CN214203682U - Flyback converter integrated control chip and flyback converter - Google Patents

Flyback converter integrated control chip and flyback converter Download PDF

Info

Publication number
CN214203682U
CN214203682U CN202120090479.8U CN202120090479U CN214203682U CN 214203682 U CN214203682 U CN 214203682U CN 202120090479 U CN202120090479 U CN 202120090479U CN 214203682 U CN214203682 U CN 214203682U
Authority
CN
China
Prior art keywords
chip
base island
pin
flyback converter
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202120090479.8U
Other languages
Chinese (zh)
Inventor
阳玉才
朱建培
胡小波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Xinfei Semiconductor Technology Co ltd
Original Assignee
Shanghai Xinfei Semiconductor Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Xinfei Semiconductor Technology Co ltd filed Critical Shanghai Xinfei Semiconductor Technology Co ltd
Priority to CN202120090479.8U priority Critical patent/CN214203682U/en
Application granted granted Critical
Publication of CN214203682U publication Critical patent/CN214203682U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Landscapes

  • Dc-Dc Converters (AREA)

Abstract

The utility model discloses a flyback converter integrated control chip and flyback converter. The utility model integrates and seals the power supply diode and the flyback converter main control chip in a packaging structure, thereby reducing the PCB position occupied by the power supply diode and realizing higher integration level and higher reliability; compare in current packaging technology's flyback converter, the utility model discloses flyback converter volume is littleer, and has reduced power supply diode's encapsulation expense and welding cost, the cost is reduced. The integrated control chip of the flyback converter with high integration level is formed by further integrating the power tube and/or the full-bridge diode forming the full-bridge rectifier bridge stack, so that the size of the flyback converter is further reduced, and the cost is reduced.

