CN214045758U - Monitoring camera with snow removing and heat dissipating functions - Google Patents
Monitoring camera with snow removing and heat dissipating functions Download PDFInfo
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- CN214045758U CN214045758U CN202022917658.2U CN202022917658U CN214045758U CN 214045758 U CN214045758 U CN 214045758U CN 202022917658 U CN202022917658 U CN 202022917658U CN 214045758 U CN214045758 U CN 214045758U
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- camera
- snow
- heat dissipation
- snow removing
- cover plate
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- 238000012544 monitoring process Methods 0.000 title claims abstract description 28
- 239000004065 semiconductor Substances 0.000 claims abstract description 76
- 230000017525 heat dissipation Effects 0.000 claims abstract description 37
- 238000001816 cooling Methods 0.000 claims abstract description 8
- 238000005057 refrigeration Methods 0.000 claims description 34
- 238000012546 transfer Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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Abstract
The utility model discloses a monitoring camera with snow removing and heat dissipating functions, which comprises a shell, a camera body arranged in the shell and an upper cover plate arranged at the top of the shell, wherein a snow removing system is arranged at the position corresponding to the camera body at the bottom of the upper cover plate, and snow on the upper cover plate is melted by the snow removing system; the camera body is internally provided with a heat dissipation system at the side part of the camera body, and the camera body is subjected to heat dissipation and cooling treatment through the heat dissipation system. The utility model has the advantages that: the camera top apron can be transmitted for pressure sensor according to the pressure that snow thickness produced, and after pressure exceeded a definite value, pressure sensor transmitted the signal of telecommunication for automatically controlled board and started semiconductor refrigerating system and make camera upper cover plate upper temperature rise to reach and melt snow, the surveillance camera load lightens after the snow removing, can not produce too big load and cause mechanical damage to camera mechanical structure.
Description
Technical Field
The utility model relates to an outdoor camera technical field, concretely relates to surveillance camera head with remove snow and heat dissipation function.
Background
The monitoring camera is a semiconductor imaging device, has the advantages of high sensitivity, strong light resistance, small distortion, small volume, long service life, vibration resistance and the like, in a safety precaution system of the monitoring camera, the generation of images mainly comes from a CCD camera at present, and the stored charges can be taken out to change the voltage, so the monitoring camera has the characteristic of vibration resistance and impact resistance and is widely applied. When the monitoring camera is used, in order to guarantee shooting continuity, the monitoring camera needs to operate continuously for 24 hours, and due to the fact that the infrared lamp with large heat productivity is configured, after the infrared lamp is started, heat is concentrated in the front portion of the infrared camera in the whole working time period (within 12 hours), namely the temperature of the front end in the cavity is too high, and normal work of other components such as the camera can be influenced if heat dissipation is not uniform. Therefore, a large amount of heat can be generated in the monitoring camera, the existing common monitoring camera has poor heat dissipation effect, the image pickup effect can be influenced by the heat generation, and the internal elements are easily damaged due to overheating. The problem of heat dissipation is removed, because the monitoring camera is in the outdoor environment for a long time, thereby can't accomplish the shooting task by the influence of many weather factors. For example when snowing in winter in the north and using surveillance camera head, the camera head top can form more snow, unable timely processing to aggravate surveillance camera head's load, surveillance camera head also is crushed easily, has increased the fault rate, and not only so, when using during surveillance camera head snows, still easy snow shelters from the shooting sight, and the task that can't accomplish the camera has reduced the practicality. Therefore, the monitoring camera with snow removal and heat dissipation functions is provided.
SUMMERY OF THE UTILITY MODEL
The utility model aims to explore out present surveillance camera head winter easy snow and the not good problem of heat dissipation, provide one kind based on thermoelectric refrigeration's the camera of removing snow initiatively, can improve the influence of snow to the surveillance camera head well, and each process links up well, compact structure improves production efficiency and reduces the cost of labor, has important meaning to the future development research of surveillance camera head.
