CN112984898A - Lunch box - Google Patents
Lunch box Download PDFInfo
- Publication number
- CN112984898A CN112984898A CN202110200692.4A CN202110200692A CN112984898A CN 112984898 A CN112984898 A CN 112984898A CN 202110200692 A CN202110200692 A CN 202110200692A CN 112984898 A CN112984898 A CN 112984898A
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- Prior art keywords
- heat
- heat conduction
- semiconductor
- shell
- semiconductor refrigeration
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- 239000004065 semiconductor Substances 0.000 claims abstract description 109
- 238000005057 refrigeration Methods 0.000 claims abstract description 61
- 239000000463 material Substances 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 235000012054 meals Nutrition 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 7
- 229920001971 elastomer Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 abstract description 17
- 230000005855 radiation Effects 0.000 abstract description 2
- 238000007493 shaping process Methods 0.000 description 12
- 238000001816 cooling Methods 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- 239000012774 insulation material Substances 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 244000261422 Lysimachia clethroides Species 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- 229910000639 Spring steel Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011490 mineral wool Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention provides a lunch box for solving the problem of low heat dissipation efficiency in the field of catering utensils, which comprises an inner container, a semiconductor refrigeration piece and a heat conduction shell, wherein one side of the semiconductor refrigeration piece is connected with the inner container, the heat conduction shell is made of a heat conduction material, and the other side of the semiconductor refrigeration piece is connected with the heat conduction shell. According to the lunch box, the semiconductor refrigeration sheet is connected with the heat conduction shell, heat is transferred to the heat conduction shell and then is radiated through the heat conduction shell, the heat radiation efficiency is high, and the heat cannot be accumulated between the heat conduction shell and the inner container.
Description
Technical Field
The invention relates to the field of catering appliances, in particular to a lunch box.
Background
Current cutlery box, including shell, semiconductor refrigeration piece, inner bag, fin and fan, the thermovent has generally been seted up on the shell, fin and semiconductor refrigeration piece hot junction are connected, the heat at semiconductor refrigeration piece hot junction is received to the fin, the fan is in the inner room of shell, distribute away the heat that the fin received from the thermovent through the fan, this kind of radiating mode leads to the heat to gather between shell and inner bag easily, and the thermovent is generally comparatively narrow and small, and radiating efficiency is not high.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides the lunch box which can dissipate heat through the heat conduction shell, has high heat dissipation efficiency and can not accumulate heat between the heat conduction shell and the inner container.
According to the embodiment of the invention, the lunch box comprises an inner container, a semiconductor refrigeration piece and a heat conduction shell, wherein one side of the semiconductor refrigeration piece is connected with the inner container, the heat conduction shell is made of a heat conduction material, and the other side of the semiconductor refrigeration piece is connected with the heat conduction shell.
The lunch box provided by the embodiment of the invention at least has the following beneficial effects: the semiconductor refrigeration piece is connected the heat conduction shell, shifts the heat to the heat conduction shell on, and rethread heat conduction shell dispels the heat, and the radiating efficiency is high, and the heat can not gather between heat conduction shell and inner bag.
According to some embodiments of the invention, the thermally conductive material is one of silver, aluminum, copper, thermally conductive rubber, and thermally conductive resin.
According to some embodiments of the invention, the refrigerator further comprises a first heat-conducting block, one side of the first heat-conducting block is connected with the inner container, and the other side of the first heat-conducting block is connected with one side of the semiconductor refrigeration sheet.
According to some embodiments of the invention, the semiconductor refrigeration device further comprises a second heat conduction block, one side of the second heat conduction block is connected with the heat conduction shell, and the other side of the second heat conduction block is connected with the other side of the semiconductor refrigeration piece.
According to some embodiments of the invention, an outer wall of the heat-conductive housing is provided with a connection recess connected with the other side of the semiconductor chilling plate.
According to some embodiments of the invention, further comprising an insulating material disposed between the inner bladder and the thermally conductive outer shell.
According to some embodiments of the invention, further comprising an external fan coupled to the thermally conductive housing.