Description

Flyback converter integrated control chip and flyback converter
Technical Field
The utility model relates to a semiconductor package technical field especially relates to a flyback converter integrated control chip and flyback converter.
Background
The flyback converter of the mainstream architecture in the current market mainly comprises a main control chip, an MOS (metal oxide semiconductor) tube, a power supply diode, a power supply capacitor and a transformer. With the increasing requirement of users on the portability of the flyback converter, various manufacturers continuously innovate and improve the design of the flyback converter. For example, the flyback converter is designed to be smaller and smaller in size, the number of electronic components is smaller and smaller, and the integration level is higher and higher.
The main innovative approach follows the following points:
(1) the components with higher characteristic frequency are adopted, so that the working frequency of the flyback converter is improved, and the volume of the transformer is reduced; this method has a significant effect on reducing the volume, but adds some cost, and is suitable for applications where volume requirements are extreme, but where cost is not critical.
(2) The inductive current is changed from a DCM mode to a CCM mode, and the peak value of the inductive current is reduced so as to reduce the volume of the transformer and the volume of the power supply capacitor; the method has obvious effect on reducing the volume and simultaneously reduces the cost, but the method has higher requirements on the technical level of the main control chip.
(3) The innovative design scheme is developed to reduce the complexity of the flyback converter and the number of electronic components, thereby reducing the size of the PCB, achieving the effect of reducing the volume and having obvious cost reduction effect. Most of the chip foundries' leading innovation and cost reduction schemes are implemented based on this goal.
(4) The flyback converter is created from the direction of industrial chain integration, so that the size and the cost of the flyback converter are reduced to the maximum extent.
In the flyback converter with the mainstream architecture in the market at present, a main control chip and a power supply diode of the flyback converter are two independent devices, so that the integration level of the flyback converter is not high, and the integral volume of the flyback converter is larger.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a flyback converter integrated control chip and flyback converter to the technical problem that exists among the prior art, can improve the integrated level of flyback converter, reduce the quantity of the peripheral electronic components of chip to reduce the whole volume of flyback converter, improve the reliability of flyback converter, reduce cost simultaneously.
In order to achieve the above object, the utility model provides a flyback converter integrated control chip, include: the packaging structure comprises a packaging body with a plurality of pins, wherein at least one base island, a first chip and a second chip are arranged in the packaging body; a first bonding pad is arranged at the top of the first chip and connected to a first pin of the packaging body through a metal lead; the second chip is provided with a plurality of second bonding pads, and the plurality of second bonding pads comprise a second bonding pad connected to the first pin through a metal lead, a second bonding pad connected to the second pin of the packaging body through a metal lead, and a second bonding pad connected to the third pin of the packaging body through a metal lead.
In order to achieve the above object, the utility model provides a flyback converter, flyback converter includes in the utility model flyback converter integrated control chip.
The utility model has the advantages that: the utility model integrates and seals the power supply diode and the flyback converter main control chip in a packaging structure, thereby reducing the PCB position occupied by the power supply diode and realizing higher integration level and higher reliability; compare in current packaging technology's flyback converter, the utility model discloses flyback converter volume is littleer, and has reduced power supply diode's encapsulation expense and welding cost, the cost is reduced. The integrated control chip of the flyback converter with high integration level is formed by further integrating the power tube and/or the full-bridge diode forming the full-bridge rectifier bridge stack, so that the size of the flyback converter is further reduced, and the cost is reduced.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic diagram of an internal structure of a first embodiment of the integrated control chip of the flyback converter of the present invention;
fig. 2 is a schematic diagram of an internal structure of a second embodiment of the integrated control chip of the flyback converter of the present invention;
fig. 3 is a schematic diagram of an internal structure of a third embodiment of the flyback converter integrated control chip of the present invention;
fig. 4 is an internal structural diagram of a fourth embodiment of the flyback converter integrated control chip of the present invention;
fig. 5 is an internal structural diagram of a fifth embodiment of the flyback converter integrated control chip of the present invention;
fig. 6 is an internal schematic diagram of a sixth embodiment of the flyback converter integrated control chip of the present invention;
fig. 7 is a schematic diagram of an internal structure of a seventh embodiment of the flyback converter integrated control chip of the present invention;
fig. 8A is a schematic structural diagram of a flyback converter according to a first embodiment of the present invention;
fig. 8B is a schematic structural diagram of a first embodiment of a prior art flyback converter;
fig. 9A is a schematic structural diagram of a flyback converter according to a first embodiment of the present invention;
fig. 9B is a schematic structural diagram of a first embodiment of a flyback converter in the prior art.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without any creative work belong to the protection scope of the present invention. The terms "first," "second," "third," and the like in the description and in the claims, as well as in the drawings, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the objects so described are interchangeable under appropriate circumstances. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover a non-exclusive inclusion.
The utility model discloses a flyback converter integrated control chip, it includes: the packaging structure comprises a packaging body with a plurality of pins, wherein at least one base island, a first chip and a second chip are arranged in the packaging body; a first bonding pad is arranged at the top of the first chip and connected to a first pin of the packaging body through a metal lead; the second chip is provided with a plurality of second bonding pads, and the plurality of second bonding pads comprise a second bonding pad connected to the first pin through a metal lead, a second bonding pad connected to the second pin of the packaging body through a metal lead, and a second bonding pad connected to the third pin of the packaging body through a metal lead. The first chip is a power supply diode chip; and a main control chip is integrated in the second chip. Specifically, the bonding pads and the base islands, and the bonding pads and the pins of the package body are connected through metal leads.
The utility model integrates and seals the power supply diode and the flyback converter main control chip in a packaging structure, thereby reducing the PCB position occupied by the power supply diode and realizing higher integration level and higher reliability; compare in current packaging technology's flyback converter, the utility model discloses flyback converter volume is littleer, and has reduced power supply diode's encapsulation expense and welding cost, the cost is reduced. The integrated control chip of the flyback converter with high integration level is formed by further integrating the power tube and/or the full-bridge diode forming the full-bridge rectifier bridge stack, so that the size of the flyback converter is further reduced, and the cost is reduced. The main control chip and the power tube can adopt an integrated or split chip structure; the power transistor may be a field effect transistor or a bipolar transistor. The utility model discloses can adopt any suitable encapsulation standard to form packaging structure. For example, any of the package sizes SOP-6, ESOP-6, SOP-8, or a mix of package sizes SOP-6 and SOP-8 (i.e., SOP-6 for a single 3-pin portion and SOP-8 for a single 4-pin portion) may be used. In other embodiments, other package specifications, such as QFN, DFN, etc., may also be used to implement the present invention.
Please refer to fig. 1, which is a schematic diagram of an internal structure of a first embodiment of a flyback converter integrated control chip according to the present invention.
As shown in fig. 1, in the present embodiment, the flyback converter integrated control chip includes a package 10 having a plurality of pins, a first base island 191, a first chip 11, and a second chip 12 are disposed in the package 10, and the first base island 191 partially leads out of the package 10 to serve as a fourth pin 104 of the package 10.
