CN214022079U - Wafer inspection and cleaning device - Google Patents
Wafer inspection and cleaning device Download PDFInfo
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- CN214022079U CN214022079U CN202022636435.9U CN202022636435U CN214022079U CN 214022079 U CN214022079 U CN 214022079U CN 202022636435 U CN202022636435 U CN 202022636435U CN 214022079 U CN214022079 U CN 214022079U
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- jacking
- wafer
- workbench
- dislocation
- cleaning apparatus
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Abstract
The utility model relates to a wafer inspection and cleaning device, which comprises a device shell, a workbench, a jacking dislocation component, a jacking rotating component, an identification camera and a cleaner, wherein the internal air pressure of the device shell is greater than the external air pressure; a cavity is arranged right below the workbench for placing the wafer box, and transverse modules for driving the jacking dislocation assembly and the jacking rotating assembly to respectively and correspondingly move to the lower part of the cavity are arranged below the jacking dislocation assembly and the jacking rotating assembly and realize that the jacking dislocation assembly and the jacking rotating assembly are lifted to penetrate through the cavity and abut against the lower end of the wafer; the utility model is used for realize the inspection and the cleanness of wafer, reduce the wafer and do not lead to follow-up occurence of failure because of carrying the damage or sequencing, can reduce the manual work in the working process, increase efficiency.
Description
Technical Field
The utility model relates to a supplementary inspection of chip trade and clean technical field, in particular to wafer inspection and cleaning device.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, which is called a wafer because the shape is circular, and various circuit element structures can be manufactured on the silicon wafer to become an IC product with specific electrical functions; the wafer box mainly plays a role in placing and conveying wafers in semiconductor production, and in order to simplify transportation and reduce the risk of contamination as much as possible, a chip manufacturer uses the wafer box to carry and store the wafers.
The wafer is in removing or the use, and the wafer that often can appear in the wafer box has the difference or is the problem of a little dust, will appear the wafer in the use not right or some listed as circumstances such as the wafer damage, consequently the utility model discloses a wafer inspection and cleaning equipment has been developed to solve the problem that exists among the prior art, through the retrieval, not discover with the utility model discloses same or similar technical scheme.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the purpose is: a wafer inspection and cleaning device is provided to solve the problem of difference or little dust in the moving or using process of the wafer in the prior art.
The technical scheme of the utility model is that: a wafer checking and cleaning device comprises a device shell, a workbench, a jacking dislocation component, a jacking rotating component, a recognition camera and a cleaner, wherein the internal air pressure of the device shell is greater than the external air pressure; a cavity is arranged right below the wafer box placed on the workbench, and transverse modules for driving the wafer box to move to the lower part of the cavity correspondingly are arranged below the jacking dislocation assembly and the jacking rotating assembly respectively and realize the lifting and penetrating of the cavity and the lower end of the wafer.
Preferably, the jacking dislocation assembly comprises a first lifting frame and a wedge-shaped table fixed at the upper end of the first lifting frame; the jacking rotary assembly comprises a second lifting frame and a plurality of rotary ejector rods arranged at the upper end of the second lifting frame.
Preferably, the number of the jacking rotary assemblies is more than one, and the single rotary ejector rods at the upper ends of the jacking rotary assemblies are distributed in an inwards concave arc shape and are respectively matched with the wafers with corresponding sizes.
Preferably, the transverse module comprises a pair of guide rails, a transmission belt arranged between the pair of guide rails, and a driving motor for driving the transmission belt to rotate; the lower ends of the first lifting frame and the second lifting frame are fixedly connected with the transmission belt and are in sliding fit with the pair of guide rails.
Preferably, the upper end face of the workbench on two sides of the cavity is provided with a pair of limiting clamping seats for positioning the wafer box and a back plate perpendicular to the pair of limiting clamping seats, and the back plate is provided with an in-place switch.
Preferably, the recognition camera is an OCR camera, is fixed at the top end inside the equipment shell and is positioned right above the wafer box.
