CN212462082U

CN212462082U - Electronic component, circuit module, and electronic device

Info

Publication number: CN212462082U
Application number: CN202021528822.4U
Authority: CN
Inventors: 张鹏
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2020-07-28
Filing date: 2020-07-28
Publication date: 2021-02-02
Anticipated expiration: 2030-07-28

Abstract

The embodiment of the utility model provides an electronic components, circuit module and electronic equipment. This electronic component includes: electronic components body and metal terminal. The metal terminal is connected with the electronic component body; the metal terminal comprises at least two metal plates and at least one connecting plate, the at least two metal plates are stacked, any two adjacent metal plates are connected through the connecting plate, and the connecting plate is an elastic conductive connecting plate. In the embodiment of the utility model, through set up the metal terminal on electronic components, after connecting electrical components on the circuit board, the circuit board can be absorbed by the metal terminal because the deformation that external force produced, and then avoids electronic components to take place the problem appearance that damages because the deformation of circuit board, has reduced the probability that electronic components device damaged, has improved electronic components's life.

Description

Electronic component, circuit module, and electronic device

Technical Field

The utility model relates to the field of communication technology, concretely relates to electronic components, circuit assembly and electronic equipment.

Background

Electronic equipment is usually provided with a circuit board, and electronic components are arranged on the circuit board, so that the circuit board can realize a control function by arranging the electronic components.

In the related art, it is common to solder an electronic component to a circuit board so that the electronic component is fixed to the circuit board.

In the process of implementing the novel usage, the inventor finds that at least the following problems exist in the related art: after welding electronic components on the circuit, when the circuit board atress warp, the deformation of circuit board can make electronic components appear the problem of damage such as crackle, leads to electronic components probably to become invalid, reduces electronic components's life.

SUMMERY OF THE UTILITY MODEL

An embodiment of the utility model provides an electronic components, circuit module and electronic equipment to the electronic components who will weld on the circuit among the solution correlation technique, warp because of the circuit board atress, lead to the impaired problem of electronic components.

In order to solve the technical problem, the utility model discloses a realize like this:

in a first aspect, an embodiment of the present invention provides an electronic component, the electronic component includes: an electronic component body and a metal terminal;

the metal terminal is connected with the electronic component body;

the metal terminal comprises at least two metal plates and at least one connecting plate, the metal plates are stacked, any two adjacent metal plates are connected through the connecting plate, and the connecting plate is an elastic conductive connecting plate.

In a second aspect, an embodiment of the present invention provides a circuit assembly, the circuit assembly includes: a circuit board and the electronic component described in the first aspect;

the electronic component is fixed on the circuit board.

In a third aspect, an embodiment of the present invention provides an electronic device, which includes the circuit assembly described in the second aspect.

The embodiment of the utility model provides an in, because metal terminals includes two at least metal sheets and at least one connecting plate, the range upon range of setting of two at least metal sheets, two arbitrary adjacent metal sheets pass through the connecting plate to be connected, and the connecting plate is the electrically conductive connecting plate of elasticity, consequently, when metal terminals received external force, metal terminals can produce certain deformation, and connecting plate between two arbitrary adjacent metal sheets can produce certain deformation promptly for the distance between two arbitrary adjacent metal sheets changes. Because this body coupling of metal terminal and electronic components, and the distance between arbitrary two adjacent metal sheets in the metal terminal can change, therefore, when connecting electronic components on the circuit board, can connect the metal terminal on the circuit board, when the circuit board takes place deformation, the circuit board makes the metal terminal produce deformation, the connecting plate produces deformation in the metal terminal promptly, make the metal terminal can be because the deformation of self and the deformation of absorption circuit board, and then avoid the deformation of circuit board to transmit to the electronic components body, avoid the electronic components body to produce deformation, therefore can avoid when the circuit board takes place deformation, lead to the electronic components body to produce the problem of damage such as crackle, consequently, electronic components's life has been improved.