The first chip 11 and the second chip 12 are both disposed on the first base island 191. A first bonding pad 111 is disposed on the top of the first chip 11, and the first bonding pad 111 is connected to the first lead 101 of the package 10 through a metal lead 17. The second chip 12 is provided with a plurality of second pads 121, and the plurality of second pads 121 include a second pad 121 connected to the first pin 101 through a metal wire 17, a second pad 121 connected to the second pin 102 of the package body 10 through the metal wire 17, and a second pad 121 connected to the third pin 103 of the package body 10 through the metal wire 17.
In a further embodiment, the bottom of the first chip 11 is electrically connected to the first base island 191 by using a conductive adhesive, and the bottom of the second chip 12 is electrically connected to the second base island 192 by using an insulating adhesive. Optionally, the area occupied by the second chip 12 on the first base island 191 is larger than the area occupied by the first chip 11 on the first base island 191, so as to facilitate the arrangement of the second chip 12.
In a further embodiment, the first chip 11 is a power supply diode chip. The cathode surface of the power supply diode chip is provided with a metal layer as the first bonding pad 111, and the power supply diode chip is electrically connected to the first base island 191 through the anode thereof, and further connected to the fourth pin 104 of the package 10 through the first base island 191.
In a further embodiment, a main control chip and a power tube are integrated in the second chip 12; the power tube is a field effect transistor or a bipolar transistor. That is, the second chip 12 is an integrated chip structure including a main control chip and a power tube. It should be noted that, in other embodiments, only the main control chip may be integrated in the second chip 12; and adaptively modifying the connection modes between the corresponding bonding pads, between the bonding pads and the base island and between the bonding pads and the pins of the packaging body.
In a further embodiment, the first pin 101 is a power pin VCC, the second pin 102 is a Drain pin Drain (a corresponding power transistor is a field effect transistor) or a Collector pin Collector (a corresponding power transistor is a bipolar transistor), the third pin 103 is a ground pin GND, and the fourth pin 104 is a feedback pin FB.
Optionally, in the present embodiment, the chips are arranged in a tiled manner in the package 10.
The utility model integrates and seals the power supply diode, the flyback converter main control chip and the power tube in a packaging structure, thereby reducing the PCB position occupied by the power supply diode and realizing higher integration level and higher reliability; compare in current packaging technology's flyback converter, the utility model discloses flyback converter volume is littleer, and has reduced power supply diode's encapsulation expense and welding cost, the cost is reduced.
Please refer to fig. 2, which is a schematic diagram of an internal structure of a flyback converter integrated control chip according to a second embodiment of the present invention.
As shown in fig. 2, in the present embodiment, the flyback converter integrated control chip includes a package 10a having a plurality of pins, a first base island 191a, a second base island 192, a first chip 11, and a second chip 12 are disposed in the package 10a, and the first base island 191a partially leads out of the package 10a to serve as a fourth pin 104 of the package 10 a.
The first chip 11 is disposed on the first base island 191a, and the second chip 12 is disposed on the second base island 192. A first bonding pad 111 is disposed on the top of the first chip 11, and the first bonding pad 111 is connected to the first lead 101 of the package 10a through a metal wire 17. The second chip 12 is provided with a plurality of second pads 121, and the plurality of second pads 121 include a second pad 121 connected to the first pin 101 through a metal wire 17, a second pad 121 connected to the second pin 102 of the package body 10a through the metal wire 17, and a second pad 121 connected to the third pin 103 of the package body 10a through the metal wire 17.
In a further embodiment, the bottom of the first chip 11 is electrically connected to the first base island 191a by using a conductive adhesive, and the bottom of the second chip 12 is electrically connected to the second base island 192 by using a conductive adhesive. Optionally, the area of the first base island 191a is smaller than that of the second base island 192, so as to facilitate the arrangement of the second chip 12.
In a further embodiment, the first chip 11 is a power supply diode chip. The cathode surface of the power supply diode chip is provided with a metal layer as the first bonding pad 111, and the power supply diode chip is electrically connected to the first base island 191a through the anode thereof, and further connected to the fourth pin 104 of the package 10a through the first base island 191 a.
In a further embodiment, a main control chip and a power tube are integrated in the second chip 12; the power tube is a field effect transistor or a bipolar transistor. That is, the second chip 12 is an integrated chip structure including a main control chip and a power tube. It should be noted that, in other embodiments, only the main control chip may be integrated in the second chip 12; and adaptively modifying the connection modes between the corresponding bonding pads, between the bonding pads and the base island and between the bonding pads and the pins of the packaging body.
In a further embodiment, the first pin 101 is a power pin VCC, the second pin 102 is a Drain pin Drain (a corresponding power transistor is a field effect transistor) or a Collector pin Collector (a corresponding power transistor is a bipolar transistor), the third pin 103 is a ground pin GND, and the fourth pin 104 is a feedback pin FB.
Optionally, in the present embodiment, the chips are arranged in a tiled manner in the package body 10 a.
The utility model integrates and seals the power supply diode, the flyback converter main control chip and the power tube in a packaging structure, thereby reducing the PCB position occupied by the power supply diode and realizing higher integration level and higher reliability; compare in current packaging technology's flyback converter, the utility model discloses flyback converter volume is littleer, and has reduced power supply diode's encapsulation expense and welding cost, the cost is reduced.
Please refer to fig. 3, which is a schematic diagram of an internal structure of a flyback converter integrated control chip according to a third embodiment of the present invention.
As shown in fig. 3, in the present embodiment, the flyback converter integrated control chip includes a package 10b having a plurality of pins, and a first base island 191b, a second base island 192b, a first chip 11 and a second chip are disposed in the package 10 b; the first base island 191b partially leads out the package 10b to serve as the fourth lead 104 of the package 10b, and the second base island 192b partially leads out the package 10b to serve as the second lead 102 of the package 10 b.
The first chip 11 is disposed on the first base island 191 b; the second chip includes a first divided chip 31 disposed on the first base island 191b, and a second divided chip 32 disposed on the second base island 192 b. A first bonding pad 111 is disposed on the top of the first chip 11, and the first bonding pad 111 is connected to the first lead 101 of the package 10b through a metal lead 17. Two second bonding pads 121 are arranged on the second split chip 32; the first divided chip 31 is provided with a plurality of second pads 121, two second pads 121 of the plurality of second pads 121 are connected to the first pin 101 and the third pin 103 of the package 10b through metal wires 17, respectively, and the other two second pads 121 of the plurality of second pads 121 are connected to two second pads 121 of the second divided chip 32 through metal wires 17, respectively.
In a further embodiment, the bottom of the first chip 11 is electrically connected to the first base island 191b by using a conductive adhesive, the bottom of the first split chip 31 is electrically connected to the first base island 191b by using an insulating adhesive, and the bottom of the second split chip 32 is electrically connected to the second base island 192b by using a conductive adhesive.
In a further embodiment, the first chip 11 is a power supply diode chip. The cathode surface of the power supply diode chip is provided with a metal layer as the first bonding pad 111, and the power supply diode chip is electrically connected to the first base island 191b through the anode thereof, and further connected to the fourth pin 104 of the package 10b through the first base island 191 b.
In a further embodiment, the first split chip 31 is a main control chip; the second split chip 32 is a power chip; the power tube is a field effect transistor or a bipolar transistor. Namely, the second chip is a split chip structure comprising a main control chip and a power tube. In other embodiments, the second chip may only have the first divided chip 31 disposed on the first base island 191 b; and adaptively modifying the connection modes between the corresponding bonding pads, between the bonding pads and the base island and between the bonding pads and the pins of the packaging body.
In a further embodiment, the first pin 101 is a power pin VCC, the second pin 102 is a Drain pin Drain (a corresponding power transistor is a field effect transistor) or a Collector pin Collector (a corresponding power transistor is a bipolar transistor), the third pin 103 is a ground pin GND, and the fourth pin 104 is a feedback pin FB.
Optionally, in the present embodiment, the chips are arranged in a tiled manner in the package body 10 b.
The utility model integrates and seals the power supply diode, the flyback converter main control chip and the power tube in a packaging structure, thereby reducing the PCB position occupied by the power supply diode and realizing higher integration level and higher reliability; compare in current packaging technology's flyback converter, the utility model discloses flyback converter volume is littleer, and has reduced power supply diode's encapsulation expense and welding cost, the cost is reduced.
Please refer to fig. 4, which is a schematic diagram of an internal structure of a flyback converter integrated control chip according to a fourth embodiment of the present invention.
As shown in fig. 4, in the present embodiment, the flyback converter integrated control chip includes a package 10c having a plurality of pins, and a first base island 191c, a second base island 192c, a third base island 193, a first chip 11, and a second chip are disposed in the package 10 c; the first base island 191c partially leads out the package 10c as the fourth lead 104 of the package 10c, and the second base island 192c partially leads out the package 10c as the second lead 102.
The first chip 11 is disposed on the first base island 191 c; the second chip includes a first divided chip 31 disposed on the third base island 193, and a second divided chip 32 disposed on the second base island 192 c. A first bonding pad 111 is disposed on the top of the first chip 11, and the first bonding pad 111 is connected to the first lead 101 of the package 10c through a metal wire 17. Two second bonding pads 121 are arranged on the second split chip 32; a plurality of second pads 121 are disposed on the first divided chip 31, two second pads 121 of the plurality of second pads 121 are connected to the first pin 101 and the third pin 103 through metal wires 17, respectively, and the other two second pads 121 of the plurality of second pads 121 are connected to two second pads 121 disposed on the second divided chip 32 through metal wires 17, respectively.
In a further embodiment, the bottom of the first chip 11 is electrically connected to the first base island 191c by using a conductive adhesive, the bottom of the first split chip 31 is electrically connected to the third base island 193 by using a conductive adhesive, and the bottom of the second split chip 32 is electrically connected to the second base island 192c by using a conductive adhesive.
In a further embodiment, the first chip 11 is a power supply diode chip. The cathode surface of the power supply diode chip is provided with a metal layer as the first bonding pad 111, and the power supply diode chip is electrically connected to the first base island 191c through the anode thereof, and further connected to the fourth pin 104 of the package 10c through the first base island 191 c.
In a further embodiment, the first split chip 31 is a main control chip; the second split chip 32 is a power chip; the power tube is a field effect transistor or a bipolar transistor. Namely, the second chip is a split chip structure comprising a main control chip and a power tube. In other embodiments, the second chip may have only the first divided chip 31 disposed on the third base island 193; and adaptively modifying the connection modes between the corresponding bonding pads, between the bonding pads and the base island and between the bonding pads and the pins of the packaging body.
In a further embodiment, the first pin 101 is a power pin VCC, the second pin 102 is a Drain pin Drain (a corresponding power transistor is a field effect transistor) or a Collector pin Collector (a corresponding power transistor is a bipolar transistor), the third pin 103 is a ground pin GND, and the fourth pin 104 is a feedback pin FB.
Optionally, in the present embodiment, the chips are arranged in a tiled manner in the package body 10 c.
The utility model integrates and seals the power supply diode, the flyback converter main control chip and the power tube in a packaging structure, thereby reducing the PCB position occupied by the power supply diode and realizing higher integration level and higher reliability; compare in current packaging technology's flyback converter, the utility model discloses flyback converter volume is littleer, and has reduced power supply diode's encapsulation expense and welding cost, the cost is reduced.
Please refer to fig. 5, which is a schematic diagram of an internal structure of a fifth embodiment of the integrated control chip of the flyback converter of the present invention.
As shown in fig. 5, in the present embodiment, the flyback converter integrated control chip includes a package 10d having a plurality of pins, and a first base island 191, a fourth base island 194, a fifth base island 195, a first chip 11, a second chip 12, a third chip 13, a fourth chip 14, a fifth chip 15, and a sixth chip 16 are disposed in the package 10 d; the first base island 191 partially leads out the package 10d to serve as a fourth pin 104 of the package 10d, the fourth base island 194 partially leads out the package 10d to serve as a fifth pin 105 of the package 10d, and the fifth base island 195 partially leads out the package 10d to serve as a seventh pin 107 of the package 10 d.
The first chip 11 and the second chip 12 are both disposed on the first base island 191. A first bonding pad 111 is disposed on the top of the first chip 11, and the first bonding pad 111 is connected to the first lead 101 of the package 10d through a metal lead 17. The second chip 12 is provided with a plurality of second pads 121, and the plurality of second pads 121 include a second pad 121 connected to the first pin 101 through a metal wire 17, a second pad 121 connected to the second pin 102 of the package body 10d through the metal wire 17, and a second pad 121 connected to the third pin 103 of the package body 10d through the metal wire 17.
The third chip 13 and the fourth chip 14 are both disposed on the fourth base island 194. A third pad 131 is disposed on the top of the third chip 13, and the third pad 131 is connected to the sixth pin 106 of the package 10d through a metal lead 17. A fourth bonding pad 141 is disposed on the top of the fourth chip 14.
The fifth chip 15 and the sixth chip 16 are both disposed on the fifth base island 195. A fifth pad 151 is disposed on the top of the fifth chip 15, and the fifth pad 151 is connected to the third pad 131 through a metal wire 17. A sixth pad 161 is disposed on the top of the sixth chip 16, and the sixth pad 161 is connected to the third lead 103 through a metal wire 17 and connected to the fourth pad 141 through the metal wire 17.
In a further embodiment, the bottom of the first chip 11 is electrically connected to the first base island 191 by using a conductive adhesive, and the bottom of the second chip 12 is electrically connected to the first base island 191 by using an insulating adhesive; the third chip 13 and the fourth chip 14 are electrically connected to the fourth base island 194 through a bottom conductive adhesive, and the fifth chip 15 and the sixth chip 16 are electrically connected to the fifth base island 195 through a bottom conductive adhesive.
In a further embodiment, the first chip 11 is a power supply diode chip. The cathode surface of the power supply diode chip is provided with a metal layer as the first bonding pad 111, and the power supply diode chip is electrically connected to the first base island 191 through the anode thereof, and further connected to the fourth pin 104 of the package 10d through the first base island 191.
In a further embodiment, a main control chip and a power tube are integrated in the second chip 12; the power tube is a field effect transistor or a bipolar transistor. That is, the second chip 12 is an integrated chip structure including a main control chip and a power tube. It should be noted that, in other embodiments, only the main control chip may be integrated in the second chip 12; and adaptively modifying the connection modes between the corresponding bonding pads, between the bonding pads and the base island and between the bonding pads and the pins of the packaging body.
In a further embodiment, the third chip 13, the fourth chip 14, the fifth chip 15, and the sixth chip 16 are a first diode D1, a second diode D2, a third diode D3, and a fourth diode D4 (refer to fig. 9A) of full-bridge diodes constituting a full-bridge rectifier bridge stack, respectively. A metal layer is disposed on the cathode surface of the third chip 13 as the third bonding pad 131, and the third chip 13 is electrically connected to the fourth base island 194 through the anode thereof, and further connected to the fifth lead 105 of the package 10d through the fourth base island 194. A metal layer is disposed on the cathode surface of the fourth chip 14 as the fourth bonding pad 141, and the fourth chip 14 is electrically connected to the fourth base island 194 through the anode thereof, and further connected to the fifth lead 105 of the package 10d through the fourth base island 194. A metal layer is disposed on the cathode surface of the fifth chip 15 as the fifth bonding pad 151, and the fifth chip 15 is electrically connected to the fifth base island 195 through the anode thereof, and further connected to the seventh lead 107 of the package 10d through the fifth base island 195. A metal layer is disposed on the cathode surface of the sixth chip 16 as the sixth bonding pad 161, and the sixth chip 16 is electrically connected to the fifth base island 195 through the anode thereof, and further connected to the seventh lead 107 of the package 10d through the fifth base island 195.