Preferably, the cleaner is a pair of static eliminators fixed at the top end inside the equipment shell and is positioned right above the wafer box.
Preferably, the front end of the equipment shell is provided with a touch screen, a control button and a double-opening sealing door for realizing the taking and placing of the wafer box, and the side wall of the equipment shell is provided with an air discharging and cleaning hole communicated with the lower part of the workbench; and the double-opening sealing door is provided with a limit switch.
Compared with the prior art, the utility model has the advantages that:
(1) the utility model is used for realize the inspection and the cleanness of wafer, reduce the wafer and do not lead to follow-up occurence of failure because of carrying the damage or sequencing, can reduce the manual work in the working process, increase efficiency.
(2) The air pressure inside the equipment shell is always greater than the external air pressure in the working state, so that no external gas or dust enters the equipment shell, and the characteristic requirements of the chip industry on pollution prevention and static prevention are effectively met.
(3) The number of the jacking rotating assemblies is more than one, so that the jacking rotating assemblies are matched with wafers of different sizes, and the use limitation of equipment is reduced.
(4) The whole device can be placed on a table top for use, accords with the ergonomic design, is convenient to move and can be combined with multiple working properties.
Drawings
The invention will be further described with reference to the following drawings and examples:
fig. 1 is a schematic view of an external structure of a wafer inspecting and cleaning apparatus according to the present invention;
fig. 2 is a schematic view of the arrangement structure of the jacking offset assembly and the jacking rotary assembly of the present invention;
fig. 3 is a partial enlarged view of the jacking offset assembly and the jacking rotary assembly of the present invention;
fig. 4 is a schematic diagram of the position structure of the recognition camera, the cleaner and the wafer cassette according to the present invention;
fig. 5 is an enlarged view of the structure of the recognition camera, the cleaner and the wafer cassette of the present invention.
Wherein: 1. an equipment housing;
11. the device comprises an upper shell, a lower shell, a touch screen, a control button, an air discharging cleaning hole, an adjustable horizontal ground foot, a double-opening sealing door, a warning lamp and a control panel, wherein the upper shell 12, the lower shell 13, the touch screen, 14, the control button, 15, the air discharging cleaning hole, 16, the adjustable horizontal ground foot, 17, the double-opening sealing door, 18 and the warning lamp are arranged on the shell;
2. a work table;
21. a cavity 22, a limit clamping seat 23 and a back plate;
3. jacking the dislocation component;
31. a first lifting frame 32 and a wedge-shaped table;
4. jacking and rotating the assembly;
41. a second lifting frame 42 and a rotary ejector rod;
5. a transverse module;
51. a guide rail 52, a transmission belt 53 and a driving motor;
6. a recognition camera (OCR camera);
7. a cleaner (static eliminator);
8. and a wafer box.
Detailed Description
The following detailed description is made in conjunction with specific embodiments of the present invention:
as shown in fig. 1, fig. 2 and fig. 4, a wafer inspecting and cleaning device comprises a device housing 1 with internal air pressure greater than external air pressure, a workbench 2 installed inside the device housing 1 and used for placing a wafer box 8, a jacking dislocation module 3 and a jacking rotation module 4 arranged below the workbench 2, a recognition camera 6 arranged above the workbench 2 and used for matching with the jacking dislocation module 3 to realize inspection work, and a cleaner 7 arranged above the workbench 2 and used for matching with the jacking rotation module 4 to complete cleaning work.
As shown in fig. 1, the workbench 2 divides the device housing 1 into an upper housing 11 and a lower housing 12, wherein the front end surface of the lower housing 12 is provided with a touch screen 13 and a control button 14 for controlling the device to work, and the front end surface is inclined, so that the device conforms to the ergonomic design and is convenient for the operation of workers; the side wall is provided with an air discharging cleaning hole 15, and the lower end surface is provided with an adjustable horizontal ground foot 16; a double-opening sealing door 17 for realizing the taking and placing of the wafer box 8 is arranged on the front end face of the upper shell 11, a limit switch is arranged on the double-opening sealing door 17, and a warning lamp 18 is arranged at the top of the double-opening sealing door 17; the device housing 1 can be used for working on a horizontal table.