According to some embodiments of the invention, the heat conduction device further comprises a metal shaping hose, one end of the metal shaping hose is connected with the external fan, the other end of the metal shaping hose is connected with the heat conduction shell, and the metal shaping hose can be bent into a preset shape.
According to some embodiments of the invention, the refrigerator further comprises a switching component, the switching component is electrically connected with the semiconductor chilling plate, and the switching component is used for switching the direction of current flowing to the semiconductor chilling plate.
According to some embodiments of the invention, further comprising a battery, the battery being electrically connected to the semiconductor chilling plate.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic view of the entire assembly of the lunch box according to the first embodiment of the invention;
FIG. 2 is a schematic view of the overall assembly of the lunch box according to the second embodiment of the invention;
FIG. 3 is a schematic view of the connection of the electronic device of the lunch box of the invention;
FIG. 4 is a schematic circuit diagram of the switching assembly of the lunch box of the present invention.
Reference numerals:
the heat-conducting cooling device comprises an inner container 100, a semiconductor refrigeration sheet 200, a heat-conducting shell 300, a connecting concave part 310, a first heat-conducting block 400, a second heat-conducting block 500, a heat-insulating material 600, an external fan 700, a metal shaping hose 800 and a battery 900;
the power supply comprises a change-over switch 1400, a voltage regulating module 1500, a first rectifying module 1600 and a second rectifying module 1700;
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the positional or orientational descriptions, such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "pointed", "inner", "outer", "axial", "radial", "circumferential", etc., are given with reference to the positional or orientational relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention. In the description of the present invention, the sidewall means a left sidewall and/or a right sidewall.
In the description of the present invention, "a plurality" means two or more, "more than", "less than", "more than", and the like are understood as excluding the present number, and "more than", "less than", "in", and the like are understood as including the present number. If the description of "first" and "second" is used for the purpose of distinguishing technical features, the description is not intended to indicate or imply relative importance or to implicitly indicate the number of the indicated technical features or to implicitly indicate the precedence of the indicated technical features.
In the description of the present invention, it should be understood that "a is disposed on B" merely represents the connection relationship between a and B, and does not represent that a is above B. It should be understood that one side of the semiconductor refrigeration piece refers specifically to the side where the semiconductor refrigeration piece is connected with the inner container, and the other side of the semiconductor refrigeration piece refers specifically to the side where the semiconductor refrigeration piece is connected with the heat-conducting shell. It should be understood that the figures do not show a complete circuit connection diagram.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. "bolted" and "screwed" are equally interchangeable. To those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in conjunction with specific situations.
Referring to fig. 1 and 2, the lunch box according to the embodiment of the invention includes an inner container 100, a semiconductor chilling plate 200 and a heat-conducting housing 300, wherein one side of the semiconductor chilling plate 200 is connected to the inner container 100, the heat-conducting housing 300 is made of a heat-conducting material, and the other side of the semiconductor chilling plate 200 is connected to the heat-conducting housing 300.
However, the existing lunch box generally transfers heat through the air around the lunch box, that is, the heat at the hot end is transferred to the air, or the heat in the air is transferred to the cold end, so that the efficiency of transferring heat through the air has a great influence on the cooling or heating efficiency of the semiconductor cooling plate 200, for example, in the above example, the object is replaced by the inner container 100 of the lunch box, the inner container 100 is connected with the cold end of the semiconductor cooling plate 200, and the faster the transfer speed is, the faster the temperature at the hot end is reduced, and the faster the temperature at the cold end is reduced correspondingly. In the conventional lunch box, the inner container 100 is connected with one side of the semiconductor refrigeration piece 200 and is connected with the other side of the semiconductor refrigeration piece 200 through the radiating fins, so that the contact area of the other side of the semiconductor refrigeration piece 200 and air is increased in a phase change manner, the heat dissipation efficiency is increased, air which is cooled or heated is timely transferred away through the fan, and the other side of the semiconductor refrigeration piece 200 is also contacted with more air in a fixed time to transfer more heat, so that the heat dissipation efficiency is further increased.