In a further embodiment, the first pin 101 is a power pin VCC, the second pin 102 is a Drain pin Drain (a corresponding power transistor is a field effect transistor) or a Collector pin Collector (a corresponding power transistor is a bipolar transistor), the third pin 103 is a ground pin GND, the fourth pin 104 is a feedback pin FB, the fifth pin 105 is a null line pin N, the sixth pin 106 is a high-voltage power supply pin HV, and the seventh pin 107 is a live line pin L.
Optionally, in the present embodiment, the chips are arranged in a tiled manner in the package 10 d.
The utility model discloses a with power supply diode and flyback converter main control chip, power tube, constitute the full-bridge diode integration of full-bridge rectifier bridge heap and seal inside an encapsulated structure, form the flyback converter integrated control chip of high integrated level, reduced power supply diode, the shared PCB position of full-bridge diode, very big reduction flyback converter volume, reduce cost, realize higher integrated level, higher reliability.
Please refer to fig. 6, which is a schematic diagram of an internal structure of a sixth embodiment of a flyback converter integrated control chip according to the present invention.
As shown in fig. 6, in the present embodiment, the flyback converter integrated control chip includes a package 10e having a plurality of pins, and a first base island 191a, a second base island 192, a fourth base island 194, a fifth base island 195, a first chip 11, a second chip 12, a third chip 13, a fourth chip 14, a fifth chip 15, and a sixth chip 16 are disposed in the package 10 e; the first base island 191a partially leads out the package 10e to serve as the fourth lead 104 of the package 10e, the fourth base island 194 partially leads out the package 10e to serve as the fifth lead 105 of the package 10e, and the fifth base island 195 partially leads out the package 10e to serve as the seventh lead 107 of the package 10 e.
The first chip 11 is disposed on the first base island 191a, and the second chip 12 is disposed on the second base island 192. A first bonding pad 111 is disposed on the top of the first chip 11, and the first bonding pad 111 is connected to the first lead 101 of the package 10e through a metal lead 17. The second chip 12 is provided with a plurality of second pads 121, and the plurality of second pads 121 include a second pad 121 connected to the first pin 101 through a metal wire 17, a second pad 121 connected to the second pin 102 of the package body 10e through the metal wire 17, and a second pad 121 connected to the third pin 103 of the package body 10e through the metal wire 17.
The third chip 13 and the fourth chip 14 are both disposed on the fourth base island 194. A third pad 131 is disposed on the top of the third chip 13, and the third pad 131 is connected to the sixth pin 106 of the package 10e through a metal lead 17. A fourth bonding pad 141 is disposed on the top of the fourth chip 14.
The fifth chip 15 and the sixth chip 16 are both disposed on the fifth base island 195. A fifth pad 151 is disposed on the top of the fifth chip 15, and the fifth pad 151 is connected to the third pad 131 through a metal wire 17. A sixth pad 161 is disposed on the top of the sixth chip 16, and the sixth pad 161 is connected to the third lead 103 through a metal wire 17 and connected to the fourth pad 141 through the metal wire 17.
In a further embodiment, the bottom of the first chip 11 is electrically connected to the first base island 191a by using a conductive adhesive, and the bottom of the second chip 12 is electrically connected to the second base island 192 by using a conductive adhesive; the third chip 13 and the fourth chip 14 are electrically connected to the fourth base island 194 through a bottom conductive adhesive, and the fifth chip 15 and the sixth chip 16 are electrically connected to the fifth base island 195 through a bottom conductive adhesive.
In a further embodiment, the first chip 11 is a power supply diode chip. The cathode surface of the power supply diode chip is provided with a metal layer as the first bonding pad 111, and the power supply diode chip is electrically connected to the first base island 191a through the anode thereof, and further connected to the fourth pin 104 of the package 10e through the first base island 191 a.
In a further embodiment, a main control chip and a power tube are integrated in the second chip 12; the power tube is a field effect transistor or a bipolar transistor. That is, the second chip 12 is an integrated chip structure including a main control chip and a power tube. It should be noted that, in other embodiments, only the main control chip may be integrated in the second chip 12; and adaptively modifying the connection modes between the corresponding bonding pads, between the bonding pads and the base island and between the bonding pads and the pins of the packaging body.
In a further embodiment, the third chip 13, the fourth chip 14, the fifth chip 15, and the sixth chip 16 are a first diode, a second diode, a third diode, and a fourth diode of a full-bridge diode forming a full-bridge rectifier bridge stack, respectively. A metal layer is disposed on the cathode surface of the third chip 13 as the third bonding pad 131, and the third chip 13 is electrically connected to the fourth base island 194 through the anode thereof, and further connected to the fifth lead 105 of the package 10e through the fourth base island 194. A metal layer is disposed on the cathode surface of the fourth chip 14 as the fourth bonding pad 141, and the fourth chip 14 is electrically connected to the fourth base island 194 through the anode thereof, and further connected to the fifth lead 105 of the package 10e through the fourth base island 194. A metal layer is disposed on the cathode surface of the fifth chip 15 as the fifth bonding pad 151, and the fifth chip 15 is electrically connected to the fifth base island 195 through the anode thereof, and further connected to the seventh lead 107 of the package 10e through the fifth base island 195. A metal layer is disposed on the cathode surface of the sixth chip 16 as the sixth bonding pad 161, and the sixth chip 16 is electrically connected to the fifth base island 195 through the anode thereof, and further connected to the seventh lead 107 of the package 10e through the fifth base island 195.
In a further embodiment, the first pin 101 is a power pin VCC, the second pin 102 is a Drain pin Drain (a corresponding power transistor is a field effect transistor) or a Collector pin Collector (a corresponding power transistor is a bipolar transistor), the third pin 103 is a ground pin GND, the fourth pin 104 is a feedback pin FB, the fifth pin 105 is a null line pin N, the sixth pin 106 is a high-voltage power supply pin HV, and the seventh pin 107 is a live line pin L.
Optionally, in the present embodiment, the chips are arranged in a tiled manner in the package body 10 e.
The utility model discloses a with power supply diode and flyback converter main control chip, power tube, constitute the full-bridge diode integration of full-bridge rectifier bridge heap and seal inside an encapsulated structure, form the flyback converter integrated control chip of high integrated level, reduced power supply diode, the shared PCB position of full-bridge diode, very big reduction flyback converter volume, reduce cost, realize higher integrated level, higher reliability.
Please refer to fig. 7, which is a schematic diagram of an internal structure of a seventh embodiment of a flyback converter integrated control chip according to the present invention.
As shown in fig. 7, in the present embodiment, the flyback converter integrated control chip includes a package 10f having a plurality of pins, and a first base island 191b, a second base island 192b, a fourth base island 194, a fifth base island 195, a first chip 11, a second chip, a third chip 13, a fourth chip 14, a fifth chip 15, and a sixth chip 16 are disposed in the package 10 f; the first base island 191b partially leads out the package 10f to serve as the fourth lead 104 of the package 10f, the second base island 192b partially leads out the package 10f to serve as the second lead 102 of the package 10f, the fourth base island 194 partially leads out the package 10f to serve as the fifth lead 105 of the package 10f, and the fifth base island 195 partially leads out the package 10f to serve as the seventh lead 107 of the package 10 f.
The first chip 11 is disposed on the first base island 191 b; the second chip includes a first divided chip 31 disposed on the first base island 191b, and a second divided chip 32 disposed on the second base island 192 b. A first bonding pad 111 is disposed on the top of the first chip 11, and the first bonding pad 111 is connected to the first lead 101 of the package 10f through a metal lead 17. Two second bonding pads 121 are arranged on the second split chip 32; a plurality of second pads 121 are disposed on the first split chip 31, two second pads 121 of the plurality of second pads 121 are connected to the first pin 101 and the third pin 103 of the package 10f through metal wires 17, respectively, and the other two second pads 121 of the plurality of second pads 121 are connected to two second pads 121 disposed on the second split chip 32 through metal wires 17, respectively. In another embodiment, the first chip 11 and the first split chip 31 may be disposed on two base islands respectively (refer to the disposition of fig. 4).