As shown in fig. 1, a cavity 21 is formed right below the wafer cassette 8 placed on the worktable 2, so that the upper shell 11 and the lower shell 12 are communicated, and the jacking dislocation assembly 3 and the jacking rotation assembly 4 can work conveniently; as shown in fig. 4 and 5, the upper end surface of the table 2 on both sides of the cavity 21 has a pair of limiting clamping seats 22 for positioning the wafer box 8 and a back plate 23 perpendicular to the pair of limiting clamping seats 22, and the back plate 23 is provided with an in-place switch for detecting whether the wafer box 8 is placed in place.
As shown in fig. 2 and 3, the jacking malposition assembly 3 comprises a first lifting frame 31 and a wedge-shaped table 32 fixed at the upper end of the first lifting frame 31; the jacking rotary component 4 comprises a second lifting frame 41 and a plurality of rotary ejector rods 42 arranged at the upper end of the second lifting frame 41; meanwhile, a transverse module 5 for driving the jacking dislocation component 3 and the jacking rotating component 4 to respectively and correspondingly move to the lower part of the cavity 21 is arranged below the jacking dislocation component 3 and the jacking rotating component 4, and the transverse module 5 is lifted to penetrate through the cavity 21 and abut against the lower end of the wafer, and comprises a pair of guide rails 51, a transmission belt 52 arranged between the pair of guide rails 51 and a driving motor 53 for driving the transmission belt 52 to rotate; the lower ends of the first lifting frame 31 and the second lifting frame 41 are fixedly connected with a transmission belt 52 and are in sliding fit with a pair of guide rails 51.
In order to realize the matching with wafers with different dimensions, the number of the jacking rotary assemblies 4 is more than one, a plurality of rotary ejector rods 42 at the upper end of a single jacking rotary assembly 4 are distributed in an inwards concave arc shape and are respectively matched with the wafers with corresponding dimensions (generally more than 6 inches); in this embodiment, two jacking rotary assemblies 4 are provided, and are respectively adapted to wafers of 6 inches and 8 inches, and meanwhile, four rotary push rods 42 are provided on each jacking rotary assembly 4.
The recognition camera 6 is an ocr (optical Character recognition) camera, that is, the optical Character recognition camera 6, fixed at the top end of the inside of the apparatus housing 1, as shown in fig. 4 and 5, and located right above the wafer cassette 8 for shooting and inspecting the wafer.
The cleaner 7 selects a pair of static eliminators fixed at the top end inside the equipment housing 1, as shown in fig. 4 and 5, and is located right above the wafer box 8 for blowing air downwards to complete the dust removal and cleaning of the wafer.
