CN214043268U - Anti-collision paster thermistor - Google Patents
Anti-collision paster thermistor Download PDFInfo
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- CN214043268U CN214043268U CN202022692750.3U CN202022692750U CN214043268U CN 214043268 U CN214043268 U CN 214043268U CN 202022692750 U CN202022692750 U CN 202022692750U CN 214043268 U CN214043268 U CN 214043268U
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Abstract
The utility model provides an anticollision paster thermistor, including conductive component and buffering subassembly, conductive component includes the crystal layer, two copper foil layers, two insulating layers and two fin, two copper foil layers set up respectively on two sides on the crystal layer, two insulating layer one-to-ones set up on the surface of two copper foil layers, two fin one-to-ones set up on the surface of two insulating layers, buffering subassembly includes two bolster, the bolster holds the piece including the top, reinforcing plate and a plurality of elasticity post, the one end of each elasticity post is connected with the fin respectively, the other end of each elasticity post is held the piece with the top respectively and is connected, the reinforcing plate sets up on the side that the piece was kept away from each elasticity post is held on the top. The arrangement of the radiating fins can improve the radiating efficiency on one hand, and the arrangement of the radiating fins can improve the structural strength on the other hand, and further, the arranged jacking blocks, the reinforcing plate and the plurality of elastic columns are matched to act, so that the chip thermistor has certain anti-collision capacity, and can be prevented from being damaged by collision when receiving collision.
Description
Technical Field
The utility model relates to a thermistor field especially relates to an anticollision paster thermistor.
Background
The thermistor is a temperature-sensitive device, the resistance of the thermistor can change along with the change of temperature, and can be divided into a positive temperature coefficient thermistor and a negative temperature coefficient thermistor according to the difference of temperature coefficients, wherein the resistance of the positive temperature coefficient thermistor can increase along with the increase of temperature, and the resistance of the negative temperature coefficient thermistor can decrease along with the increase of temperature.
Firstly, because the existing chip thermistor lacks an anti-collision function, the chip thermistor is easy to deform by collision when being impacted by external force, thereby causing the chip thermistor to face a damaged sealing risk; secondly, the heat dissipation capability of the conventional chip thermistor is poor, so that the resistance value is delayed to a certain extent along with the temperature change.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the weak point among the prior art, providing an anticollision paster thermistor, can possess certain crashproof ability when being faced by the striking to prevent to be damaged, the radiating effect is good moreover, can improve the response speed to the temperature.
The purpose of the utility model is realized through the following technical scheme:
an anti-collision patch thermistor comprising:
the conductive assembly comprises a crystal layer, two copper foil layers, two insulating layers and two radiating fins, wherein the two copper foil layers are respectively arranged on two side surfaces of the crystal layer, the two insulating layers are arranged on the outer surfaces of the two copper foil layers in a one-to-one correspondence manner, and the two radiating fins are arranged on the outer surfaces of the two insulating layers in a one-to-one correspondence manner; and
the buffer assembly comprises two buffer parts, and the two buffer parts are correspondingly arranged on the two radiating fins one by one;
the buffer piece comprises a jacking block, a reinforcing plate and a plurality of elastic columns, one end of each elastic column is connected with the radiating fin, the other end of each elastic column is connected with the jacking block, and the reinforcing plate is arranged on the side face, away from each elastic column, of the jacking block.
In one embodiment, the conductive assembly further comprises two welding parts, and the two welding parts are connected with the two copper foil layers in a one-to-one correspondence mode.
In one embodiment, the welding part comprises a copper sheet and two welding blocks, the two welding blocks are arranged on the two insulation layers in a one-to-one correspondence mode, two ends of the copper sheet are connected with the two welding blocks respectively, and the copper sheet is connected with the copper foil layer.
In one embodiment, the copper sheet is in a semicircular sheet structure.
In one embodiment, the insulating layer is a polypropylene layer.
In one embodiment, the outer surface of the insulating layer is provided with a groove, and the heat sink is accommodated in the groove.
In one embodiment, the heat sink and the stiffener are both copper foils.
In one embodiment, the elastic column is a cylindrical structure.
In one embodiment, the supporting block and each elastic column are of an integrally formed structure.
In one embodiment, the supporting block and each elastic column are made of teflon.