The technical scheme of the utility model as follows:
a monitoring camera with snow removing and heat dissipating functions is characterized by comprising a shell, a camera body arranged in the shell and an upper cover plate arranged at the top of the shell, wherein a snow removing system is arranged at the position, corresponding to the camera body, of the bottom of the upper cover plate, and snow on the upper cover plate is melted through the snow removing system; the camera body is internally provided with a heat dissipation system at the side part of the camera body, and the camera body is subjected to heat dissipation and cooling treatment through the heat dissipation system.
The monitoring camera with the snow removing and heat dissipating functions is characterized by further comprising a control system, wherein the control system is in electric signal connection with the snow removing system and the heat dissipating system respectively; the control system comprises an electronic integrated circuit board and a controller connected with the electronic integrated circuit board, and the snow removal system and the heat dissipation system are controlled through the controller.
The monitoring camera with snow removing and heat dissipating functions is characterized in that the snow removing system comprises a first semiconductor refrigeration block, a pressure sensor and a first rectifier, the pressure sensor is arranged on an upper cover plate and used for monitoring the pressure of the upper cover plate, and when the pressure exceeds a set value, the first rectifier is controlled to be opened through electronic control, so that the first semiconductor refrigeration block starts to operate.
The monitoring camera with the snow removing and heat dissipating functions is characterized in that the heat dissipating system comprises a second semiconductor refrigerating block, a temperature sensor and a second rectifier, the temperature sensor is arranged inside a camera body and monitors the temperature of the camera in real time during working, and after the temperature monitored by the temperature sensor exceeds a set value, the second rectifier is electronically controlled to be powered on, so that the second semiconductor refrigerating block starts to work.
The monitoring camera with snow removing and heat dissipating functions is characterized in that heat dissipating holes are formed in the front portion and the rear portion of the shell and used for dissipating heat inside the shell.
The monitoring camera with snow removing and heat dissipating functions is characterized in that the first semiconductor refrigerating block and the second semiconductor refrigerating block have the same structure and respectively comprise an n-type semiconductor and a p-type semiconductor, the n-type semiconductor and the p-type semiconductor are connected in series on a circuit, and temperature difference can be generated after the circuit is powered on to realize heat transfer.
The utility model has the advantages that:
1) the camera top apron can be transmitted for pressure sensor according to the pressure that snow thickness produced, and after pressure exceeded a definite value, pressure sensor transmitted the signal of telecommunication for automatically controlled board and started semiconductor refrigerating system and make camera upper cover plate upper temperature rise to reach and melt snow, the surveillance camera load lightens after the snow removing, can not produce too big load and cause mechanical damage to camera mechanical structure. And meanwhile, the monitoring visual field is improved and cannot be blocked.
2) When the semiconductor refrigerating block is not in operation, part of heat generated by the camera can be dissipated by heat dissipation holes which can also be conducted to the upper end cover and the front and the back of the semiconductor refrigerating block. The heat dissipation effect is improved, and the large-area heat dissipation holes of the rear cover and the heat dissipation holes at the front end of the upper cover plate are beneficial to heat transfer. Under the snow removing mode does not operate, the produced heat of surveillance camera head can be transmitted to the upper end cover by the semiconductor refrigeration piece, further accelerates the snow removing speed for the heat of camera obtains further utilization. Therefore, each element of the monitoring camera can stably and effectively operate at a proper temperature and cannot be damaged due to overheating.
3) Compared with the traditional mechanical snow removal and refrigeration, the semiconductor refrigeration block has no moving part, no noise, no vibration, no abrasion, easy miniaturization of capacity size, direct current working, reliable work, convenient maintenance and long service life. The environment is more green and environment-friendly without using refrigerant.
