CN214173303U - Crack monitoring device - Google Patents
Crack monitoring device Download PDFInfo
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- CN214173303U CN214173303U CN202120321472.2U CN202120321472U CN214173303U CN 214173303 U CN214173303 U CN 214173303U CN 202120321472 U CN202120321472 U CN 202120321472U CN 214173303 U CN214173303 U CN 214173303U
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Abstract
The utility model provides a crack monitoring device, which comprises an intelligent collector and a crack meter connected with the intelligent collector; the intelligent collector comprises a main control chip U4, a power management module, a signal receiving and processing module, a displacement processing module and a display module, wherein the power management module, the signal receiving and processing module, the displacement processing module and the display module are connected with the main control chip U4. Compared with the prior art, the utility model provides a crack monitoring device can obtain the crack width in real time, realizes the automation and the real-time monitoring of crack width.
Description
Technical Field
The utility model relates to a monitoring technology field especially relates to a crack monitoring device.
Background
The method plays an important role in monitoring the development trend of building foundation pits, landslides, tunnel pipelines, river dams and surface cracks of buildings and the safety of the structures or rock-soil bodies. Most of traditional crack monitoring manual operations are mainly performed, crack width development cannot be obtained in real time and continuously, the environment is severe in the process of crack monitoring, and monitoring instruments are required to have good environment adaptability.
Therefore, there is a need to provide a new crack monitoring device to overcome the above-mentioned drawbacks.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a novel crack monitoring device, it can obtain the crack width in real time, realizes the automation and the real-time supervision of crack width.
In order to achieve the purpose, the utility model provides a crack monitoring device, which comprises an intelligent collector and a crack meter connected with the intelligent collector; the intelligent collector comprises a main control chip U4, a power management module, a signal receiving and processing module, a displacement processing module and a display module, wherein the power management module, the signal receiving and processing module, the displacement processing module and the display module are connected with the main control chip U4;
the power management module comprises a lithium battery input unit for lithium battery power supply management and a solar charging unit for charging the lithium battery;
the signal receiving and processing module comprises a communication chip U9, a level conversion unit U14 connected with the communication chip U9, and a SIM card socket SIMCARD1 connected with the level conversion unit U14;
the displacement processing module comprises a single chip microcomputer U8 with two displacement interfaces and a differential reference input unit U15 connected with the single chip microcomputer;
the display module comprises a digital display driving chip U17 and a digital display connected with the digital display driving chip U17.
Further, the first pin of the single chip microcomputer U8 is connected with the second pin of the connector JP25, the third twelve pin of the single chip microcomputer U8 is connected with the first pin of the connector JP25, and the seventh pin of the single chip microcomputer U8 is connected with the fourth pin of the connector JP25 of the connector JP25 and is grounded; a twenty-third pin of the single chip microcomputer U8 is connected with a seventh pin, a twenty-first pin of the single chip microcomputer U8 is connected with a twenty-third pin of the single chip microcomputer U8 through a parallel capacitor C59, a capacitor C60 and a capacitor C52, a twenty-first pin of the single chip microcomputer U8 is grounded, a twenty-fourth pin and a twenty-fifth pin of the single chip microcomputer U8 are connected with a first path of displacement signals, and a sixteenth pin and a seventeenth pin of the single chip microcomputer U8 are connected with a second path of displacement signals;
a fifth pin of the single chip microcomputer U8 is connected with a fifth pin of the differential reference input unit U15 through a resistor R63, a first pin of the differential reference input unit U15 is connected with a tenth pin of the single chip microcomputer U8, a second pin and a third pin of the differential reference input unit U15 are connected with a crystal oscillator X2, and a fourth pin of the differential reference input unit U15 is connected with a ninth pin of the single chip microcomputer U8 through a resistor R60;
the sixth pin of the differential reference input unit U15 is connected with the third pin of a plug JP4 through a resistor R51, the second pin of the plug JP4 is connected with the ninth pin of the differential reference input unit U15, the seventh pin of the differential reference input unit U15 is connected with the third pin of the plug JP3 through a resistor R50, the second pin of the plug JP3 is connected with the ninth pin of the differential reference input unit U15, the eighth pin of the differential reference input unit U15 is grounded, the tenth pin and the eleventh pin of the differential reference input unit U15 are grounded, the twelfth pin of the differential reference input unit U15 is connected with the fifteenth pin of the singlechip U8, the thirteenth pin of the differential reference input unit U15 is connected with the fourteenth pin of the singlechip U8, the fourteenth pin of the differential reference input unit U15 is connected with the thirteenth pin of the singlechip U8, the fifteenth pin of the differential reference input unit U15 is connected with the seventh pin 8 of the singlechip U8, the sixteenth leg of the differential reference input unit U15 is connected to ground.