Compared with the prior art, the utility model discloses at least, following advantage has:
the utility model discloses an anticollision paster thermistor, including conductive component and buffering subassembly, conductive component includes the crystal layer, two copper foil layers, two insulating layers and two fin, two copper foil layers set up respectively on two sides on the crystal layer, two insulating layer one-to-ones set up on the surface of two copper foil layers, two fin one-to-ones set up on the surface of two insulating layers, the buffering subassembly includes two bolsters, two bolster one-to-ones set up on two fin, the bolster holds the piece including the top, reinforcing plate and a plurality of elasticity post, the one end of each elasticity post is connected with the fin respectively, the other end of each elasticity post is held the piece with the top respectively and is connected, the reinforcing plate sets up on the side that each elasticity post was kept away from to the piece is held on the top. The heat radiating efficiency can be improved by arranging the heat radiating fins, the structural strength of the chip thermistor can be improved by the invention, and further, the arranged supporting block, the reinforcing plate and the plurality of elastic columns are matched to have certain anti-collision capacity, so that the chip thermistor can be prevented from being damaged by collision when receiving collision.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of an anti-collision chip thermistor according to an embodiment of the present invention;
fig. 2 is a partially enlarged structural diagram of an a of the anti-collision patch thermistor shown in fig. 1.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
It is noted that as used herein, reference to an element being "connected" to another element also means that the element is "in communication" with the other element, and fluid can be in exchange communication between the two.
Referring to fig. 1, an anti-collision chip thermistor 10 includes a conductive element 100 and a buffering element 200, wherein the buffering element 200 is mounted on the conductive element 100, and the buffering element 200 can improve the anti-collision ability of the anti-collision chip thermistor 10, so as to prevent the anti-collision chip thermistor from being damaged by collision.
Referring to fig. 1 again, the conductive element 100 includes a crystal layer 110, two copper foil layers 120, two insulating layers 130 and two heat sinks 140, wherein the two copper foil layers 120 are respectively disposed on two side surfaces of the crystal layer 110, the two insulating layers 130 are disposed on outer surfaces of the two copper foil layers 120 in a one-to-one correspondence manner, and the two heat sinks 140 are disposed on outer surfaces of the two insulating layers 130 in a one-to-one correspondence manner.
It should be noted that two copper foil layers 120 are respectively disposed on two sides of the crystal layer 110, in an embodiment, the crystal layer 110 may be a fiber board, in an embodiment, the crystal layer 110 may also be a mixture of a metal powder and a PE material, wherein the PE material is a polyethylene body, and the metal powder is a zinc powder, so that a structure in which two copper foil layers 120 are sandwiched between two sides of the crystal layer 110 can be formed by coating the two copper foil layers 120 with the fiber board in a molten state or the mixture of the metal powder and the PE in a molten state; further, the insulating layers 130 are disposed on the two copper foil layers 120 on the side far from the crystal layer 110 in a one-to-one correspondence manner, in one embodiment, the insulating layers 130 are polypropylene layers, and the insulating layers 130 are adhered to the outer surfaces of the copper foil layers 120, so that the outer surfaces of the copper foil layers 120 can be protected by the insulating layers 130; further, a heat sink 140 is disposed on a side of the insulating layer 130 away from the copper foil layer 120, in an embodiment, the heat sink 140 is a copper foil, and the heat sink 140 is adhered to the insulating layer 130, of course, the heat sink 140 may also be welded to the insulating layer 130, for example, by heating the insulating layer 130, so that the heat sink 140 can be welded to the insulating layer 130, it should be noted that, by disposing the heat sink 140 on an outer surface of the insulating layer 130, on one hand, the structural strength of the insulating layer 130 can be improved, and the insulating layer 130 is prevented from being damaged by collision, and on the other hand, by using the characteristic of strong heat conductivity of metal, the heat conduction effect of the insulating layer 130 and the copper foil layer 120 can be improved, so that the anti-collision chip thermistor 10 can respond to temperature quickly.
Referring to fig. 1 and 2, the buffer assembly 200 includes two buffer members 210, the two buffer members 210 are disposed on the two heat sinks 140 in a one-to-one correspondence manner, each buffer member 210 includes a supporting block 211, a reinforcing plate 212, and a plurality of elastic columns 213, one end of each elastic column 213 is connected to the heat sink 140, the other end of each elastic column 213 is connected to the supporting block 211, and the reinforcing plate 212 is disposed on a side surface of the supporting block 211 away from the elastic columns 213.
It should be noted that the two buffers 210 are respectively disposed on the two heat dissipation fins 140, so that each buffer 210 can perform anti-collision protection on the heat dissipation fin 140 connected thereto; further, one end of each elastic column 213 is disposed on the heat sink 140, in one embodiment, the elastic column 213 is adhered to the heat sink 140, so that the elastic column 213 is fixedly connected to the heat sink 140; furthermore, the other end of each elastic column 213 is connected to the supporting block 211, so that under the support of each elastic column 213, a certain gap exists between the supporting block 211 and the heat sink 140, and the distance of the gap is equal to the length of the elastic column 213, so that, because the elastic column 213 has a certain elastic force, the supporting block 211 has a certain buffering capacity relative to the heat sink 140, in an embodiment, the supporting block 211 and each elastic column 213 are integrally formed, and the supporting block 211 and the elastic column 213 are made of teflon, because the teflon has good heat conductivity, the elastic column 213 is disposed on the heat sink 140, the influence on the heat dissipation effect can be ignored, and because the gap exists between the supporting block 211 and the heat sink 140, the influence on the heat dissipation effect is further reduced; further, a reinforcing plate 212 is arranged on the side surface of the supporting block 211 far away from the elastic columns 213, in one embodiment, the reinforcing plate 212 is adhered to the supporting block 211, in one embodiment, the reinforcing plate 212 is a copper foil, so that the outer surface of the supporting block 211 can form an integral plane by arranging the reinforcing plate 212 on the outer surface of the supporting block 211, and thus, when external impact is received, the plane of the supporting block 211 can be stressed integrally rather than locally, so that the impact resistance of the supporting block can be improved, and because the reinforcing plate 212 is made of metal, heat conducted to the supporting block 211 through the elastic columns 213 can be diffused to the outside quickly, so that the heat dissipation efficiency can be improved.
In one embodiment, the elastic column 213 has a cylindrical structure. It should be noted that, the elastic column 213 is configured to be a column to enhance the structural strength of the elastic column 213, for example, the elastic column 213 may be configured to be a cylinder or a prism, and further, in an embodiment, the elastic column 213 may be configured to be a shape with a diameter larger at both ends than at a middle portion, so that the deformation capability of the middle portion of the elastic column 213 can be enhanced, and the buffering capability of the supporting block 211 can be enhanced.
Referring to fig. 1 and fig. 2 again, in one embodiment, a groove 131 is formed on an outer surface of the insulating layer 130, and the heat sink 140 is accommodated in the groove 131. It should be noted that, the insulating layer 130 is provided with the groove 131, and then the heat sink 140 is accommodated in the groove 131, so that the distance between the heat sink 140 and the copper foil layer 120 is reduced, thereby enabling the heat to be conducted to the heat sink 140 more greatly.
Referring to fig. 1 again, in one embodiment, the conductive element 100 further includes two solder parts 150, and the two solder parts 150 are connected to the two copper foil layers 120 in a one-to-one correspondence. It should be noted that two welding parts 150 are connected to two copper foil layers 120 in a one-to-one correspondence, and the two welding parts 150 are used for welding with an external circuit board.
Referring to fig. 1 again, in an embodiment, the soldering element 150 includes a copper sheet 151 and two soldering blocks 152, the two soldering blocks 152 are disposed on the two insulating layers 130 in a one-to-one correspondence, two ends of the copper sheet 151 are respectively connected to the two soldering blocks 152, and the copper sheet 151 is connected to the copper foil layer 120.
It should be noted that, two welding blocks 152 are respectively disposed on two insulating layers 130, and two welding blocks 152 are all located at the edge positions thereof, two ends of the copper sheet 151 are in one-to-one correspondence with the two welding blocks 152, and the copper sheet 151 is connected with the copper foil layer 120, so the copper foil layer 120 can be connected with the two welding blocks 152, so that the copper foil layer 120 can be connected with an external circuit board by using the welding blocks 152, in an embodiment, the welding blocks 152 are also copper foils, further, a nickel plating layer and a tin plating layer are further disposed on the welding blocks 152, so that the connection of the welding blocks 152 and the circuit board can be facilitated.
Referring to fig. 1 again, in one embodiment, through slots are formed on the crystal layer 110, the two copper foil layers 120, the two insulating layers 130 and the two welding blocks 152, the through slots penetrate through the crystal layer 110, the two copper foil layers 120, the two insulating layers 130 and the two welding blocks 152, and the copper sheets 151 are accommodated in the through slots; in one embodiment, the through groove has a semicircular groove structure, and the copper sheet 151 has a semicircular sheet structure, and in one embodiment, the copper sheet 151 is a copper plated body, and the copper sheet 151 is formed on the inner side wall of the through groove by an electroplating process.
