CN214142567U - Solution flowing type inner tube electroplating experimental device - Google Patents
Solution flowing type inner tube electroplating experimental device Download PDFInfo
- Publication number
- CN214142567U CN214142567U CN202120058871.4U CN202120058871U CN214142567U CN 214142567 U CN214142567 U CN 214142567U CN 202120058871 U CN202120058871 U CN 202120058871U CN 214142567 U CN214142567 U CN 214142567U
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- Prior art keywords
- pipe
- base frame
- tee joint
- electroplating
- anode
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- 238000009713 electroplating Methods 0.000 title claims abstract description 54
- 238000007747 plating Methods 0.000 claims abstract description 31
- 230000007246 mechanism Effects 0.000 claims abstract description 6
- 238000007789 sealing Methods 0.000 claims description 13
- 239000007788 liquid Substances 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 230000008901 benefit Effects 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000006872 improvement Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Abstract
The utility model provides a solution flowing type inner tube electroplating experimental device, which comprises a plating solution groove, a base frame, and an upper bracket and a lower bracket arranged on the base frame; the electroplating device is characterized in that a cathode conducting column and a first tee joint are arranged in the lower support, a second tee joint and an auxiliary sleeve are arranged in the upper support, an upper clamping piece is installed at the top of the upper support, the upper end of an anode penetrates through the auxiliary sleeve and the second tee joint and then is fixed on the upper support through the upper clamping piece, and during electroplating, the upper support enables the anode to be inserted into a pipe fitting to be plated through a lifting mechanism installed on the base frame, and the auxiliary sleeve is sleeved on the pipe fitting to be plated. The device has the advantages of simple operation, convenient and safe workpiece loading and unloading, even cathode and anode spacing, controllable and adjustable main technological parameters such as plating solution temperature, current density and the like.
Description
Technical Field
The utility model relates to an electroplating experimental device, in particular to a solution flow type inner tube electroplating experimental device.
Background
The inner tube electroplating is one of electroplating processes, and due to the difference of the dispersion capacity and the deep plating capacity of the electrolyte, the inner tube electroplating production has great difference, and particularly for electroplating types with poor dispersion capacity of the electrolyte, such as chromium plating, the problems of uneven electroplated layer, low product percent of pass and the like exist, so the research on the high-efficiency inner tube electroplating technology has been paid attention.
In order to explore the influence of various process parameters such as the distance between a cathode plate and an anode plate, the flowing speed of a plating solution, the current density, the temperature of the plating solution and the like on the uniformity and the qualification rate of an electroplated product in the electroplating production process of the inner tube, the industry develops deep research, and the test means and the method are different. However, the present invention relates to a solution flow type inner tube plating experimental apparatus, and there are not many studies, and there is no mature solution flow type inner tube plating experimental apparatus in domestic and foreign markets.
SUMMERY OF THE UTILITY MODEL
The technical task of the invention is to provide a solution flowing type inner tube electroplating experimental device with good universality aiming at the defects of the prior art.
The utility model provides a technical scheme that its technical problem adopted is: a solution flowing type inner tube electroplating experimental device comprises a plating solution tank, a base frame, and an upper bracket and a lower bracket which are arranged on the base frame;
the lower support is fixed on a lower support supporting plate, two ends of the lower support supporting plate are installed at the lower part of the base frame, a cathode conductive column and a tee joint I are arranged in the lower support, the cathode conductive column is used for installing a pipe to be plated, the upper end of a straight pipe of the tee joint I is connected with the cathode conductive column, the lower end of the straight pipe is fixed at the bottom of the lower support, a branch pipe end is connected with an electroplating solution liquid inlet pipe, and the top of the lower support is provided with an opening for placing the pipe to be plated;
the upper support is internally provided with a second tee joint and an auxiliary sleeve, the lower end of the second tee joint straight pipe is connected with the auxiliary sleeve, the end of a branch pipe is connected with an electroplating solution outlet pipe, the auxiliary sleeve is arranged at the bottom of the upper support, the top of the upper support is provided with an upper clamping piece, the upper end of an anode is fixed on the upper support through the upper clamping piece after penetrating through the auxiliary sleeve and the second tee joint, and the upper support enables the anode to be inserted into a pipe fitting to be plated through a lifting mechanism arranged on the base frame and enables the auxiliary sleeve to be sleeved on the pipe fitting to be plated during electroplating;
a base frame supporting plate is arranged below the lower support frame, a lower clamping piece is arranged on the base frame supporting plate, and the lower clamping piece is used for fixing the bottom end of the anode penetrating through the cathode conducting column, the tee joint I and the lower support frame supporting plate during electroplating;
the cathode conductive column is cylindrical, a metal elastic sheet is arranged in the cathode conductive column and used for fixing and contacting the pipe fitting to be plated, and the metal elastic sheet is communicated with the negative pole of the power supply through a negative pole connecting sheet connected with the metal elastic sheet; the positive electrode of the power supply is communicated with the anode through the lower clamping piece; the plating solution inlet pipe and the plating solution outlet pipe are respectively connected with a plating solution tank, and the upper end and the lower end of the straight pipe of the tee joint I and the straight pipe of the tee joint II are respectively provided with a sealing piece for preventing the plating solution from seeping out.
Furthermore, the lower support plate is adjustable and can be fixed at different heights of the base frame according to the length of the pipe to be plated.
Further, the top opening of the lower support, the auxiliary sleeve and the center of the cathode conductive column are located on the same straight line.
Furthermore, a flowmeter, an electromagnetic valve and a circulating pump are arranged on the electroplating liquid inlet pipe, the flow of the electroplating liquid flowing in the pipe to be plated can be adjusted through the flowmeter and the electromagnetic valve, and a heating device is arranged on the electroplating liquid tank.
Further, elevating system includes motor and belt, the motor is installed on the upper portion of bed frame, and the belt suit is on the belt pulley on the output shaft of motor and the driven round of driving wheel of bed frame lower part, the upper bracket is fixed on the belt.
Furthermore, the device also comprises an anode upper limit sensor and an anode lower limit sensor, wherein the anode upper limit sensor and the anode lower limit sensor are arranged on the base frame between the motor and the driven wheel, and the movement distance of the anode is controlled by the anode upper limit sensor and the anode lower limit sensor.
Furthermore, the size of the cathode conducting column, the tee joint I, the tee joint II, the sealing element and the auxiliary sleeve is determined according to the pipe diameter of the pipe fitting to be plated.
Compared with the prior art, the beneficial effects of the utility model are that:
the device has easy operation, and workpiece handling is convenient, safe, and it is even to have the negative and positive pole interval, and the controllable, adjustable advantage of main technological parameter such as plating solution temperature, current density (according to the size of different pipe fittings pipe diameters of waiting to plate internal surface area, the technological requirement that combines different electroplated metals calculates the regulation) can provide manifold experimental means, has reduced the experiment cost.
Drawings
FIG. 1 is a front view of the structure of the present invention;
FIG. 2 is a left side view of the structure of the present invention;
fig. 3 is a front view of the cathode conductive column of the present invention;
fig. 4 is a left side view of the structure of the cathode conductive column of the present invention;
reference numerals: 1-a circulating pump; 2-a pedestal supporting plate; 3-a control cabinet; 4-driven wheel; 5-an anode lower limit sensor; 6-belt, 7-anode upper limit sensor; 8, a motor; 9-a belt pulley; 10-upper bracket fixing block; 11-upper support; 12-an upper clamping member; 13-sealing a second rubber gasket; 14-a second tee joint; 15-the pipe fitting to be plated; 16-an anode; 17-a cathode conductive post; 18-sealing rubber gasket I; 19-a tee joint I; 20-lower support; 21-a sealing block; 22-lower bracket support plate; 23-a lower clamping member; 24-plating bath; 25-a heating device; 26-a power supply; 27-a flow meter; 28-a solenoid valve; 29-electroplating liquid inlet and outlet pipes; 30-a base frame; 31-a copper shrapnel; 32-a negative electrode connecting sheet; 33-auxiliary sleeve.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
Example 1
As shown in FIGS. 1 to 4, a solution flowing type inner tube electroplating experimental apparatus comprises a plating solution tank 24, a base frame 30, an upper bracket 11 and a lower bracket 20 arranged on the base frame; the lower support is fixed on a lower support plate 22, two ends of the lower support plate are installed at the lower part of the base frame, a cathode conductive column 17 and a first tee joint 19 are arranged in the lower support, the cathode conductive column is used for installing a pipe fitting 15 to be plated, the upper end of a straight pipe of the first tee joint is connected with the cathode conductive column, the lower end of the straight pipe is fixed at the bottom of the lower support through a sealing block 21, the end of a branch pipe is connected with an electroplating solution liquid inlet pipe 29, sealing rubber gaskets 18 are arranged at the upper end and the lower end of the straight pipe of the first tee joint to prevent the electroplating solution from seeping out, and an opening used for placing the pipe fitting to be plated is formed in the top of the lower support;
the electroplating device is characterized in that a second tee joint 14 and an auxiliary sleeve 33 are arranged in the upper support, the lower end of the second tee joint straight pipe is connected with the auxiliary sleeve, the end of a branch pipe is connected with an electroplating solution outlet pipe 29, the upper end and the lower end of the second tee joint straight pipe are respectively provided with a second sealing rubber mat 13 for preventing electroplating solution from seeping out, the auxiliary sleeve is arranged at the bottom of the upper support, an upper clamping piece 12 is arranged at the top of the upper support, the upper end of an anode 16 passes through the auxiliary sleeve and the second tee joint and then is fixed on the upper support through the upper clamping piece, during electroplating, the upper support enables the anode to be inserted into a pipe to be plated through a lifting mechanism arranged on the base frame, the auxiliary sleeve is sleeved on the pipe to be plated, and meanwhile, under the action of the pressure of the upper support, the sealing of a plating solution loop is realized, and electroplating can be carried out;
a base frame supporting plate 2 is arranged below the lower support, a lower clamping piece 23 is arranged on the base frame supporting plate, and the lower clamping piece is used for fixing the bottom end of the anode penetrating through the cathode conducting column, the tee joint I and the lower support supporting plate during electroplating;
the cathode conductive column is cylindrical, a copper elastic sheet 31 is arranged in the cathode conductive column, the copper elastic sheet is used for fixing and contacting the pipe fitting to be plated, and the copper elastic sheet is communicated with the negative electrode of the power supply 26 through a negative electrode connecting sheet 32 connected with the copper elastic sheet; the positive electrode of the power supply is communicated with the anode through the lower clamping piece; the electroplating liquid inlet pipe and the electroplating liquid outlet pipe are respectively connected with an electroplating liquid tank;
the lifting mechanism comprises a motor 8 and a belt 6, the motor is mounted on the upper portion of the base frame, the belt is sleeved on a belt pulley 9 on an output shaft of the motor and a driven wheel 4 on the lower portion of the base frame, and the upper support is fixed on the belt through an upper support fixing block 10.
As an improvement of the technical scheme, the lower support plate is adjustable and can be fixed at different heights of the base frame according to the length of the pipe fitting to be plated, the cathode conductive column, the tee joint I and the tee joint II, the sealing block, the sealing rubber mat and the auxiliary sleeve are determined according to the pipe diameter of the pipe fitting to be plated.
As the improvement of the technical scheme, a flow meter 27, an electromagnetic valve 28 and a circulating pump 1 are arranged on the plating solution inlet pipe, the flow of the plating solution flowing in the pipe to be plated can be adjusted through the flow meter and the electromagnetic valve, and a heating device 25 is arranged on the plating solution tank.
As the improvement of the technical scheme, the device also comprises an anode upper limit sensor 7 and a anode lower limit sensor 5, wherein the anode upper limit sensor and the anode lower limit sensor are arranged on a base frame between the motor and the driven wheel, and the movement distance of the anode is controlled by the anode upper limit sensor and the anode lower limit sensor.
The inner tube electroplating experimental device also comprises a control cabinet 3 for controlling the opening of the heating device, the electromagnetic valve and the circulating pump, and an upper limit sensor indicator lamp and a lower limit sensor indicator lamp which are connected with the upper limit sensor and the lower limit sensor are arranged in the control cabinet.
The working steps of the utility model are as follows:
firstly, pouring a plating solution into a plating solution tank, wherein the liquid level reaches the minimum specified scale in the plating tank;
secondly, a main power supply in the control cabinet is firstly turned on, a heating device is started, and the plating solution stops heating after reaching the required temperature;
fixing the anode through an upper clamping piece on an upper bracket, fixing the pipe fitting to be plated on a lower bracket, starting a motor, enabling the upper bracket to move downwards to enable the anode to move downwards to enter the pipe fitting to be plated to reach a specified position, enabling an indicator lamp of a lower limiting sensor to be on, and fixing the lower end of the anode extending out of the pipe fitting to be plated through the lower clamping piece;
fourthly, starting a circulating pump, enabling the plating solution to start to circularly flow, and adjusting the flow through a solenoid valve control switch;
fifthly, turning on an electroplating power switch to adjust the electroplating working current (or voltage);
sixthly, after the electroplating is finished, turning off an electroplating power switch, then turning off a circulating pump switch, and waiting for 30-60 seconds to ensure that the solution in the pipeline flows back into the plating tank;
seventhly, the upper support moves upwards to enable the anode to move upwards to be away from the pipe fitting to be plated to reach a specified position, the upper limiting sensor indicator lamp is turned on, the pipe fitting to be plated is taken down, and electroplating is finished;
and step eight, after the step is finished, closing the heating device and then closing the main power supply.
Above technical scheme has explained the utility model discloses a technical thought can not injecing with this the utility model discloses a protection scope, all do not break away from the utility model discloses technical scheme's content, the basis the utility model discloses a technical entity all belongs to any change and the decoration of above technical scheme to what do the utility model discloses a technical scheme's protection scope.
Claims (7)
1. The utility model provides an experimental apparatus is electroplated to solution flow type inner tube which characterized in that: a solution flowing type inner tube electroplating experimental device comprises a plating solution tank, a base frame, and an upper bracket and a lower bracket which are arranged on the base frame;
the lower support is fixed on a lower support supporting plate, two ends of the lower support supporting plate are installed at the lower part of the base frame, a cathode conductive column and a tee joint I are arranged in the lower support, the cathode conductive column is used for installing a pipe to be plated, the upper end of a straight pipe of the tee joint I is connected with the cathode conductive column, the lower end of the straight pipe is fixed at the bottom of the lower support, a branch pipe end is connected with an electroplating solution liquid inlet pipe, and the top of the lower support is provided with an opening for placing the pipe to be plated;
the upper support is internally provided with a second tee joint and an auxiliary sleeve, the lower end of the second tee joint straight pipe is connected with the auxiliary sleeve, the end of a branch pipe is connected with an electroplating solution outlet pipe, the auxiliary sleeve is arranged at the bottom of the upper support, the top of the upper support is provided with an upper clamping piece, the upper end of an anode is fixed on the upper support through the upper clamping piece after penetrating through the auxiliary sleeve and the second tee joint, and the upper support enables the anode to be inserted into a pipe fitting to be plated through a lifting mechanism arranged on the base frame and enables the auxiliary sleeve to be sleeved on the pipe fitting to be plated during electroplating;
a base frame supporting plate is arranged below the lower support frame, a lower clamping piece is arranged on the base frame supporting plate, and the lower clamping piece is used for fixing the bottom end of the anode penetrating through the cathode conducting column, the tee joint I and the lower support frame supporting plate during electroplating;
the cathode conductive column is cylindrical, a metal elastic sheet is arranged in the cathode conductive column and used for fixing and contacting the pipe fitting to be plated, and the metal elastic sheet is communicated with the negative pole of the power supply through a negative pole connecting sheet connected with the metal elastic sheet; the positive electrode of the power supply is communicated with the anode through the lower clamping piece; the plating solution inlet pipe and the plating solution outlet pipe are respectively connected with a plating solution tank, and the upper end and the lower end of the straight pipe of the tee joint I and the straight pipe of the tee joint II are respectively provided with a sealing piece for preventing the plating solution from seeping out.
2. The experimental apparatus for electroplating solution flowing type inner tube according to claim 1, wherein: the lower support supporting plate is adjustable and can be fixed at different heights of the base frame according to the length of the pipe to be plated.
3. The experimental apparatus for electroplating solution flowing type inner tube according to claim 1, wherein: the top opening of the lower support, the auxiliary sleeve and the center of the cathode conductive column are positioned on the same straight line.
4. The experimental apparatus for electroplating solution flowing type inner tube according to claim 1, wherein: the electroplating solution inlet pipe is provided with a flowmeter, an electromagnetic valve and a circulating pump, and the electroplating solution tank is provided with a heating device.
5. The experimental apparatus for electroplating solution flowing type inner tube according to claim 1, wherein: the lifting mechanism comprises a motor and a belt, the motor is mounted on the upper portion of the base frame, the belt is sleeved on a belt pulley on an output shaft of the motor and a driven wheel on the lower portion of the base frame, and the upper support is fixed on the belt.
6. The experimental apparatus for electroplating solution flowing type inner tube according to claim 1, wherein: the device also comprises an anode upper limiting sensor and an anode lower limiting sensor which are arranged on the base frame between the motor and the driven wheel.
7. The experimental apparatus for electroplating solution flowing type inner tube according to claim 1, wherein: the size of the cathode conducting column, the tee joint I, the tee joint II, the sealing element and the auxiliary sleeve is determined according to the pipe diameter of the pipe fitting to be plated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120058871.4U CN214142567U (en) | 2021-01-11 | 2021-01-11 | Solution flowing type inner tube electroplating experimental device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120058871.4U CN214142567U (en) | 2021-01-11 | 2021-01-11 | Solution flowing type inner tube electroplating experimental device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214142567U true CN214142567U (en) | 2021-09-07 |
Family
ID=77547083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120058871.4U Expired - Fee Related CN214142567U (en) | 2021-01-11 | 2021-01-11 | Solution flowing type inner tube electroplating experimental device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214142567U (en) |
-
2021
- 2021-01-11 CN CN202120058871.4U patent/CN214142567U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210907 |