The third chip 13 and the fourth chip 14 are both disposed on the fourth base island 194. A third pad 131 is disposed on the top of the third chip 13, and the third pad 131 is connected to the sixth pin 106 of the package body 10f through a metal lead 17. A fourth bonding pad 141 is disposed on the top of the fourth chip 14.
The fifth chip 15 and the sixth chip 16 are both disposed on the fifth base island 195. A fifth pad 151 is disposed on the top of the fifth chip 15, and the fifth pad 151 is connected to the third pad 131 through a metal wire 17. A sixth pad 161 is disposed on the top of the sixth chip 16, and the sixth pad 161 is connected to the third lead 103 through a metal wire 17 and connected to the fourth pad 141 through the metal wire 17.
In a further embodiment, the bottom of the first chip 11 is electrically connected to the first base island 191b by using a conductive adhesive, the bottom of the first split chip 31 is electrically connected to the first base island 191b by using an insulating adhesive, and the bottom of the second split chip 32 is electrically connected to the second base island 192b by using a conductive adhesive; the third chip 13 and the fourth chip 14 are electrically connected to the fourth base island 194 through a bottom conductive adhesive, and the fifth chip 15 and the sixth chip 16 are electrically connected to the fifth base island 195 through a bottom conductive adhesive.
In a further embodiment, the first chip 11 is a power supply diode chip. The cathode surface of the power supply diode chip is provided with a metal layer as the first bonding pad 111, and the power supply diode chip is electrically connected to the first base island 191b through the anode thereof, and further connected to the fourth pin 104 of the package 10f through the first base island 191 b.
In a further embodiment, the first split chip 31 is a main control chip; the second split chip 32 is a power chip; the power tube is a field effect transistor or a bipolar transistor. Namely, the second chip is a split chip structure comprising a main control chip and a power tube. In other embodiments, the second chip may only have the first divided chip 31 disposed on the first base island 191 b; and adaptively modifying the connection modes between the corresponding bonding pads, between the bonding pads and the base island and between the bonding pads and the pins of the packaging body.
In a further embodiment, the third chip 13, the fourth chip 14, the fifth chip 15, and the sixth chip 16 are a first diode, a second diode, a third diode, and a fourth diode of a full-bridge diode forming a full-bridge rectifier bridge stack, respectively. A metal layer is disposed on the cathode surface of the third chip 13 as the third bonding pad 131, and the third chip 13 is electrically connected to the fourth base island 194 through the anode thereof, and further connected to the fifth lead 105 of the package 10f through the fourth base island 194. A metal layer is disposed on the cathode surface of the fourth chip 14 as the fourth bonding pad 141, and the fourth chip 14 is electrically connected to the fourth base island 194 through the anode thereof, and further connected to the fifth lead 105 of the package 10f through the fourth base island 194. A metal layer is disposed on the cathode surface of the fifth chip 15 as the fifth bonding pad 151, and the fifth chip 15 is electrically connected to the fifth base island 195 through the anode thereof, and further connected to the seventh lead 107 of the package 10f through the fifth base island 195. A metal layer is disposed on the cathode surface of the sixth chip 16 as the sixth bonding pad 161, and the sixth chip 16 is electrically connected to the fifth base island 195 through the anode thereof, and further connected to the seventh lead 107 of the package 10f through the fifth base island 195.
In a further embodiment, the first pin 101 is a power pin VCC, the second pin 102 is a Drain pin Drain (a corresponding power transistor is a field effect transistor) or a Collector pin Collector (a corresponding power transistor is a bipolar transistor), the third pin 103 is a ground pin GND, the fourth pin 104 is a feedback pin FB, the fifth pin 105 is a null line pin N, the sixth pin 106 is a high-voltage power supply pin HV, and the seventh pin 107 is a live line pin L.
Optionally, in the present embodiment, the chips are arranged in a tiled manner in the package body 10 f.
The utility model discloses a with power supply diode and flyback converter main control chip, power tube, constitute the full-bridge diode integration of full-bridge rectifier bridge heap and seal inside an encapsulated structure, form the flyback converter integrated control chip of high integrated level, reduced power supply diode, the shared PCB position of full-bridge diode, very big reduction flyback converter volume, reduce cost, realize higher integrated level, higher reliability.
Based on same utility model the design, the utility model also provides a flyback converter, it includes the utility model discloses foretell flyback converter integrated control chip.
Please refer to fig. 8A-8B, wherein fig. 8A is a schematic structural diagram of a flyback converter according to a first embodiment of the present invention, and fig. 8B is a schematic structural diagram of a flyback converter according to the prior art.
As shown in fig. 8A, the flyback converter 80 of the present embodiment includes a flyback converter integrated control chip IC0 and peripheral circuits. The peripheral circuit comprises a power supply capacitor C0 and a transformer T; the transformer T includes a primary winding T1, a secondary winding T2, and an auxiliary winding T3. The drain/collector pin D/C of the flyback converter integrated control chip IC0 is electrically connected to the primary winding T1, the feedback pin FB thereof is electrically connected to the auxiliary winding T3, the power supply pin VCC thereof is electrically connected to the power supply capacitor C0, and the ground pin GND thereof is electrically connected to the ground terminal. The flyback converter integrated control chip IC0 may adopt the flyback converter integrated control chip shown in any one of the embodiments of fig. 1 to 4.
As shown in fig. 8B, the conventional flyback converter 81 includes a main control chip IC1 and peripheral circuits. The peripheral circuit comprises a power supply diode D0, a power supply capacitor C0 and a transformer T; the transformer T includes a primary winding T1, a secondary winding T2, and an auxiliary winding T3.
Compared with the flyback converter 81 shown in fig. 8B, the flyback converter 80 of the present embodiment reduces the PCB position occupied by the power supply diode D0 by integrating the power supply diode D0 into the flyback converter integrated control chip IC0, and has higher integration level, higher reliability, and smaller flyback converter volume; meanwhile, the packaging cost and the welding cost of the power supply diode D0 are reduced, and the cost is reduced.
Please refer to fig. 9A-9B, wherein fig. 9A is a schematic structural diagram of a flyback converter according to a second embodiment of the present invention, and fig. 9B is a schematic structural diagram of a flyback converter according to a second embodiment of the prior art.
As shown in fig. 9A, the flyback converter 90 of the present embodiment includes a flyback converter integrated control chip IC0 and peripheral circuits. The peripheral circuit comprises a power supply capacitor C0 and a transformer T; the transformer T includes a primary winding T1, a secondary winding T2, and an auxiliary winding T3. The drain/collector pin D/C of the flyback converter integrated control chip IC0 is electrically connected with the primary winding T1, the feedback pin FB is electrically connected with the auxiliary winding T3, the power supply pin VCC is electrically connected with the power supply capacitor C0, the ground pin GND is electrically connected with the ground terminal, the null line pin N is electrically connected with the null line terminal N, and the live line pin L is electrically connected with the live line terminal L. The flyback converter integrated control chip IC0 may adopt the flyback converter integrated control chip shown in any one of the embodiments of fig. 5 to 7.
As shown in fig. 9B, the conventional flyback converter 91 includes a main control chip IC1 and peripheral circuits. The peripheral circuit comprises full-bridge diodes D1-D4, a power supply diode D0, a power supply capacitor C0 and a transformer T which form a full-bridge rectifier bridge stack; the transformer T includes a primary winding T1, a secondary winding T2, and an auxiliary winding T3.
Compared with the flyback converter 91 shown in fig. 9B, the flyback converter 90 of the present embodiment integrates the full-bridge diodes D1-D4 and the power supply diode D0 that form the full-bridge rectifier bridge stack into the flyback converter integrated control chip IC0, so that the PCB positions occupied by the full-bridge diodes D1-D4 and the power supply diode D0 are reduced, and the flyback converter has higher integration level and higher reliability, and has a smaller size; meanwhile, the packaging cost and the welding cost of the full-bridge diodes D1-D4 and the power supply diode D0 are reduced, and the cost is reduced.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.

