CN214190171U

CN214190171U - Heat dissipation assembly for cabin and spacecraft

Info

Publication number: CN214190171U
Application number: CN202023079686.8U
Authority: CN
Inventors: 支佳运; 靳书岩
Original assignee: Galaxy Aerospace Beijing Network Technology Co ltd
Current assignee: Galaxy Aerospace Beijing Network Technology Co ltd
Priority date: 2020-12-18
Filing date: 2020-12-18
Publication date: 2021-09-14
Anticipated expiration: 2030-12-18

Abstract

The application provides a heat dissipation assembly for a cabin and a spacecraft. The enclosure includes a plurality of enclosure panels, and the heat dissipation assembly includes a plurality of intra-panel thermal conduction members and a plurality of inter-panel thermal conduction members. Each of the plurality of in-board thermally conductive members is configured to be thermally coupled to one of the plurality of deck boards. Each of the plurality of inter-plate thermally conductive members is configured to be thermally coupled to at least two of the plurality of intra-plate thermally conductive members. The spacecraft comprises the cabin body and the heat dissipation assembly. The heat dissipation assembly and the spacecraft disclosed by the application can effectively promote the isothermization between the plates and the boards of a plurality of cabin plates.

Description

Heat dissipation assembly for cabin and spacecraft

Technical Field

The application relates to the technical field of thermal control, in particular to a heat dissipation assembly for a cabin and a spacecraft.

Background

Today, high power, high heat flux devices are increasingly in use. However, in a closed space environment, for example, in a cabin of a near-earth circular orbit communication satellite, there is no stable heat dissipation surface, and a plurality of high-power devices are intensively arranged, and heat generated by the devices is not easy to diffuse, thereby affecting the service life and the working reliability.

Therefore, how to improve the heat dissipation of the high heat-generating equipment in the closed space environment so that the high heat-generating equipment can work with high reliability for a long time is a technical problem to be solved.

SUMMERY OF THE UTILITY MODEL

The technical problem that this application will be solved is how to improve the heat dissipation of high heat equipment under the enclosure space environment.

In view of the above technical problems, one aspect of the present application provides a heat dissipation assembly for a cabin, wherein the cabin includes a plurality of cabin panels, the heat dissipation assembly including: a plurality of in-board thermal conduction members, each of the plurality of in-board thermal conduction members configured to be thermally coupled to one of the plurality of deck boards; and a plurality of inter-plate heat-conducting members, each of the plurality of inter-plate heat-conducting members configured to be thermally coupled to at least two of the plurality of intra-plate heat-conducting members.

In some embodiments, the plurality of deck boards comprises: a first deck board; and a second deck adjacent to the first deck; the plurality of in-board heat-conductive members include: a first in-board thermally conductive member configured to be thermally coupled to the first deck board; a second in-board thermally conductive member configured to be thermally coupled to the second deck board; the plurality of inter-plate heat-conductive members include: a first inter-plate heat-conducting member configured to be thermally coupled to the first intra-plate heat-conducting member and the second intra-plate heat-conducting member.

In some embodiments, the heat dissipation assembly further comprises: a first thermally conductive layer configured to encase the first deck; and a second thermally conductive layer configured to encase the second deck, wherein the first in-board thermally conductive component is disposed within the first deck and in contact with the first thermally conductive layer; the second inboard heat transfer component is disposed within the second deck and in contact with the second heat transfer layer; the first inter-plate heat conduction member is in contact with the first heat conduction layer and the second heat conduction layer.

In some embodiments, the first in-board heat transfer component comprises a plurality of first in-board heat pipes, any of which are thermally coupled to an adjacent heat pipe; the second in-board thermal conduction component comprises a plurality of second in-board heat pipes, any of which is thermally coupled to an adjacent heat pipe; the first inter-plate heat transfer member includes a first inter-plate heat pipe thermally coupled to one or more of the first plurality of in-plate heat pipes and to one or more of the second plurality of in-plate heat pipes.

In some embodiments, any of the plurality of first in-board heat pipes is in contact with an adjacent heat pipe; any heat pipe of the second plurality of in-board heat pipes is in contact with an adjacent heat pipe.

In some embodiments, the plurality of deck boards comprises: a third deck adjacent to the second deck; the plurality of in-board heat-conductive members include: a third in-board thermally conductive member configured to thermally couple with the third deck; the plurality of inter-plate heat-conductive members include: a second inter-plate heat-conducting member configured to be thermally coupled to the second intra-plate heat-conducting member and the third intra-plate heat-conducting member.

In some embodiments, the third in-plate heat transfer member comprises a plurality of third in-plate heat pipes, any of which are thermally coupled to an adjacent heat pipe; the second inter-plate heat conducting member includes a second inter-plate heat pipe thermally coupled to one or more of the second plurality of in-plate heat pipes and one or more of the third plurality of in-plate heat pipes.

In some embodiments, any of the plurality of third in-plate heat pipes is in contact with an adjacent heat pipe.

In some embodiments, the plurality of deck boards comprises: a first deck board; a second deck adjacent to the first deck; and a third deck adjacent to the second deck; the plurality of in-board heat-conductive members include: a first in-board thermally conductive member configured to be thermally coupled to the first deck board; a second in-board thermally conductive member configured to be thermally coupled to the second deck board; and a third intra-panel thermal conduction member configured to thermally couple with the third deck, the plurality of inter-panel thermal conduction members comprising: a third inter-plate heat-conducting member configured to be thermally coupled to the first intra-plate heat-conducting member, the second intra-plate heat-conducting member, and the third intra-plate heat-conducting member.

In some embodiments, the heat dissipation assembly further comprises: a first thermally conductive layer configured to encase the first deck; a second thermally conductive layer configured to encase the second deck; and a third thermally conductive layer configured to encase the third deck, wherein the first in-board thermally conductive component is disposed within and in contact with the first thermally conductive layer; the second inboard heat transfer component is disposed within the second deck and in contact with the second heat transfer layer; the third in-board heat transfer member is disposed within the third deck and in contact with the third heat transfer layer; the third inter-plate heat-conductive member is in contact with the first heat-conductive layer, the second heat-conductive layer, and the third heat-conductive layer.

In some embodiments, the first in-board heat transfer component comprises a plurality of first in-board heat pipes, any of which are thermally coupled to an adjacent heat pipe; the second in-board thermal conduction component comprises a plurality of second in-board heat pipes, any of which is thermally coupled to an adjacent heat pipe; the third in-plate heat transfer member comprises a plurality of third in-plate heat pipes, any of which is thermally coupled to an adjacent heat pipe; the third inter-plate heat transfer member includes a third inter-plate heat pipe thermally coupled to one or more of the plurality of first intra-plate heat pipes, one or more of the plurality of second intra-plate heat pipes, and one or more of the plurality of third intra-plate heat pipes.