Further, the main control chip U4 is further connected with an expansion chip U12, a sixteenth pin of the expansion chip U12 is connected with a thirty-eighth pin of the main control chip U4, a eleventh pin of the expansion chip U12 is connected with a thirty-eighth pin of the main control chip U4, a twelfth pin of the expansion chip U12 is connected with a thirty-first pin of the main control chip U4, a thirteenth pin of the expansion chip U12 is connected with a third pin of the plug connector JP16, and a fourteenth pin of the expansion chip U12 is connected with a second pin of the plug connector JP 16.
Further, the master control chip U4 is further connected to an RTC chip U13.
Compared with the prior art, the crack monitoring device of the utility model adopts a modular design, a 40w lithium battery is arranged in the intelligent collector, data are reported 2 times a day, one year of endurance, a low-power step-down IC is used for stepping down to 3.3V and 5V detection battery power, an external low-power RTC is awakened at regular time or is awakened by a key, and the data are ensured to be actively and continuously reported according to the user requirements; adopt solar power source and built-in lithium cell dual power supply scheme, installation 10w solar panel can realize unlimited continuation of the journey, can guarantee the incessant collection of data, adopts the 4G module to carry out data display with data transmission to the server, guarantees that data can carry out remote transmission, realizes the long-range seamless linking of data to guarantee the nimble selection of data transfer, not receive the distance restriction, still can realize remote management under adverse circumstances.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
FIG. 1 is a schematic structural view of the crack monitoring device of the present invention;
FIG. 2 is a circuit diagram of a main control chip of the crack monitoring device of the present invention;
fig. 3 is a circuit diagram of the solar charging of the crack monitoring device of the present invention;
fig. 4 is a circuit diagram of a lithium battery input unit of the crack monitoring device of the present invention;
fig. 5 is a circuit diagram of a communication chip of the crack monitoring device of the present invention;
FIG. 6 is a circuit diagram of the communication chip of the crack monitoring device according to the present invention;
fig. 7 is a circuit diagram of the level conversion unit of the crack monitoring device of the present invention;
fig. 8 is a circuit diagram of the SIM card holder of the crack monitoring device of the present invention;
fig. 9 is a circuit diagram of the single chip microcomputer of the crack monitoring device of the present invention;
FIG. 10 is a circuit diagram of the crystal oscillator and the SWD download port interface of the single chip microcomputer of the crack monitoring device of the present invention;
FIG. 11 is a circuit diagram of the differential reference input unit of the crack monitoring device of the present invention
Fig. 12 is a circuit diagram of a display module of the crack monitoring device of the present invention;
fig. 13 is a circuit diagram of an extended chip of the crack monitoring device of the present invention;
fig. 14 is a circuit diagram of the RTC chip of the crack monitoring device of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below, and it should be apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1, a crack monitoring device includes an intelligent collector 1, and a crack meter 2 connected to the intelligent collector 1; the crack meter adopts a KTR11 crack meter. The intelligent collector comprises a main control chip U4, a power management module, a signal receiving and processing module, a displacement processing module and a display module, wherein the power management module, the signal receiving and processing module, the displacement processing module and the display module are connected with the main control chip U4.
