CN214172671U - Temp. regulating beverage can - Google Patents
Temp. regulating beverage can Download PDFInfo
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- CN214172671U CN214172671U CN202022873152.6U CN202022873152U CN214172671U CN 214172671 U CN214172671 U CN 214172671U CN 202022873152 U CN202022873152 U CN 202022873152U CN 214172671 U CN214172671 U CN 214172671U
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- beverage
- semiconductor
- power supply
- supply assembly
- temperature
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- 235000013361 beverage Nutrition 0.000 title claims abstract description 51
- 230000001105 regulatory effect Effects 0.000 title claims description 3
- 239000004065 semiconductor Substances 0.000 claims abstract description 77
- 238000005057 refrigeration Methods 0.000 claims abstract description 26
- 239000007788 liquid Substances 0.000 claims abstract description 22
- 239000000919 ceramic Substances 0.000 claims description 30
- 238000001816 cooling Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229920006268 silicone film Polymers 0.000 claims description 3
- 230000005679 Peltier effect Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 235000020965 cold beverage Nutrition 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 235000012171 hot beverage Nutrition 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000035622 drinking Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000033764 rhythmic process Effects 0.000 description 1
- 235000021260 warm beverage Nutrition 0.000 description 1
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- Devices That Are Associated With Refrigeration Equipment (AREA)
- Packages (AREA)
Abstract
The utility model discloses a beverage can adjusts temperature belongs to the technical field of beverage can, provides a novel beverage can and pollution-free. It includes a jar body, it has liquid-carrying portion and semiconductor refrigeration subassembly to set gradually from top to bottom in the jar body, wherein: the liquid carrying part can contain beverage; the semiconductor refrigeration assembly can refrigerate or heat so as to reduce or heat the temperature of the beverage in the liquid carrying part. The utility model discloses be used for perfecting the function of beverage can, satisfy people and use energy-conserving and convenient requirement to the beverage can.
Description
Technical Field
The utility model belongs to the technical field of beverage can, a beverage can adjusts temperature is related to.
Background
The beverage is always popular with people, and with the development of technology, the beverage can is suitable for the rhythm of international trend. For example, beverage cans with heating or cooling functions appear, which overcomes the problem that in hot summer, cold beverages can be obtained only by external cooling, such as putting into a refrigerator, or warm beverages can be obtained only by an insulation can in cold winter, and it is a urgent desire for outdoor consumers to obtain beverages at a proper temperature anytime and anywhere.
The products in the prior art are all chemical reaction refrigeration of medicaments, and the medicaments are easy to pollute the environment after being used.
In view of this, the present invention is especially provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a beverage can adjusts temperature, provide a novel beverage can and pollution-free. The technical scheme of the scheme has a plurality of technical beneficial effects, which are described as follows:
the present case provides a beverage can, including a jar body, it has liquid-carrying portion and semiconductor refrigeration subassembly to set gradually from top to bottom in the jar body, wherein:
the liquid carrying part can contain beverage;
the semiconductor refrigeration assembly can refrigerate or heat so as to reduce or heat the temperature of the beverage in the liquid carrying part. The semiconductor refrigeration assembly comprises a semiconductor wafer, wherein the semiconductor refrigeration wafer utilizes the Peltier effect and the Peltier effect of semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, and the purpose of refrigeration can be realized. By utilizing the semiconductor refrigeration technology, the electric energy can be effectively saved, and cold drinks or hot drinks can be drunk when people go out or travel
In a preferred or alternative embodiment, the semiconductor refrigeration assembly includes a power module mounted on the bottom of the can and a semiconductor chip (boss and boss support) electrically connected to the power module
The semiconductor member can cool or heat to lower or heat the temperature of the beverage in the liquid-carrying part when the power supply assembly supplies power.
In a preferred or alternative embodiment, the cooling side and/or the heating side of the semiconductor element are respectively bonded with a thermally conductive silicone film.