In the conventional lunch box, a heat dissipation port is generally formed in a housing, a heat dissipation sheet is connected with the hot end of the semiconductor refrigeration sheet 200, the heat dissipation sheet receives heat at the hot end of the semiconductor refrigeration sheet 200, and a fan is arranged in an inner chamber of the housing and dissipates the heat received by the heat dissipation sheet from the heat dissipation port. If the heat dissipation opening is arranged at the bottom of the lunch box, the heat dissipation opening is easily blocked when the lunch box is placed, and heat can not be dissipated well; if the heat dissipation opening is arranged on the side wall of the lunch box, the lunch box has too large volume or the fan is too small, so that the heat dissipation speed is slow. And when semiconductor refrigeration piece 200 heated the cutlery box, thereby the fan does not have the effect to heating the cold junction and can not open, leads to near the cold junction of semiconductor refrigeration piece 200 the circulation of air not smooth, and cold air gathers near the cold junction of semiconductor refrigeration piece 200, reduces the heating efficiency of cutlery box.
The lunch box adopting the traditional refrigeration mode basically cannot adopt the shell to dissipate heat, because the shell finally can dissipate heat through air, the lowest temperature of the shell is approximately not much higher than the temperature difference of the chamber, the temperature is generally higher than the temperature actually required by the inner container 100 of the lunch box, and the condition of heat dissipation is not met.
In the lunch box of the present invention, one side of the semiconductor chilling plate 200 is connected to the inner container 100, the heat-conducting housing 300 is made of a heat-conducting material, and the other side of the semiconductor chilling plate 200 is connected to the heat-conducting housing 300. Because the heat-conducting shell 300 is made of heat-conducting material, when the meal box is refrigerated, the heat-conducting shell 300 can quickly transfer heat to the whole shell from the connecting area connected with the other side of the semiconductor refrigerating sheet 200, and the whole heat-conducting shell 300 is contacted with the outside air, so that the contact area of a heat dissipation device of the meal box and the air is large, the heat-conducting performance of the meal box is high, and the heat on the heat-conducting shell 300 can be timely and quickly transferred to the air; compared with the existing lunch box, the heat radiating fins are positioned in the inner cavity of the shell, air nearby the heat radiating fins is not easy to circulate, a fan is needed for auxiliary heat radiation, the air contacted with the heat conducting shell 300 is obviously better in natural circulation, and the heat radiating efficiency of the lunch box can not be greatly influenced without the fan. When the lunch box is heated, the other side of the semiconductor refrigeration sheet 200 absorbs the heat of the area of the heat conduction shell 300 connected with the semiconductor refrigeration sheet, and the heat conduction shell 300 is made of heat conduction materials, so that the heat of other areas of the heat conduction shell 300 can be quickly transferred to the area, and the whole heat conduction shell 300 is in contact with the outside air, so that the contact area of the refrigeration device of the lunch box and the air is large, the heat conduction performance is high, and the heat in the air can be quickly transferred to the heat conduction shell 300 in time; compared with the existing lunch box, the heat radiating fins are positioned in the inner cavity of the shell, air nearby the heat radiating fins is difficult to circulate, cold air is easy to focus nearby the heat radiating fins, the air contacted with the heat conducting shell 300 is obviously better in natural circulation, the cold air is difficult to focus, and the refrigerating efficiency is higher than that of the existing lunch box. In summary, the heat transfer efficiency between the heat-conducting casing 300 and the semiconductor refrigeration sheet 200 and between the heat-conducting casing 300 and the air is high, the electricity and material costs required by the fan are saved due to the arrangement of the heat-conducting casing 300, the heat-radiating fins and the fan do not need to be installed, the space of the lunch box is saved, and the lunch box can be made to be smaller and more compact and is convenient to carry and transport. It is understood that the semiconductor chilling plates 200 may be disposed at the bottom of the inner container 100, and may also be disposed at the side wall of the inner container 100.
Referring to fig. 1 and 2, in some embodiments of the present invention, the heat conductive material is one of silver, aluminum, copper, heat conductive rubber, and heat conductive resin.
Silver, aluminium, copper, heat conduction rubber and heat conduction resin are common heat conduction materials, easily purchase and use, and the price of aluminium is lower, can save the cost, and heat conduction rubber and heat conduction resin weight are lighter, and possess certain insulating nature.