Referring to fig. 2, fig. 3 and fig. 4, the power management module includes a lithium battery input unit for managing power supply of the lithium battery, and a solar charging unit for charging the lithium battery; the solar charging unit comprises a power management chip U1 and a solar charging management chip U2 connected with the power management chip U1;
the first pin, the second pin and the three pins of the power management chip U1 are connected with Vsun in parallel, the fifth pin, the sixth pin, the seventh pin and the eight pin of the power management chip U1 are connected with a diode D1 in parallel, the diode D1 is connected with an inductor L1, and the inductor L1 is connected with Vbat through a resistor R2; the fourth pin of the power management chip U1 is connected with the sixteenth pin of the solar charging management chip U2;
a first pin of the solar charging management chip U2 is connected with Vsun through a capacitor C3, a second pin and a third pin are grounded in parallel, a fourth pin of the solar charging management chip U2 is connected with one end of a light-emitting diode D4, a fifth pin of the solar charging management chip U2 is connected with one end of a light-emitting diode D3, and the other ends of the light-emitting diode D4 and the light-emitting diode D3 are both connected with Vsun; the seventh pin of the solar charging management chip U2 is connected with Vsun through a resistor R4; one end of the resistor R4, which is connected with the Vsun, is further connected with a fuse F3, the fuse F3 is connected with a diode D5, the diode D5 is connected with the second pin of the interface JP17, the first pin of the interface JP17 is grounded, the seventh pin of the solar charging management chip U2 is further grounded through a resistor R10, and the resistor R4 and the resistor R10 are connected in series;
an eighth pin of the solar charging management chip U2 is abutted by a capacitor C8, a ninth pin of the solar charging management chip U2 is grounded by a resistor R12 and a capacitor C10, a resistor R12 and a capacitor C10 are connected in series, a tenth pin of the solar charging management chip U2 is connected to one end of a resistor R3 by a resistor R6, an eleventh pin of the solar charging management chip U2 is grounded by a capacitor C5, a twelfth pin of the solar charging management chip U2 is idle, a thirteenth pin of the solar charging management chip U2 is connected to the other end of the resistor R3, the resistor R3 and the resistor R2 are connected in parallel, a fourteenth pin of the solar charging management chip U2 is connected to Vbat, a fifteenth pin of the solar charging management chip U2 is connected to Vsun, and is grounded by a capacitor C4.
The lithium battery input unit comprises a voltage reduction chip U3, a voltage reduction chip U5 and a power supply chip U6;
an eighth pin of the buck chip U3 passes through a collector of a triode Q12, a base of a triode Q12 is connected with a fourth pin of the main control chip U4 through a resistor R79, an emitter of the triode Q12 is connected with a base of a triode Q12 through a resistor R80, an emitter of the triode Q12 is grounded, a collector of the triode Q12 is connected with a voltage of 12V of the lithium battery through a resistor R8, the resistor R8 is connected in series with the resistor R9, the resistor R9 is grounded, a fifth pin of the buck chip U3 is connected with a sixth pin of the buck chip U3 through a capacitor C9, and the sixth pin of the buck chip U3 outputs a voltage of 5V through an inductor L2; the inductor L2 is connected with the first pin of the voltage reduction chip U3 through a resistor R14, the resistor R14 is connected with a resistor R16 in series, and the resistor R16 is grounded;
the eighth pin of the voltage reduction chip U5 is connected with 12V voltage of a lithium battery through a resistor R18, the resistor R18 is connected with the resistor R19 in series, the resistor R19 is grounded, the fifth pin of the voltage reduction chip U5 is connected with the sixth pin of the voltage reduction chip U5 through a capacitor C25, the sixth pin of the voltage reduction chip U5 outputs 3.3V voltage through an inductor L5, the inductor L5 is connected with the first pin of the voltage reduction chip U5 through a resistor R24, the resistor R24 is connected with the resistor R25 in series, and the resistor R25 is grounded;
the second pin of the voltage reduction chip U3 is grounded through a resistor R13, the third pin and the fourth pin of the voltage reduction chip U3 are grounded, and the fifth pin of the voltage reduction chip U3 is connected with the 12V voltage of the lithium battery and is grounded through a capacitor C11;
the second pin of the voltage reduction chip U5 is grounded through a resistor R23, the third pin and the fourth pin of the voltage reduction chip U3 are grounded, and the fifth pin of the voltage reduction chip U3 is connected with the 12V voltage of the lithium battery and is grounded through a capacitor C26;
the first pin and the second pin of the power chip U6 are connected in parallel with the inductor L2, the fourth pin of the power chip U6 is connected with the sixty-th pin of the communication chip U9, the fifth pin of the power chip U6 is grounded through a resistor R32, the resistor R32 is connected with a resistor R28 in series, the resistor R28 is connected with the fourth pin of the power chip U6, and the third pin and the sixth pin of the power chip U6 are grounded.
Referring to fig. 5, 6, 7 and 8, the signal receiving and processing module includes a communication chip U9, a level conversion unit U14 connected to the communication chip U9, and a SIM card socket SIMCARD1 connected to the level conversion unit U14.