In a preferred or alternative embodiment, the semiconductor member includes a first ceramic sheet and a second ceramic sheet fixed to the bottom of the tank and installed at an interval in a vertical direction, the first ceramic sheet is disposed above the second ceramic sheet, and an NP-type semiconductor layer or a PN-type semiconductor layer is sandwiched between the first ceramic sheet and the second ceramic sheet, wherein:
the N-type semiconductor in the NP-type semiconductor layer is connected to the positive electrode or the negative electrode of the power supply assembly, and the N-type semi-semiconductor is connected to the negative electrode or the positive electrode of the power supply assembly, or the N-type semi-semiconductor in the PN-type semiconductor layer is connected to the negative electrode or the positive electrode of the power supply assembly, and the N-type semi-semiconductor is connected to the positive electrode or the negative electrode of the power supply assembly, so that the temperature of the beverage in the liquid carrying part is reduced or heated.
In a preferred or alternative embodiment, the first ceramic plate and the second ceramic plate are each provided with a metal layer, which sandwiches the NP-type or PN-type semiconductor layer.
In a preferred or alternative embodiment, the power supply assembly comprises a battery, or alternatively, the power supply assembly comprises a miniature dc generator.
In a preferred or optional embodiment, the first ceramic plate is connected with the tank body in a sealing manner, and the liquid carrying part is communicated with the first ceramic plate.
In a preferred or alternative embodiment, a switch is mounted on a side of the canister adjacent the bottom surface for electrical connection with the power supply assembly.
In a preferred or alternative embodiment, the top lid of the can body is provided with a ring-pull tab and the bottom lid of the can body is provided with a bottom lid in a removable manner.
In a preferred or alternative embodiment, the side of the can body is provided with a thermochromic layer.
Compared with the prior art, the utility model provides a technical scheme includes following beneficial effect:
the semiconductor refrigeration assembly comprises a semiconductor wafer, wherein the semiconductor refrigeration wafer utilizes the Peltier effect and the Peltier effect of semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, and the purpose of refrigeration can be realized. By utilizing the semiconductor refrigeration technology, the electric energy can be effectively saved, and cold drinks or hot drinks can be drunk when people go out or travel.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural view of a beverage can of the present invention;
FIG. 2 is a schematic view of the semiconductor refrigeration principle of the present invention;
wherein:
1. a tank body; 11. a top cover; 12. a bottom cover; 13. a liquid carrying section; 14. a protrusion; 21. a first ceramic sheet; 22. a second ceramic sheet; 23. a semiconductor layer; 24. a battery; 25. a switch; 26. a metal layer.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It is noted that various aspects of the embodiments are described below within the scope of the appended claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the disclosure, one skilled in the art should appreciate that one aspect described herein may be implemented independently of any other aspects and that two or more of these aspects may be combined in various ways. For example, an apparatus may be implemented and/or a method practiced using any number of the aspects set forth herein. In addition, such design may be implemented and/or such method may be practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.
It should be further noted that the drawings provided in the following embodiments are only schematic illustrations for explaining the basic idea of the present invention, and only the components related to the present invention are shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the form, quantity and proportion of each component in actual implementation may be changed at will, and the layout of the components may be more complicated.
Beverage can as shown in fig. 1, including a jar body 1, set gradually liquid-carrying portion 13 and semiconductor refrigeration subassembly from top to bottom in jar body 1, can hold liquid beverage or thick drink such as milk, cola, snow be Bian, king old ji or add duo bao in the liquid-carrying portion 13, jar body 1, including top cap 11 and bottom 12, set up the oral area that is used for drinking beverage on the top cap 11, the oral area is sealed with the easy open can, bottom 12 installs with the mode of dismantling, wherein:
the liquid carrying part 13 can contain beverage, and the liquid carrying part 13 can be arranged in an integrated manner or in a non-integrated manner in the tank body 1 to form an independent containing area;
the semiconductor cooling assembly is capable of cooling or heating to lower or heat the temperature of the beverage within the carrier liquid portion 13. The semiconductor refrigeration assembly comprises a semiconductor wafer, wherein the semiconductor refrigeration wafer utilizes the Peltier effect and the Peltier effect of semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, and the purpose of refrigeration can be realized. By utilizing the semiconductor refrigeration technology, the electric energy can be effectively saved, and cold drinks or hot drinks can be drunk when people go out or travel.