Referring to fig. 1, in some embodiments of the present invention, a first heat conduction block 400 is further included, one side of the first heat conduction block 400 is connected to the inner container 100, and the other side of the first heat conduction block 400 is connected to one side of the semiconductor cooling plate 200.
The first heat-conducting block 400 is arranged, heat between the semiconductor refrigerating sheet 200 and the inner container 100 can be transferred quickly, the semiconductor refrigerating sheet 200 can refrigerate or heat better, and the working efficiency of the semiconductor refrigerating sheet 200 is improved. And the first heat-conducting block 400 is arranged, so that the other side of the semiconductor chilling plate 200 is farther away from the inner container 100, and the air on the other side of the semiconductor chilling plate 200 and the air around the semiconductor chilling plate can not be easily exchanged with the inner container 100 again, thereby reducing the working efficiency of the semiconductor chilling plate 200. It is understood that the first heat conduction block 400 may be integrally formed with the inner container 100 or may be a separate block. It is understood that the first heat conductive block 400 is also composed of a heat conductive material, such as silver, aluminum, copper, heat conductive rubber, and heat conductive resin.
Referring to fig. 1, in some embodiments of the present invention, a second heat conduction block 500 is further included, one side of the second heat conduction block 500 is connected to the heat conduction housing 300, and the other side of the second heat conduction block 500 is connected to the other side of the semiconductor cooling plate 200.
Set up second heat conduction piece 500, can shift the heat between semiconductor refrigeration piece 200 and the heat conduction shell 300 fast, let semiconductor refrigeration piece 200 refrigerate or heat better, improve semiconductor refrigeration piece 200's work efficiency. And the second heat-conducting block 500 is arranged, so that one side of the semiconductor refrigeration piece 200 is farther away from the heat-conducting shell 300, and the air on one side of the semiconductor refrigeration piece 200 and the air around the semiconductor refrigeration piece can not easily exchange heat with the heat-conducting shell 300 again, thereby reducing the working efficiency of the semiconductor refrigeration piece 200. It is understood that the second heat conduction block 500 may be integrally formed with the heat conduction housing 300 or may be a separate block. It is understood that the second heat conduction block 500 is also composed of a heat conduction material, such as silver, aluminum, copper, heat conduction rubber, and heat conduction resin.
Referring to fig. 2, in some embodiments of the present invention, the outer wall of the heat conductive housing 300 is provided with a coupling recess 310, and the coupling recess 310 is coupled with the other side of the semiconductor chilling plate 200.
A portion of the region of the heat conductive housing 300 protrudes inward to form a coupling recess 310, and the coupling recess 310 is coupled to the other side of the semiconductor chilling plate 200. The connection concave part 310 is arranged to directly connect the heat-conducting shell 300 and the semiconductor chilling plate 200, so that the assembly process is reduced, and the assembly efficiency is improved. Furthermore, the connection recess 310 is disposed to enable one side of the semiconductor chilling plate 200 to be farther away from other areas of the heat-conducting housing 300, so that air on one side of the semiconductor chilling plate 200 and its accessories cannot easily exchange heat with other areas of the heat-conducting housing 300 again, thereby reducing the working efficiency of the semiconductor chilling plate 200. It is understood that the other side of the semiconductor chilling plate 200 can be directly connected with the heat-conductive housing 300, thereby saving space.
Referring to fig. 1 and 2, in some embodiments of the present invention, an insulation material 600 is further included, the insulation material 600 being disposed between the inner container 100 and the heat conductive outer shell 300.
The heat insulating material 600 is arranged to prevent the heat conducting case 300 from transferring heat with the inner container 100 through the air between the heat conducting case 300 and the inner container 100, which results in the reduction of the cooling or heating efficiency of the lunch box; the heat insulation material 600 can insulate the inner container 100, and prevent the inner container 100 from being influenced by the heat conduction shell 300 and air, and reduce or raise the temperature; meanwhile, the heat insulation material 600 can play a certain supporting role; the liner 100 can be prevented from directly impacting the heat-conducting shell 300, and certain anti-collision capacity is achieved. It is understood that the insulation material 600 may be rock wool, fiberglass, polyurethane foam, aluminized polyester film. It is understood that the heat insulating material 600 may be installed on the outer wall of the inner container 100, the inner wall of the heat conductive housing 300, or a separate material filled between the inner container and the heat conductive housing 300.