Claims (19)

1. An integrated control chip of a flyback converter is characterized by comprising: the packaging structure comprises a packaging body with a plurality of pins, wherein at least one base island, a first chip and a second chip are arranged in the packaging body;
a first bonding pad is arranged at the top of the first chip and connected to a first pin of the packaging body through a metal lead;
the second chip is provided with a plurality of second bonding pads, and the plurality of second bonding pads comprise a second bonding pad connected to the first pin through a metal lead, a second bonding pad connected to the second pin of the packaging body through a metal lead, and a second bonding pad connected to the third pin of the packaging body through a metal lead.
2. The flyback converter integrated control chip of claim 1, wherein the at least one base island comprises a first base island, the first chip and the second chip are both disposed on the first base island, and the first base island partially leads out of the package to serve as a fourth pin of the package.
3. The flyback converter integrated control chip of claim 2, wherein the bottom of the first chip is electrically connected to the first base island using a conductive adhesive, and the bottom of the second chip is electrically connected to the second base island using an insulating adhesive.
4. The flyback converter integrated control chip of claim 1, wherein the at least one base island comprises a first base island and a second base island, the first base island partially leading out of the package as a fourth pin of the package;
the first chip is arranged on the first base island, and the second chip is arranged on the second base island.
5. The flyback converter integrated control chip of claim 4, wherein the bottom of the first chip is electrically connected to the first base island using a conductive adhesive, and the bottom of the second chip is electrically connected to the second base island using a conductive adhesive.
6. The flyback converter integrated control chip of claim 2 or 4, wherein the first chip is a power supply diode chip; and a main control chip is integrated in the second chip.
7. The integrated control chip of the flyback converter of claim 6, wherein the second chip further integrates a power transistor, wherein the power transistor is a field effect transistor or a bipolar transistor.
8. The flyback converter integrated control chip of claim 1, wherein the at least one base island comprises a first base island and a second base island, the first base island partially leading out of the package as a fourth pin of the package, the second base island partially leading out of the package as the second pin;
the first chip is arranged on the first base island;
the second chip comprises a first split chip arranged on the first base island and a second split chip arranged on the second base island.
9. The flyback converter integrated control chip of claim 8, wherein the bottom of the first chip is electrically connected to the first base island using a conductive adhesive, the bottom of the first split chip is electrically connected to the first base island using an insulating adhesive, and the bottom of the second split chip is electrically connected to the second base island using a conductive adhesive.
10. The flyback converter integrated control chip of claim 1, wherein the at least one base island includes a first base island, a second base island, and a third base island, the first base island partially leading out of the package as a fourth pin of the package, the second base island partially leading out of the package as the second pin;
the first chip is arranged on the first base island;
the second chip comprises a first split chip arranged on the third base island and a second split chip arranged on the second base island.
11. The integrated control chip of the flyback converter of claim 8 or 10,
two second bonding pads are arranged on the second split chip;
the first split chip is provided with a plurality of second bonding pads, two of the second bonding pads are connected to the first pin and the third pin through metal leads respectively, and the other two of the second bonding pads are connected to the two second bonding pads arranged on the second split chip through metal leads respectively.
12. The flyback converter integrated control chip of claim 11, wherein the first chip, the first split chip, and the second split chip are all electrically connected to the corresponding base island at their bottoms using a conductive adhesive.
13. The integrated control chip of the flyback converter of claim 8 or 10,
the first split chip is a main control chip;
the second split chip is a power chip, wherein the power transistor is a field effect transistor or a bipolar transistor.
14. The flyback converter integrated control chip of any of claims 2, 4, 8, or 10, wherein the at least one base island further comprises: a fourth base island and a fifth base island;
a third chip and a fourth chip are arranged on the fourth base island, and the packaging body is partially led out of the fourth base island to be used as a fifth pin of the packaging body;
and a fifth chip and a sixth chip are arranged on the fifth base island, and the packaging body is partially led out of the fifth base island to be used as a seventh pin of the packaging body.
15. The flyback converter integrated control chip of claim 14,
a third bonding pad is arranged at the top of the third chip and connected to a sixth pin of the packaging body through a metal lead;
a fourth bonding pad is arranged at the top of the fourth chip;
a fifth bonding pad is arranged at the top of the fifth chip and connected to the third bonding pad through a metal lead;
and a sixth bonding pad is arranged at the top of the sixth chip, and the sixth bonding pad is connected to the third pin through a metal lead and is connected to the fourth bonding pad through a metal lead.
16. The flyback converter integrated control chip of claim 14, wherein the third chip and the fourth chip are both electrically connected to the fourth base island with a bottom conductive adhesive, and the fifth chip and the sixth chip are both electrically connected to the fifth base island with a bottom conductive adhesive.
17. The integrated flyback converter control chip of claim 14, wherein the third chip, the fourth chip, the fifth chip and the sixth chip are a first diode, a second diode, a third diode and a fourth diode of full-bridge diodes constituting a full-bridge rectifier bridge stack, respectively.
18. The flyback converter integrated control chip of claim 14, wherein the first pin is a power pin, the second pin is a drain pin or a collector pin, the third pin is a ground pin, the fourth pin is a feedback pin, the fifth pin is a neutral pin, the sixth pin of the package is a high voltage supply pin, and the seventh pin is a hot pin.
19. A flyback converter, characterized in that the flyback converter comprises the flyback converter integrated control chip as claimed in any one of claims 2, 4, 8 and 10.
CN202120090479.8U 2021-01-13 2021-01-13 Flyback converter integrated control chip and flyback converter Active CN214203682U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120090479.8U CN214203682U (en) 2021-01-13 2021-01-13 Flyback converter integrated control chip and flyback converter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120090479.8U CN214203682U (en) 2021-01-13 2021-01-13 Flyback converter integrated control chip and flyback converter