Drawings

Fig. 1 is a schematic diagram of an electronic component provided in the related art;

fig. 2 is an isometric view of an electronic component according to an embodiment of the present invention;

fig. 3 is a front view of an electronic component according to an embodiment of the present invention;

fig. 4 is an isometric view of a metal terminal according to an embodiment of the present invention;

fig. 5 is a second perspective view of a metal terminal according to an embodiment of the present invention;

fig. 6 is a third perspective view of a metal terminal according to an embodiment of the present invention;

fig. 7 is a fourth perspective view of a metal terminal according to an embodiment of the present invention.

Reference numerals:

10: an electronic component body; 20: a metal terminal; 30: a circuit board; 11: a terminal electrode; 21: a metal plate; 22: a connecting plate; 211: a first welding surface; 212: a second weld face; 213: a third weld face; 214: a first through groove; 221: a second through groove; 2101: a first plate; 2102: a second plate; 100: and (7) soldering tin.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, of the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

Right the embodiment of the utility model provides an before electronic components explains, it is earlier right the utility model provides an electronic components's application scene does concrete description: referring to fig. 1, a schematic diagram of an electronic component provided in the related art is shown, and as shown in fig. 1, the electronic component includes an electronic component body 10 and a terminal electrode 11, where the terminal electrode 11 is disposed on the electronic component. When an electronic component is fixed to the circuit board 30, the terminal electrode 11 of the electronic component is usually soldered to the circuit board 30 by the solder 100.

Because electronic components's terminal electrode 11 and circuit board 30 welding, as shown in fig. 1, when circuit board 30 received external force to take place deformation, circuit board 30 can drive soldering tin 100 and remove, transmits electronic components's terminal electrode 11 with the deformation of circuit board 30 through soldering tin 100, and then makes electronic components body 10 probably take place deformation, leads to electronic components to appear the problem of damage such as crackle for electronic components probably became invalid, has reduced electronic components's life.

Referring to fig. 2, an axonometric view of an electronic component provided by an embodiment of the present invention is shown. Referring to fig. 3, a front view of an electronic component according to an embodiment of the present invention is shown. As shown in fig. 2 and 3, the electronic component includes: an electronic component body 10 and metal terminals 20.

The metal terminals 20 are connected to the electronic component body 10. The metal terminal 20 includes at least two metal plates 21 and at least one connecting plate 22, the at least two metal plates 21 are stacked, any two adjacent metal plates 21 are connected by the connecting plate 22, and the connecting plate 22 is an elastic conductive connecting plate 22.

The embodiment of the present invention provides an embodiment, because the metal terminal 20 includes at least two metal plates 21 and at least one connecting plate 22, the range upon range of setting of at least two metal plates 21, two arbitrary adjacent metal plates 21 are connected through the connecting plate 22, the connecting plate 22 is the elastic conductive connecting plate 22, therefore, when the metal terminal 20 receives external force, the metal terminal 20 can produce certain deformation, that is, the connecting plate 22 between two arbitrary adjacent metal plates 21 can produce certain deformation, so that the distance between two arbitrary adjacent metal plates 21 changes. Because the metal terminals 20 are connected with the electronic component body 10, and the distance between any two adjacent metal plates 21 in the metal terminals 20 can be changed, therefore, when the electronic component is connected on the circuit board 30, the metal terminals 20 can be connected on the circuit board 30, when the circuit board 30 deforms, the circuit board 30 enables the metal terminals 20 to deform, namely, the connecting plate 22 in the metal terminals 20 deforms, so that the metal terminals 20 can absorb the deformation of the circuit board 30 due to the deformation of the metal terminals, further, the deformation of the circuit board 30 is prevented from being transmitted to the electronic component body 10, the deformation of the electronic component body 10 is prevented, and therefore, when the circuit board 30 deforms, the problem that the electronic component body 10 is damaged due to cracks and the like can be avoided, and therefore, the service life of the electronic component is prolonged.

