CN214165911U

CN214165911U - Three-dimensional fixed wafer packing carton

Info

Publication number: CN214165911U
Application number: CN202022640513.2U
Authority: CN
Inventors: 杨琦; 张连鹏; 孙凯英; 崔岩; 孙新; 谷丽波; 韩立萍; 宋洪影; 李琳
Original assignee: Jilin Ruineng Semiconductor Co ltd
Current assignee: Jilin Ruineng Semiconductor Co ltd
Priority date: 2020-11-16
Filing date: 2020-11-16
Publication date: 2021-09-10
Anticipated expiration: 2030-11-16

Abstract

The utility model discloses a three-dimensional fixed wafer packaging box, which comprises a box cover, a box body, a buckle, a sponge pad, antistatic paper, a sponge pad II, a sponge pad III and a wafer, wherein the box cover is tightly covered on the box body after the internal elements of the box body are boxed, and the buckle is formed below the box body; the inner wall of box body is attached with No. three foam-rubber cushions, and various raw materials have been placed in No. three foam-rubber cushions in different levels to the inside, and wherein two foam-rubber cushions have been placed in the bottom of box body to the below, and two antistatic paper have been placed to the top of these two foam-rubber cushions, and the wafer is placed to the top of antistatic paper, then places the wafer in proper order, has all placed one deck foam-rubber cushion between every layer of wafer simultaneously, and two antistatic paper are placed to the wafer top when placing the top of box body, and two-layer foam-rubber cushion is placed to the top of antistatic paper.

Description

Three-dimensional fixed wafer packing carton

Technical Field

The utility model relates to a packing carton specifically is a three-dimensional fixed wafer packing carton.

Background

At present, the known wafer packaging method is formed by packaging electrostatic paper, a foam pad, a foam edge strip and a wafer box. A gap is left between the edge strip and the wafer, and the electrostatic paper is directly contacted with the wafer to be used as isolation. However, during transportation and transportation, the metal on the surface of the wafer is scratched due to bumping or shaking caused by the outside, thereby causing defects.

The method aims to overcome the problem that the existing packaging mode cannot meet the condition of protecting the metal on the surface of the wafer. The utility model provides an adopt three-dimensional fixed method's packaging method, add the stopper foam, upper strata through the edge and add the pad foam-rubber cushion, carry out the fixed in space to the wafer, play the protection to the wafer surface.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a three-dimensional fixed wafer packing carton to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

a three-dimensional fixed wafer packaging box comprises a box cover, a box body, a buckle, a first sponge pad, antistatic paper, a second sponge pad, a third sponge pad and a wafer, wherein the box cover is tightly covered on the box body after elements in the box body are packaged; the inner wall of box body is attached with No. three foam-rubber cushions, the inside layering of No. three foam-rubber cushions has various raw materials, wherein it has two foam-rubber cushions to attach in the bottom top of box body, the top of these two foam-rubber cushions closely laminates has two to prevent static paper, the top laminating of preventing static paper has the wafer, it is provided with a plurality of wafer to pile up in the box body, all laminate simultaneously between every layer of wafer has one deck foam-rubber cushion, the wafer top laminating at the top of box body has two to prevent static paper, the top of preventing static paper closely laminates two-layer foam-rubber cushion.

As a further aspect of the present invention: the two layers of the first sponge cushions on the uppermost layer in the box body should not exceed the upper edge of the box body.

As a further aspect of the present invention: no. two foam-rubber cushions that fold into the seventy percent discount are placed through the instrument in the space that box body adhesion has No. three foam-rubber cushions, carry out the fixed in space to the wafer, and No. two foam-rubber cushions should not exceed the last edge of box body simultaneously.

As a further aspect of the present invention: the lid has the draw-in groove along the shaping outward, and the below shaping of box body has the buckle, and when the box of placing the wafer stacks, the buckle on the box body of top inserted in this lid draw-in groove and makes the box more stable when stacking.

Compared with the prior art, the beneficial effects of the utility model are that:

through the edge foam that adds stopper, upper strata add the pad foam-rubber cushion, carry out the space fixed to the wafer, guarantee that static paper or contact and wafer keep the state of relative stillness, avoid wafer surface metal to produce the mar.

Drawings

Fig. 1 is a schematic structural diagram of a three-dimensional fixed wafer packaging box.

FIG. 2 is a schematic top view of a three-dimensional fixed wafer packaging box.

In the figure: 1 lid, 2 box bodies, 3 buckles, No. 4 foam-rubber cushion, 5 antistatic paper, No. 6 foam-rubber cushion, No. 7 foam-rubber cushion and 8 wafers.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, in an embodiment of the present invention, a three-dimensional fixed wafer packaging box includes a box cover 1, a box body 2, a buckle 3, a first sponge pad 4, an anti-static paper 5, a second sponge pad 6, a third sponge pad 7, and a wafer 8, wherein the box cover 1 is tightly covered on the box body 2 after the internal components of the box body 2 are completely packed; the inner wall of the box body 2 is attached with a third sponge cushion 7, various raw materials are layered inside the third sponge cushion 7, two first sponge cushions 4 are attached to the upper portion of the bottom of the box body, two pieces of anti-static paper 5 are closely attached to the upper portions of the two first sponge cushions 4, wafers 8 are attached to the upper portions of the anti-static paper 5, a plurality of wafers 8 are sequentially arranged in the box body 2, a layer of first sponge cushion is attached between every two layers of wafers 8, two pieces of anti-static paper 5 are attached to the upper portion of the wafer at the top of the box body 2, and two layers of first sponge cushions 4 are closely attached to the upper portions of the anti-static paper 5;

the two uppermost layers of the sponge pads 4 in the box body 2 should not exceed the upper edge of the box body 2;

a second sponge pad 6 folded into three parts is placed in a gap of the box body 2 attached with the third sponge pad 7 through a tool, the wafer is spatially fixed, and meanwhile, the second sponge pad 6 does not exceed the upper edge of the box body 2;

the shaping has the draw-in groove along the shaping outside lid 1, and the below shaping of box body 2 has buckle 3, and when the box of placing the wafer stacked, buckle 3 on the box body 2 of top inserted in this lid 1 draw-in groove and made the box more stable when stacking.

The utility model discloses a theory of operation is: the method aims to overcome the problem that the existing packaging mode cannot meet the condition of protecting the metal on the surface of the wafer. The utility model provides an adopt three-dimensional fixed method's packaging method adds stopper foam, upper strata through the edge and adds the pad foam-rubber cushion, carries out the fixed in space to the wafer, guarantees that static paper or contact and wafer keep the state of relative rest, avoids wafer surface metal to produce the mar.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. A three-dimensional fixed wafer packing box comprises a box cover (1) and a box body (2), and is characterized in that the box cover (1) tightly covers the box body (2) after elements in the box body (2) are packed into the box; the inner wall of box body (2) is attached with No. three foam-rubber cushion (7), No. three foam-rubber cushion (7) inside layering has various raw materials, wherein there are two foam-rubber cushion (4) of bottom top attachment at the box body, the top of these two foam-rubber cushion (4) is closely laminated and is had two antistatic paper (5), the top laminating of antistatic paper (5) has wafer (8), it is provided with a plurality of wafer (8) to pile up in box body (2), all laminate one deck foam-rubber cushion between every layer of wafer (8) simultaneously, laminate two antistatic paper (5) to the wafer top of box body (2), the top of antistatic paper (5) is closely laminated two-layer foam-rubber cushion (4).

2. The three-dimensional fixed wafer packaging box of claim 1, wherein the two uppermost sponge pads (4) of the box body (2) should not exceed the upper edge of the box body (2).

3. The three-dimensional fixed wafer packaging box of claim 1, wherein a second sponge pad (6) folded into three is placed in the gap of the third sponge pad (7) attached to the box body (2) through a tool to fix the wafer in space, and the second sponge pad (6) should not exceed the upper edge of the box body (2).

4. The three-dimensional fixed wafer packaging box of claim 1, characterized in that the outer edge of the box cover (1) is formed with a slot, the lower part of the box body (2) is formed with a buckle (3), when the box for placing wafers is stacked, the buckle (3) on the upper box body (2) is inserted into the slot of the box cover (1) to make the box more stable when stacked.