Publications (1)

Publication Number Publication Date
CN214203682U true CN214203682U (en) 2021-09-14

Family

ID=77635715

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202120090479.8U Active CN214203682U (en) 2021-01-13 2021-01-13 Flyback converter integrated control chip and flyback converter

Country Status (1)

Country Link
CN (1) CN214203682U (en)

Similar Documents

Publication Publication Date Title
TWI397156B (en) A multi-die dc-dc boost power converter with efficient packaging
US9129947B2 (en) Multi-chip packaging structure and method
CN103107171B (en) Semiconductor device of flip chip
US20080197458A1 (en) Small Outline Package in Which Mosfet and Schottky Diode Being Co-Packaged
US20180277470A1 (en) Integrated package assembly for switching regulator
US6489682B1 (en) Ball grid array semiconductor package and substrate therefor
CN219017646U (en) Package for high-voltage BUCK switch power supply chip
CN110600450A (en) Lead frame for arranging chip, packaging body and power supply module
CN214203682U (en) Flyback converter integrated control chip and flyback converter
CN213026176U (en) Flip chip packaging support and packaging body
CN210327397U (en) Power supply module
US11742268B2 (en) Package structure applied to power converter
CN211792144U (en) Constant current controller packaging device and constant current source load driving device
CN210405108U (en) Constant voltage power supply circuit
CN211182198U (en) Multi-base-island lead frame and SOP packaging structure
CN210577915U (en) Power supply module
CN210805764U (en) Packaging structure of sealed rectifier bridge and power module
CN117673065B (en) Intelligent power module and electronic equipment
CN111710665A (en) Voltage-multiplying rectification module and voltage-multiplying rectification circuit adopting same
CN201657457U (en) Low-power unidirectional full-wave bridge type rectifier
CN117673064B (en) Intelligent power module and electronic equipment
CN117673067B (en) Intelligent power module and electronic equipment
CN212182321U (en) Voltage-multiplying rectification module and voltage-multiplying rectification circuit adopting same
CN214177288U (en) Electronic package, switch circuit system and electric equipment
CN218182193U (en) Rectifier bridge closes frame construction for sealing MOS and based on its packaging body

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant