weight of polyacrylic acid photoetching resin, 25-55 parts by weight of titanium oxide, 2-10 parts by weight of photoinitiator and 0.1-15 parts by weight of other additives, and the curing agent comprises 25-55 parts by weight of epoxy resin, 10-30 parts by weight of polyfunctional group acrylic monomer, 15-35 parts by weight of titanium dioxide, 0.1-5 parts by weight of melamine, 0.5-4 parts by weight of auxiliary agent and 5-20 parts by weight of solvent;
the weight average molecular weight of the polyacrylic acid photo-etching resin is 15000-25000, and the acid value of the solid component of the polyacrylic acid photo-etching resin is 65-85 mgKOH/g.
9. A printed circuit board solder mask is characterized by comprising a solder mask layer and a silica gel layer, wherein the silica gel layer is coated on the outer surface of the solder mask layer, and the solder mask layer is prepared from the solder mask ink of any one of claims 1-8.
10. A Mini-LED printed circuit board is characterized by sequentially comprising a substrate layer, a circuit layer, a solder mask layer and a silica gel layer from inside to outside, wherein the solder mask layer is prepared from the solder mask ink of any one of claims 1-8, and the total content of nitrogen, phosphorus and sulfur in the solder mask layer is less than 2000 ppm.
CN202111654528.7A 2021-12-30 2021-12-30 Solder resist ink, solder resist layer and Mini-LED printed circuit board Pending CN114395287A (en)

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Citations (5)

* Cited by examiner, † Cited by third party
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