Referring to fig. 1 and 2, in some embodiments of the invention, an external fan 700 is further included, the external fan 700 being connected to the thermally conductive housing 300.
The external fan 700 is provided to increase the air circulation near the heat-conducting case 300, so that more air can be contacted by the heat-conducting case 300 in a fixed time, and the cooling or heating efficiency of the lunch box is increased. It is understood that the external fan 700 may be fixedly installed on the heat conductive housing 300 and not easily disassembled, or may be detachably connected to the heat conductive housing 300 and easily disassembled.
Referring to fig. 1 and 2, in some embodiments of the present invention, a metal-shaped hose 800 is further included, one end of the metal-shaped hose 800 is connected to the external fan 700, the other end of the metal-shaped hose 800 is connected to the heat-conductive housing 300, and the metal-shaped hose 800 can be bent into a predetermined shape.
The metal shaping hose 800 is a composite metal tube coated by a metal spring steel wire, the hollow part of the metal shaping hose is externally provided with spiral grains, wires with certain sizes can penetrate through the tube hole, the metal shaping hose can be bent into a certain shape in a three-dimensional space at will and can keep the shape of the metal shaping hose, the length and the size of the metal shaping hose are basically stable during bending, the bent hose has certain supporting force to support objects with certain weight, and the supporting force is controllable within a certain range. The metal shaped hose 800 is also called a gooseneck, a coil, or a universal tube. The metal shaping hose 800 is arranged, so that the metal shaping hose 800 can be bent, the external fan 700 can blow air for people or food, and the comfort of a user of the lunch box is improved.
Referring to fig. 1 to 4, in some embodiments of the present invention, a switching assembly is further included, and the switching assembly is electrically connected to the semiconductor chilling plate 200 and is used for switching a direction of current flowing to the semiconductor chilling plate 200.
Be provided with conversion assembly, give semiconductor refrigeration piece 200's circular telegram direction through the conversion, can let the hot junction of original semiconductor refrigeration piece 200 become the cold junction to can enough give the cutlery box refrigeration, can give the cutlery box heating again. It can be understood that, referring to fig. 3, the state of the lunch box can be accurately displayed and controlled through the single chip microcomputer, the display screen and the buttons, the lunch box is controlled to be refrigerated or heated, and the single chip microcomputer can be set according to common electric appliances in life, such as an intelligent electric cooker. It can be understood, refer to fig. 4, the household power consumption in the cutlery box can external life, can be through change over switch 1400, control cutlery box refrigerates, heat or cut off the power supply, and set up the regulator circuit in the regulator module 1500, a voltage that semiconductor refrigeration piece 200 was suitable for is adjusted to the household power consumption, be provided with rectifier circuit in first rectifier module 1600 and the second rectifier module 1700, a current that is used for providing current direction for semiconductor refrigeration piece 200 is unchangeable, the regulator circuit, rectifier circuit is common circuit setting, specifically choose for use which kind do not do further and prescribe a limit.
Referring to fig. 2 and 3, in some embodiments of the present invention, a battery 900 is further included, and the battery 900 is electrically connected to the semiconductor chilling plate 200.
The battery 900 is directly arranged in the meal box to supply power to the meal box, so that the meal box is more convenient to use and is suitable for the field environment without an external power supply, such as the use in field meal gathering. It is understood that, from the structure of the battery 900, the battery 900 may be a single battery 900, a group of batteries 900, or a battery jar; the battery 900 may be a dry cell 900, a lithium cell 900, a solar cell 900, a fuel cell 900, or the like, in terms of the composition of the battery 900.
Referring to fig. 1, in some embodiments of the present invention, the external connection socket 1800 and the external connection cable 1900 are included, the external connection socket 1800 is electrically connected to the semiconductor chilling plate 200, one end of the external connection cable 1900 is provided with an external connection plug 1910, the other end of the external connection cable 1900 is provided with a plug 1920, the external connection plug 1910 is used for plugging the external connection socket 1800, and the plug 1920 is used for plugging the socket jack.
