SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a telescopic cup, which solves the technical problem that products in the prior art are inconvenient to carry. The technical scheme of the scheme has a plurality of technical beneficial effects, which are described as follows:
a collapsible cup comprising a body comprising a compressible or collapsible liquid-carrying portion and a semiconductor temperature regulating assembly disposed below the liquid-carrying portion, wherein:
the liquid carrying part can contain drinkable liquid;
the semiconductor temperature adjusting assembly can cool or heat to reduce or heat the temperature of the liquid in the liquid carrying part, and optionally comprises a power supply assembly arranged at the bottom of the body and a semiconductor assembly electrically connected with the power supply assembly;
the semiconductor assembly can cool or heat to lower or heat the temperature of the liquid in the liquid carrying part when the power supply assembly supplies power.
Optionally, the cooling surface and/or the heating surface of the semiconductor component are respectively adhered with a heat-conducting silicone film, and/or,
one end of the liquid carrying part is opened, and a reinforcing ring is arranged at the middle position from the opening part to the bottom of the liquid carrying part so as to improve the supporting force of the liquid carrying part.
Compared with the prior art, the technical scheme provided by the utility model has the following beneficial effects:
the cup provided by the application has at least two functions, one is that the liquid carrying part of the cup body is telescopic or compressible, when in use, the liquid carrying part is stretched to present the structure of a common cup for use, and when in collection, the liquid carrying part is compressed, so that the integral volume is reduced, and the cup is convenient for people to carry; and secondly, a semiconductor temperature adjusting component is arranged below the liquid carrying part, so that the temperature of liquid in the liquid carrying part can be reduced or heated by refrigerating or heating, the use function of the water cup is integrally improved, and the water cup can be refrigerated or heated.
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. It is to be understood that the described embodiments are merely exemplary of the utility model, and not restrictive of the full scope of the utility model. The utility model is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is noted that various aspects of the embodiments are described below within the scope of the appended claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the disclosure, one skilled in the art should appreciate that one aspect described herein may be implemented independently of any other aspects and that two or more of these aspects may be combined in various ways. For example, an apparatus may be implemented and/or a method practiced using any number of the aspects set forth herein. In addition, such design may be implemented and/or such method may be practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.
It should be noted that the drawings provided in the following embodiments are only for illustrating the basic idea of the present invention in a schematic manner, and the drawings only show the components related to the present invention rather than the number, shape and size of the components in actual implementation, the form, quantity and proportion of each component in actual implementation can be changed freely, and the layout of the components can be more complicated.
The telescopic cup as shown in fig. 1 comprises a body 1, wherein the body 1 comprises a compressible or telescopic liquid carrying part 13 and a semiconductor temperature regulating component arranged below the liquid carrying part 13, wherein:
the liquid-carrying part 13 is made of compressible or retractable food-grade material, such as food silica gel, which is an inorganic high molecular colloid material formed by condensation polymerization of silicic acid, the main component is SiO 2. nH2O, the content of which is more than 98 percent, the liquid-carrying part is nontoxic and tasteless, the chemical property is stable, the pore diameter is about 8-10nm, the specific surface area is 300-500m2/g, and the edible silica gel has no toxic or side effect on human bodies after being refined and sterilized.
The liquid carrying part 13 can contain drinkable liquid, for example, liquid beverages such as milk, cola, sprite, king old ji or jiaduobao, or purified water, etc.;
the semiconductor temperature conditioning assembly is capable of cooling or heating to reduce or heat the temperature of the liquid within the carrier liquid portion 13. The semiconductor temperature regulating assembly comprises a semiconductor chip, a semiconductor refrigerating chip utilizes the Peltier effect, and utilizes the Peltier effect of semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, and the purpose of refrigeration can be realized. By utilizing the semiconductor refrigeration technology, the electric energy can be effectively saved, and cold drinks or hot drinks can be drunk when people go out or travel.
The structure has at least two functions, namely, the liquid carrying part 13 of the body 1 is telescopic or compressible, when in use, the liquid carrying part 13 is stretched to present the structure of a common water cup for use, and when in collection, the liquid carrying part 13 is compressed, so that the integral volume is reduced, and the water cup is convenient for people to carry; secondly, a semiconductor temperature adjusting component is arranged below the liquid carrying part 13, and can refrigerate or heat to reduce or heat the temperature of liquid in the liquid carrying part 13, so that the using function of the water cup is integrally improved, refrigeration or heating can be realized, and a user can drink hot drinks or cold drinks at any time and any place.
As some embodiments provided in the present application, the semiconductor temperature adjusting assembly includes a power supply assembly mounted on the bottom of the main body 1 and a semiconductor assembly electrically connected to the power supply assembly, and the semiconductor assembly can cool or heat to lower or heat the temperature of the liquid in the liquid carrying portion 13 when the power supply assembly supplies power
As some embodiments provided in the present application, the cooling surface and/or the heating surface of the semiconductor component are respectively adhered with a heat-conductive silicone film, the heat-conductive silicone is a thermal interface material in the prior art, and is used to improve the stability during heating or cooling, and/or,
one end of the liquid carrying part 13 is open and a reinforcing ring is arranged at the middle position from the opening part to the bottom part of the liquid carrying part 13 so as to improve the supporting force of the liquid carrying part 13.