In some embodiments, any of the plurality of first in-board heat pipes is in contact with an adjacent heat pipe; any heat pipe of the second plurality of in-board heat pipes is in contact with an adjacent heat pipe; any heat pipe of the third plurality of in-plate heat pipes is in contact with an adjacent heat pipe.

In some embodiments, the hull is a satellite hull and the plurality of panels are all aluminum honeycomb panels.

Another aspect of the application provides a spacecraft comprising a nacelle and a heat dissipation assembly as described hereinbefore for the nacelle.

The technical effects of this application lie in: through the heat dissipation scheme provided by the heat dissipation assembly, a heat pipe network with high radiation efficiency and light weight can be constructed, the heat pipe network can enable heat of high-power equipment with concentrated heat consumption to be effectively and quickly conducted and dispersed in a single cabin plate, and meanwhile, heat coupling can be achieved between adjacent cabin plates with large heat consumption difference, and isothermal of the whole cabin body is promoted.

Drawings

The following drawings describe in detail exemplary embodiments disclosed in the present application. Wherein like reference numerals represent similar structures throughout the several views of the drawings. Those of ordinary skill in the art will understand that the present embodiments are non-limiting, exemplary embodiments and that the accompanying drawings are for illustrative and descriptive purposes only and are not intended to limit the scope of the present application, as other embodiments may equally fulfill the objectives of the present application. It should be understood that the drawings are not to scale. Wherein:

FIG. 1 is a perspective view of a cabin;

FIG. 2 is a side view of a heat dissipation assembly;

FIG. 3 is a side view of another heat dissipation assembly;

fig. 4A is a schematic view of a tiling of a heat dissipation assembly according to an embodiment of the present application;

FIG. 4B is a side schematic view taken along line AA' of FIG. 4A;

FIG. 4C is a schematic view of the heat dissipation assembly shown in FIG. 4A when viewed from another direction;

FIG. 5 is a schematic view of a heat sink assembly according to another embodiment of the present application;

fig. 6A is a schematic view of a tiling of a heat dissipation assembly according to yet another embodiment of the present application;

FIG. 6B is a perspective view of the heat sink assembly shown in FIG. 6A;

fig. 7 is a schematic view of a tiling of a heat dissipation assembly according to yet another embodiment of the present application;

fig. 8 is a schematic view of a tiling of a heat dissipation assembly according to yet another embodiment of the present application.

Detailed Description

The following description is presented to enable any person skilled in the art to make and use the present disclosure, and is provided in the context of a particular application and its requirements. Various modifications to the disclosed embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of the present application. Thus, the present application is not limited to the embodiments shown, but is to be accorded the widest scope consistent with the claims.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. For example, as used herein, the singular forms "a", "an" and "the" may include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," and/or "including," when used in this specification, are intended to specify the presence of stated integers, steps, operations, elements, components, and/or groups, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "A is located on top of B" means that A is directly adjacent to (above or below) B or alternatively, it may be indirectly adjacent to B (i.e., there is some material between A and B); the term "A is located within B" means that A is located entirely within B or that A is partially within B.

Fig. 1 is a schematic view of a nacelle, wherein the nacelle 1 may be a satellite nacelle. The nacelle 1 may comprise six deck boards, which may together define an enclosed space. It should be noted that the application scenario of the present application is not limited to the cabin shown in fig. 1, but may relate to a cabin, a box, a cabinet or a house of various vehicles, vehicles or accommodation means, such as a cargo hold, a container, a cockpit, a cabin, a satellite cabin, a space station cabin, an spacecraft cabin, an aircraft cabin, a container, a computer case, a house and a warehouse. It should also be noted that the nacelle referred to in the present application may comprise other numbers of deck boards, for example, two, three, four, five, seven, eight, nine, ten or more. It should also be noted that the deck boards referred to herein may be other shapes, such as curved, convex, concave, etc.

Fig. 2 shows a heat dissipation assembly, wherein the heat dissipation assembly 10 may comprise

heat diffusion plates

12 and 13 attached to a deck 11. Heat generating sources 14 and 15 (e.g., high power devices) may be mounted on the

heat diffusion plates

12 and 13, respectively. In this solution, the concentrated heat from the

heat generation sources

14 and 15 is diffused to the

heat diffusion plates

12 and 13 having a large area, is conducted to the deck 11 via the

heat diffusion plates

12 and 13, and is radiated out via the deck 11. However, when the

heat diffusion plates

12 and 13 are made of metal material with good heat conductivity, the weight of the heat dissipation assembly 10 is greatly increased, which is very disadvantageous in a weight-sensitive application scenario because the heavier the cabin, the more fuel is required to propel the cabin, and the running cost is also increased.

Fig. 3 shows another heat dissipating assembly, wherein the heat dissipating assembly 20 may comprise a heat conducting member 22 embedded in the deck 21 and a heat conducting member 23 attached to the deck 21. The

heat generation sources

24 and 25 may be mounted on the deck 21. In this solution, the concentrated heat from the

heat generating sources

24 and 25 can be diffused through the heat

conductive members

22 and 23. However, with a structure in which a plurality of deck boards 21 are present, it is difficult to achieve a uniform temperature design between the deck boards 21.

In order to solve the above problem, embodiments of the present application provide a heat dissipation assembly. It should be noted that the heat dissipating assembly disclosed herein may be applied to various structures capable of forming a fully or semi-enclosed space, and may also be applied to a semi-open structure or a fully open structure.

For convenience of description, the application uses a satellite cabin comprising six cabin plates as an application scene to describe the structure and arrangement of the whole heat dissipation assembly. For convenience of illustration, components that are not visible in normal viewing are indicated in the figures by dashed lines.

Fig. 4A to 4C illustrate a heat dissipation assembly according to an embodiment of the present application.

The plurality of deck boards may include a first deck board 100, a second deck board 200, a third deck board 300, a fourth deck board 400, a fifth deck board 500, and a sixth deck board 600. The first deck board 100 may be a left side deck board of the nacelle 1, the second deck board 200 may be a lower side deck board of the nacelle 1, the third deck board 300 may be a right side deck board of the nacelle 1 (i.e., opposite the first deck board 100), the fourth deck board 400 may be a front side deck board of the nacelle 1, the fifth deck board 500 may be an upper side deck board of the nacelle 1 (i.e., opposite the second deck board 200), and the sixth deck board 600 may be a rear side deck board of the nacelle 1 (i.e., opposite the fourth deck board 400). It should be noted that the directional terms "front side" and "rear side" as referred to herein may correspond to two opposing faces perpendicular to the x-axis of the three-dimensional coordinate system in fig. 1, "upper side" and "lower side" may correspond to two opposing faces perpendicular to the y-axis of the three-dimensional coordinate system in fig. 1, and "left side" and "right side" may correspond to two opposing faces perpendicular to the z-axis of the three-dimensional coordinate system in fig. 1. It should be noted that the positions of "front side", "rear side", "upper side", "lower side", "left side", and "right side" may be changed depending on the viewing angle or the viewing direction, and may also be changed depending on the change of the three-dimensional coordinate system. The first, second, third, fourth, fifth and/or

sixth deck boards

100, 200, 300, 400, 500, 600 may be honeycomb boards, for example, aluminum honeycomb boards. The aluminum honeycomb panel can greatly reduce the overall weight of the satellite and simultaneously provide certain heat conduction and heat dissipation capacity.

For ease of illustration, the first deck 100, the second deck 200, and the third deck 300 are shown in a tiled fashion in fig. 4A. It should be noted that the actual positional relationship of the first deck board 100, the second deck board 200, and the third deck board 300 may be as shown in fig. 1.

The heat sink assembly 1000 may include a plurality of intra-plate thermally conductive members and a plurality of inter-plate thermally conductive members. The plurality of intra-plate thermally conductive members are configured to be thermally coupled to a deck plate to facilitate heat dissipation within the deck plate to accelerate an isothermal process within the deck plate. A plurality of inter-board thermally conductive members, each of the plurality of inter-board thermally conductive members configured to be thermally coupled to at least two of the plurality of intra-board thermally conductive members to facilitate heat spreading between the plurality of deck boards to accelerate isothermal tempering between the plurality of deck boards and, in turn, isothermal tempering of the entire cabin.

The heat dissipation assembly 1000 may include a first heat conduction layer 731, a second heat conduction layer 732, a third heat conduction layer 733, a first heat diffusion plate 721, a second heat diffusion plate 722, a third heat diffusion plate 723, a first in-board heat conduction member 741, a second in-board heat conduction member 742, a third in-board heat conduction member 743, a first inter-board heat conduction member 711, a second inter-board heat conduction member 712, a first heat dissipation layer 761, a second heat dissipation layer 762, a third heat dissipation layer 763, a first thermal insulation layer 771, a second thermal insulation layer 772, and a third thermal insulation layer 773. It should be noted that the above listed components or layers are only exemplary and not limiting. In other embodiments, one or more of the above-described layers, plates, or components may not be present or omitted.

The first heat conductive layer 731 may encase the first deck 100. The first thermally conductive layer 731 may be made of metal to provide thermal conduction to promote the diffusion of heat within the first deck 100. The first heat conductive layer 731 may completely or partially encase the first deck board 100. For example, the first thermally conductive layer 731 may be an aluminum film.

The second thermally conductive layer 732 may encase the second deck 200. The second thermally conductive layer 732 may be made of metal to provide thermal conduction to promote the diffusion of heat within the second deck 200. The second thermally conductive layer 732 may completely or partially encase the second deck 200. For example, the second thermally conductive layer 732 may be an aluminum film. The first heat conductive layer 731 may be in contact with the second heat conductive layer 732 to further promote the diffusion of heat between the first deck 100 and the second deck 200.

The third heat conducting layer 733 may cover the third deck 300. The third heat conducting layer 733 may be made of metal to provide heat conduction to promote heat diffusion within the third deck 300. The third heat conducting layer 733 may completely or partially envelop the third deck 300. For example, the third heat conduction layer 733 may be an aluminum film. The second thermally conductive layer 732 may be in contact with the third thermally conductive layer 733 to further promote the diffusion of heat between the second deck 200 and the third deck 300.

The first heat spreading plate 721 is attached to the first heat conducting layer 731 on a first side of the first deck 100 (e.g., the side on which the first heat source 110 is located). The plurality of first heat diffusion plates 721 are shown in the figure to be respectively in contact with the first heat source 110 to promote the diffusion of heat from the first heat source 110 to the first heat conduction layer 731. The first thermally conductive layer 731 may then spread the heat to the first deck board 100. The first heat source 110 may be a high power electronic device or device. It should be noted that the number, size, shape, orientation, and/or location of the first heat sources 110 shown in the figures are exemplary only, and not limiting. The number, size, shape, orientation, and/or location of the first heat diffusion plates 721 may be changed according to the number, size, shape, orientation, and/or location of the first heat sources 110. The first heat diffusion plate 721 may be a metal plate, for example, an aluminum plate.

A second heat spreading plate 722 is attached to the second heat conducting layer 732 on a first side of the second deck 200 (e.g., the side on which the second heat source 210 is located). The plurality of second thermal diffusion plates 722 are shown in contact with the second heat source 210 to promote the diffusion of heat from the second heat source 210 to the second thermal conduction layer 732. The second thermally conductive layer 732 may then diffuse heat to the second deck 200. The second heat source 210 may be a high power electronic device or device. It should be noted that the number, size, shape, orientation, and/or location of the second heat sources 210 shown in the figures are exemplary only, and not limiting. The number, size, shape, orientation, and/or location of the second heat diffusion plate 722 may vary according to the number, size, shape, orientation, and/or location of the second heat sources 210. The second heat diffusion plate 722 may be a metal plate, for example, an aluminum plate.

A third heat spreading plate 723 is attached to the third heat conducting layer 733 on a first side of the third deck 300 (e.g., the side on which the third heat source 310 is located). A plurality of third thermal diffusion plates 723 are shown in the figure to be in contact with the third heat sources 310, respectively, to promote the diffusion of heat from the third heat sources 310 to the third heat conduction layer 733. The third thermally conductive layer 733 may then diffuse heat to the third deck 300. The third heat source 310 may be a high power electronic device or device. It should be noted that the number, size, shape, orientation, and/or location of the third heat sources 310 shown in the figures are exemplary only and not limiting. The number, size, shape, orientation, and/or location of the third heat diffusion plates 723 may vary according to the number, size, shape, orientation, and/or location of the third heat sources 310. The third heat diffusion plate 723 may be a metal plate, for example, an aluminum plate.

The first intra-panel heat-conducting member 741 may be thermally coupled to the first deck board 100 to promote diffusion of heat within the first deck board 100, thereby accelerating isothermal temperature of the first deck board 100. In this application, isothermal refers to a process in which the system continuously adjusts the temperature to be the same as that of the heat source through heat exchange or heat diffusion. In this application, thermally coupled refers to a heat transfer connection achieved by means of heat transfer, heat convection and/or heat radiation. The thermal coupling may be achieved by direct contact between the two heat conducting members, or by two heat conducting members each contacting an intermediate heat conducting member. The first intra-panel heat conduction member 741 may be disposed within the first deck board 100 and in contact with the first heat conduction layer 731. The first intra-panel heat conduction member 741 may be completely embedded or partially embedded in the first deck board 100. The radiator of the first in-board heat conduction member 741 arranged in an embedded manner has the highest efficiency and the smallest weight and area. The first in-board heat conductive member 741 may also be disposed on the first heat conductive layer 731 in contact with the one or more first heat diffusion plates 721.

The first in-board heat conduction member 741 may include a plurality of first in-board heat pipes 751. In this application, a heat pipe refers to a heat transfer element that rapidly transfers heat from a heat source to the outside of the heat source using the principle of heat conduction and the rapid heat transfer property of a refrigerant medium. The heat pipe may be comprised of a pipe shell, a wick comprised of a capillary porous material, and end caps. When one end of the heat pipe is heated, the liquid in the capillary tube is quickly vaporized, the vapor flows to the other end under the power of heat diffusion, and is condensed at the cold end to release heat, and the liquid flows back to the evaporation end along the porous material by capillary action, and the circulation is not continued until the temperatures at the two ends of the heat pipe are basically equal. Any one of the plurality of first in-board heat pipes 751 may be thermally coupled to an adjacent heat pipe. For example, any one of the plurality of first in-board heat pipes 751 may be in contact with an adjacent heat pipe. One or more portions of any of the plurality of first in-board heat pipes 751 may be orthogonal to adjacent heat pipes to form an orthogonal network of pipes such that heat from the first heat source 110 can quickly spread throughout the first deck board 100 and the first heat conductive layer 731 through the orthogonal network of pipes and then radiate to the external environment (e.g., space) via the first heat conductive layer 731 and a first heat spreading layer 761 (described in detail below). One or more of the plurality of first in-board heat pipes 751 may be arranged on the first heat conducting layer 731 and in contact with the one or more first heat spreading plates 721. Any one of the first in-board heat pipes 751 may be used to facilitate isothermization between two first heat sources 110 thermally coupled thereto. It should be noted that the number, size, shape, orientation, and/or location of the heat pipes 751 within the first plate illustrated in the figures are merely exemplary, and not limiting. The number, size, shape, orientation, and/or location of the first in-board heat pipes 751 may vary depending on the number, size, shape, orientation, and/or location of the first heat sources 110. In some embodiments, the plurality of first in-board heat pipes 751 are all at the same level.

The second in-board thermal conduction member 742 may be thermally coupled to the second deck 200 to facilitate the diffusion of heat within the second deck 200 to accelerate the isothermal temperature of the second deck 200. The second in-board heat conducting member 742 may be disposed within the second deck 200 and in contact with the second heat conducting layer 732. The second in-board heat conducting member 742 may be completely embedded or partially embedded within the second deck 200. The radiator of the second in-board heat conduction member 742, which is disposed in an embedded manner, has the highest efficiency and the smallest weight and area. A second in-board heat conducting member 742 may also be disposed on the second heat conducting layer 732 and in contact with the second heat spreading plate 722.

The second in-board heat conducting member 742 may comprise a plurality of second in-board heat pipes 752. Any one of the plurality of second in-board heat pipes 752 may be thermally coupled to an adjacent heat pipe. For example, any one of the plurality of second in-board heat pipes 752 may be in contact with an adjacent heat pipe. One or more portions of any of the plurality of second on-board heat pipes 752 may be orthogonal to adjacent heat pipes to form an orthogonal network of pipes such that heat from the second heat source 210 can quickly diffuse throughout the second deck 200 and the second heat conductive layer 732 through the orthogonal network of pipes and then radiate to the external environment (e.g., aerospace) via the second heat conductive layer 732 and a second heat dissipation layer 762 (described in detail below). One or more of the plurality of second in-board heat pipes 752 may be disposed on the second heat conducting layer 732 and in contact with the one or more second heat spreading plates 722. Any one of the second in-board heat pipes 752 may be used to facilitate isothermization between the two second heat sources 210 thermally coupled thereto. It should be noted that the number, size, shape, orientation, and/or location of the second in-board heat pipes 752 shown in the figures are exemplary only and not limiting. The number, size, shape, orientation, and/or location of the second in-board heat pipes 752 may vary depending on the number, size, shape, orientation, and/or location of the second heat sources 210. In some embodiments, the plurality of second in-board heat pipes 752 are all at the same level.

The third plate inner thermally conductive member 743 may be thermally coupled to the third deck 300 to promote the diffusion of heat within the third deck 300 to accelerate the isothermal transformation of the second deck 300. The third in-plate heat transfer member 743 may be disposed in the third compartment plate 300 and in contact with the third heat transfer layer 733. The third in-board thermal conduction member 743 may be completely embedded or partially embedded within the third deck 300. The radiator of the third plate inner heat-conductive member 743, which is provided by the pre-buried manner, has the highest efficiency and the smallest weight and area. The third in-plate heat conductive member 743 may also be disposed on the third heat conductive layer 733 and in contact with the third heat diffusion plate 723.

The third in-plate heat transfer member 743 may include a plurality of third in-plate heat pipes 753. Any one of the plurality of third in-plate heat pipes 753 may be thermally coupled to an adjacent heat pipe. For example, any one of the plurality of third in-plate heat pipes 753 may be in contact with an adjacent heat pipe. One or more portions of any of the plurality of third in-plate heat pipes 753 can be orthogonal to adjacent heat pipes to form an orthogonal network of pipes through which heat from the third heat source 310 can quickly spread throughout the third deck 300 and the third heat conducting layer 733 and subsequently radiate to the external environment (e.g., aerospace) via the third heat conducting layer 733 and a third heat dissipation layer 763 (described in detail below). One or more of the plurality of third in-plate heat pipes 753 may be disposed on the third heat conducting layer 733 and in contact with one or more third heat spreading plates 723. Any one of the third in-plate heat pipes 753 may be used to facilitate isothermization between two third heat sources 310 that are thermally coupled thereto. It should be noted that the number, size, shape, orientation, and/or location of the third in-plate heat pipes 753 shown in the figures is merely exemplary, and not limiting. The number, size, shape, orientation, and/or location of third in-plate heat pipes 753 may be varied depending on the number, size, shape, orientation, and/or location of third heat sources 310. In some embodiments, the plurality of third in-plate heat pipes 753 are all at the same level.

The first inter-plate heat-conduction member 781 may be thermally coupled to the first intra-plate heat-conduction member 741 and the second intra-plate heat-conduction member 742 to promote the diffusion of heat between the first and

second deck boards

100, 200, thereby accelerating the isothermal temperature between the first and

second deck boards

100, 200. The first inter-plate heat conductive members 781 may be in contact with the first heat conductive layer 731 and the second heat conductive layer 732. The first inter-plate heat transfer member 781 may include one or more first inter-plate heat pipes 711, and the first inter-plate heat pipes 711 may be thermally coupled to one or more of the plurality of first in-plate heat pipes 751 and may be thermally coupled to one or more of the plurality of second in-plate heat pipes 752. One or more portions of the first inter-plate heat pipes 711 may be orthogonal to the one or more first in-plate heat pipes 751 and orthogonal to the one or more second in-plate heat pipes 752. In some embodiments, the first inter-plate heat pipes 711 may have an L-shaped cross-section (e.g., when the first and

second deck boards

100 and 200 are substantially perpendicular to each other). In some embodiments, the first inter-plate heat pipes 711 may be in contact with one or more first heat diffusion plates 721 and/or second heat diffusion plates 722 to enhance the heat diffusion effect. It should be noted that the number, size, shape, orientation, and/or location of the first inter-plate heat pipes 711 shown in the figures are merely exemplary and not limiting. The number, size, shape, orientation, and/or location of the first inter-plate heat pipes 711 may vary depending on the number, size, shape, orientation, and/or location of the first and/or

second heat sources

110, 210, and may also vary depending on the number, size, shape, orientation, and/or location of the first and/or second

intra-plate heat pipes

751, 752.

The second inter-panel heat transfer member 782 may be thermally coupled to the second intra-panel heat transfer member 742 and the third intra-panel heat transfer member 743 to promote the diffusion of heat between the second deck 200 and the third deck 300, thereby accelerating the isothermal occurrence between the second deck 200 and the third deck 300. The second inter-plate heat conductive members 782 may be in contact with the second and third heat

conductive layers

732, 733. The second inter-plate heat transfer member 782 may include one or more second inter-plate heat pipes 712, and the second inter-plate heat pipes 712 may be thermally coupled to one or more of the second plurality of in-plate heat pipes 752 and may be thermally coupled to one or more of the third plurality of in-plate heat pipes 753. One or more portions of the second inter-plate heat pipes 712 may be orthogonal to the one or more second in-plate heat pipes 752 and orthogonal to the one or more third in-plate heat pipes 753. In some embodiments, the second inter-plate heat pipes 712 may have an L-shaped cross-section (e.g., when the second and

third deck boards

200, 300 are substantially perpendicular to each other). In some embodiments, the second inter-plate heat pipes 712 may be in contact with one or more second heat diffusion plates 722 and/or third heat diffusion plates 723 to enhance the heat diffusion effect. It should be noted that the number, size, shape, orientation, and/or location of the second inter-plate heat pipes 712 shown in the figures is merely exemplary and not limiting. The number, size, shape, orientation, and/or location of second inter-plate heat pipes 712 may vary depending on the number, size, shape, orientation, and/or location of second heat sources 210 and/or third heat sources 310, as well as the number, size, shape, orientation, and/or location of second in-plate heat pipes 752 and/or third in-plate heat pipes 753.

The first heat spreading layer 761 may be attached to the first heat conducting layer 731 on a second side of the first deck 100 (e.g., a side away from the first heat source 110) opposite the first side of the first deck 100 to facilitate the spreading of heat from the first heat conducting layer 731 to an external environment (e.g., outer space). The first heat sink layer 761 may be white paint or other high emissivity material.

The second heat spreading layer 762 may be attached to the second heat conducting layer 732 on a second side of the second deck 200 (e.g., the side away from the second heat source 210) opposite the first side of the second deck 200 to promote the spreading of heat from the second heat conducting layer 732 to the external environment (e.g., outer space). The second heat spreading layer 762 may be a white paint or other high emissivity material.

A third heat sink layer 763 may be attached to the third heat conducting layer 733 on a second side of the third deck 300 (e.g., the side away from the third heat source 310) opposite the first side of the third deck 300 to promote the diffusion of heat from the third heat conducting layer 733 to the external environment (e.g., outer space). The third heat spreading layer 763 can be white paint or other high emissivity material.

The first thermal insulation layer 771 can be attached to the first heat conducting layer 731 on the second side of the first deck 100 to limit the diffusion of heat from the first heat conducting layer 731 to the outside environment. The first insulating layer 771 may include a high absorption rate material, for example, polyimide. The first insulating layer 771 may be a mesh-like multi-layer (e.g., 5 to 10 layers) structure. The first thermal insulation layer 771 may have a first opening exposing the first thermal conduction layer 731, and the first heat dissipation layer 761 may be located in the first opening. The position, number, size and/or shape of the first opening may be designed according to the position, number, size and/or shape of the first heat source 110. For example, the first opening may be disposed at a location that is substantially symmetrical to the first heat source 110 relative to the first deck board 100. The first heat dissipation layer 761 may be sprayed to fill the first opening.

A second insulating layer 772 may be attached to the second heat conducting layer 732 on the second side of the second deck 200 to limit the diffusion of heat from the second heat conducting layer 732 to the outside environment. The second insulating layer 772 may include a high absorption rate material, such as polyimide. The second insulating layer 772 may have a mesh-like multi-layer (e.g., 5 to 10 layers) structure. The second insulating layer 772 has a second opening exposing the second heat conducting layer 732, and the second heat dissipation layer 762 may be located in the second opening. The position, number, size and/or shape of the second openings may be designed according to the position, number, size and/or shape of the second heat sources 210. For example, the second opening may be disposed at a location that is substantially symmetrical to the second heat source 210 relative to the second deck board 200. The second heat dissipation layer 762 may be sprayed to fill the second opening.

A third insulating layer 773 may be attached to the third heat conducting layer 733 on a second side of the third deck 300 to limit the diffusion of heat from the third heat conducting layer 733 to the outside environment. The third insulating layer 773 may comprise a high absorption rate material, such as polyimide. The third insulating layer 773 may be a mesh-like multi-layer (e.g., 5 to 10 layers) structure. The third insulating layer 773 has a third opening exposing the third heat conducting layer 733, and the third heat dissipation layer 763 may be located in the third opening. The position, number, size, and/or shape of the third openings may be designed according to the position, number, size, and/or shape of the third heat sources 310. For example, the third opening may be disposed at a location that is substantially symmetrical with the third heat source 310 relative to the third deck 300. The third heat dissipation layer 763 may be sprayed to fill the third opening.

Fig. 5 shows another exemplary embodiment of a heat sink assembly 1000, wherein a first inter-plate heat pipe 711 is thermally coupled to only one first in-plate heat pipe 751 and one second in-plate heat pipe 752, and a second inter-plate heat pipe 712 is thermally coupled to only one second in-plate heat pipe 752 and one third in-plate heat pipe 753.

Fig. 6A and 6B illustrate yet another exemplary embodiment of a heat dissipation assembly 1000, wherein the first inter-plate heat conductive member 781 may include a plurality of fourth inter-plate heat pipes 714 (e.g., two), and the second inter-plate heat conductive member 782 may include a plurality of fifth inter-plate heat pipes 715 (e.g., two). It should be noted that for convenience of description, in fig. 6B, in addition to the first, second, third, fifth, and fourth

inter-plate heat pipes

714, 715, 751, 752, and 753, no other deck boards, components, or layers are shown, but this does not mean that these deck boards, components, or layers must not be present.

Both ends of each of the plurality of fourth inter-plate heat pipes 714 may be thermally coupled to the first in-plate heat pipe 751 and the second in-plate heat pipe 752, respectively. One or more portions of the fourth inter-plate heat pipe 714 may be parallel to the one or more first in-plate heat pipes 751 and parallel to the one or more second in-plate heat pipes 752. In some embodiments, the fourth inter-plate heat pipes 714 may have an L-shaped cross-section (e.g., when the first and

second deck boards

100 and 200 are substantially perpendicular to each other). In some embodiments, the fourth inter-plate heat pipes 714 may be in contact with one or more of the first heat diffusion plate 721 and/or the second heat diffusion plate 722 to enhance the heat diffusion effect. It should be noted that the number, size, shape, orientation, and/or location of the fourth inter-plate heat pipes 714 shown in the figures are merely exemplary and not limiting. The number, size, shape, orientation, and/or location of the fourth inter-plate heat pipes 714 may vary depending on the number, size, shape, orientation, and/or location of the first and/or

second heat sources

110, 210, as well as the number, size, shape, orientation, and/or location of the first and/or second in-

plate heat pipes

751, 752.

Both ends of each of the fifth inter-plate heat pipes 715 may be thermally coupled to the second in-plate heat pipe 752 and the third in-plate heat pipe 753, respectively. One or more portions of the fifth plurality of inter-plate heat pipes 715 may be parallel to the one or more second in-plate heat pipes 752 and parallel to the one or more third in-plate heat pipes 753. In some embodiments, the plurality of fifth inter-plate heat pipes 715 may have an L-shaped cross-section (e.g., when the second and

third deck boards

200, 300 are substantially perpendicular to each other). In some embodiments, a plurality of fifth inter-plate heat pipes 715 may be in contact with one or more second heat diffusion plates 722 and/or third heat diffusion plates 723 to enhance the heat diffusion effect. It should be noted that the number, size, shape, orientation, and/or location of the plurality of fifth inter-plate heat pipes 715 shown in the figures are merely exemplary, and not limiting. The number, size, shape, orientation, and/or location of the plurality of fifth inter-plate heat pipes 715 may vary depending on the number, size, shape, orientation, and/or location of second heat sources 210 and/or third heat sources 310, and may also vary depending on the number, size, shape, orientation, and/or location of second in-plate heat pipes 752 and/or third in-plate heat pipes 753.

Fig. 7 illustrates yet another exemplary embodiment of a heat dissipation assembly 1000, wherein the plurality of inter-panel heat transfer members includes a third inter-panel heat transfer member 783, the third inter-panel heat transfer member 783 configured to thermally couple with the first, second, and third intra-panel

heat transfer members

741, 742, 743 to facilitate heat dissipation among the first, second, and

third deck panels

100, 200, and 300 to accelerate isothermization among the first, second, and

third deck panels

100, 200, and 300.

The third inter-plate heat conductive member 783 may be in contact with the first heat conductive layer 731, the second heat conductive layer 732, and the third heat conductive layer 733. The third inter-plate heat-conducting member 783 includes one or more third inter-plate heat pipes 713, the third inter-plate heat pipes 713 being thermally coupled to one or more of the plurality of first intra-plate heat pipes 751, to one or more of the plurality of second intra-plate heat pipes 752, and to one or more of the plurality of third intra-plate heat pipes 753. One or more portions of the third inter-plate heat pipes 713 may be orthogonal to the one or more first in-plate heat pipes 751, orthogonal to the one or more second in-plate heat pipes 752, and orthogonal to the one or more third in-plate heat pipes 753. In some embodiments, the third inter-plate heatpipes 713 may have a U-shaped cross-section (e.g., when the first and

second hatches

100, 200 are substantially perpendicular to each other and the second and

third hatches

200, 300 are substantially perpendicular to each other). In some embodiments, the third inter-plate heat pipes 713 may be in contact with one or more of the first heat diffusion plate 721, the second heat diffusion plate 722, and/or the third heat diffusion plate 723 to enhance the heat diffusion effect. It should be noted that the number, size, shape, orientation, and/or location of the third inter-plate heat pipes 713 shown in the figures are exemplary only and not limiting. The number, size, shape, orientation, and/or location of the first inter-plate heat pipes 711 may vary depending on the number, size, shape, orientation, and/or location of the first, second, and/or

third heat sources

110, 210, and/or 310, and may also vary depending on the number, size, shape, orientation, and/or location of the first, second, and/or third in-

plate heat pipes

751, 752, and/or 753.

It should be noted that any of the configurations of the heat dissipating assembly 100 previously mentioned for the first deck board 100, the second deck board 200, and/or the third deck board 300 may be used for the fourth deck board 400, the fifth deck board 500, and/or the sixth deck board 600, and various combinations, changes, and adjustments thereof also fall within the scope of the present application.

Fig. 8 shows a further exemplary embodiment of a heat dissipation assembly 1000, wherein six deck boards of the nacelle 1 are shown in a tiled manner. As shown, the heat dissipation assembly 1000 may include a first inter-plate heat conduction member 741, a second inter-plate heat conduction member 742, a third inter-plate heat conduction member 743, a fourth inter-plate heat conduction member 744, a fifth inter-plate heat conduction member 745, a sixth inter-plate heat conduction member 746, a first inter-plate heat conduction member, a second inter-plate heat conduction member, a sixth inter-plate heat conduction member, a seventh inter-plate heat conduction member, and an eighth inter-plate heat conduction member.

The first intra-plate heat-conducting member 741 may be thermally coupled or in contact with the first deck plate 100 to promote diffusion of heat within the first deck plate 100, thereby accelerating isothermal temperature of the first deck plate 100. The first in-board heat conduction member 741 may include a plurality of first in-board heat pipes 751. Any one of the plurality of first in-board heat pipes 751 may be thermally coupled or in contact with an adjacent heat pipe.

The second in-board thermal conduction member 742 may be thermally coupled or in contact with the second deck 200 to promote the diffusion of heat within the second deck 200, thereby accelerating the isothermal temperature of the second deck 200. The second in-board heat conducting member 742 may comprise a plurality of second in-board heat pipes 752. Any one of the plurality of second in-board heat pipes 752 may be thermally coupled or in contact with an adjacent heat pipe.

The third plate inner thermally conductive member 743 may be thermally coupled to or in contact with the third deck 300 to promote the diffusion of heat within the third deck 300 to accelerate the isothermal transformation of the second deck 300. The third in-plate heat transfer member 743 may include a plurality of third in-plate heat pipes 753. Any one of the plurality of third in-plate heat pipes 753 may be thermally coupled to or in contact with an adjacent heat pipe.

The fourth in-board heat transfer member 744 may be thermally coupled to or in contact with the fourth deck board 400 to facilitate the diffusion of heat within the fourth deck board 400 to accelerate the isothermal temperature of the fourth deck board 400. The fourth in-board heat transfer component 744 may include a plurality of fourth in-board heat pipes 754. Any one of the plurality of fourth in-board heat pipes 754 may be thermally coupled or in contact with an adjacent heat pipe.

The fifth in-board thermal conduction members 745 may be thermally coupled to or in contact with the fifth deck board 500 to facilitate heat dissipation within the fifth deck board 500, thereby accelerating isothermal temperature of the fifth deck board 500. The fifth in-board heat transfer member 745 may comprise a plurality of fifth in-board heat pipes 755. Any one of the fifth plurality of in-board heat pipes 755 may be thermally coupled or in contact with an adjacent heat pipe.

The sixth in-plate heat transfer member 746 may be thermally coupled or in contact with the sixth deck plate 600 to facilitate heat dissipation within the sixth deck plate 600, thereby accelerating isothermization of the sixth deck plate 600. Sixth in-plate heat transfer member 746 may include a plurality of sixth in-plate heat pipes 756. Any one of the plurality of sixth in-board heat pipes 756 may be thermally coupled to or in contact with an adjacent heat pipe.

The first inter-plate heat-conduction member may be thermally coupled to the first intra-plate heat-conduction member 741 and the second intra-plate heat-conduction member 742 to promote diffusion of heat between the first and

second deck boards

100 and 200, thereby accelerating isothermization between the first and

second deck boards

100 and 200. The first inter-plate heat transfer member may include one or more first inter-plate heat pipes 711, and the first inter-plate heat pipes 711 may be thermally coupled to one or more of the plurality of first in-plate heat pipes 751 and may be thermally coupled to one or more of the plurality of second in-plate heat pipes 752.

The second inter-plate heat-transfer member may be thermally coupled to the second intra-plate heat-transfer member 742 and the third intra-plate heat-transfer member 743 to promote the diffusion of heat between the second deck 200 and the third deck 300, thereby accelerating the isothermal temperature between the second deck 200 and the third deck 300. The second inter-plate heat transfer member may comprise one or more second inter-plate heat pipes 712, and the second inter-plate heat pipes 712 may be thermally coupled to one or more of the plurality of second in-plate heat pipes 752 and may be thermally coupled to one or more of the plurality of third in-plate heat pipes 753.

The sixth inter-plate heat-conduction member may be thermally coupled to the second intra-plate heat-conduction member 742 and the sixth intra-plate heat-conduction member 746 to promote the diffusion of heat between the second deck plate 200 and the sixth deck plate 600, thereby accelerating the isothermal temperature between the second deck plate 200 and the sixth deck plate 600. The sixth inter-plate heat transfer member may include one or more sixth inter-plate heat pipes 716, and the sixth inter-plate heat pipes 716 may be thermally coupled to one or more of the second plurality of in-plate heat pipes 752 and may be thermally coupled to one or more of the sixth plurality of in-plate heat pipes 756.

The seventh inter-plate heat transfer member may be thermally coupled to the sixth intra-plate heat transfer member 746 and the fifth intra-plate heat transfer member 745 to facilitate heat dissipation between the sixth deck 600 and the fifth deck 500, thereby accelerating isothermal temperature between the sixth deck 600 and the fifth deck 500. The seventh inter-plate heat transfer member may include one or more seventh inter-plate heat pipes 717, and the seventh inter-plate heat pipes 717 may be thermally coupled to one or more of the sixth plurality of in-plate heat pipes 756 and may be thermally coupled to one or more of the fifth plurality of in-plate heat pipes 755.

The eighth inter-plate heat-conduction member may be thermally coupled to the second intra-plate heat-conduction member 742 and the fourth intra-plate heat-conduction member 744 to promote the diffusion of heat between the second deck 200 and the fourth deck 400, thereby accelerating the isothermal process between the second deck 200 and the fourth deck 400. The eighth inter-plate heat transfer member may include one or more eighth inter-plate heat pipes 718, and the eighth inter-plate heat pipes 718 may be thermally coupled to one or more of the second plurality of in-plate heat pipes 752 and may be thermally coupled to one or more of the fourth plurality of in-plate heat pipes 754.

To enhance the isothermal effect, interplate heat conducting members may be provided between any two adjacent deck boards.

The present application further discloses a spacecraft, which may include: cabin and the heat dissipation assembly for the cabin according to the embodiment of the application. The spacecraft may be a space station, a spacecraft, or a satellite.

Through the various high-efficiency heat pipe network arrangement schemes, the heat of the high-power-consumption single-machine equipment with concentrated heat consumption can be effectively and quickly diffused, the isothermal design of the cabin body is realized to the maximum extent, meanwhile, the heat of all cabin plates with great heat consumption disparity can be coupled to form the three-dimensional heat pipe network of the whole satellite, the isothermal design of the whole satellite is realized, and a stable working environment is provided for loads working for a long time.

In the present application, certain terminology has been used to describe embodiments of the present application. For example, the terms "embodiment," "one embodiment," and/or "some embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Therefore, it is emphasized and should be appreciated that two or more references to "an embodiment," "one embodiment," or "an alternative embodiment" in various portions of this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined as suitable in one or more embodiments of the application.

Having thus described the basic concepts, it will become apparent to those skilled in the art from this detailed disclosure, which is intended to be presented by way of example only, and not limitation. Various changes, improvements and modifications may be desired and suggested to one skilled in the art, although not explicitly described herein. For example, the steps in the methods of the present application may not necessarily be operated exactly in the order described. These steps may also be performed in part and/or in other combinations as reasonably contemplated by one of ordinary skill in the art. Such alterations, improvements, and modifications are intended to be suggested by this application and are within the spirit and scope of the exemplary embodiments of this application.

Claims

1. A heat dissipation assembly for a cabin, the cabin including a plurality of deck boards, the heat dissipation assembly comprising:

a plurality of in-board thermal conduction members, each of the plurality of in-board thermal conduction members configured to be thermally coupled to one of the plurality of deck boards; and

a plurality of inter-plate thermally conductive members, each of the plurality of inter-plate thermally conductive members configured to be thermally coupled to at least two of the plurality of intra-plate thermally conductive members.

2. The heat dissipation assembly of claim 1,

the plurality of deck boards comprising:

a first deck board; and

a second deck adjacent to the first deck,

the plurality of in-board heat-conductive members include:

a first in-board thermally conductive member configured to be thermally coupled to the first deck board; and

a second in-board thermally conductive member configured to be thermally coupled to the second deck board,

the plurality of inter-plate heat-conductive members include:

a first inter-plate heat-conducting member configured to be thermally coupled to the first intra-plate heat-conducting member and the second intra-plate heat-conducting member.

3. The heat dissipation assembly of claim 2, further comprising:

a first thermally conductive layer configured to encase the first deck; and

a second thermally conductive layer configured to encase the second deck,

wherein the first inboard thermally conductive member is disposed within the first deck and is in contact with the first thermally conductive layer; the second inboard heat transfer component is disposed within the second deck and in contact with the second heat transfer layer; the first inter-plate heat conduction member is in contact with the first heat conduction layer and the second heat conduction layer.

4. The heat removal assembly of claim 2, wherein the first in-board heat transfer component comprises a plurality of first in-board heat pipes, any of the plurality of first in-board heat pipes being thermally coupled to an adjacent heat pipe; the second in-board thermal conduction component comprises a plurality of second in-board heat pipes, any of which is thermally coupled to an adjacent heat pipe; the first inter-plate heat transfer member includes a first inter-plate heat pipe thermally coupled to one or more of the first plurality of in-plate heat pipes and to one or more of the second plurality of in-plate heat pipes.

5. The heat removal assembly of claim 4, wherein any of the plurality of first in-board heat pipes is in contact with an adjacent heat pipe; any heat pipe of the second plurality of in-board heat pipes is in contact with an adjacent heat pipe.

6. The heat dissipation assembly of claim 5,

the plurality of deck boards comprising:

a third deck adjacent to the second deck,

the plurality of in-board heat-conductive members include:

a third in-board thermally conductive member configured to thermally couple with the third deck,

the plurality of inter-plate heat-conductive members include:

a second inter-plate heat-conducting member configured to be thermally coupled to the second intra-plate heat-conducting member and the third intra-plate heat-conducting member.

7. The heat removal assembly of claim 6, wherein the third in-board heat transfer component comprises a plurality of third in-board heat pipes, any of the plurality of third in-board heat pipes thermally coupled to an adjacent heat pipe; the second inter-plate heat conducting member includes a second inter-plate heat pipe thermally coupled to one or more of the second plurality of in-plate heat pipes and one or more of the third plurality of in-plate heat pipes.

8. The heat removal assembly of claim 7, wherein any of the plurality of third in-board heat pipes is in contact with an adjacent heat pipe.

9. The heat dissipation assembly of claim 1,

the plurality of deck boards comprising:

a first deck board;

a second deck adjacent to the first deck; and

a third deck adjacent to the second deck,

the plurality of in-board heat-conductive members include:

a first in-board thermally conductive member configured to be thermally coupled to the first deck board;

a second in-board thermally conductive member configured to be thermally coupled to the second deck board; and

the plurality of inter-plate heat-conductive members include:

a third inter-plate heat-conducting member configured to be thermally coupled to the first intra-plate heat-conducting member, the second intra-plate heat-conducting member, and the third intra-plate heat-conducting member.

10. The heat dissipation assembly of claim 9, further comprising:

a first thermally conductive layer configured to encase the first deck;

a second thermally conductive layer configured to encase the second deck; and

a third thermally conductive layer configured to encase the third deck,

wherein the first inboard thermally conductive member is disposed within the first deck and is in contact with the first thermally conductive layer; the second inboard heat transfer component is disposed within the second deck and in contact with the second heat transfer layer; the third in-board heat transfer member is disposed within the third deck and in contact with the third heat transfer layer; the third inter-plate heat-conductive member is in contact with the first heat-conductive layer, the second heat-conductive layer, and the third heat-conductive layer.

11. The heat removal assembly of claim 9, wherein the first in-board heat transfer component comprises a plurality of first in-board heat pipes, any of the plurality of first in-board heat pipes being thermally coupled to an adjacent heat pipe; the second in-board thermal conduction component comprises a plurality of second in-board heat pipes, any of which is thermally coupled to an adjacent heat pipe; the third in-plate heat transfer member comprises a plurality of third in-plate heat pipes, any of which is thermally coupled to an adjacent heat pipe; the third inter-plate heat transfer member includes a third inter-plate heat pipe thermally coupled to one or more of the plurality of first intra-plate heat pipes, one or more of the plurality of second intra-plate heat pipes, and one or more of the plurality of third intra-plate heat pipes.

12. The heat removal assembly of claim 11, wherein any of the plurality of first in-board heat pipes is in contact with an adjacent heat pipe; any heat pipe of the second plurality of in-board heat pipes is in contact with an adjacent heat pipe; any heat pipe of the third plurality of in-plate heat pipes is in contact with an adjacent heat pipe.

13. The heat dissipation assembly of claim 1, wherein the tank is a satellite tank and the plurality of deck boards are aluminum honeycomb panels.

14. A spacecraft, comprising:

a cabin body; and

the heat dissipating assembly for a cabin of any one of claims 1 to 13.