CN214065481U - Silicon wafer drying device - Google Patents

Abstract

The utility model relates to a solar cell production technical field discloses a silicon chip drying device. This silicon chip drying device includes the stoving case, the air-blast subassembly, heating cabinet and converter, and the stoving case can bear the weight of the silicon chip of treating drying, and the heating cabinet sets up between air-blast subassembly and the stoving case and is linked together with both respectively, and the air-blast subassembly can blow to the heating cabinet is inside, and the heating cabinet is used for heating its inside wind, and the wind energy after the heating cabinet heating can get into the stoving case to the silicon chip of treating drying is dried in the stoving, and the converter is configured to the air-out frequency of adjusting the air-blast subassembly. The utility model provides a silicon chip drying device realizes the regulation to the air-out frequency of blast air subassembly through setting up the converter, can play the effectual guard action of treating the silicon chip of drying, prevents to treat the silicon chip of drying because the too big lobe of a leaf that causes of air-out frequency or because the stoving that the air-out frequency undersize caused is not in time treating the silicon chip of drying and leaving the condition emergence of water stain, can improve product quality.

Description

Silicon wafer drying device

Technical Field

The utility model relates to a solar cell produces technical field, especially relates to a silicon chip drying device.

Background

With the development of the solar photovoltaic industry, the crystalline silicon cell is developed towards the trend of low cost, high efficiency and large yield. With the continuous improvement of the production process of the crystalline silicon cell, after the last processing procedure, the silicon wafer of the cell can be cleaned so as to remove the pollution impurities on the surface of the silicon wafer.

After the silicon wafer is cleaned, drying treatment is needed, a drying device in the prior art usually comprises a fan and a drying box, the drying box bears the silicon wafer to be dried, and the fan can blow air into the drying box to dry the silicon wafer. However, the existing drying device often cannot adjust the frequency of the fan, if only one wind speed frequency is adopted to dry the silicon wafer in the whole drying process, when the wind speed frequency is too small, the phenomenon that water stains are left on the surface of the silicon wafer due to untimely drying of the silicon wafer is easily caused; when the wind speed frequency is too high, the phenomenon that the silicon wafer is blown apart by wind is easily caused, and the processing quality of the silicon wafer is poor. In addition, when one group of silicon wafers is cleaned, the silicon wafers are taken out of the drying box, and then the next group of silicon wafers are put into the drying box, if the fan blows air into the drying box at the wind speed frequency, energy waste is caused.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a silicon chip drying device, it can be controlled the wind speed frequency of the wind of blowing in the stoving incasement, guarantees the drying efficiency and the finished product quality of silicon chip, can also the energy can be saved.

As the conception, the utility model adopts the technical proposal that:

a silicon wafer drying device comprises:

the drying box can bear the silicon wafers to be dried;

the heating box is arranged between the air blowing assembly and the drying box and is respectively communicated with the air blowing assembly and the drying box, the air blowing assembly can blow air into the heating box, the heating box is used for heating the air in the heating box, and the air heated by the heating box can enter the drying box to dry the silicon wafer to be dried;

a frequency converter configured to adjust an air outlet frequency of the blower assembly.

As a preferred scheme of the silicon wafer drying device, air inlets are formed in two sides of the drying box, and an outlet of the heating box is communicated with the air inlets in the two sides of the drying box.

As a preferred scheme of the silicon wafer drying device, a flow equalizing plate is further arranged inside the drying box, the flow equalizing plate is located between the air inlet and the silicon wafer to be dried, the flow equalizing plate is parallel to the side face, provided with the air inlet, of the drying box, and the flow equalizing plate is provided with uniformly distributed vent holes.

As a preferred scheme of the silicon wafer drying device, the flow equalizing plate is detachably connected to the inner wall of the drying box.

As a preferable aspect of the silicon wafer drying apparatus, the drying box includes:

the drying box body can bear the silicon wafer to be dried, an air outlet is formed in the bottom of the drying box body, and the air outlet is communicated with an inlet of the air blowing assembly;

and the drying box cover is arranged on the drying box body in a covering manner.

As a preferred scheme of the silicon wafer drying device, a wind sensor is arranged at the air inlet and electrically connected with the frequency converter so as to detect wind power entering the air inlet.

As a preferred scheme of the silicon wafer drying device, a pressure sensor is further arranged in the drying box, and the pressure sensor is electrically connected with the frequency converter so as to detect the pressure born by the drying box.

As a preferred scheme of the silicon wafer drying device, a dehumidifying component is further arranged between the drying box and the air blowing component.

As a preferable aspect of the silicon wafer drying apparatus, the heating box includes:

the heating box body is respectively communicated with the air blowing assembly and the drying box;

and the heating wire is arranged in the heating box body and can heat the wind in the heating box body, and the heating wire is electrically connected with an external power supply.

As a preferred scheme of the silicon wafer drying device, the heating wires are spirally distributed on the inner wall of the heating box body.

The utility model has the advantages that:

the utility model provides a silicon chip drying device, the stoving case has played the effect of bearing the weight of the silicon chip of waiting to dry, and the blast air subassembly is used for blowing to the heating cabinet in, for the silicon chip of waiting to dry provides the wind regime, and the heating cabinet is used for heating the wind in it, and the wind energy after the heating can blow in the stoving case and blow to the surface of the silicon chip of waiting to dry the silicon chip of waiting to dry, adopts the mode of hot air drying, can reduce the required time of drying, improves drying efficiency, promotes output; the air outlet frequency of the air blowing assembly is adjusted by the aid of the frequency converter, so that effective protection effect on the silicon wafer to be dried can be achieved, the silicon wafer to be dried is prevented from being broken due to too large air outlet frequency or being dried untimely due to too small air outlet frequency, water stain is left on the silicon wafer to be dried, and product quality can be improved.

Drawings

Fig. 1 is a schematic structural diagram of a silicon wafer drying device provided by an embodiment of the present invention;

fig. 2 is a schematic structural diagram of the flow equalizing plate of the silicon wafer drying device provided by the embodiment of the present invention.

In the figure:

100-silicon chip to be dried;

1-drying box; 11-an air inlet; 12-an air outlet; 13-a flow homogenizing plate; 131-a vent;

2-a blower assembly; 3-heating the box; 4-a frequency converter; 5-a dehumidifying component.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

As shown in fig. 1, the embodiment provides a silicon wafer drying device, the silicon wafer drying device includes a drying box 1, a blower assembly 2, a heating box 3 and a frequency converter 4, wherein the drying box 1 can bear a silicon wafer 100 to be dried, the heating box 3 is disposed between the blower assembly 2 and the drying box 1 and is respectively communicated with the blower assembly 2 and the drying box 1, the blower assembly 2 can blow air to the inside of the heating box 3, the heating box 3 is used for heating the air in the heating box, the air heated by the heating box 3 can enter the drying box 1 to dry the silicon wafer 100 to be dried, and the frequency converter 4 is configured to adjust the air outlet frequency of the blower assembly 2.

In the silicon wafer drying device provided by the embodiment, the drying box 1 plays a role of bearing the silicon wafer 100 to be dried, the air blowing assembly 2 is used for blowing air into the heating box 3 to provide an air source for drying the silicon wafer 100 to be dried, the heating box 3 is used for heating the air in the heating box, the heated air can be blown into the drying box 1 and blown to the surface of the silicon wafer 100 to be dried, so as to dry the silicon wafer 100 to be dried, and by adopting a hot air drying mode, the time required by drying can be reduced, the drying efficiency is improved, and the yield is improved; realize the regulation to the air-out frequency of air-blast subassembly 2 through setting up converter 4, can play the effectual guard action of treating stoving silicon chip 100, prevent to treat stoving silicon chip 100 because the too big lobe of a leaf that causes of air-out frequency, perhaps because the stoving that the too little causes of air-out frequency is untimely the condition emergence of leaving water stain in treating stoving silicon chip 100, can improve product quality.

In the present embodiment, the blower unit 2 is a high temperature blower. Of course, in other embodiments, the blower assembly 2 may also be another device capable of providing an air source for drying the silicon wafer 100 to be dried, and the embodiment is not limited in this respect.

Furthermore, both sides of the drying box 1 are provided with air inlets 11, and the outlet of the heating box 3 is communicated with the air inlets 11 at both sides of the drying box 1. It can be understood that, if the air inlet 11 is only arranged on one side of the drying box 1, the silicon wafer 100 to be dried, which is loaded inside the drying box 1, will have a condition that one side faces the wind and the other side is leeward, which causes different drying effects and poor uniformity on the two sides of the silicon wafer 100 to be dried. In this embodiment, the air inlets 11 are disposed on both sides of the drying box 1, so that both sides of the silicon wafer 100 to be dried are windward, the drying uniformity is good, and the product quality is high.

In order to further dry the surface of the silicon wafer 100 to be dried uniformly, as shown in fig. 1-2, a flow equalizing plate 13 is further disposed inside the drying box 1, the flow equalizing plate 13 is located between the air inlet 11 and the silicon wafer 100 to be dried, the flow equalizing plate 13 is parallel to the side of the drying box 1 where the air inlet 11 is disposed, and the flow equalizing plate 13 is provided with uniformly distributed vent holes 131. Through setting up the even flow plate 13 in the stoving case 1, the wind that gets into stoving case 1 inside can blow to the surface of waiting to dry silicon chip 100 after the homogenization effect of even flow plate 13 earlier, makes the surface of waiting to dry silicon chip 100 catch the wind evenly, and whole surface homoenergetic obtains drying efficiency well.

Further, the flow equalizing plate 13 is detachably connected to the inner wall of the drying box 1. With this arrangement, when the flow equalizing plate 13 is damaged or the vent holes 131 thereof are clogged and need to be replaced, the flow equalizing plate 13 can be easily detached from the drying box 1 to be replaced.

Particularly, stoving case 1 includes stoving box and stoving case lid, and the inside of stoving box can bear the weight of silicon chip 100 of treating drying, and the bottom of stoving box is provided with air outlet 12, and air outlet 12 is linked together with the import of air-blast subassembly 2, and stoving case lid is located on the stoving box. The inner wall of the drying box body is provided with a sliding chute corresponding to the flow equalizing plate 13, and the flow equalizing plate 13 is in sliding fit in the sliding chute so as to realize detachable connection between the flow equalizing plate 13 and the drying box 1. When the uniform flow plate 13 needs to be installed, the drying box cover can be opened firstly, and then the uniform flow plate 13 slides into the drying box body along the sliding groove, so that the installation process is simple, convenient and quick.

In this embodiment, the circulation of the wind can be realized by communicating the wind outlet 12 provided at the bottom of the drying cabinet with the inlet of the blowing assembly 2. Preferably, a dehumidifying component 5 is further disposed between the drying box 1 and the blowing component 2, the dehumidifying component 5 can firstly dehumidify the air flowing out from the air outlet 12 of the drying box 1 and then flow into the blowing component 2, so as to prevent the blowing component 2 from being damaged due to over-damp air, and prolong the service life of the blowing component 2.

When the silicon wafer 100 to be dried needs to be dried, the drying box cover can be opened first, the manipulator is used for grabbing the silicon wafer 100 to be dried and placing the silicon wafer 100 to be dried in the drying box body, and then the drying box cover is covered, so that the silicon wafer 100 to be dried can be dried. Through the arrangement of the drying box cover, the silicon wafer 100 to be dried can be dried in a closed space, and the silicon wafer 100 to be dried is prevented from being oxidized with oxygen in the air under a high-temperature environment to affect the surface quality of the silicon wafer 100 to be dried. Preferably, after the drying box cover is covered, protective gas can be introduced into the drying box body to prevent the silicon wafers 100 to be dried from being oxidized. In particular, the protective gas may be nitrogen.

Further, in order to prevent the silicon wafer 100 to be dried from cracking due to the excessive frequency of the wind, in this embodiment, a wind sensor is disposed at the air inlet 11 of the drying box 1, and the wind sensor is electrically connected to the frequency converter 4 to detect the wind force entering the air inlet 11. By adopting the arrangement, when the wind power entering the air inlet 11 and detected by the wind sensor exceeds the preset range, the frequency converter 4 can be controlled to adjust the air outlet frequency of the air blowing component 2, so that the condition that the silicon wafer 100 to be dried is cracked due to too large wind power or the water stain appears on the surface of the silicon wafer 100 to be dried due to the fact that the silicon wafer 100 to be dried cannot be dried in time due to too small wind power is prevented.

Further, still be provided with pressure sensor in the stoving case 1, pressure sensor is connected with converter 4 electricity to detect the inside pressure that bears of stoving case 1. Through set up pressure sensor in stoving case 1 inside, when pressure sensor detected that stoving case 1 is inside not to place and treat stoving silicon chip 100, can control converter 4 earlier and adjust the air-out frequency of air-blast subassembly 2 to less numerical value to avoid the waste of the energy. Preferably, in this embodiment, if the pressure sensor detects that no silicon wafer 100 to be dried is placed in the drying box 1 within the preset time range, the frequency converter 4 is controlled to adjust the air outlet frequency of the air blowing assembly 2 to 0, and the air blowing assembly 2 is restarted to start working after the silicon wafer 100 to be dried is placed.

Further, the heating box 3 includes heating box and heating wire, and the heating box is linked together with air-blast subassembly 2 and stoving case 1 respectively, and the heating wire sets up in the inside of heating box, can heat the wind in the heating box, and the heating wire is connected with external power source electricity. The heating box has the advantages that the heating wires are arranged to heat the air inside the heating box body, the heating efficiency is high, the materials are convenient to obtain, and the manufacturing cost is low.

Preferably, the heating wires are spirally distributed on the inner wall of the heating box body. By adopting the arrangement, the heating efficiency can be improved, and the wind in each space inside the heating box body can be heated in time.

The drying process of the silicon wafer drying device is briefly described below by taking the drying time of the silicon wafer 100 to be dried as 500s as an example:

(1) after the mechanical arm puts the silicon wafer 100 to be dried into the drying box 1, because the surface of the silicon wafer 100 to be dried has more moisture and the humidity in the drying box 1 is higher due to the evaporation effect of the moisture on the surface of the silicon wafer 100 to be dried, the frequency converter 4 can adjust the air outlet frequency of the air blowing component 2 to be 30Hz-40Hz in 0-120s so as to ensure that the surface of the silicon wafer 100 to be dried can be dried in time;

(2) at 120s-500s, because a large amount of moisture on the surface of the silicon wafer 100 to be dried is evaporated, the humidity inside the drying box 1 is high, the frequency converter 4 can adjust the air outlet frequency of the air blowing assembly 2 to 15Hz-20Hz, and the humidity inside the drying box 1 is kept continuously evaporated;

(3) and (3) opening the drying box cover, taking out the silicon wafers which are dried, putting the silicon wafers into the next group of silicon wafers 100 to be dried, and repeating the steps (1) to (2).

(4) When the pressure sensor detects that the silicon wafer 100 to be dried is not put into the drying box for 10min, the air blowing assembly 2 and the heating box 3 are stopped to save energy.

The above embodiments have been described only the basic principles and features of the present invention, and the present invention is not limited by the above embodiments, and is not departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (10)

1. The utility model provides a silicon chip drying device which characterized in that includes:

the drying box (1) can bear the silicon wafers (100) to be dried;

the silicon wafer drying device comprises a blowing component (2) and a heating box (3), wherein the heating box (3) is arranged between the blowing component (2) and the drying box (1) and is respectively communicated with the blowing component (2) and the drying box (1), the blowing component (2) can blow air into the heating box (3), the heating box (3) is used for heating the air in the heating box, and the air heated by the heating box (3) can enter the drying box (1) to dry the silicon wafer (100) to be dried;

a frequency converter (4) configured to adjust an air outlet frequency of the blower assembly (2).

2. The silicon wafer drying device according to claim 1, wherein air inlets (11) are arranged on both sides of the drying box (1), and the outlet of the heating box (3) is communicated with the air inlets (11) on both sides of the drying box (1).

3. The silicon wafer drying device according to claim 2, wherein a flow equalizing plate (13) is further disposed inside the drying box (1), the flow equalizing plate (13) is located between the air inlet (11) and the silicon wafers (100) to be dried, the flow equalizing plate (13) is parallel to the side surface of the drying box (1) where the air inlet (11) is disposed, and the flow equalizing plate (13) is provided with uniformly distributed vent holes (131).

4. The silicon wafer drying apparatus according to claim 3, wherein the flow homogenizing plate (13) is detachably connected to the inner wall of the drying box (1).

5. The silicon wafer drying apparatus according to claim 3, wherein the drying box (1) comprises:

the drying box body can bear the silicon wafer (100) to be dried, an air outlet (12) is formed in the bottom of the drying box body, and the air outlet (12) is communicated with an inlet of the air blowing assembly (2);

and the drying box cover is arranged on the drying box body in a covering manner.

6. The silicon wafer drying device according to claim 2, wherein a wind sensor is disposed at the wind inlet (11), and the wind sensor is electrically connected to the frequency converter (4) to detect wind entering the interior of the wind inlet (11).

7. The silicon wafer drying device according to claim 1, wherein a pressure sensor is further disposed in the drying box (1), and the pressure sensor is electrically connected to the frequency converter (4) to detect the pressure applied to the inside of the drying box (1).

8. The silicon wafer drying device according to claim 1, wherein a dehumidifying component (5) is further arranged between the drying box (1) and the air blowing component (2).

9. The silicon wafer drying apparatus according to any one of claims 1 to 8, wherein the heating box (3) comprises:

the heating box body is respectively communicated with the air blowing assembly (2) and the drying box (1);

and the heating wire is arranged in the heating box body and can heat the wind in the heating box body, and the heating wire is electrically connected with an external power supply.

10. The silicon wafer drying device of claim 9, wherein the heating wires are spirally distributed on the inner wall of the heating box body.

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