Further, in order to improve the mechanical property of the whole structure, folding lines are arranged from the opening end to the bottom surface of the liquid carrying part 13 at intervals, so that the folding lines are easy to stretch or compress during use, secondly, the supporting property of the liquid carrying part 13 can be improved, and the liquid carrying part is not compressed due to small external force.
As some embodiments provided in the present application, as shown in fig. 2, the semiconductor temperature adjustment assembly includes a first ceramic sheet 21 and a second ceramic sheet 22 fixed at the bottom of the body 11 and installed at an interval in a vertical direction, the first ceramic sheet 21 is disposed above the second ceramic sheet 22, and an NP-type semiconductor layer 23 or a PN-type semiconductor layer 23 is sandwiched between the first ceramic sheet 21 and the second ceramic sheet 22, wherein:
the positive electrode or negative electrode of the N-type semiconductor access power supply component in the NP-type semiconductor layer 23, the N-type semi-access negative electrode (cold end up) or positive electrode (hot end up), or the negative electrode or positive electrode of the N-type semiconductor access power supply component in the PN-type semiconductor layer 23, the N-type semi-access positive electrode or negative electrode, to lower or heat the temperature of the beverage in the carrier liquid part 13.
Further, the first ceramic sheet 21 and the second ceramic sheet 22 are respectively provided with a metal layer 26, and the metal layer 26 clamps the NP-type semiconductor layer 23 or the PN-type semiconductor layer 23.
The power supply assembly provides energy required by electron flow, after the power supply is powered on, the electron cathode starts to move, firstly passes through the P-type semiconductor, the heat is absorbed by the P-type semiconductor, then reaches the N-type semiconductor, and then the heat is discharged, and every time the electron cathode passes through one NP module, the heat is sent out from one side to the other side to cause temperature difference, so that a cold end and a hot end are formed. The cold and hot ends are respectively composed of two ceramic sheets, and the cold end is connected with a heat source, i.e. the one to be cooled. If the power supply is reversed, the temperature at the junction will change inversely. The effect is much greater by replacing the metal with one N-type semiconductor and one P-type semiconductor, and thus, the provision of the metal layer 26 improves the cooling or heating efficiency.
After the power supply is switched on, electron hole pairs are generated near the upper contact, the internal energy is reduced, the temperature is reduced, and heat is absorbed to the outside, namely the cold end. The other end is called hot end because the electron hole pair is compounded, the internal energy is increased, the temperature is raised, and heat is released to the environment. The temperature of the cold end can reach-10 to-20 ℃, generally, the temperature of the beverages stored in the supermarket is 0 to 5 ℃, the required direct current battery 24 is enough to be used with 2.5V, the expected refrigeration effect is achieved, on the contrary, the thermal efficiency of the semiconductor is more than 1, the battery 24 is enough to be used with 2.5V, and other types of batteries 24 can also be adopted.
The body 1 is divided into a carrier liquid section and a semiconductor component section (a base 12 part) from top to bottom, wherein the carrier liquid section can be compressed, the semiconductor component section is not compressible, and the two ends are integrally arranged or detachably connected in a threaded manner. A semiconductor body temperature component is arranged in the base 12, and the base 12
The semiconductor temperature adjusting component comprises a power supply component arranged at the bottom of the body 11 and a semiconductor slice electrically connected with the power supply component, the power supply component is supported by the bulge 14, a switch 25 is arranged on the inner side of the position, close to the bottom cover, of the body 1, the switch 25 can control the opening or closing of the power supply component, when the switch 25 is closed, the power supply component supplies power to the semiconductor component, and the semiconductor component can refrigerate or heat to reduce or heat the temperature of the beverage in the liquid carrying part 13.
As part of the embodiments provided by the application, the power supply assembly comprises an accumulator 24, and a charging plug is electrically connected with the accumulator 24, wherein the charging plug is a USB charging plug and/or a two-core power plug and/or a three-core power plug. The function of the multifunctional mobile phone is the same as that of the data line of the existing multifunctional mobile phone, and the multifunctional mobile phone is suitable for different sockets.
As partial implementation mode that this application provided, still include bowl cover 11, bowl cover 11 can close body 1, for example, bowl cover 11 and body 1 snap connection or threaded connection, or bowl cover 11 and body 1 hinged joint. Mining
Furthermore, a ring buckle (not shown) is arranged in the central area of the cup cover 11, so that the cup cover 11 can be conveniently taken, and the body can be conveniently compressed or stretched.
The products provided by the present invention are described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the core concepts of the present invention. It should be noted that, for a person skilled in the art, without departing from the inventive concept of the present invention, several improvements and modifications can be made to the utility model, and these improvements and modifications also fall within the scope of the claims of the utility model.