CN214203731U - Electrode structure, organic light-emitting device and lighting panel - Google Patents

Abstract

The utility model discloses an electrode structure, an organic light-emitting device and an illumination panel, wherein the electrode structure comprises a substrate; the first conductive film layer comprises a first groove, the first groove penetrates through the first conductive film layer, and the first groove is used for dividing the first conductive film layer into a plurality of independent first conductive film layer blocks; the first grooves comprise a plurality of longitudinal grooves and a plurality of transverse grooves, each longitudinal groove is parallel to a longitudinal wire of the metal wire grid layer, each transverse groove is parallel to a transverse wire of the metal wire grid layer, the vertical projection of each first conductive film layer block on the substrate at least covers part of the wire of the metal wire grid layer, a through hole is formed in the insulating layer covered by each first conductive film layer block, and the vertical projection of the through hole on the substrate is located on the wire of part of the metal wire grid layer. Therefore, the brightness uniformity of the illumination panel can be realized, and when the current at a certain position in the illumination panel is overlarge, only one pixel point of the illumination panel is burnt out, and the whole illumination panel cannot be burnt out.

Description

Electrode structure, organic light-emitting device and lighting panel

Technical Field

The embodiment of the utility model provides a relate to OLED technical field, especially relate to an electrode structure, organic light emitting device and illumination panel.

Background

Organic Light-Emitting diodes (OLEDs) have been reported by Tang et al, and since OLEDs have many advantages such as high brightness, high efficiency, wide viewing angle, self-luminescence, full solid state, ultra-thin and ultra-Light, simple manufacturing process, fast response speed, full color Display, and good machining performance, compared to CRTs (Cathode Ray tubes), LCDs (Liquid Crystal displays), PDPs (Plasma Display panels), and inorganic Light-Emitting diodes, OLEDs can be manufactured into displays having different shapes.

ITO (Indium tin oxide) is becoming the most suitable thin film electrode material due to its good conductivity and light transmittance. However, the sheet resistance of the conventional ITO film is large, the voltage drop is severe, and the voltage drop becomes more significant as the OLED panel is farther from the power supply when emitting light, so that the illumination panel has a significant uneven brightness phenomenon. Moreover, when the current at a certain position in the lighting panel is too large, a short circuit can be caused in the panel, and the whole lighting panel can be burnt out.

SUMMERY OF THE UTILITY MODEL

The utility model provides an electrode structure, organic light emitting device and illumination panel to realize that illumination panel's luminance is even, and when the electric current of somewhere was too big in illumination panel, can not burn out whole illumination panel.

In order to achieve the above object, the present invention provides an electrode structure, including:

a substrate;

the metal wiring grid layer, the insulating layer and the first conductive film layer are sequentially arranged on one side of the substrate, the first conductive film layer comprises a first groove, the first groove penetrates through the first conductive film layer, and the first groove is used for dividing the first conductive film layer into a plurality of independent first conductive film layer blocks;

the first grooves comprise a plurality of longitudinal grooves and a plurality of transverse grooves, each longitudinal groove is parallel to a longitudinal wiring of the metal wiring grid layer, each transverse groove is parallel to a transverse wiring of the metal wiring grid layer, the vertical projection of each first conductive film layer block on the substrate at least covers part of the wiring of the metal wiring grid layer, a through hole is formed in the insulating layer covered by each first conductive film layer block, and the vertical projection of the through hole on the substrate is located on part of the wiring of the metal wiring grid layer.

Optionally, the area of each first conductive film layer block is smaller than the area of a region surrounded by the outer edge of each grid in the metal routing grid layer and is larger than the area of a region surrounded by the inner edge of each grid in the metal routing grid layer;

the grooving width of the longitudinal groove and the grooving width of the transverse groove are both smaller than the wiring line width of the metal wiring grid layer.