Drawings
FIG. 1 is a schematic view of the overall apparatus of the present invention;
FIG. 2 is a schematic view of the front louvers of the present invention;
FIG. 3 is a schematic view of the rear louvers of the present invention;
FIG. 4 is a schematic view of the heat dissipation function of the present invention;
FIG. 5 is a schematic view of the snow removal function of the present invention;
FIG. 6 is a schematic diagram of the control system of the present invention;
FIG. 7 is a flow chart of the present invention;
in the figure, 1-camera; 2-heat dissipation holes; 3-upper cover plate; 4-a first semiconductor refrigeration block; 5-a pressure sensor; 6-a shell; 7-body; 8-a first rectifier; 9-a second rectifier; 11-a camera mount; 12-a temperature sensor; 14-electronic circuit board; 15-a second semiconductor refrigeration block; a 100-P type semiconductor material; 101-N type semiconductor material; 102-copper connection pads.
Detailed Description
The present invention will be further explained with reference to the accompanying drawings:
as shown in fig. 1-7, the monitoring camera with snow removing and heat dissipating functions comprises a camera 1, a heat dissipating hole 2, an upper cover plate 3, a semiconductor refrigeration block 4, a pressure sensor 5, a housing 6, a body 7, a first rectifier 8, a second rectifier 9, a camera support 11, a temperature sensor 12, an electronic circuit board 14 and a second semiconductor refrigeration block; p-type semiconductor material 100, -N-type semiconductor material 101, and copper connection pad 102.
The camera body 7 is arranged inside the shell 6, the upper cover plate 3 is arranged at the top of the shell 6, a snow removing system is arranged at the position, corresponding to the camera body 7, of the bottom of the upper cover plate 3, and snow on the upper cover plate 3 is melted through the snow removing system; a heat dissipation system is arranged on the side of the camera body 7 in the shell 6, and the camera body 7 is subjected to heat dissipation and cooling treatment through the heat dissipation system.
The snow removing system comprises a first semiconductor refrigeration block 4, a pressure sensor 5 and a first rectifier 8, wherein the pressure sensor 5 is arranged on the upper cover plate 3, the pressure of the upper cover plate 3 is monitored, and the first rectifier 8 is opened under the electronic control when the pressure exceeds a set value, so that the first semiconductor refrigeration block 4 starts to operate.
The heat dissipation system comprises a second semiconductor refrigeration block 15, a temperature sensor 12 and a second rectifier 9, wherein the temperature sensor 12 is arranged inside the camera body 7, the temperature sensor 12 monitors the temperature of the camera in real time during working, and when the temperature monitored by the temperature sensor 12 exceeds a set value, the second rectifier 9 is electronically controlled to start to be powered on, so that the second semiconductor refrigeration block 15 starts to work.
The control system is respectively connected with the snow removing system and the heat dissipation system through electric signals; the control system comprises an electronic integrated circuit board 14 and a controller (the controller adopts a programmable controller) connected with the electronic integrated circuit board 14, and the controller is used for controlling the snow removing system and the heat dissipation system. The first semiconductor refrigeration block 4, the second semiconductor refrigeration block 15, the pressure sensor 5, the temperature sensor 12, the first rectifier 8 and the second rectifier 9 are respectively connected to the electronic integrated circuit board 14, and the first rectifier 8 and the second rectifier 9 are controlled by the controller to enable the first semiconductor refrigeration block 4 and the second semiconductor refrigeration block 15 to work.
The first semiconductor refrigerating block 4 and the second semiconductor refrigerating block 15 are identical in structure and comprise an n-type semiconductor and a p-type semiconductor, the n-type semiconductor and the p-type semiconductor are connected in series on a circuit through a copper connecting sheet, and heat transfer is realized by temperature difference generated after the circuit is electrified. Where n to p in the direction of current flow at the upper junction, the temperature drops and absorbs heat, is the cold side, as is the second semiconductor refrigeration block 15. The current direction at the lower joint is from p to n, the temperature rises and heat is released, and the lower joint is a hot end, such as the first semiconductor refrigeration block 4.
The front and the rear parts of the shell 6 are provided with heat dissipation holes 2 for dissipating heat inside the shell 6. The housing is mounted by means of a camera support 11.
