CN2116180U - heat pipe semiconductor cold and hot container - Google Patents

heat pipe semiconductor cold and hot container Download PDF

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Publication number
CN2116180U
CN2116180U CN92203955U CN92203955U CN2116180U CN 2116180 U CN2116180 U CN 2116180U CN 92203955 U CN92203955 U CN 92203955U CN 92203955 U CN92203955 U CN 92203955U CN 2116180 U CN2116180 U CN 2116180U
Authority
CN
China
Prior art keywords
heat pipe
container
heat
shell
courage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN92203955U
Other languages
Chinese (zh)
Inventor
赵续胜
许光辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
XINYANG BROADCASTING EQUIPMENT
Original Assignee
XINYANG BROADCASTING EQUIPMENT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by XINYANG BROADCASTING EQUIPMENT filed Critical XINYANG BROADCASTING EQUIPMENT
Priority to CN92203955U priority Critical patent/CN2116180U/en
Publication of CN2116180U publication Critical patent/CN2116180U/en
Granted legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00Machines, plants or systems, using electric or magnetic effects
    • F25B21/02Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

The heat pipe semiconductor cold and hot container consists of container cover 1, container liner 2, semiconductor refrigerating sheet 3, heat insulating layer 4 and casing 5, and features the heat pipe as the casing and the semiconductor refrigerating sheet 3 adhered between the container liner 2 and the heat pipe casing 5.

Description

Semiconductor temperature insulating container with heat exchanger tube
The utility model belongs to daily living article, and especially a kind of food containers with refrigeration, heat insulation function is specially adapted to travel outdoors, field work etc.
In the life, existing various water tumblers, lunch box, as thermos cup, electric cup, Electric heating box etc., they can only be incubated heating, all can not freeze, be difficult to satisfy the needs of people's life, CN2068791U for this reason, that CN2041512U has announced respectively is a kind of " electricity refrigeration; insulation multiple-purpose cup " and " semiconductor is cold; lunch box ", they all are according to Pa Er card altitude temperature difference effect principle, adopt the semiconductor refrigerating composting cold, heating and glass evacuated INSULATION DESIGN manufacturing, the former contacts the fin in all hot junctions of a plurality of thermoelectric couples electricity with outside air, emit heat, the latter dispels the heat the hot junction of semiconductor cooler and forces to cool off by fin and fan, and incapability is by fin or fin heat radiation, because of its area of dissipation little, radiating effect is all very poor, thereby its refrigerating efficiency is low, utilizes the fan heat radiation, also increased manufacturing cost, and volume is big, power consumption is big.
The purpose of this utility model is on the basis of existing electricity system cold-hot glass and box, and a kind of refrigerating efficiency height is provided, and volume is little, the hot and cold container of the heat pipe semiconductor of low cost of manufacture.
Realize that the purpose of this utility model is to be made of container cover, container courage, conductor refrigeration sheet, heat-insulation layer, shell, shell is a heat pipe, and the conductor refrigeration sheet is connected between container courage and the heat pipe shell.
The utility model is owing to adopt the heat pipe shell, and the hot junction of conductor refrigeration sheet is through heat pipe heat radiation, and area of dissipation is big, and speed is effective soon, thereby has improved refrigerating efficiency, and simple in structure, and volume is little, and it is little to consume energy, and low cost of manufacture is carried and used all very convenient.
Fig. 1 is the utility model profile;
Fig. 2 is an A-A profile among Fig. 1;
Fig. 3 is a circuit diagram of the present utility model.
Describe in detail below in conjunction with the utility model accompanying drawing.
As shown in Figure 1, container cover 1, container courage 2, conductor refrigeration sheet 3, heat-insulation layer 4, shell 5 constitutes a cylindrical vessel, the outside of container courage 2 is equipped with shell 5, shell 5 is that gravity assisted heat pipe or capillary heat pipe are made, container courage 2 adopts heat conductivility good metal thin plate to make, between the bottom of container courage 2 and heat pipe shell 5, be bonded with conductor refrigeration sheet 3, also can same bonding conductor refrigeration sheet between its both sides, conductor refrigeration sheet 3 has good the contact with container courage 2 with heat pipe shell 5, how much can deciding of conductor refrigeration sheet 3 according to the size of refrigerating capacity, can be 1 or several pieces, its complementary space between container courage 2 and the shell 5 is that the heat-insulation layer 4(of foamed plastic or other insulation material filling is referring to Fig. 2), plastic hoop 6 is bonded on the heat-insulation layer 4 in the upper end of container courage 2 with shell 5, container cover 1 spins or snaps onto on container courage 2 and the shell 5, and perhaps container cover 1 is hinged with hinge with a side of shell 5; Be fixedly connected with container base 9 in the bottom of shell 5, device has the rectification power circuit element in the base 9, AC socket 7 also is installed on the base 9, direct current jack 8 and reversing switch 10, the circuit that method 10 is opened in conductor refrigeration sheet 3 and AC socket 7, direct current jack 8, commutation as shown in Figure 3, wherein, CZ1 is an AC socket 7, CZ2 is a direct current jack 8, double-point double-throw switch K is the reversing switch 10 of half consubstantiality refrigerating sheet, 3 polarity, container courage 2 of the present utility model can also be cuboid or square, and capacity is also changeable.
During refrigeration, connect AC power or dc source, displacement is given container courage 2 refrigeration places to switch 10 in the conductor refrigeration sheet, the heat that the hot junction of conductor refrigeration sheet 3 and heat pipe shell 5 junctions produce is by the heat radiation of heat pipe shell, the high speed thermal conductivity and the isothermal of heat pipe, area of dissipation and radiating rate have been increased, temperature in the container courage 2 is descended rapidly, and reduce the cold junction of conductor refrigeration sheet 3 and interfering with each other of hot junction, thereby reach good refrigeration purpose; Only need stir reversing switch 10 on the contrary when heating, same principle makes in the container courage 2 and heats up.For example,, adopt 1 CT1-12703 conductor refrigeration sheet and supply 12 volts of dc sources, 3 peaces when volume is 350 milliliters, its refrigeration work consumption 24W, in 35 ℃ of environment, the 300 milliliters of beverages that freeze can be reduced to 13 ℃ in 20 minutes, continued refrigeration and can drop to 4 ℃; If with 300 milliliters of beverages, under 5 ℃ of conditions, heat, can reach 36 ℃ in 20 minutes, continue energising and can reach about 60 ℃, its refrigeration, heating effect are very good, and its volume has only 100 * 140(mm) 3, carry and use all very convenient.