The first pin of the communication chip U9 is connected with the nineteenth pin of the main control chip U4, the fifth pin of the communication chip U9 is connected with the second pin of the connector JP5, the sixth pin of the communication chip U9 is connected with the first pin of the connector JP5, the ninth pin of the communication chip U9 is connected with the third pin of the SIM card holder SIMCARD1 through a resistor R68, the tenth pin of the communication chip U9 is connected with the sixth pin of the SIM card holder SIMCARD1 through resistors R69 and R70, the eleventh pin of the communication chip U9 is connected with the second pin of the SIM card holder SIMCARD1 through a resistor R65, the twelfth pin of the communication chip U9 is connected with the first pin of the SIM card holder SIMCARD1, and the fifteenth pin of the communication chip U9 is connected with the seventh pin of the SIM card holder SIMCARD1 through a resistor R64; the sixty-eight pin of the communication chip U9 is connected with the twentieth pin of the master control chip U4 through a triode Q9;
a sixty-first pin and a sixty-second pin of the communication chip U9 are connected in parallel and are connected with a fourth pin of the power supply chip U6 through a capacitor E1, a fifty-eighth pin of the communication chip U9 is connected with a triode Q2, a fifty-ninth pin of the communication chip U9 is connected with a triode Q1, and a forty-ninth pin of the communication chip U9 is connected with the triode Q6;
the base electrode of the triode Q1 is connected with the emitter electrode of the triode Q1 through a resistor R39, the base electrode of the triode Q1 is connected with the communication chip U9 through a resistor R33, and the collector electrode of the triode Q1 is connected with an LED6 and an LED3 through a resistor R30;
the base electrode of the triode Q2 is connected with the emitter electrode of the triode Q2 through a resistor R40, the base electrode of the triode Q2 is connected with the communication chip U9 through a resistor R34, and the collector electrode of the triode Q2 is connected with an LED7 and an LED4 through a resistor R31;
the base electrode of the triode Q6 is connected with the emitter electrode of the triode Q6 through a resistor R57, the base electrode of the triode Q6 is connected with the communication chip U9 through a resistor R56, and the collector electrode of the triode Q6 is connected with the LED5 through a resistor R53.
A first pin of the level conversion unit U14 is grounded through a capacitor C46, a fourteenth pin of the level conversion unit U14 is grounded through a capacitor C47, an eighth pin of the level conversion unit U14 is connected with a sixteenth pin of the communication chip U9 through a capacitor, a second pin of the level conversion unit U14 is connected with a thirty-sixth pin of the communication chip U9, a third pin of the level conversion unit U14 is connected with a thirty-fifteenth pin of the communication chip U9, a twelfth pin of the level conversion unit U14 is connected with a twelfth pin of the main control chip U4, and a thirteenth pin of the level conversion unit U14 is connected with a thirteenth pin of the main control chip U4.
Referring to fig. 9, 10 and 11, the displacement processing module includes a single chip microcomputer U8 with two displacement interfaces, and a differential reference input unit U15 connected to the single chip microcomputer.
The first pin of the single-chip microcomputer U8 is connected with the second pin of the connector JP25, the third twelve pin of the single-chip microcomputer U8 is connected with the first pin of the connector JP25, and the seventh pin of the single-chip microcomputer U8 is connected with the fourth pin of the connector JP25 of the JP25 and is grounded; a twenty-third pin of the single chip microcomputer U8 is connected with a seventh pin, a twenty-first pin of the single chip microcomputer U8 is connected with a twenty-third pin of the single chip microcomputer U8 through a parallel capacitor C59, a capacitor C60 and a capacitor C52, a twenty-first pin of the single chip microcomputer U8 is grounded, a twenty-fourth pin and a twenty-fifth pin of the single chip microcomputer U8 are connected with a first path of displacement signals, and a sixteenth pin and a seventeenth pin of the single chip microcomputer U8 are connected with a second path of displacement signals;
a fifth pin of the single chip microcomputer U8 is connected with a fifth pin of the differential reference input unit U15 through a resistor R63, a first pin of the differential reference input unit U15 is connected with a tenth pin of the single chip microcomputer U8, a second pin and a third pin of the differential reference input unit U15 are connected with a crystal oscillator X2, and a fourth pin of the differential reference input unit U15 is connected with a ninth pin of the single chip microcomputer U8 through a resistor R60;
the sixth pin of the differential reference input unit U15 is connected with the third pin of a plug JP4 through a resistor R51, the second pin of the plug JP4 is connected with the ninth pin of the differential reference input unit U15, the seventh pin of the differential reference input unit U15 is connected with the third pin of the plug JP3 through a resistor R50, the second pin of the plug JP3 is connected with the ninth pin of the differential reference input unit U15, the eighth pin of the differential reference input unit U15 is grounded, the tenth pin and the eleventh pin of the differential reference input unit U15 are grounded, the twelfth pin of the differential reference input unit U15 is connected with the fifteenth pin of the singlechip U8, the thirteenth pin of the differential reference input unit U15 is connected with the fourteenth pin of the singlechip U8, the fourteenth pin of the differential reference input unit U15 is connected with the thirteenth pin of the singlechip U8, the fifteenth pin of the differential reference input unit U15 is connected with the seventh pin 8 of the singlechip U8, the sixteenth leg of the differential reference input unit U15 is connected to ground.