That is, in the embodiment of the utility model, through set up metal terminal 20 on electronic components, after connecting electrical components on circuit board 30, circuit board 30 can be absorbed by metal terminal 20 because the deformation that external force produced, and then avoids electronic components to appear because the problem that circuit board 30's deformation took place to damage, has reduced the probability of electronic components damage, has improved electronic components's life.

In the embodiment of the present invention, the metal plate 21 may be made of copper, stainless steel, or the like. The thickness of the metal plate 21 may be 0.05mm, and certainly, the thickness of the metal plate 21 may also be other values, which is not limited herein in the embodiment of the present invention.

In addition, in the embodiment of the present invention, the material of the connecting plate 22 may be the same as the material of the metal plate 21, and of course, the material of the connecting plate 22 may also be different from the material of the metal plate 21.

In addition, in the embodiment of the present invention, when the metal terminal 20 is processed, there may be the following two modes:

(1) one metal plate 21 is bent at least one, so that the bent metal plate 21 is laminated, and at this time, the metal plate 21 and the connecting plate 22 are integrated as a whole in the embodiment of the present invention. For example, one metal plate 21 is bent once so that the bent metal plate 21 has a U-shaped configuration.

(2) Connect the one end of connecting plate 22 on a metal sheet 21, connect the other end of connecting plate 22 on another metal sheet 21, at this moment, be equivalent to the embodiment of the utility model provides a metal sheet 21 and connecting plate 22 are not a whole, link together through other modes. For example, the two ends of the connecting plate 22 can be welded to the two metal plates 21 by welding.

Additionally, in some embodiments, referring to fig. 4, there is shown one of the isometric views of a metal terminal provided by embodiments of the present invention. Referring to fig. 5, a second perspective view of a metal terminal according to an embodiment of the present invention is shown. Referring to fig. 6, a third perspective view of a metal terminal according to an embodiment of the present invention is shown. Referring to fig. 7, a fourth perspective view of a metal terminal according to an embodiment of the present invention is shown. As shown in fig. 4, 5, 6 and 7, the metal terminal 20 may include a first side and a second side opposite to each other, a first welding surface 211 is disposed on the metal plate 21 on the first side, the first welding surface 211 is connected to the electronic component body 10, and a second welding surface 212 is disposed on the metal plate 21 on the second side.

When the first welding surface 211 is provided on the metal plate 21 on the first side and the second welding surface 212 is provided on the metal plate 21 on the second side, the first welding surface 211 can be connected to the electronic component body 10 when the metal terminal 20 is connected to the electronic component body 10. In addition, when the electronic component is fixed to the circuit, the second soldering surface 212 may be soldered to the circuit board 30. By providing the first welding surface 211 and the second welding surface 212, which is equivalent to providing a specific welding area on the metal terminal 20, when the metal terminal 20 is connected to the electronic component body 10, it is possible to directly determine where the electronic component is connected to the metal terminal 20, so that the connection efficiency between the metal terminal 20 and the electronic component can be improved, and time can be saved. Similarly, when the electronic component is fixed on the circuit board 30, it can be directly determined where the metal terminal 20 is fixed on the circuit board 30, so that the connection efficiency between the metal terminal 20 and the circuit board 30 can be improved, and the time can be saved. That is, by providing the first welding surface 211 and the second welding surface 212, it is possible to quickly determine where the metal terminal 20 is connected, saving time.

In addition, in some embodiments, as shown in fig. 2, at least two terminal electrodes 11 are disposed on the electronic component body 10. The terminal electrode 11 is connected to the metal terminal 20.

When at least two terminal electrodes 11 are provided on the electronic component body 10, in this case, when the electronic component body 10 is connected to the metal terminal 20, the terminal electrodes 11 are actually connected to the metal terminal 20.

In addition, in the case where the metal terminal 20 includes the first welding surface 211, as shown in fig. 2, the terminal electrode 11 may be welded to the first welding surface 211 by the solder 100 so that the metal terminal 20 is connected to the terminal electrode 11.

