CN214025183U - Adjusting mechanism for angle of workbench of wafer thinning machine - Google Patents
Adjusting mechanism for angle of workbench of wafer thinning machine Download PDFInfo
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- CN214025183U CN214025183U CN202023274607.9U CN202023274607U CN214025183U CN 214025183 U CN214025183 U CN 214025183U CN 202023274607 U CN202023274607 U CN 202023274607U CN 214025183 U CN214025183 U CN 214025183U
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- workbench
- lead screw
- adjusting mechanism
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Abstract
The utility model discloses an adjusting mechanism for the angle of a workbench of a wafer thinning machine, which comprises a speed reducer, wherein the upper end of the speed reducer is connected with a coupler, the upper end of the coupler is provided with a lead screw, the upper end of the lead screw is provided with a nut, the upper end of the adjusting mechanism is provided with a workbench, the upper end of the workbench is a workbench surface, the speed reducer drives the lead screw to rotate through the coupler, so that the nut drives the workbench to move up and down, and the workbench is enabled to realize a certain angle; the utility model relates to an adjustment mechanism of wafer attenuate machine workstation angle, the speed reducer passes through the shaft coupling and drives the lead screw rotation to make the nut drive the workstation from top to bottom, make the workstation realize certain angle, and a workstation has two isostructures and a fixed fulcrum, realize the convenient regulation of wafer attenuate machine workstation angle, have the practicality.
Description
Technical Field
The utility model relates to a wafer attenuate machine technical field specifically is a guiding mechanism of wafer attenuate machine workstation angle.
Background
Advances in integrated circuit manufacturing technology have been derived primarily from market demands and secondarily from competing demands. In the manufacture of integrated circuits, semiconductor silicon materials are important base materials of integrated circuits due to abundant resources, low manufacturing cost and good manufacturability.
From the perspective of the cross-sectional structure of the integrated circuit, most integrated circuits are fabricated on a shallow surface layer of silicon substrate material. Due to the requirements of the manufacturing process, high requirements are put on the dimensional accuracy, geometric accuracy, surface cleanliness and surface micro-lattice structure of the wafer. Therefore, in hundreds of technological processes, thinner wafers cannot be adopted, and only wafers with certain thickness can be used for transferring and flowing in the technological process. It is often necessary to remove a certain thickness of excess substrate material from the back side of the wafer prior to packaging of the integrated circuit. The process is called as a wafer back thinning process, and the corresponding equipment is a wafer thinning machine;
because the worktable surface of the wafer thinning machine needs to form a certain angle with the grinding wheel during grinding, the angle of the worktable needs to be adjusted, and the traditional wafer thinning machine cannot conveniently adjust the angle.
Therefore, the adjusting mechanism for the angle of the worktable of the wafer thinning machine is provided.
SUMMERY OF THE UTILITY MODEL
The utility model provides a not enough to the background art, the utility model provides a wafer attenuate machine workstation angle's adjustment mechanism has solved the problem that above-mentioned background art provided.
The utility model provides an adjustment mechanism of wafer attenuate machine workstation angle, includes the speed reducer, the upper end of speed reducer is connected with the shaft coupling, and the lead screw is installed to the upper end of this shaft coupling, the upper end of lead screw is provided with the nut, and this adjustment mechanism's upper end has the workstation, and the upper end of workstation is table surface.
Preferably, the speed reducer drives the screw rod to rotate through the coupler, so that the nut drives the workbench to move up and down, and the workbench is enabled to realize a certain angle.
Preferably, the two adjusting mechanisms are arranged on the bottom of the lower end of the workbench respectively.
Preferably, the working table top is clung to the working table.
Preferably, the lead screw is mounted to a lower end of the nut.
The utility model discloses possess following beneficial effect: according to the adjusting mechanism for the angle of the workbench of the wafer thinning machine, the speed reducer drives the lead screw to rotate through the coupler, so that the nut drives the workbench to rotate up and down, the workbench is enabled to realize a certain angle, one workbench has two same structures and one fixed fulcrum, the convenient adjustment of the angle of the workbench of the wafer thinning machine is realized, and the adjusting mechanism has practicability.