As some embodiments provided in the present application, the semiconductor refrigeration assembly includes a power module mounted on the bottom of the tank 1 and a semiconductor chip electrically connected to the power module, the power module is supported by the protrusion 14, and a switch 25 is mounted on the inner side of the tank 1 adjacent to the bottom cover 12, the switch 25 can control the power module to be turned on or off, when the switch 25 is turned on, the power module supplies power to the semiconductor module, and the semiconductor module can cool or heat to lower or heat the temperature of the beverage in the liquid carrier 13. This structure sets up the node and simply just easily makes, during the use, opens bottom 12, and switch 25 is closed, can heat or reduce the temperature of carrying liquid or beverage in the liquid portion 13 promptly, moreover, can practice thrift the electric energy, and the mode of placing of relative transmission beverage all needs to be placed and keeps warm in refrigerator or beverage cabinet, and the power consumption is great, can practice thrift the electric energy through the scheme of this case.
As part of the implementation mode provided by the scheme, the cooling surface and/or the heating surface of the semiconductor piece are/is respectively adhered with the heat-conducting silicone film, when the structure is arranged, the liquid carrying part 13 and the tank body 1 can be integrally arranged, and the liquid carrying part 13 and the semiconductor piece are hermetically connected at the inner wall of the tank body 1, for example, a sealing film is adopted to seal the inner wall of the tank body 1 to prevent the beverage from seeping out.
As some embodiments provided in the present disclosure, as shown in fig. 2, the semiconductor member includes a first ceramic sheet 21 and a second ceramic sheet 22 fixed at the bottom of the can 1 and installed at an interval in a vertical direction, the first ceramic sheet 21 is disposed above the second ceramic sheet 22, and an NP-type semiconductor layer 23 or a PN-type semiconductor layer 23 is sandwiched between the first ceramic sheet 21 and the second ceramic sheet 22, wherein:
the positive electrode or negative electrode of the N-type semiconductor access power supply component in the NP-type semiconductor layer 23, the N-type semi-access negative electrode (cold end up) or positive electrode (hot end up), or the negative electrode or positive electrode of the N-type semiconductor access power supply component in the PN-type semiconductor layer 23, the N-type semi-access positive electrode or negative electrode, to lower or heat the temperature of the beverage in the carrier liquid part 13.
Further, the first ceramic sheet 21 and the second ceramic sheet 22 are respectively provided with a metal layer 26, and the metal layer 26 clamps the NP-type semiconductor layer 23 or the PN-type semiconductor layer 23.
The power supply assembly supplies energy required by electron current, after the power supply is switched on, the electron cathode (-) starts to go out, firstly passes through the P-type semiconductor, absorbs heat, reaches the N-type semiconductor, and releases heat, and every time the power supply passes through one NP module, the heat is sent out from the power supply assembly while causing temperature difference to form a cold end and a hot end. The cold and hot ends are respectively composed of two ceramic sheets, and the cold end is connected with a heat source, i.e. the one to be cooled. If the power supply is reversed, the temperature at the junction will change inversely. The effect is much greater by replacing the metal with one N-type semiconductor and one P-type semiconductor, and thus, the provision of the metal layer 26 improves the cooling or heating efficiency.
After the power supply is switched on, electron hole pairs are generated near the upper contact, the internal energy is reduced, the temperature is reduced, and heat is absorbed to the outside, namely the cold end. The other end is called hot end because the electron hole pair is compounded, the internal energy is increased, the temperature is raised, and heat is released to the environment. The temperature of the cold end can reach-10 to-20 ℃, generally, the temperature of the beverages stored in a supermarket is 0 to 5 ℃, the required direct current battery 24 is enough to be used at 2.5V, the expected refrigeration effect is achieved, and on the contrary, the semiconductor heat efficiency is more than 1, and the direct current battery 24 is enough to be used at 2.5V.
As some embodiments provided herein, the power module includes a battery 24, or the power module includes a micro dc generator, such as a hand-pull or hand-operated micro dc generator in the prior art, to provide power for the semiconductor refrigeration module.
As part of the implementation mode provided by the scheme, the first ceramic plate is connected with the tank body in a sealing mode, the liquid carrying part is communicated with the first ceramic plate, the time for heating or cooling the beverage can be prolonged, and a switch electrically connected with the power supply assembly is mounted on the side face, close to the bottom face, of the tank body.
As part of the embodiment provided by the scheme, the side surface of the tank body is provided with the temperature-sensitive color-changing layer. For example, the temperature sensitive ink or other temperature sensitive color changing layer in the prior art is used to alert the user that the temperature of the beverage is adjusted to a drinkable temperature.