Optionally, a perpendicular projection of each of the longitudinal grooves on the substrate is located on a longitudinal trace of the metal trace grid layer, and a perpendicular projection of each of the transverse grooves on the substrate is located on a transverse trace of the metal trace grid layer.

Optionally, a vertical projection of each of the longitudinal grooves on the substrate is located on a longitudinal trace of the metal trace grid layer, and a vertical projection of each of the transverse grooves on the substrate is located between adjacent transverse traces of the metal trace grid layer;

or the vertical projection of each longitudinal groove on the substrate is located between adjacent longitudinal wires of the metal wire grid layer, and the vertical projection of each transverse groove on the substrate is located on the transverse wires of the metal wire grid layer.

Optionally, a perpendicular projection of each of the longitudinal grooves on the substrate is located between adjacent longitudinal traces of the metal trace grid layer, and a perpendicular projection of each of the transverse grooves on the substrate is located between adjacent transverse traces of the metal trace grid layer.

Optionally, the first conductive film layer partially fills the via.

Optionally, the substrate is provided with second grooves which are communicated with each other in a criss-cross manner, and the second grooves are filled with the metal routing grid layer.

Optionally, the bottom surface of the second groove is an arc surface.

In order to achieve the above object, a second aspect of the present invention provides an organic light emitting device, including the electrode structure, further including: the organic functional layer is positioned on one side, away from the insulating layer, of the first conductive film layer, and the surface, away from the insulating layer, of the first conductive film layer is in contact with the organic functional layer;

and the surface of one side of the organic functional layer, which is deviated from the first conductive film layer, is in contact with the second conductive film layer.

In order to achieve the above object, the third aspect of the present invention provides an illumination panel including the organic light emitting device.

According to the present invention, an electrode structure, an organic light emitting device and a lighting panel are provided, wherein the electrode structure comprises a substrate; the metal wiring grid layer, the insulating layer and the first conductive film layer are sequentially arranged on one side of the substrate, the first conductive film layer comprises a first groove, the first groove penetrates through the first conductive film layer, and the first groove is used for dividing the first conductive film layer into a plurality of independent first conductive film layer blocks; the first grooves comprise a plurality of longitudinal grooves and a plurality of transverse grooves, each longitudinal groove is parallel to a longitudinal wire of the metal wire grid layer, each transverse groove is parallel to a transverse wire of the metal wire grid layer, the vertical projection of each first conductive film layer block on the substrate at least covers part of the wire of the metal wire grid layer, a through hole is formed in the insulating layer covered by each first conductive film layer block, and the vertical projection of the through hole on the substrate is located on the wire of part of the metal wire grid layer. Therefore, the brightness uniformity of the illumination panel can be realized, and when the current at a certain position in the illumination panel is overlarge, only one pixel point of the illumination panel is burnt out, and the whole illumination panel cannot be burnt out.

Drawings

Fig. 1 is a schematic structural diagram of an electrode structure according to an embodiment of the present invention;

FIG. 2 is a cross-sectional view along AA' of FIG. 1;

fig. 3 is a schematic structural diagram of an electrode structure according to another embodiment of the present invention;

fig. 4 is a schematic structural diagram of an electrode structure according to another embodiment of the present invention;

fig. 5 is a schematic structural diagram of an electrode structure according to yet another embodiment of the present invention;

fig. 6 is a schematic structural diagram of a substrate in an electrode structure according to another embodiment of the present invention;

fig. 7 is a cross-sectional view along AA' in fig. 1 of an electrode structure according to another embodiment of the present invention;

fig. 8 is a schematic structural diagram of an organic light emitting device according to an embodiment of the present invention;

fig. 9 is a schematic block diagram of an illumination panel according to an embodiment of the present invention.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