Additionally, in some embodiments, as shown in fig. 4, the metal plate 21 may be a bent plate, and the metal plate 21 includes a first plate 2101 and a second plate 2102, and the first plate 2101 and the second plate 2102 are at a predetermined angle.

When the metal plate 21 is a bent plate and the metal plate includes the first plate 2101 and the second plate 2102, at this time, when the metal terminal 20 is connected to the electronic component, the first plate 2101 and the second plate 2102 may connect different portions of the electronic component, so that the connection between the metal terminal 20 and the electronic component is more secure.

When the metal plate 21 is of a bent structure, at this time, when the metal terminal 20 is connected to the electronic component, the metal plate 21 may be connected to different portions of the electronic component, so that the connection between the metal terminal 20 and the electronic component is firmer.

It should be noted that, in the embodiment of the present invention, when the preset included angle is different, the structure of the metal plate 21 is also different, and specifically there may be the following two ways:

(1) as shown in fig. 4, the preset included angle α may be 90 °, and at this time, when the metal terminal 20 is connected to the terminal electrode 11, both the first plate 2101 and the second plate 2102 on the first side may be connected to the terminal electrode 11, that is, the first plate 2101 and the second plate 2102 are respectively connected to two surfaces of the terminal electrode 11, so that the connection between the metal terminal 20 and the terminal electrode 11 is relatively firm.

(2) As shown in fig. 5, the preset included angle α may be 270 °, in which case, when the metal terminal 20 is connected to the terminal electrode 11, the first plate 2101 located at the first side may be connected to the terminal electrode 11, and the second plate 2102 may be connected to other devices.

It should be noted that the preset included angle α may also be other angles, for example, 180 degrees, and the embodiment of the present invention is not limited herein for the numerical value of the preset included angle.

As shown in fig. 6 and 7, the first plate 2101 of the first metal plate 21 on the first side of the metal terminal 20 is provided with the first welding surface 211, the second plate 2102 of the first metal plate 21 is provided with the third welding surface 213, and the first plate 2101 on the second side of the metal terminal is provided with the second welding surface 212.

When the first welding surface 211 is arranged on the first plate 2101 of the first side metal plate 21 and the second welding surface 212 is arranged on the first plate 2101 on the second side, when the metal terminal 20 is connected with the terminal electrode 11, the first welding surface 211 and one surface of the terminal electrode can be welded, and the second welding surface 212 can be welded on the circuit board, so that the electronic component can be fixed on the circuit board. Since the third welding surface 213 is also provided on the second plate 2102 of the first-side metal plate 21, the third welding surface 213 can be welded to different devices when the preset included angle between the first plate 2101 and the second plate 2102 is different.

When the preset included angle is 90 °, at this moment, the third welding surface 212 is connected with the electronic component body 10, and if the terminal electrode is arranged on the electronic component body 10, at this moment, the first welding surface 211 and the third welding surface 213 can be welded on the terminal electrode at the same time, so that the connection between the metal terminal 20 and the terminal electrode 11 is firmer. When the preset included angle is greater than 180 ° and less than or equal to 270 °, the third bonding surface 213 may be bonded to other devices.

In addition, in some embodiments, the first welding surface 211, the second welding surface 212 and the third welding surface 213 are all provided with metal plating.

When all being provided with metallic coating on first face of weld 211, second face of weld 212 and the third face of weld 213, can avoid first face of weld 211, second face of weld 212 and third face of weld 213 to weld with the air contact and the problem of oxidation appears, through setting up metallic coating promptly, can avoid first face of weld 211, second face of weld 212 and third face of weld 213 to be oxidized, appear difficult welding, perhaps weld insecure problem. That is, by providing the metal plating layer, the first welding surface 211, the second welding surface 212, and the third welding surface 213 can be prevented from being oxidized, and the weldability of the metal terminal 20 can be improved.