Be provided with outer socket 1800 and outer cable 1900 that links, can prolong the scope that the cutlery box can peg graft the power promptly, it is more convenient to use. Meanwhile, the external cable 1900 is plugged into the external socket 1800 through the external plug 1910, so that the external cable 1900 can be pulled out when not in use, and the carrying and the use are more convenient.
Referring to fig. 2, in some embodiments of the present invention, a plug 1920 is included, and the plug 1920 is electrically connected to the semiconductor cooling chip 200.
The lunch box comprises a plug 1920, and household electricity or factory electricity is connected into the lunch box in a manner that the plug 1920 is plugged into a socket, so that the lunch box is wide in application range and convenient to use.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (10)
1. A cutlery box, comprising:
an inner container;
one side of the semiconductor refrigeration piece is connected with the inner container;
the heat conduction shell is made of heat conduction materials, and the other side of the semiconductor refrigeration piece is connected with the heat conduction shell.
2. The cutlery box of claim 1, wherein the thermally conductive material is one of silver, aluminum, copper, thermally conductive rubber, and thermally conductive resin.
3. The meal box of claim 1, further comprising a first heat conducting block, wherein one side of the first heat conducting block is connected to the inner container, and the other side of the first heat conducting block is connected to the one side of the semiconductor refrigeration sheet.
4. The meal box of claim 1, further comprising a second heat conducting block, wherein one side of the second heat conducting block is connected to the heat conducting housing, and the other side of the second heat conducting block is connected to the other side of the semiconductor chilling plate.
5. The meal box of claim 1, wherein an outer wall of the heat-conductive housing is provided with a connection recess, and the connection recess is connected with the other side of the semiconductor chilling plate.
6. The cutlery box of claim 1, further comprising an insulating material disposed between the inner container and the thermally conductive outer shell.
7. The cutlery box of claim 1, further comprising an external fan coupled to the thermally conductive housing.
8. The meal box of claim 7, further comprising a metal shaped hose, wherein one end of the metal shaped hose is connected to the external fan, the other end of the metal shaped hose is connected to the heat conducting shell, and the metal shaped hose can be bent into a predetermined shape.
9. The meal box of claim 1, further comprising a switching assembly, wherein the switching assembly is electrically connected to the semiconductor chilling plate, and the switching assembly is configured to switch a direction of current flowing to the semiconductor chilling plate.
10. The meal box of claim 1, further comprising a battery electrically connected to the semiconductor chilling plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110200692.4A CN112984898A (en) | 2021-02-23 | 2021-02-23 | Lunch box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110200692.4A CN112984898A (en) | 2021-02-23 | 2021-02-23 | Lunch box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112984898A true CN112984898A (en) | 2021-06-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110200692.4A Pending CN112984898A (en) | 2021-02-23 | 2021-02-23 | Lunch box |
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| Country | Link |
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| CN (1) | CN112984898A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN110522151A (en) * | 2019-08-27 | 2019-12-03 | 邹瑜 | A kind of semiconductor refrigerating heating heat-preservation lunch box |
| CN211794763U (en) * | 2020-03-23 | 2020-10-30 | 袁绪鹏 | Refrigeration and heating meal box |
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| CN2116180U (en) * | 1992-03-06 | 1992-09-16 | 河南省信阳广播器材厂 | Semiconductor temperature insulating container with heat exchanger tube |
| CN201108120Y (en) * | 2007-11-07 | 2008-09-03 | 熊丽 | Multifunctional portable dining tank |
| CN104329828A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Semiconductor refrigeration refrigerator and hot-end heat exchange device thereof |
| CN104329852A (en) * | 2014-08-29 | 2015-02-04 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
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| CN110522151A (en) * | 2019-08-27 | 2019-12-03 | 邹瑜 | A kind of semiconductor refrigerating heating heat-preservation lunch box |
| CN211794763U (en) * | 2020-03-23 | 2020-10-30 | 袁绪鹏 | Refrigeration and heating meal box |
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Application publication date: 20210618 |