Referring to fig. 12, the display module includes a digital display driving chip U17 and a digital display connected to the digital display driving chip U17.
The first pin of the digital display driving chip U17 is idle, the second pin of the digital display driving chip U17 is connected with the fourteenth pin of the main control chip U4, the third pin of the digital display driving chip U17 is connected with the thirty-ninth pin of the main control chip U4, the fourth pin of the digital display driving chip U17 is connected with the forty-fourth pin of the main control chip U4, the seventh pin and the twenty-first pin of the digital display driving chip U17 are connected with the eighteenth pin of the main control chip U4, and the twenty-twelfth pin, the twenty-fifth pin and the twenty-eighth pin of the digital display driving chip U17 are grounded;
the eighth pin, the ninth pin, the tenth pin, the eleventh pin, the twelfth pin, the thirteenth pin, the fourteenth pin, the fifteenth pin, the sixteenth pin and the seventeenth pin of the digital display driving chip U17 are connected with the output end of the digital display, and the nineteenth pin, the twentieth pin, the twenty-third pin, the twenty-fourth pin, the twenty-sixth pin and the twenty-seventh pin of the digital display driving chip U17 are connected with the control end of the digital display.
Referring to fig. 13, the main control chip U4 is further connected to an expansion chip U12, a sixteenth pin of the expansion chip U12 is connected to a thirty-eighth pin of the main control chip U4, a eleventh pin of the expansion chip U12 is connected to a thirty-third pin of the main control chip U4, a twelfth pin of the expansion chip U12 is connected to a thirty-first pin of the main control chip U4, a thirteenth pin of the expansion chip U12 is connected to a third pin of the plug JP16, and a fourteenth pin of the expansion chip U12 is connected to a second pin of the plug JP 16.
Referring to fig. 14, the main control chip U4 is further connected to an RTC chip U13. The model number of the RTC chip U13 is DS 3231. SCL and SDA of RTC chip U13 connect the forty second foot and the forty third foot of main control chip through resistance R83 and R84 respectively, and the 3.3V power supply of step-down chip U5 is received in parallel, RST end and VCC termination 3.3 power supply of RTC chip U13, and the INT end of RTC chip U13 connects 3.V power supply through resistance R86, and the VBAT termination battery CR1 of RTC chip U13, battery CR1 one end ground connection.
Compared with the prior art, the crack monitoring device of the utility model adopts a modular design, a 40w lithium battery is arranged in the intelligent collector, data are reported 2 times a day, one year of endurance, a low-power step-down IC is used for stepping down to 3.3V and 5V detection battery power, an external low-power RTC is awakened at regular time or is awakened by a key, and the data are ensured to be actively and continuously reported according to the user requirements; adopt solar power source and built-in lithium cell dual power supply scheme, installation 10w solar panel can realize unlimited continuation of the journey, can guarantee the incessant collection of data, adopts the 4G module to carry out data display with data transmission to the server, guarantees that data can carry out remote transmission, realizes the long-range seamless linking of data to guarantee the nimble selection of data transfer, not receive the distance restriction, still can realize remote management under adverse circumstances.
The above only is the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent processes of the present invention are used in the specification and the attached drawings, or directly or indirectly applied to other related technical fields, and the same principle is included in the protection scope of the present invention.