Fig. 1 is a schematic structural diagram of an electrode structure according to an embodiment of the present invention. FIG. 2 is a cross-sectional view along AA' of FIG. 1. As shown in fig. 1 and 2, the electrode structure 100 includes:

a substrate 101;

the metal routing grid layer 102, the insulating layer 103 and the first conductive film layer 104 are sequentially arranged on one side of the substrate 101, the first conductive film layer 104 comprises a first groove 105, the first groove 105 penetrates through the first conductive film layer 104, and the first groove 105 is used for dividing the first conductive film layer 104 into a plurality of independent first conductive film layer blocks 1041;

the first groove 105 includes a plurality of longitudinal grooves 1051 and a plurality of transverse grooves 1052, each longitudinal groove 1051 is parallel to a longitudinal trace of the metal trace grid layer 102, each transverse groove 1052 is parallel to a transverse trace of the metal trace grid layer 102, a vertical projection of each first conductive film layer block 1041 on the substrate 101 at least partially covers the trace of the metal trace grid layer 102, a through hole 106 is disposed on the insulating layer 103 covered by each first conductive film layer block 1041, and a vertical projection of the through hole 106 on the substrate 101 is located on a portion of the trace of the metal trace grid layer 102.

It is understood that the first groove 105 includes a plurality of longitudinal grooves 1051 and a plurality of lateral grooves 1052, and the longitudinal grooves 1051 and the lateral grooves 1052 separate the first conductive film layer 104 into a plurality of first conductive film layer blocks 1041. The first groove 105 may be filled with an insulating material, or may not be filled with an insulating material, and other organic materials are directly vapor-plated on the first conductive film layer 104. The discrete first conductive film layer block 1041 is connected to the metal trace grid layer 102 through the via hole 106 in the insulating layer 103. Optionally, the first conductive film layer 104 partially fills the via 106. Furthermore, the first conductive film layer 104 in the through hole 106 directly contacts the metal trace grid layer 102, that is, the metal trace grid layer 102 is connected to the first conductive film layer block 1041 through the first conductive film layer 104 in the through hole 106 for providing an electrical signal to the first conductive film layer block 1041. When the current of a certain first conductive film layer block 1041 is too large, the first conductive film layer 104 in the through hole 106 may be fused, thereby cutting off the connection between the first conductive film layer block 1041 and the metal routing grid layer 102, preventing the first conductive film layer block 1041 from short-circuiting, and avoiding the other first conductive film layer blocks 1041 around the first conductive film layer block 1041 from being extinguished, and by the arrangement of the metal routing grid layer 102, the sheet resistance of the electrode structure 100 is reduced, and the brightness of the lighting panel having the electrode structure 100 is uniformly displayed.

Optionally, as shown in fig. 1, the area of each first conductive film layer block 1041 is smaller than the area of the region enclosed by the outer edge of each grid in the metal trace grid layer 102 and larger than the area of the region enclosed by the inner edge of each grid in the metal trace grid layer 102;

the groove width of the longitudinal groove 1051 and the groove width of the transverse groove 1052 are both smaller than the trace line width of the metal trace grid layer 102.

That is, the longitudinal grooves 1051 and the transverse grooves 1052 divide the first conductive film layer 104 into a plurality of first conductive film layer blocks 104, and a vertical projection area of the first conductive film layer block 104 on the substrate 101 is smaller than an area surrounded by outer edges of each grid in the metal trace grid layer 102 and larger than an area surrounded by inner edges of each grid in the metal trace grid layer 102. That is, the first conductive film layer block 104 is provided with a through hole 106 in the insulating layer 103 covering one of the sides of the metal mesh layer 102. The groove width of the longitudinal groove 1051 and the groove width of the transverse groove 1052 are both smaller than the trace line width of the metal trace grid layer 102, so as to facilitate the arrangement of the through holes 106 in the insulating layer 103.

It should be noted that the through holes 106 in the insulating layer 103 are only disposed in the insulating layer 103 vertically corresponding to each first conductive film layer block 1041, and the area of the metal trace grid layer 102 corresponding to which side of each first conductive film layer block 1041 is large, so that the through holes 106 are disposed in the insulating layer 103 corresponding to the side of the first conductive film layer block 1041.