The material of the metal plating layer may be a metal material that is not easily oxidized, such as gold, silver, nickel, and the like, and the embodiment of the present invention is not limited herein.

In addition, in some embodiments, as shown in fig. 4, a first through groove 214 is provided on the metal plate 21 on a side close to the connection plate 22, a second through groove 221 is provided on the connection plate 22, the first through groove 214 and the second through groove 221 communicate, and the first through groove 214 and the second through groove 221 are used to deform the metal plate 21 and the connection plate 22 in the event that the metal terminal 20 is deformed.

When the metal plate 21 receives the pulling force that the deformation of circuit board 30 brought, because one side that is close to connecting plate 22 on the metal plate 21 is provided with first logical groove 214, set up the second on the connecting plate 22 and lead to groove 221, first logical groove 214 and second logical groove 221 intercommunication, therefore, metal plate 21 can produce deformation, connecting plate 22 also can produce deformation, make metal terminal 20 can absorb the deformation of circuit board 30, and then avoid the deformation transmission of circuit board 30 to electronic components body 10 on, make electronic components body 10 damaged. That is, the first through groove 214 is formed in one side, close to the connecting plate 22, of the metal plate 21, the second through groove 221 is formed in the connecting plate 22, and the first through groove 214 and the second through groove 221 are communicated, so that the metal terminal 20 can absorb deformation of the circuit board 30, and the electronic component body 10 is prevented from being damaged.

For example, as shown in fig. 2 and fig. 4, in the X direction, when the circuit board 30 deforms, the metal plate 21 deforms along with the circuit board, because the first through groove 214 is disposed on one side of the metal plate 21 close to the connecting plate 22, the second through groove 221 is disposed on the connecting plate 22, the first through groove 214 communicates with the second through groove 221, when the metal plate 21 and the connecting plate 22 deform, the first through groove 214 and the second through groove 221 can deform conveniently, which is beneficial for the metal terminal 20 to absorb the deformation of the circuit board 30, and further, deformation of the electronic component body 10 is avoided.

In addition, in some embodiments, the number of the metal plates 21 is two, and the number of the connection plates 22 is one. One metal plate 21 is disposed at a distance from the other metal plate 21, and the two metal plates 21 are connected by a connecting plate 22.

When the number of the metal plates 21 is two and the number of the connection plates 22 is one, one metal plate 21 may be connected to the electronic component main body 10 when the metal terminal 20 is connected to the electronic component main body 10. When the electronic component is fixed to the circuit board 30, the other metal plate 21 may be connected to the circuit board 30. That is, by setting the number of the metal plates 21 to two and the number of the connecting plates 22 to one, the metal terminals 20 can absorb the deformation of the circuit board 30, and thus, the material saving effect can be achieved.

Additionally, in some embodiments, as shown in FIG. 4, the web 22 may be an arcuate plate.

In the process that the position of the metal plate 21 subjected to the external force is changed, the metal plate 21 applies force to the connecting plate 22, and the connecting plate 22 is an arc-shaped plate, so that the connecting plate 22 can be subjected to smaller stress. When the stress on the connection plate 22 is small, the service life of the connection plate 22 is also long. That is, by setting the connection plate 22 to be an arc-shaped plate, the stress applied to the connection plate 22 can be made small, and the service life of the connection plate 22 can be prolonged.

In addition, in some embodiments, the separation distance between any two adjacent metal plates 21 may be less than or equal to a preset distance threshold.

When the spacing distance between any two adjacent metal plates 21 can be smaller than or equal to the preset distance threshold, at this time, the size of the metal terminal 20 can be smaller, and further the size of the electronic component is smaller, so that when the electronic component is arranged on the circuit board 30 in the electronic equipment, the space utilization rate of the electronic equipment is favorably improved.

It should be noted that, the preset distance threshold value can be set according to actual needs, for example, the preset distance threshold value can be 0.02 mm, and to the numerical value of the preset distance threshold value, the embodiment of the present invention is not limited herein.