Claims (4)
1. A crack monitoring device is characterized by comprising an intelligent collector and a crack meter connected with the intelligent collector; the intelligent collector comprises a main control chip U4, a power management module, a signal receiving and processing module, a displacement processing module and a display module, wherein the power management module, the signal receiving and processing module, the displacement processing module and the display module are connected with the main control chip U4;
the power management module comprises a lithium battery input unit for lithium battery power supply management and a solar charging unit for charging the lithium battery; the signal receiving and processing module comprises a communication chip U9, a level conversion unit U14 connected with the communication chip U9, and a SIM card socket SIMCARD1 connected with the level conversion unit U14; the displacement processing module comprises a single chip microcomputer U8 with two displacement interfaces and a differential reference input unit U15 connected with the single chip microcomputer; the display module comprises a digital display driving chip U17 and a digital display connected with the digital display driving chip U17.
2. The crack monitoring device of claim 1, wherein the first leg of the one-chip U8 connects with the second leg of the connector JP25, the third twelve leg of the one-chip U8 connects with the first leg of the connector JP25, and the seventh leg of the one-chip U8 connects with the fourth leg of the connector JP25 of JP25 and is grounded; a twenty-third pin of the single chip microcomputer U8 is connected with a seventh pin, a twenty-first pin of the single chip microcomputer U8 is connected with a twenty-third pin of the single chip microcomputer U8 through a parallel capacitor C59, a capacitor C60 and a capacitor C52, a twenty-first pin of the single chip microcomputer U8 is grounded, a twenty-fourth pin and a twenty-fifth pin of the single chip microcomputer U8 are connected with a first path of displacement signals, and a sixteenth pin and a seventeenth pin of the single chip microcomputer U8 are connected with a second path of displacement signals;
a fifth pin of the single chip microcomputer U8 is connected with a fifth pin of the differential reference input unit U15 through a resistor R63, a first pin of the differential reference input unit U15 is connected with a tenth pin of the single chip microcomputer U8, a second pin and a third pin of the differential reference input unit U15 are connected with a crystal oscillator X2, and a fourth pin of the differential reference input unit U15 is connected with a ninth pin of the single chip microcomputer U8 through a resistor R60;
the sixth pin of the differential reference input unit U15 is connected with the third pin of a plug JP4 through a resistor R51, the second pin of the plug JP4 is connected with the ninth pin of the differential reference input unit U15, the seventh pin of the differential reference input unit U15 is connected with the third pin of the plug JP3 through a resistor R50, the second pin of the plug JP3 is connected with the ninth pin of the differential reference input unit U15, the eighth pin of the differential reference input unit U15 is grounded, the tenth pin and the eleventh pin of the differential reference input unit U15 are grounded, the twelfth pin of the differential reference input unit U15 is connected with the fifteenth pin of the singlechip U8, the thirteenth pin of the differential reference input unit U15 is connected with the fourteenth pin of the singlechip U8, the fourteenth pin of the differential reference input unit U15 is connected with the thirteenth pin of the singlechip U8, the fifteenth pin of the differential reference input unit U15 is connected with the seventh pin 8 of the singlechip U8, the sixteenth leg of the differential reference input unit U15 is connected to ground.
3. The crack monitoring device of claim 1, wherein an expansion chip U12 is further connected to the main control chip U4, a sixteenth pin of the expansion chip U12 is connected to a thirty-eighth pin of the main control chip U4, a eleventh pin of the expansion chip U12 is connected to a thirty-third pin of the main control chip U4, a twelfth pin of the expansion chip U12 is connected to a thirty-first pin of the main control chip U4, a thirteenth pin of the expansion chip U12 is connected to a third pin of the connector JP16, and a fourteenth pin of the expansion chip U12 is connected to a second pin of the connector JP 16.
4. The crack monitoring device of claim 1, wherein the master control chip U4 is further connected with an RTC chip U13.
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| CN202120321472.2U CN214173303U (en) | 2021-02-04 | 2021-02-04 | Crack monitoring device |
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| CN202120321472.2U CN214173303U (en) | 2021-02-04 | 2021-02-04 | Crack monitoring device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113933481A (en) * | 2021-10-14 | 2022-01-14 | 重庆大学 | Rock fracture real-time monitoring system and method under freeze thawing condition |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113933481A (en) * | 2021-10-14 | 2022-01-14 | 重庆大学 | Rock fracture real-time monitoring system and method under freeze thawing condition |
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