Claims (1)

1, the hot and cold container of a kind of heat pipe semiconductor is made of container cover 1, container courage 2, conductor refrigeration sheet 3, heat-insulation layer 4, shell 5, it is characterized in that shell 5 is heat pipe, and conductor refrigeration sheet 3 is bonded between container courage 2 and the heat pipe shell 5.
CN92203955U 1992-03-06 1992-03-06 heat pipe semiconductor cold and hot container Granted CN2116180U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN92203955U CN2116180U (en) 1992-03-06 1992-03-06 heat pipe semiconductor cold and hot container

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN92203955U CN2116180U (en) 1992-03-06 1992-03-06 heat pipe semiconductor cold and hot container

Publications (1)

Publication Number Publication Date
CN2116180U true CN2116180U (en) 1992-09-16

Family

ID=4950477

Family Applications (1)

Application Number Title Priority Date Filing Date
CN92203955U Granted CN2116180U (en) 1992-03-06 1992-03-06 heat pipe semiconductor cold and hot container

Country Status (1)

Country Link
CN (1) CN2116180U (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100344919C (en) * 2002-07-10 2007-10-24 德尔塔T公司 Food chiller with ductless air circulation
CN104329890A (en) * 2014-03-28 2015-02-04 海尔集团公司 Heat conduction device and semiconductor refrigerator with heat conduction device
CN105466151A (en) * 2014-08-08 2016-04-06 青岛海尔特种电冰柜有限公司 Liquor cooling and storing device capable of achieving effective heat dissipation both in vertically-placed mode and horizontally-placed mode
CN110623339A (en) * 2019-10-30 2019-12-31 罗任植 22-28 ℃ double-temperature-control phase change clothes
CN112984898A (en) * 2021-02-23 2021-06-18 珠海市芯业科技有限公司 Lunch box
CN113383889A (en) * 2020-03-12 2021-09-14 合肥华凌股份有限公司 Sugar control device and refrigerator

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100344919C (en) * 2002-07-10 2007-10-24 德尔塔T公司 Food chiller with ductless air circulation
CN104329890A (en) * 2014-03-28 2015-02-04 海尔集团公司 Heat conduction device and semiconductor refrigerator with heat conduction device
CN104329890B (en) * 2014-03-28 2017-01-04 海尔集团公司 Heat-transfer device and there is the semiconductor freezer of this heat-transfer device
CN105466151A (en) * 2014-08-08 2016-04-06 青岛海尔特种电冰柜有限公司 Liquor cooling and storing device capable of achieving effective heat dissipation both in vertically-placed mode and horizontally-placed mode
CN110623339A (en) * 2019-10-30 2019-12-31 罗任植 22-28 ℃ double-temperature-control phase change clothes
CN113383889A (en) * 2020-03-12 2021-09-14 合肥华凌股份有限公司 Sugar control device and refrigerator
CN113383889B (en) * 2020-03-12 2023-12-22 合肥华凌股份有限公司 Sugar control device and refrigerator
CN112984898A (en) * 2021-02-23 2021-06-18 珠海市芯业科技有限公司 Lunch box

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C06 Publication
PB01 Publication
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee