CN214203617U

CN214203617U - Surface treatment production line for semiconductor equipment parts

Info

Publication number: CN214203617U
Application number: CN202022950939.8U
Authority: CN
Inventors: 黎纠
Original assignee: Dijing Semiconductor Technology Suzhou Co ltd
Current assignee: Dijing Semiconductor Technology Suzhou Co ltd
Priority date: 2020-12-08
Filing date: 2020-12-08
Publication date: 2021-09-14
Anticipated expiration: 2030-12-08

Abstract

The utility model relates to a semiconductor equipment spare part surface treatment production line belongs to semiconductor device surface treatment technical field, and it includes the platform, platform upper portion both sides are provided with the sliding tray, be provided with the transfer line in the sliding tray, the transfer line cover is equipped with first electronic slider, first electronic slider upper portion fixedly connected with electric telescopic handle can carry out the regulation in height according to the instrument of different models, has improved the device accommodation, matches the setting be provided with the connecting plate between the electric telescopic handle upper end, be connected with the rotation post between two the connecting plates, rotation post lower extreme fixedly connected with centre gripping arm is used for centre gripping semiconductor spare part; a cleaning mechanism, an air drying mechanism and a processing mechanism are arranged between the sliding grooves. The utility model discloses can realize the concentrated management and control of production process, improve the level of production automation, can handle semiconductor surface more effectually.

Description

Surface treatment production line for semiconductor equipment parts

Technical Field

The utility model relates to a semiconductor device surface treatment technical field, more specifically relate to a semiconductor equipment spare part surface treatment production line.

Background

Semiconductor devices are widely used in the fields of rail transit, household appliances, new energy, power supplies, frequency converters, consumer electronics, computers and peripherals, network communication, automotive electronics, LEDs, and the like. In the production process, the surfaces of the parts of the semiconductor equipment need to be treated, the traditional treatment process is complicated, the efficiency is low, the parts are not treated in place, and the quality is not guaranteed.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor equipment spare part surface treatment production line for the loaded down with trivial details inefficiency of traditional processing procedure that proposes in solving above-mentioned background art, arouse the processing of spare part not in place, the problem that the quality can not obtain the guarantee.

In order to achieve the above object, the utility model provides a following technical scheme: a surface treatment production line for semiconductor equipment parts comprises a platform, wherein sliding grooves are formed in two sides of the upper portion of the platform, a transmission rod is arranged in each sliding groove, a first electric slide block is sleeved on each transmission rod, an electric telescopic rod is fixedly connected to the upper portion of each first electric slide block, height adjustment can be conducted according to tools of different models, the adaptive range of the device is improved, a connecting plate is arranged between the upper ends of the electric telescopic rods which are arranged in a matched mode, a rotating column is connected between the two connecting plates, and a clamping arm is fixedly connected to the lower end of each rotating column and used for clamping the semiconductor parts; a cleaning mechanism, an air drying mechanism and a processing mechanism are arranged between the sliding grooves;

the cleaning mechanism comprises an ultrasonic cleaner embedded at the upper part of the platform, and cleaning liquid is arranged in the ultrasonic cleaner;

the air drying mechanism can be used for treating impurities which are air-dried and adhered to a workpiece and is beneficial to cleaning on the surface of the workpiece, and comprises a fan chamber arranged on the upper part of the platform, driving chambers are arranged on the outer sides of four corners of the fan chamber, a first driving motor is arranged in each driving chamber, the fan chamber is rotatably connected and provided with a first connecting column through a first rotating shaft, a first fan is fixedly connected onto the first connecting column, the fan chamber is rotatably connected and provided with a second connecting column through a second rotating shaft, the second connecting column is fixedly connected with a second fan, and the first fan and the second fan are vertically arranged; first pivot and second pivot both ends extend to in the drive groove, and install intermeshing's drive gear, drive gear cup joints the one end of first pivot and second pivot to carry out the transmission of drive power, the drive groove sets up platform terminal surface below, the drive groove with be provided with the intercommunication passageway between the fan room, so that running through of first pivot and second pivot, moreover first pivot and second pivot with the drive groove with be provided with the bearing frame between the fan room, support first pivot and second pivot, first fan and second fan match and are provided with two sets ofly, and power can be according to the transmission of clockwise to synchronous oscillation about together.

Processing mechanism can adjust inclination in a flexible way, makes things convenient for subsequent processing, including seting up in the machining room on platform upper portion, the machining room is inside to rotate through the fixed axle and is connected with the processing board, can adjust its inclination according to different processes such as welding or cutting, improves the processing precision, the main stroke groove has been seted up on the machining room lateral wall, be provided with the electronic slider of second in the main stroke groove, the processing board with the corresponding one end in main stroke groove is provided with corresponding vice stroke groove.

The rotary column is characterized in that inner grooves are formed in two ends of the rotary column, the connecting plate is arranged in the inner grooves, an installation cavity is formed in the connecting plate, a second driving motor is arranged in the installation cavity, an output shaft of the second driving motor is connected with a third rotating shaft through a coupler, one end of the third rotating shaft penetrates through the connecting plate and is connected with the inner wall of the inner groove, and the rotating shaft is supported through a bearing seat in the connecting plate.

Furthermore, a sensor is arranged on one side of the upper end face of the platform, and a signal end head which is matched with the sensor is arranged on one side of the first electric sliding block, so that the running position of the monitoring device can be automatically controlled according to the set program.

Compared with the prior art, the utility model has the advantages of: the centralized management and control of the production process can be realized, the production automation level is improved, and the semiconductor surface can be more effectively treated.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the structure A-A of FIG. 1;

fig. 3 is a schematic structural view of the air drying mechanism of the present invention;

FIG. 4 is a side view of FIG. 1;

fig. 5 is an enlarged view of the portion K in fig. 4.

The reference numbers in the figures illustrate:

1-platform, 2-sliding groove, 3-first electric slider, 4-sensor, 5-rotating column, 6-holding arm, 7-ultrasonic cleaner, 8-cleaning liquid, 9-blower chamber, 10-first connecting column, 11-first blower, 12-second connecting column, 13-second blower, 14-second rotating shaft, 15-first rotating shaft, 16-transmission groove, 17-processing chamber, 18-second electric slider, 19-fixed shaft, 20-processing plate, 21-first driving motor, 22-driving chamber, 23-main stroke groove, 24-electric telescopic rod, 25-connecting plate, 26-inner groove, 27-mounting cavity, 28-second driving motor, 29-third rotating shaft, 30-transmission rod.

Detailed Description

The technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiment of the present invention; obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention based on the embodiments of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "sleeved/connected", "connected", and the like are to be understood in a broad sense, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1:

referring to fig. 1-5, the present invention provides an embodiment of a surface treatment production line for semiconductor device components: the device comprises a platform 1, wherein sliding grooves 2 are formed in two sides of the upper part of the platform 1, a transmission rod 30 is arranged in each sliding groove 2, a first electric slider 3 is sleeved on each transmission rod 30, a sensor 4 is arranged on one side of the upper end face of the platform 1, and a signal end head which is matched with the sensor 4 is arranged on one side of the first electric slider 3, so that the running position of the device can be monitored, and a program can be automatically controlled according to the running position of the device; an electric telescopic rod 24 is fixedly connected to the upper part of the first electric sliding block 3, the height of the first electric sliding block can be adjusted according to tools of different models, the adaptive range of the device is improved, a connecting plate 25 is arranged between the upper ends of the electric telescopic rods 24 which are arranged in a matching manner, a rotating column 5 is connected between the two connecting plates 25, and a clamping arm 6 is fixedly connected to the lower end of the rotating column 5 and used for clamping semiconductor parts; a cleaning mechanism, an air drying mechanism and a processing mechanism are arranged between the sliding grooves 2; the cleaning mechanism comprises an ultrasonic cleaner 7 embedded in the upper part of the platform 1, and cleaning liquid 8 is arranged in the ultrasonic cleaner 7; the air drying mechanism can be used for treating impurities which are air-dried and adhered to a workpiece and is beneficial to cleaning on the surface of the workpiece, and comprises a fan chamber 9 arranged on the upper part of the platform 1, driving chambers 22 are arranged on the outer sides of four corners of the fan chamber 9, a first driving motor 21 is arranged in each driving chamber 22, the fan chamber 9 is rotatably connected with a first connecting column 10 through a first rotating shaft 15, a first fan 11 is fixedly connected onto each first connecting column 10, the fan chamber 9 is rotatably connected with a second connecting column 12 through a second rotating shaft 14, the second connecting column 12 is fixedly connected with a second fan 13, and the first fan 11 and the second fan 13 are vertically arranged; the two ends of the first rotating shaft 15 and the second rotating shaft 14 extend into a transmission groove 16, and are provided with transmission gears which are meshed with each other, the transmission gears are sleeved at one ends of the first rotating shaft 15 and the second rotating shaft 14 to transmit driving force, the transmission groove 16 is arranged below the end surface of the platform 1, a communication channel is arranged between the transmission groove 16 and the fan chamber 9 so as to facilitate the penetration of the first rotating shaft 15 and the second rotating shaft 14, and bearing seats are arranged between the first rotating shaft 15 and the second rotating shaft 14 and between the transmission groove 16 and the fan chamber 9 to support the first rotating shaft 14 and the second rotating shaft 14, two groups of the first fan 11 and the second fan 13 are arranged in a matching way, and power can be transmitted in a clockwise direction so as to synchronously swing up and down together; the machining mechanism can flexibly adjust the inclination angle and facilitate subsequent machining, and comprises a machining chamber 17 arranged on the upper part of the platform 1, wherein a machining plate 20 is rotatably connected inside the machining chamber 17 through a fixed shaft 19, the inclination angle of the machining chamber can be adjusted according to different procedures such as welding or cutting, the machining precision is improved, a main stroke groove 23 is formed in the side wall of the machining chamber 17, a second electric slide block 18 is arranged in the main stroke groove 23, and a corresponding auxiliary stroke groove is formed in one end, corresponding to the main stroke groove 23, of the machining plate 21; the two ends of the rotating column 5 are provided with inner grooves 26, the connecting plate 25 is arranged in the inner grooves 26, a mounting cavity 27 is formed in the connecting plate 25, a second driving motor 28 is arranged inside the mounting cavity 27, an output shaft of the second driving motor 28 is connected with a third rotating shaft 29 through a coupling, one end of the third rotating shaft 29 penetrates through the connecting plate 25 and is connected with the inner wall of the inner groove 26, and the rotating shaft 29 is supported through a bearing seat arranged in the connecting plate 25.

