CN214097127U - Chip image acquisition device - Google Patents
Chip image acquisition device Download PDFInfo
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- CN214097127U CN214097127U CN202023334302.2U CN202023334302U CN214097127U CN 214097127 U CN214097127 U CN 214097127U CN 202023334302 U CN202023334302 U CN 202023334302U CN 214097127 U CN214097127 U CN 214097127U
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- chip
- image pickup
- pickup device
- bearing platform
- fixing
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Abstract
The utility model provides a chip image acquisition device, which comprises a chip bearing platform, a plurality of reflectors and a camera device; a through hole is formed in the upper surface of the chip bearing platform; the reflector is fixedly connected with the lower surface of the chip bearing platform at a preset angle; each reflector is arranged around the through hole; each reflector is in staggered butt joint and surrounds a detection area with the area smaller than or equal to that of the through hole, and the side face of the chip placed in the detection area is reflected to the lower side; the camera device is located below the detection area. The utility model discloses a chip image acquisition device can once only acquire the image of a plurality of surfaces of chip through a camera device, improves the efficiency of acquireing the chip image, and use cost is low.
Description
Technical Field
The utility model relates to a chip image acquisition device's technical field, concretely relates to chip image acquisition device.
Background
At present, when the chip is subjected to appearance inspection, the outer surfaces of the chip are respectively photographed, some cameras are adopted to simultaneously acquire images, but the image acquisition cost is high, and some cameras are adopted to photograph the outer surfaces of the chip one by one, but the image acquisition efficiency is very low.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome shortcoming and not enough among the prior art, provide a chip image acquisition device, can once only acquire the image of a plurality of surfaces of chip through a camera device, improve the efficiency of acquireing the chip image, and use cost is low.
An embodiment of the utility model provides a chip image acquisition device, include: the chip bearing platform, a plurality of reflectors and a camera device;
a through hole is formed in the upper surface of the chip bearing platform;
each reflector is fixed on the lower surface of the chip bearing platform at a preset angle, is in staggered butt joint and surrounds and forms a detection area with the area smaller than or equal to the cross section area of the opening of the through hole below the through hole, so that the side surface of the chip placed in the detection area is reflected to the lower part;
the camera device is arranged below the detection area and faces the detection area.
Compared with the prior art, the utility model discloses a chip image acquisition device passes through the side reflection to the below of the chip that the speculum will be placed in the detection zone makes camera device can acquire the lower surface of the chip in the detection zone and the image of side simultaneously, has improved the efficiency of acquireing the chip image, and only needs a camera device, and is with low costs.
Further, still including the first chip adsorption component that is used for adsorbing the chip, still including the fixed subassembly of first chip that is used for adsorbing the chip, the fixed subassembly of first chip adsorbs the chip, makes the chip pass the through-hole stops the detection zone. The chip can be flexibly moved into the detection area.
Further, the first chip fixing assembly comprises a horizontal moving component, a vertical moving component and an adsorption piece for adsorbing the chip; the horizontal moving part is arranged above the chip bearing platform in parallel; one end of the vertical moving component is vertically connected with the horizontal moving component, and the adsorption piece is connected with the other end of the vertical moving component. The horizontal moving component moves the vertical moving component to the upper part of the through hole, and the vertical moving component enables the adsorption piece to pass through the through hole and stay in the detection area.
Further, the chip carrier is arranged in the detection area; the chip bearing seat comprises a transparent bottom plate and a transparent side wall, the transparent side wall surrounds an accommodating cavity with an upward opening, the accommodating cavity is arranged on the transparent side wall and forms an opening, the opening of the accommodating cavity faces the through hole, and the edge of the opening of the accommodating cavity is connected with the chip bearing seat. Can be used for stably placing the chip.
The chip bearing platform and the camera device are arranged on the same side of the mounting seat from top to bottom. And fixing the chip bearing platform and the camera device through the mounting seat.
Further, the device also comprises a first fixing piece and a second fixing piece; the first fixing piece comprises at least two right-angle fixing supports, one right-angle edge of each right-angle fixing support is connected with the chip bearing platform, and the other right-angle edge of each right-angle fixing support is connected with the mounting seat; the second fixing piece comprises a fixing flat plate, the fixing flat plate is provided with a penetrating part, the camera device is connected with the second fixing piece through the penetrating part, and one end of the second fixing piece is connected with the mounting seat. The chip bearing platform is more stable through the first fixing piece, and the camera device is more stable through the second fixing piece, so that the accuracy of the acquired chip image is improved.
Further, still include light source, light source is located between speculum and the camera device, light source centers on the detection zone sets up. And the obtained image of the chip is more accurate by utilizing the light.
Further, the shape of the area surrounded by the lighting source is rectangular or circular. The light is more uniform.
The imaging side of the optical lens is provided with a light splitting module which can split the light wave into a plurality of light waves with different wavelength ranges; the optical path adjusting mechanism is arranged between the light splitting module and the photosensitive chip. An image of the chip within the detection zone is accurately acquired.
Further, the body of speculum is the triangle prism, the triangle prism towards one side of detection zone is equipped with the mirror surface coating. The reflecting mirror is in a triangular prism structure, so that the reflecting angle is stable and unchanged.
In order to make the present invention more clearly understood, the following description will be made in conjunction with the accompanying drawings.
Drawings
Fig. 1 is a structural diagram of a chip image acquisition apparatus according to an embodiment of the present invention.
Fig. 2 is a schematic diagram illustrating the arrangement of the reflectors of the chip image capturing device according to an embodiment of the present invention.
Fig. 3 is a structural diagram of a chip image capturing device with a light source according to an embodiment of the present invention.
1. A chip carrying platform; 11. a through hole; 3. a mirror; 5. a camera device; 7. a mounting seat; 71. a first fixing member; 73. a second fixing member; 75. a gravity balance member; 9. and a light source of light.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, fig. 1 is a structural diagram of a chip image acquisition device according to an embodiment of the present invention, and fig. 2 is a schematic diagram of a reflector 3 of a chip image acquisition device according to an embodiment of the present invention; the chip image acquisition device includes: the chip bearing platform 1, a plurality of reflectors 3 and a camera device 5.
Wherein, a through hole 11 is arranged on the upper surface of the chip bearing platform 1; each reflector 3 is fixed on the lower surface of the chip bearing platform 1 at a preset angle, each reflector 3 is in staggered butt joint, and a detection area with the area smaller than or equal to the opening section area of the through hole 11 is formed around the lower part of the through hole 11, so that the side surface of a chip placed in the detection area is reflected to the lower part; the camera device 5 is arranged below the detection area and faces the detection area.
In particular, by arranging the mirrors 3 in a staggered manner, a detection area with a side length smaller than any one of the side lengths of the mirrors 3 can be surrounded by a plurality of large-area mirrors 3.
In this embodiment, the chip is placed in the detection area through the through hole 11 of the chip bearing platform 1 and stays in the detection area, and the side surface of the chip placed in the detection area is reflected to the lower side by the reflector 3, so that the image pickup device 5 can simultaneously acquire the images of the lower surface and the side surface of the chip in the detection area.
Compared with the prior art, the utility model discloses a chip image acquisition device has realized fast and acquireing simultaneously the effect of the image of a plurality of faces of chip to the camera device who uses is few, and is with low costs.
In a possible embodiment, the chip detection device further comprises a first chip fixing component for adsorbing the chip, wherein the first chip fixing component adsorbs the chip, so that the chip passes through the through hole 11 and stays in the detection area.
Preferably, the first chip fixing assembly includes a horizontal moving member, a vertical moving member, and an adsorption member for adsorbing a chip; the horizontal moving part is arranged above the chip bearing platform 1 in parallel; one end of the vertical moving component is vertically connected with the horizontal moving component, and the adsorption piece is connected with the other end of the vertical moving component.
Specifically, the horizontal moving component comprises a guide rail and a moving block, the guide rail is arranged above the chip bearing platform 1 in parallel, and the moving block is movably arranged on the guide rail; the vertical moving part comprises a telescopic rod, one end of the telescopic rod is connected with the movable block, and the other end of the telescopic rod is connected with the adsorption piece; preferably, the suction member is a vacuum nozzle that sucks the chip using air pressure.
In this embodiment, the horizontally moving member may move the vertically moving member to a position above the through hole 11, and then the vertically moving member may cause the adsorbing member to pass through the through hole 11 and stay in the detection area, and the reflecting mirror 3 may reflect the side surface of the chip adsorbed by the adsorbing member to a lower position, so that the imaging device 5 may simultaneously acquire images of the lower surface and the side surface of the chip in the detection area.
In one possible embodiment, further comprising the chip-holding socket disposed within the detection zone; the chip bearing seat comprises a transparent bottom plate and a transparent side wall, the transparent side wall surrounds an accommodating cavity with an upward opening, the accommodating cavity is arranged on the transparent side wall and forms an opening, the opening of the accommodating cavity faces the through hole 11, and the edge of the opening of the accommodating cavity is connected with the chip bearing seat.
In this embodiment, the chip is placed in the holding cavity through the through hole 11, the reflector 3 reflects the side surface of the chip on the chip holding component to the lower side through the transparent side wall, the camera device 5 obtains the side image of the chip reflected by the reflector 3, and the bottom image of the chip is obtained through the transparent bottom plate, so that the camera device 5 can simultaneously obtain the images of the bottom surface and the side surface of the chip placed on the chip component.
In a possible embodiment, the chip carrying platform 7 and the camera device 5 are mounted on the same side of the mounting seat 7 from top to bottom. And the chip bearing platform 1 and the camera device 5 are fixed through the mounting seat 7.
Preferably, the device further comprises a first fixing piece and a second fixing piece; the first fixing member 71 includes at least two right-angle fixing brackets, one right-angle side of each right-angle fixing bracket is connected with the chip bearing platform 1, and the other right-angle side is connected with the mounting base 7; the second fixing member includes a fixing plate, the fixing plate is provided with a penetrating portion, the image pickup device 5 is connected with the second fixing member 73 through the penetrating portion, and one end of the second fixing member 73 is connected with the mounting base 7.
In this embodiment, the chip carrying platform 1 is more stable by the first fixing member 71, and the image pickup device 5 is more stable by the second fixing member 73, so that the shake of the chip carrying platform 1 and the image pickup device 5 caused by accidental touch is reduced, and the accuracy of the acquired chip image is improved. Preferably, a gravity balance part 75 is disposed on a side of the mounting base 7 away from the chip carrying platform 1, so as to prevent the mounting base 7 from tilting or even bending due to a long-time gravity in only one direction.
Referring to fig. 3, in a possible embodiment, the lighting device further includes a lighting source, the lighting source 9 is located between the reflector 3 and the camera device 5, and the lighting source is perpendicular to the shooting direction of the camera device 5 and is disposed around the shooting range of the camera device 5. And the obtained image of the chip is more accurate by utilizing the light.
Preferably, the shape of the area surrounded by the lamp light source is rectangular or circular. The light is more uniform.
In a possible embodiment, the image capturing device 5 includes an optical lens, an optical path adjusting mechanism for adjusting an optical path, and a light sensing chip for receiving an optical signal, and a light splitting module capable of splitting an optical wave into a plurality of optical waves with different wavelength ranges is disposed on an imaging side of the optical lens; the optical path adjusting mechanism is arranged between the light splitting module and the photosensitive chip. An image of the chip within the detection zone is accurately acquired.
In a possible embodiment, the body of the mirror 3 is a triangular prism, the side of which facing the detection zone is provided with a mirror coating.
Preferably, the number of said mirrors 3 is four. May correspond to four sides of the reflective chip.
In this embodiment, a triangular prism structure is used as the reflector 3, so that the contact area between the reflector 3 and the chip bearing platform 1 can be increased, the connection stability is improved, and the reflection angle is stable and unchanged.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A chip image acquisition apparatus, comprising: the chip bearing platform, a plurality of reflectors and a camera device;
a through hole is formed in the chip bearing platform;
each reflector is fixed on the lower surface of the chip bearing platform at a preset angle, the reflectors are in staggered butt joint, a detection area with the area smaller than or equal to the cross section area of an opening of the through hole is formed below the through hole in a surrounding mode, and the side face of the chip placed in the detection area is reflected to the camera device through each reflector;
the camera device is arranged below the detection area and faces the detection area.
2. The chip image pickup device according to claim 1, wherein: still including the fixed subassembly of first chip that is used for adsorbing the chip, the fixed subassembly of first chip adsorbs the chip, makes the chip pass the through hole and stop in the detection area.
3. The chip image pickup device according to claim 2, wherein: the first chip fixing assembly comprises a horizontal moving component, a vertical moving component and an adsorption piece for adsorbing a chip; the horizontal moving part is arranged above the chip bearing platform in parallel; one end of the vertical moving component is connected with the horizontal moving component, and the adsorption piece is connected with the other end of the vertical moving component.
4. The chip image pickup device according to claim 1, wherein: a chip-holding seat disposed within the detection zone; the chip bearing seat comprises a transparent bottom plate and a transparent side wall, the transparent side wall surrounds the transparent side wall and is provided with an accommodating cavity with an upward opening, the opening of the accommodating cavity faces the through hole, and the edge of the opening of the accommodating cavity is connected with the chip bearing seat.
5. The chip image pickup device according to claim 1, wherein: the chip bearing platform and the camera device are arranged on the same side of the mounting seat from top to bottom.
6. The chip image pickup device according to claim 5, wherein: the device also comprises a first fixing piece and a second fixing piece; the first fixing piece comprises at least two right-angle fixing supports, one right-angle edge of each right-angle fixing support is connected with the chip bearing platform, and the other right-angle edge of each right-angle fixing support is connected with the mounting seat; the second fixing piece comprises a fixing flat plate, the fixing flat plate is provided with a penetrating part, the camera device is connected with the second fixing piece through the penetrating part, and one end of the second fixing piece is connected with the mounting seat.
7. The chip image pickup device according to claim 1, wherein: still include the light source, the light source is located between speculum and the camera device, the light source centers on the detection zone sets up.
8. The chip image pickup device according to claim 7, wherein: the shape of the area surrounded by the light source is rectangular or circular.
9. The chip image pickup device according to claim 1, wherein: the image pickup device comprises an optical lens, an optical path adjusting mechanism for adjusting an optical path and a photosensitive chip for receiving optical signals, wherein a light splitting module capable of splitting light waves into a plurality of light waves with different wavelength ranges is arranged on the imaging side of the optical lens; the optical path adjusting mechanism is arranged between the light splitting module and the photosensitive chip.
10. The chip image pickup device according to claim 1, wherein: the body of speculum is the triangle prism, the triangle prism towards one side of detection zone is equipped with the mirror surface coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023334302.2U CN214097127U (en) | 2020-12-30 | 2020-12-30 | Chip image acquisition device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023334302.2U CN214097127U (en) | 2020-12-30 | 2020-12-30 | Chip image acquisition device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214097127U true CN214097127U (en) | 2021-08-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023334302.2U Active CN214097127U (en) | 2020-12-30 | 2020-12-30 | Chip image acquisition device |
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| Country | Link |
|---|---|
| CN (1) | CN214097127U (en) |
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2020
- 2020-12-30 CN CN202023334302.2U patent/CN214097127U/en active Active
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