Alternatively, as shown in fig. 1, the vertical projection of each longitudinal groove 1051 on the substrate 101 is located on the longitudinal traces of the metal trace grid layer 102, and the vertical projection of each transverse groove 1052 on the substrate 101 is located on the transverse traces of the metal trace grid layer 102. This example can make the area enclosed by the inner edge of the metal trace grid layer 102 all emit light, and the area of the light-emitting area is large.

Alternatively, as shown in fig. 3, the vertical projection of each longitudinal groove 1051 on the substrate 101 is located on the longitudinal traces of the metal trace grid layer 102, and the vertical projection of each transverse groove 1052 on the substrate 101 is located between adjacent transverse traces of the metal trace grid layer 102. This arrangement facilitates the provision of the through-hole 106 in the insulating layer 103.

Alternatively, as shown in fig. 4, the vertical projection of each longitudinal groove 1051 on the substrate 101 is located between adjacent longitudinal traces of the metal trace grid layer 101, and the vertical projection of each transverse groove 1052 on the substrate 101 is located on the transverse traces of the metal trace grid layer 102. Also, this arrangement facilitates the arrangement of the via hole 106 in the insulating layer 103. It should be noted that the size of the through hole 106 disposed in the first conductive film layer block 1041 located at the edge of the electrode structure 100 may be specifically determined according to the size of the metal trace grid layer 102 covered by the vertical projection of the first conductive film layer block 1041 on the substrate 101.

Alternatively, as shown in fig. 5, the vertical projection of each longitudinal groove 1051 on the substrate 101 is located between adjacent longitudinal traces of the metal trace grid layer 102, and the vertical projection of each transverse groove 1052 on the substrate 101 is located between adjacent transverse traces of the metal trace grid layer 102. This arrangement facilitates the placement of the vias 106 in the insulating layer.

Optionally, as shown in fig. 6 and fig. 7, the substrate 101 is provided with second grooves 107 that are interconnected in a criss-cross manner, and the second grooves 107 are filled with the metal trace grid layer 102. Wherein, one side of the metal trace grid layer 102 away from the substrate 101 is flush with the surface of one side of the substrate 101 adjacent to the insulating layer 103. Therefore, the insulating layer 103 and the first conductive film layer 104 on the substrate 101 can be prevented from being folded, and the situation of fracture when other organic film layers are evaporated upwards can be avoided.

Alternatively, as shown in fig. 7, the bottom surface of the second groove 107 is a curved surface. Thus, the substrate 101 is prevented from being broken during the process of opening the second groove 107.

Fig. 8 is a schematic structural diagram of an organic light emitting device according to an embodiment of the present invention. As shown in fig. 8, the organic light emitting device 200 includes the electrode structure 100, further including: the organic functional layer 201 is positioned on one side, away from the insulating layer 103, of the first conductive film layer 104, and the surface of one side, away from the insulating layer 103, of the first conductive film layer 104 is in contact with the organic functional layer 201; the second conductive film layer 202 is located on one side of the organic functional layer 201, which is far away from the first conductive film layer 104, and the surface of the organic functional layer 201, which is far away from the first conductive film layer 104, is in contact with the second conductive film layer 202. The first conductive film layer 104 may be an ITO material, the second conductive film layer 202 may be metal aluminum, and the organic functional layer 201 includes an organic light emitting layer.

Fig. 9 is a schematic block diagram of an illumination panel according to an embodiment of the present invention. As shown in fig. 9, the illumination panel 300 includes the organic light emitting device 200.