The working process is as follows:
the snow removing system comprises an upper cover plate 3 which can form accumulated snow in an environment where snow is left for a long time, and the pressure of the upper cover can be increased along with the increase of the accumulated snow. When the accumulated snow reaches a certain weight, the accumulated snow is sensed by the pressure sensor 5 and an electric signal is transmitted to the controller, the controller controls the first rectifier 8 to be opened, the first rectifier 8 is connected with the first semiconductor refrigerating block 4 and supplies power to the first semiconductor refrigerating block, and after the pressure applied to the pressure sensor 5 reaches a set value of 100Pa, the first rectifier 8 starts to provide direct current, and the rectifier can convert the alternating current into the direct current. When the first semiconductor refrigerating block 4 operates, in the semiconductor materials, the N-type semiconductor material 101 has redundant electrons relative to the P-type semiconductor material 100, the P-type semiconductor material 100 and the N-type semiconductor material 101 are connected into a galvanic couple, temperature difference is generated at a joint and heat transfer is realized after current connection, and at the moment, heat is released at one end of the upper cover plate 3 in contact, so that snow on the upper cover plate 2 is melted, and the purpose of removing snow is achieved. The section of the first semiconductor refrigeration block contained in the body 7 absorbs heat when operating in the snow removal mode, thereby absorbing heat generated when the camera in the body 7 is operated.
The active heat dissipation system comprises a monitoring camera 1 in a machine body 7, wherein the monitoring camera 1 generates heat under the condition of long-time operation, and the temperature sensor 12 is arranged in the machine body 7. The working environment temperature of the monitoring camera 1 can be monitored and sensed by the temperature sensor 12 in real time, when the temperature exceeds a preset value by 30 ℃, an electric signal is transmitted to the controller, the controller electronically controls the second rectifier 9, the second rectifier 9 is connected with the second semiconductor refrigerating block 15 and supplies power to the second semiconductor refrigerating block, when the temperature monitored by the temperature sensor 12 reaches a set value, the second rectifier 8 starts to supply power, the second semiconductor refrigerating block 15 starts to operate, and the second semiconductor refrigerating block 15 transmits heat generated in the machine body 7 to the rear part of the machine body 7 through heat conduction and radiates the heat through the heat radiating holes 2. The temperature in the machine body 7 is reduced, and the second semiconductor refrigerating block 15 continuously operates, so that the temperature in the machine body 7 is continuously within the range of 30-40 ℃;
when the temperature in the machine body 7 is changed to be higher than 45 ℃ under the condition of environment change, the temperature sensor 12 transmits a signal to the controller, the controller sends a signal to enable the first rectifier 8 to start supplying direct current to the first semiconductor refrigerating block 4, the first semiconductor refrigerating block 4 starts to operate to reduce the temperature in the machine body 7, the temperature in the machine body 7 is further maintained to be between 40 ℃ and 45 ℃, and at the moment, the first semiconductor refrigerating block 4 and the second semiconductor refrigerating block 15 continuously operate to maintain the temperature in the machine body 7. When the temperature in the body 7 is lower than 40 ℃, the first semiconductor refrigeration block 4 stops operating, and when the temperature in the body 7 is lower than 30 ℃, the second semiconductor refrigeration block 15 stops operating.
The first semiconductor refrigeration block 4 is controlled by a pressure sensor and a temperature sensor, and when any one of the sensors reaches a preset value, the first semiconductor refrigeration block 4 starts to work.
The passive heat dissipation system mainly comprises heat dissipation holes 2. The louvre 2 is located the front end of upper cover plate 3, the rear portion of organism 7, surveillance camera head 1 during operation can produce the heat, and when the heat did not exceed the temperature that temperature sensor 12 established, the heat also can be transmitted to the external world through the structure of first semiconductor refrigeration piece 4, second semiconductor refrigeration piece 15, louvre, can form spontaneous heat transfer when the temperature risees to ambient temperature more than. And a large amount of louvres increase the quality of air convection, thereby more heat can be taken away to make the radiating effect of camera more showing.