The product provided by the utility model is introduced in detail above. The principles and embodiments of the present invention have been explained herein using specific examples, and the above descriptions of the embodiments are only used to help understand the core concepts of the present invention. It should be noted that, for a person skilled in the art, without departing from the inventive concept of the present invention, several improvements and modifications can be made to the invention, and these improvements and modifications also fall within the scope of the claims of the invention.
Claims (10)
1. The utility model provides a beverage can adjusts temperature, its characterized in that, includes a jar body, from top to bottom sets gradually liquid-carrying portion and semiconductor refrigeration subassembly in the jar body, wherein:
the liquid carrying part can contain beverage;
the semiconductor refrigeration assembly can refrigerate or heat so as to reduce or heat the temperature of the beverage in the liquid carrying part.
2. The tempered beverage can of claim 1, wherein the semiconductor refrigeration assembly comprises a power supply assembly mounted to the bottom of the can and a semiconductor component electrically connected to the power supply assembly,
the semiconductor member can cool or heat to lower or heat the temperature of the beverage in the liquid-carrying part when the power supply assembly supplies power.
3. The tempered beverage can of claim 2, wherein the cooling and/or heating surfaces of the semiconductor member are each bonded with a thermally conductive silicone film.
4. The temperature-regulated beverage can according to claim 2 or 3, wherein the semiconductor member comprises a first ceramic sheet and a second ceramic sheet fixed to the bottom of the can body and vertically spaced apart from each other, the first ceramic sheet being disposed above the second ceramic sheet with an NP-type semiconductor layer or a PN-type semiconductor layer interposed therebetween, wherein:
the N-type semiconductor in the NP-type semiconductor layer is connected to the positive electrode or the negative electrode of the power supply assembly, and the N-type semi-semiconductor is connected to the negative electrode or the positive electrode of the power supply assembly, or the N-type semi-semiconductor in the PN-type semiconductor layer is connected to the negative electrode or the positive electrode of the power supply assembly, and the N-type semi-semiconductor is connected to the positive electrode or the negative electrode of the power supply assembly, so that the temperature of the beverage in the liquid carrying part is reduced or heated.
5. The tempered beverage can of claim 4, wherein the first and second ceramic sheets are each provided with a metal layer sandwiching the semiconductor layer having an NP-type or PN-type.
6. The tempered beverage can of claim 4, wherein the power supply component comprises a battery or the power supply component comprises a micro-dc generator.
7. The tempered beverage can of claim 4, wherein the first ceramic sheet is sealingly connected to the can body and the liquid carrier is in communication with the first ceramic sheet.
8. The tempered beverage can of claim 4, wherein a switch is mounted on a side of the can proximate the bottom surface for electrical connection with the power supply assembly.
9. The tempered beverage can of claim 1, wherein the top lid of the can body is provided with an opening tab and the bottom lid of the can body is removably provided with a bottom lid.
10. The tempered beverage can of claim 1, wherein the side of the can body is provided with a thermochromic layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022873152.6U CN214172671U (en) | 2020-12-02 | 2020-12-02 | Temp. regulating beverage can |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022873152.6U CN214172671U (en) | 2020-12-02 | 2020-12-02 | Temp. regulating beverage can |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214172671U true CN214172671U (en) | 2021-09-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022873152.6U Active CN214172671U (en) | 2020-12-02 | 2020-12-02 | Temp. regulating beverage can |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214172671U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112484393A (en) * | 2020-12-02 | 2021-03-12 | 陕西合鼎森新智能科技有限公司 | Temp. regulating beverage can |
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- 2020-12-02 CN CN202022873152.6U patent/CN214172671U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112484393A (en) * | 2020-12-02 | 2021-03-12 | 陕西合鼎森新智能科技有限公司 | Temp. regulating beverage can |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240108 Address after: Building 3, Electronic Industry Park, Development Avenue, Qiuxian Economic Development Zone, Handan City, Hebei Province, 056000 Patentee after: Hebei Xuanyangsheng Intelligent Technology Co.,Ltd. Address before: Floor 1-4, building 6, quanquanchen digital entertainment and entrepreneurship Industrial Park, 466 Xiying Road, Qujiang New District, Xi'an City, Shaanxi Province, 710000 Patentee before: Shaanxi hedingsen New Intelligent Technology Co.,Ltd. |
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| TR01 | Transfer of patent right |