Referring to fig. 1 again, in one embodiment, since the two copper foil layers 120 are respectively disposed on two side surfaces of the crystal layer 110, and the two copper foil layers 120 have the same area as the crystal layer 110, in order to ensure that the two copper foil layers 120 can be connected to the two copper sheets 151 in a one-to-one correspondence, it is necessary to form the isolation groove 121 on the end of the copper foil layer 120 away from the copper sheet 151 connected thereto, and it should be noted that the isolation grooves 121 on the two copper foil layers 120 are located at two ends of the crystal layer 110, so that the two copper foil layers 120 can be connected to the two copper sheets 151 in a one-to-one correspondence.
Compared with the prior art, the utility model discloses at least, following advantage has:
the utility model discloses an anticollision paster thermistor, including conductive component and buffering subassembly, conductive component includes the crystal layer, two copper foil layers, two insulating layers and two fin, two copper foil layers set up respectively on two sides on the crystal layer, two insulating layer one-to-ones set up on the surface of two copper foil layers, two fin one-to-ones set up on the surface of two insulating layers, the buffering subassembly includes two bolsters, two bolster one-to-ones set up on two fin, the bolster holds the piece including the top, reinforcing plate and a plurality of elasticity post, the one end of each elasticity post is connected with the fin respectively, the other end of each elasticity post is held the piece with the top respectively and is connected, the reinforcing plate sets up on the side that each elasticity post was kept away from to the piece is held on the top. The heat radiating efficiency can be improved by arranging the heat radiating fins, the structural strength of the chip thermistor can be improved by the invention, and further, the arranged supporting block, the reinforcing plate and the plurality of elastic columns are matched to have certain anti-collision capacity, so that the chip thermistor can be prevented from being damaged by collision when receiving collision.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. An anti-collision patch thermistor, comprising:
the conductive assembly comprises a crystal layer, two copper foil layers, two insulating layers and two radiating fins, wherein the two copper foil layers are respectively arranged on two side surfaces of the crystal layer, the two insulating layers are arranged on the outer surfaces of the two copper foil layers in a one-to-one correspondence manner, and the two radiating fins are arranged on the outer surfaces of the two insulating layers in a one-to-one correspondence manner; and
the buffer assembly comprises two buffer parts, and the two buffer parts are correspondingly arranged on the two radiating fins one by one;
the buffer piece comprises a jacking block, a reinforcing plate and a plurality of elastic columns, one end of each elastic column is connected with the radiating fin, the other end of each elastic column is connected with the jacking block, and the reinforcing plate is arranged on the side face, away from each elastic column, of the jacking block.
2. The anti-collision patch thermistor according to claim 1, wherein the conductive assembly further comprises two solder members, the two solder members being connected to the two copper foil layers in a one-to-one correspondence.
3. The anti-collision patch thermistor according to claim 2, wherein the welding member comprises a copper sheet and two welding blocks, the two welding blocks are disposed on the two insulating layers in a one-to-one correspondence, two ends of the copper sheet are connected to the two welding blocks, respectively, and the copper sheet is connected to the copper foil layer.
4. The anti-collision patch thermistor according to claim 3, wherein the copper sheet is of a semicircular sheet structure.
5. The anti-collision patch thermistor according to claim 1, wherein the insulating layer is a polypropylene layer.
6. The anti-collision patch thermistor according to claim 1, wherein a groove is formed in an outer surface of the insulating layer, and the heat sink is received in the groove.
7. The anti-collision patch thermistor according to claim 1, wherein the heat sink and the reinforcing plate are both copper foils.
8. The anti-collision patch thermistor according to claim 1, wherein the elastic column is of a cylindrical structure.
9. The anti-collision patch thermistor according to claim 1, wherein the supporting block and each of the elastic columns are of an integrally molded structure.
10. The anti-collision patch thermistor according to claim 9, wherein the supporting block and each of the elastic columns are made of teflon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022692750.3U CN214043268U (en) | 2020-11-18 | 2020-11-18 | Anti-collision paster thermistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022692750.3U CN214043268U (en) | 2020-11-18 | 2020-11-18 | Anti-collision paster thermistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214043268U true CN214043268U (en) | 2021-08-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022692750.3U Active CN214043268U (en) | 2020-11-18 | 2020-11-18 | Anti-collision paster thermistor |
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| CN (1) | CN214043268U (en) |
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- 2020-11-18 CN CN202022692750.3U patent/CN214043268U/en active Active
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