The working principle of the utility model is as follows:
(1) placing the wafer box 8 with the specified size between a pair of limiting clamping seats 22, attaching the rear side end to a back plate 23, closing a double-opening sealing door 17, pressing a control button 14, starting the equipment to work when an in-place switch detects that the wafer box 8 is in place, and flashing a warning lamp 18 if the in-place switch does not detect the wafer box 8; in the process, if the limit switch detects that the double-opening sealing door 17 is not tightly closed, the warning lamp 18 flickers, and the equipment does not run;
(2) the transverse module 5 drives the jacking dislocation component 3 to move to the position under the cavity 21, the first lifting frame 31 drives the wedge-shaped table 32 to penetrate through the cavity 21 and move to the position under the wafer box 8 to abut against the lower end part of a wafer in the wafer box 8, and because the upper end of the wedge-shaped table 32 is inclined, when the wafer is jacked, each wafer is higher than the previous wafer by 3-5mm, and then the wafer is shot and identified by the identification camera 6, and the wafer is subjected to self-inspection to determine whether the wafer is missed or wrong in numbering;
(3) after the detection is finished without errors, the transverse module 5 drives the jacking rotary component 4 matched with the corresponding wafer in size to move to the position under the cavity 21, the second lifting frame 41 drives the rotary ejector rod 42 to penetrate through the cavity 21 and move to the position under the wafer box 8, the rotary ejector rod abuts against the lower end portion of the wafer in the wafer box 8, the wafer is jacked and floats in the upper shell 11, and then the electrostatic eliminator blows downwards to finish dust removal and cleaning of the wafer.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. It is obvious to a person skilled in the art that the invention is not limited to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention, and that the embodiments are therefore to be considered in all respects as exemplary and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Claims (8)
1. A wafer inspection and cleaning apparatus, characterized by: the device comprises a device shell, a workbench, a jacking dislocation component, a jacking rotating component, a recognition camera and a cleaner, wherein the internal air pressure of the device shell is greater than the external air pressure, the workbench is arranged in the device shell and used for placing a wafer box, the jacking dislocation component and the jacking rotating component are arranged below the workbench, the recognition camera is arranged above the workbench and used for being matched with the jacking dislocation component to realize inspection work, and the cleaner is arranged above the workbench and used for being matched with the jacking rotating component to finish cleaning work; a cavity is arranged right below the wafer box placed on the workbench, and transverse modules for driving the wafer box to move to the lower part of the cavity correspondingly are arranged below the jacking dislocation assembly and the jacking rotating assembly respectively and realize the lifting and penetrating of the cavity and the lower end of the wafer.
2. The wafer inspection and cleaning apparatus of claim 1, wherein: the jacking dislocation assembly comprises a first lifting frame and a wedge-shaped table fixed at the upper end of the first lifting frame; the jacking rotary assembly comprises a second lifting frame and a plurality of rotary ejector rods arranged at the upper end of the second lifting frame.
3. The wafer inspection and cleaning apparatus of claim 2, wherein: the number of the jacking rotary assemblies is more than one, and the jacking rotary assemblies are single, and a plurality of rotary ejector rods at the upper ends of the jacking rotary assemblies are distributed in an inwards concave arc shape and are respectively matched with the wafers with corresponding sizes.
4. The wafer inspection and cleaning apparatus of claim 2, wherein: the transverse module comprises a pair of guide rails, a transmission belt arranged between the pair of guide rails and a driving motor for driving the transmission belt to rotate; the lower ends of the first lifting frame and the second lifting frame are fixedly connected with the transmission belt and are in sliding fit with the pair of guide rails.
5. The wafer inspection and cleaning apparatus of claim 1, wherein: the upper end face of the workbench on two sides of the cavity is provided with a pair of limiting clamping seats used for positioning the wafer box and a back plate perpendicular to the limiting clamping seats, and the back plate is provided with an in-place switch.
6. The wafer inspection and cleaning apparatus of claim 1, wherein: and the recognition camera is an OCR camera, is fixed at the top end in the equipment shell and is positioned right above the wafer box.
7. The wafer inspection and cleaning apparatus of claim 1, wherein: the cleaner selects a pair of static eliminators fixed at the top end in the equipment shell and is positioned right above the wafer box.
8. The wafer inspection and cleaning apparatus of claim 1, wherein: the front end of the equipment shell is provided with a touch screen, a control button and a double-opening sealing door for realizing the taking and placing of the wafer box, and the side wall of the equipment shell is provided with an air discharging and cleaning hole communicated with the lower part of the workbench; and the double-opening sealing door is provided with a limit switch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022636435.9U CN214022079U (en) | 2020-11-13 | 2020-11-13 | Wafer inspection and cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022636435.9U CN214022079U (en) | 2020-11-13 | 2020-11-13 | Wafer inspection and cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214022079U true CN214022079U (en) | 2021-08-24 |
Family
ID=77359123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022636435.9U Active CN214022079U (en) | 2020-11-13 | 2020-11-13 | Wafer inspection and cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214022079U (en) |
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2020
- 2020-11-13 CN CN202022636435.9U patent/CN214022079U/en active Active
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