The utility model mainly relates to a snow removing system, initiative cooling system, passive cooling system. The principle that one end of a semiconductor refrigeration block releases heat and the other end absorbs heat when a direct current is conducted is utilized, and a pressure probe is utilized to sense the degree of accumulated snow on an upper cover plate to control a first rectifier to judge whether snow removal is started or not; the temperature probe is used for sensing the temperature in the machine body to control the second rectifier and the first rectifier to start cooling or not and select a cooling mode. In addition, the front end and the rear end of the upper cover plate and the rear part of the machine body are provided with a large number of heat dissipation holes, so that the quality of air convection is greatly improved, and a good heat dissipation effect can be kept.
Claims (6)
1. A monitoring camera with snow removing and heat dissipating functions is characterized by comprising a shell (6), a camera body (7) arranged inside the shell (6) and an upper cover plate (3) arranged at the top of the shell (6), wherein a snow removing system is arranged at the position, corresponding to the camera body (7), at the bottom of the upper cover plate (3), and snow on the upper cover plate (3) is melted through the snow removing system; the camera body (7) is internally provided with a heat dissipation system at the side part of the camera body (7) in the shell (6), and the camera body (7) is subjected to heat dissipation and cooling treatment through the heat dissipation system.
2. The surveillance camera with snow removal and heat dissipation functions of claim 1, further comprising a control system in electrical signal connection with the snow removal system and the heat dissipation system, respectively; the control system comprises an electronic integrated circuit board (14) and a controller connected with the electronic integrated circuit board (14), and the snow removing system and the heat dissipation system are controlled through the controller.
3. A surveillance camera with snow removal and heat dissipation functions as claimed in claim 1, characterized in that the snow removal system comprises a first semiconductor refrigeration block (4), a pressure sensor (5) and a first rectifier (8), the pressure sensor (5) is arranged on the upper cover plate (3) and monitors the pressure of the upper cover plate (3), and when a set value is exceeded, the first rectifier (8) is electronically controlled to be opened so that the first semiconductor refrigeration block (4) starts to operate.
4. A monitoring camera with snow removing and heat dissipating functions as claimed in claim 1, wherein the heat dissipating system comprises a second semiconductor refrigeration block (15), a temperature sensor (12) and a second rectifier (9), the temperature sensor (12) is arranged inside the camera body (7), the temperature sensor (12) monitors the temperature of the camera in real time during operation, and when the temperature monitored by the temperature sensor (12) exceeds a set value, the second rectifier (9) is electronically controlled to start to be powered on, so that the second semiconductor refrigeration block (15) starts to operate.
5. A monitoring camera with snow removing and heat dissipating functions as claimed in claim 1, wherein the front and rear portions of the housing (6) are provided with heat dissipating holes (2) for dissipating heat inside the housing (6).
6. The surveillance camera with snow removing and heat dissipating functions as claimed in claim 3, wherein the first semiconductor refrigeration block (4) and the second semiconductor refrigeration block (15) have the same structure, and both comprise an n-type semiconductor and a p-type semiconductor, and the n-type semiconductor and the p-type semiconductor are connected in series on a circuit, and generate a temperature difference after being electrified to realize heat transfer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022917658.2U CN214045758U (en) | 2020-12-08 | 2020-12-08 | Monitoring camera with snow removing and heat dissipating functions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022917658.2U CN214045758U (en) | 2020-12-08 | 2020-12-08 | Monitoring camera with snow removing and heat dissipating functions |
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| Publication Number | Publication Date |
|---|---|
| CN214045758U true CN214045758U (en) | 2021-08-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202022917658.2U Expired - Fee Related CN214045758U (en) | 2020-12-08 | 2020-12-08 | Monitoring camera with snow removing and heat dissipating functions |
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| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112383696A (en) * | 2020-12-08 | 2021-02-19 | 浙江工业大学 | Monitoring camera with snow removing and heat dissipating functions and operation method thereof |
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2020
- 2020-12-08 CN CN202022917658.2U patent/CN214045758U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112383696A (en) * | 2020-12-08 | 2021-02-19 | 浙江工业大学 | Monitoring camera with snow removing and heat dissipating functions and operation method thereof |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210824 |