Drawings
Fig. 1 is a schematic view of the overall structure of an angle adjusting mechanism for a worktable of a wafer thinning machine according to the present invention;
in the figure: 1. a speed reducer; 2. a coupling; 3. a lead screw; 4. a nut; 5. a work table; 6. a working table.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The embodiment of the utility model provides an in the attached drawing: the different types of hatching in the figures are not given the national standards, do not require the material of the elements, and distinguish between cross-sectional views of the elements in the figures.
Referring to fig. 1, an adjusting mechanism for adjusting an angle of a worktable of a wafer thinning machine includes a speed reducer 1, a coupler 2 is connected to an upper end of the speed reducer 1, a lead screw 3 is installed at an upper end of the coupler 2, a nut 4 is arranged at an upper end of the lead screw 3, a worktable 5 is arranged at an upper end of the adjusting mechanism, and a worktable surface 6 is arranged at an upper end of the worktable 5.
The speed reducer 1 drives the screw rod 3 to rotate through the coupler 2, so that the nut 4 drives the workbench 5 to move up and down, and the workbench 5 is enabled to realize a certain angle.
Two adjusting mechanisms are arranged on the two adjusting mechanisms, and the two adjusting mechanisms are respectively arranged at the bottom of the lower end of the workbench 5.
The working table surface 6 is tightly attached to the working table 5.
The lead screw 3 is mounted to the lower end of the nut 4.
It should be noted that, in the adjusting mechanism for the angle of the worktable of the wafer thinning machine, the speed reducer 1 drives the screw rod 3 to rotate through the coupler 2, so that the nut 4 drives the worktable 5 to move up and down, and the worktable 5 realizes a certain angle.
And in the adjusting mechanism for the angle of the worktable of the wafer thinning machine, one worktable has two same structures and one fixed pivot, so that the convenient adjustment of the angle of the worktable of the wafer thinning machine is realized, and the adjusting mechanism has practicability.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides an adjustment mechanism of wafer attenuate machine workstation angle, includes speed reducer (1), its characterized in that: the upper end of speed reducer (1) is connected with shaft coupling (2), and lead screw (3) are installed to the upper end of this shaft coupling (2), the upper end of lead screw (3) is provided with nut (4), and workstation (5) have in this adjustment mechanism's upper end, and the upper end of workstation (5) is table surface (6).
2. The adjusting mechanism of the angle of the worktable of the wafer thinning machine as claimed in claim 1, which is characterized in that: the speed reducer (1) drives the lead screw (3) to rotate through the coupler (2), so that the nut (4) drives the workbench (5) to move up and down, and the workbench (5) is enabled to realize a certain angle.
3. The adjusting mechanism of the angle of the worktable of the wafer thinning machine as claimed in claim 1, which is characterized in that: the two adjusting mechanisms are arranged on the bottom of the lower end of the workbench (5) respectively.
4. The adjusting mechanism of the angle of the worktable of the wafer thinning machine as claimed in claim 1, which is characterized in that: the working table top (6) is tightly attached to the working table (5).
5. The adjusting mechanism of the angle of the worktable of the wafer thinning machine as claimed in claim 1, which is characterized in that: the lead screw (3) is arranged at the lower end of the nut (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023274607.9U CN214025183U (en) | 2020-12-30 | 2020-12-30 | Adjusting mechanism for angle of workbench of wafer thinning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023274607.9U CN214025183U (en) | 2020-12-30 | 2020-12-30 | Adjusting mechanism for angle of workbench of wafer thinning machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214025183U true CN214025183U (en) | 2021-08-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023274607.9U Active CN214025183U (en) | 2020-12-30 | 2020-12-30 | Adjusting mechanism for angle of workbench of wafer thinning machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214025183U (en) |
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2020
- 2020-12-30 CN CN202023274607.9U patent/CN214025183U/en active Active
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