The working principle is as follows: after the clamping arm 6 clamps the semiconductor workpiece, the first electric slider 3 slides on the transmission rod 30 to drive the clamping arm 6 to move, the sensor 4 transmits the position information of the first electric slider in real time, so that the automatic control system can control the movement of the first electric slider to be right above the ultrasonic cleaner 7, the electric telescopic rod 24 automatically stretches to a certain height to enable the workpiece to enter the cleaning solution 8 for cleaning, the workpiece recovers to the height after cleaning, then the workpiece continuously slides to be right above the fan chamber 9 and then descends to a certain height, the first driving motor 21 drives the first rotating shaft 15 to rotate, then the first connecting column 10 and the first fan 11 to rotate, then the second rotating shaft 14 is driven to rotate by a meshed gear in the transmission groove 16, then the second connecting column 12 and the second fan 13 are driven to rotate, and can simultaneously rotate under clockwise transmission, so that substances and the cleaning solution on the surface of the workpiece are blown off by the fan, simultaneously cooling to enable the workpiece to meet the requirement of subsequent processing, then continuously sliding to the position above the processing plate 20, adjusting the angle of the processing plate 20 by controlling the second electric slide block 18 according to the angle requirement, and then dropping the workpiece onto the surface of the processing plate 20 for processing; in the process, the rotating column 5 and the connecting plate 25 can be driven by the second driving motor 28 and rotate through the third rotating shaft 29 to drive the rotating column 5 to rotate, so that the flexible rotation of the clamping arm 6 is facilitated, and the component can be conveniently grabbed or other processes can be conveniently carried out.

The above description is only the preferred embodiment of the present invention; the scope of the present invention is not limited thereto. Any person skilled in the art should also be able to cover the technical scope of the present invention by replacing or changing the technical solution and the improvement concept of the present invention with equivalents and modifications within the technical scope of the present invention.

Claims

1. The surface treatment production line for the parts of the semiconductor equipment is characterized by comprising a platform, wherein sliding grooves are formed in two sides of the upper portion of the platform, a transmission rod is arranged in each sliding groove, a first electric slide block is sleeved on the transmission rod, an electric telescopic rod is fixedly connected to the upper portion of the first electric slide block, the height of the electric telescopic rod can be adjusted according to tools of different models, the adaptive range of the device is improved, a connecting plate is arranged between the upper ends of the electric telescopic rods which are arranged in a matched mode, a rotating column is connected between the two connecting plates, and a clamping arm is fixedly connected to the lower end of the rotating column and used for clamping the semiconductor parts; a cleaning mechanism, an air drying mechanism and a processing mechanism are arranged between the sliding grooves;

the air drying mechanism can be used for treating impurities which are air-dried and adhered to a workpiece and is beneficial to cleaning on the surface of the workpiece, and comprises a fan chamber arranged on the upper part of the platform, driving chambers are arranged on the outer sides of four corners of the fan chamber, a first driving motor is arranged in each driving chamber, the fan chamber is rotatably connected and provided with a first connecting column through a first rotating shaft, a first fan is fixedly connected onto the first connecting column, the fan chamber is rotatably connected and provided with a second connecting column through a second rotating shaft, the second connecting column is fixedly connected with a second fan, and the first fan and the second fan are vertically arranged; the two ends of the first rotating shaft and the second rotating shaft extend into the transmission grooves, transmission gears which are meshed with each other are installed, the transmission gears are sleeved at one ends of the first rotating shaft and the second rotating shaft to transmit driving force, the transmission grooves are arranged below the end face of the platform, a communication channel is arranged between the transmission grooves and the fan room to facilitate the penetration of the first rotating shaft and the second rotating shaft, bearing seats are arranged between the first rotating shaft and the second rotating shaft, the transmission grooves and the fan room to support the first rotating shaft and the second rotating shaft, the first fan and the second fan are arranged in two groups in proportion, and power can be transmitted in a clockwise direction so as to synchronously swing up and down together;

the processing mechanism can flexibly adjust the inclination angle and facilitate subsequent processing, and comprises a processing chamber arranged on the upper part of the platform, wherein the processing chamber is internally and rotatably connected with a processing plate through a fixed shaft, the inclination angle of the processing plate can be adjusted according to different welding or cutting procedures, so that the processing accuracy is improved;

2. The surface treatment line for semiconductor device parts according to claim 1, wherein: a sensor is arranged on one side of the upper end face of the platform, and a signal end head matched with the sensor is arranged on one side of the first electric sliding block.