That is, in the embodiment of the utility model, through set up the metal terminal on electronic components, after connecting electrical components on the circuit board, the circuit board can be absorbed by the metal terminal because the deformation that external force produced, and then avoids electronic components to take place the problem of damage and appear because the deformation of circuit board, has reduced the probability of electronic components device damage, has improved electronic components's life.

An embodiment of the utility model provides a circuit assembly, this circuit assembly includes: circuit board and the electronic component of any one of the embodiments above. The electronic component is fixed on the circuit board.

The fixing method of the electronic component to the circuit may be: and welding the metal terminals in the electronic component on the circuit board.

When the metal terminal comprises a first side and a second side which are opposite, a first welding surface is arranged on the metal plate positioned on the first side, and when a second welding surface is arranged on the metal plate positioned on the second side, the first welding surface is welded with the electronic component body, and the second welding surface is welded with the circuit board.

An embodiment of the utility model provides an electronic equipment, this electronic equipment include the circuit assembly in the above-mentioned embodiment.

It should be noted that, in the embodiment of the present invention, the electronic device includes, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted terminal, a wearable device, a pedometer, and the like.

It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.

While alternative embodiments of the present invention have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including alternative embodiments and all such alterations and modifications as fall within the true scope of the embodiments of the invention.

Finally, it should also be noted that, in this document, relational terms such as first and second, and the like may be used solely to distinguish one entity from another entity without necessarily requiring or implying any actual such relationship or order between such entities. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or terminal apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or terminal apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of additional like elements in the article or terminal device comprising the element.

It is right above to the technical scheme that the utility model provides a detailed introduction has been carried out, and it is right to have used specific individual example herein the utility model discloses a principle and implementation mode have been elucidated, simultaneously, to the general technical staff in this field, according to the utility model discloses a principle and implementation mode all have the change part on concrete implementation mode and application scope, to sum up, this description content should not be understood as the restriction of the utility model.

Claims

1. An electronic component, characterized in that the electronic component comprises: an electronic component body and a metal terminal;

the metal terminal is connected with the electronic component body;

2. The electronic component as claimed in claim 1, wherein the metal terminal includes a first side and a second side opposite to each other, a first soldering surface is disposed on the metal plate on the first side, the first soldering surface is connected to the electronic component body, and a second soldering surface is disposed on the metal plate on the second side.

3. The electronic component as claimed in claim 2, wherein the metal plate is a bent plate, the metal plate includes a first plate and a second plate, and a predetermined included angle exists between the first plate and the second plate.

4. An electronic component as claimed in claim 3, wherein a first soldering surface is provided on the first plate of the metal plate on the first side, a third soldering surface is provided on the second plate of the metal plate on the first side, and a second soldering surface is provided on the first plate of the metal plate on the second side.

5. An electronic component as claimed in claim 4, wherein the first bonding surface, the second bonding surface and the third bonding surface are provided with a metal plating layer.

6. The electronic component as claimed in claim 4, wherein the third soldering surface is connected to the electronic component body.

7. The electronic component as claimed in claim 1, wherein the electronic component body is provided with at least two terminal electrodes at intervals;

the terminal electrode is connected to the metal terminal.

8. An electronic component as claimed in claim 1, wherein a first through groove is provided on a side of the metal plate close to the connection plate, a second through groove is provided on the connection plate, the first through groove communicates with the second through groove, and the first through groove and the second through groove are configured to deform the metal plate and the connection plate in a case where the metal terminal is deformed.

9. An electronic component as claimed in any one of claims 1 to 8, wherein the connecting plate is an arc-shaped plate.

10. A circuit assembly, comprising: a circuit board and an electronic component as claimed in any one of claims 1 to 9;

the electronic component is fixed on the circuit board.

11. An electronic device, characterized in that it comprises a circuit assembly as claimed in claim 10.