In summary, according to the present invention, an electrode structure, an organic light emitting device and a lighting panel are provided, wherein the electrode structure includes a substrate; the metal wiring grid layer, the insulating layer and the first conductive film layer are sequentially arranged on one side of the substrate, the first conductive film layer comprises a first groove, the first groove penetrates through the first conductive film layer, and the first groove is used for dividing the first conductive film layer into a plurality of independent first conductive film layer blocks; the first grooves comprise a plurality of longitudinal grooves and a plurality of transverse grooves, each longitudinal groove is parallel to a longitudinal wire of the metal wire grid layer, each transverse groove is parallel to a transverse wire of the metal wire grid layer, the vertical projection of each first conductive film layer block on the substrate at least covers part of the wire of the metal wire grid layer, a through hole is formed in the insulating layer covered by each first conductive film layer block, and the vertical projection of the through hole on the substrate is located on the wire of part of the metal wire grid layer. Therefore, the brightness uniformity of the illumination panel can be realized, and when the current at a certain position in the illumination panel is overlarge, only one pixel point of the illumination panel is burnt out, and the whole illumination panel cannot be burnt out.

It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.

Claims (10)

1. An electrode structure, comprising:

a substrate;

the metal wiring grid layer, the insulating layer and the first conductive film layer are sequentially arranged on one side of the substrate, the first conductive film layer comprises a first groove, the first groove penetrates through the first conductive film layer, and the first groove is used for dividing the first conductive film layer into a plurality of independent first conductive film layer blocks;

the first grooves comprise a plurality of longitudinal grooves and a plurality of transverse grooves, each longitudinal groove is parallel to a longitudinal wiring of the metal wiring grid layer, each transverse groove is parallel to a transverse wiring of the metal wiring grid layer, the vertical projection of each first conductive film layer block on the substrate at least covers part of the wiring of the metal wiring grid layer, a through hole is formed in the insulating layer covered by each first conductive film layer block, and the vertical projection of the through hole on the substrate is located on part of the wiring of the metal wiring grid layer.

2. The electrode structure of claim 1, wherein the area of each first conductive film layer block is smaller than the area of the area enclosed by the outer edge of each grid in the metal trace grid layer and larger than the area of the area enclosed by the inner edge of each grid in the metal trace grid layer;

the grooving width of the longitudinal groove and the grooving width of the transverse groove are both smaller than the wiring line width of the metal wiring grid layer.

3. The electrode structure as claimed in claim 2, wherein a perpendicular projection of each of the longitudinal grooves on the substrate is located on a longitudinal trace of the metal trace grid layer, and a perpendicular projection of each of the transverse grooves on the substrate is located on a transverse trace of the metal trace grid layer.

4. The electrode structure of claim 2, wherein a perpendicular projection of each of the longitudinal grooves on the substrate is located on the longitudinal traces of the metal trace grid layer, and a perpendicular projection of each of the transverse grooves on the substrate is located between adjacent transverse traces of the metal trace grid layer;

or the vertical projection of each longitudinal groove on the substrate is located between adjacent longitudinal wires of the metal wire grid layer, and the vertical projection of each transverse groove on the substrate is located on the transverse wires of the metal wire grid layer.

5. The electrode structure of claim 2, wherein a perpendicular projection of each of the longitudinal grooves on the substrate is located between adjacent longitudinal traces of the metal trace grid layer, and a perpendicular projection of each of the transverse grooves on the substrate is located between adjacent transverse traces of the metal trace grid layer.

6. The electrode structure of claim 1, wherein the first conductive film layer partially fills the via.

7. The electrode structure according to any one of claims 1 to 6, wherein the substrate is provided with second grooves which are criss-cross and communicated with each other, and the second grooves are filled with the metal trace grid layer.

8. The electrode structure of claim 7, wherein the bottom surface of the second groove is a curved surface.

9. An organic light-emitting device comprising the electrode structure of any one of claims 1-8, further comprising: the organic functional layer is positioned on one side, away from the insulating layer, of the first conductive film layer, and the surface, away from the insulating layer, of the first conductive film layer is in contact with the organic functional layer;

and the surface of one side of the organic functional layer, which is deviated from the first conductive film layer, is in contact with the second conductive film layer.

10. A lighting panel comprising the organic light-emitting device according to claim 9.

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