CN213998865U

CN213998865U - Device for simultaneously machining multiple plane optical parts

Info

Publication number: CN213998865U
Application number: CN202023324695.9U
Authority: CN
Inventors: 应常建; 邓祥兴; 罗志刚; 李娇; 王兴华; 陆贵兵; 苟华飞; 张忠海
Original assignee: Kunming Yunzhe High Tech Co ltd
Current assignee: Kunming Yunzhe High Tech Co ltd
Priority date: 2020-12-31
Filing date: 2020-12-31
Publication date: 2021-08-20
Anticipated expiration: 2030-12-31

Abstract

The invention belongs to the technical field of optical part preparation, and particularly discloses a device for simultaneously processing multiple planar optical parts, which comprises a polishing machine, a base bottom die and a bonding die, wherein the base bottom die and the bonding die are respectively connected to the polishing machine, fixing columns are arranged on the edge of the base bottom die, a positioning area of the bonding die is determined on the base bottom die, the manufactured parts containing adhesives are uniformly distributed on the base bottom die in the positioning area, the distance between the parts is 1-2 mm, the bonding die is heated to 100 ℃ and is used for carrying out hot pressing on the parts by means of the positioning of the fixing columns, when the temperature of the bonding die is reduced to 70 ℃, 100 grams of pressure per square millimeter of the parts is applied until the parts are cooled and processed at normal temperature, the invention realizes the simultaneous processing of multiple planar parts, easily obtains higher surface form precision and parallelism, and improves the processing efficiency by 5-30 times compared with the single optical part according to the size of a mirror plate of the polishing machine, the processing of the ultra-small diameter parts is difficult to be simplified.

Description

Device for simultaneously machining multiple plane optical parts

Technical Field

The invention belongs to the technical field of optical part preparation, and particularly relates to a device for simultaneously processing planes of multiple optical parts.

Background

No matter the plane optical part is processed in common high-efficiency processing and traditional processing, a product with higher requirement is generally processed by a single piece, or a product with low end can be processed by a plurality of pieces, the qualification rate can reach 70-80% generally, and the polishing machine needs more than 80% of substrates covering a mirror disc of the polishing machine, has uniform size and cannot process the product with the wedge-shaped part. The high-precision plane single piece processing has low efficiency and continuously increased labor cost, the utilization rate of auxiliary materials is usually only 10-20%, and the requirement on a processor is very high.

Therefore, a technology for processing multiple planar parts is urgently needed to solve the problems that in the current planar optical part processing, the single-part processing difficulty is high, the efficiency is low, time and waste are wasted, the processing precision of multiple parts cannot be guaranteed, the yield is low and the like.

Disclosure of Invention

The invention mainly aims to provide a device for simultaneously processing a plurality of plane optical parts, which is used for solving the problems of high processing difficulty and low efficiency of high-precision plane optical parts and incapability of processing products with wedge-shaped parts in the background technology.

In order to achieve the above purpose, the invention provides the following technical scheme:

a device for simultaneously processing a plurality of plane optical parts comprises a polishing machine and a bonding die, wherein the bonding die is connected to the polishing machine, a base die block is arranged at the bottom of the bonding die, a plurality of fixing columns vertical to the base die are fixedly connected to the edge of the base die block, and a plurality of optical parts are bonded to the bottom of the bonding die through a bonding agent.

Furthermore, two fixing columns perpendicular to the base mold are fixedly connected to the edge of the base mold, and an angle of 30-175 degrees is formed between the two fixing columns and the central point of the base mold.

Further, the distance between the optical parts is 1-2 mm.

Further, the thickness of the binder is 5-8 mm.

Furthermore, the diaphragm N = + 4-10 Nfr and the surface accuracy delta N < 0.5Nfr of the corresponding surface of the base mold in the range of the bonding mold, and the diaphragm N = -4-10 Nfr +/-4 Nfr and the surface accuracy delta N < 0.5Nfr of the surface of the optical component far away from the bonding mold enable the errors between the contact surfaces of the base mold and the optical component to be mutually offset. In other words, in the processing process of the optical part, if the processing precision of the optical part is controlled to be N = -6Nfr, delta N < 0.5Nfr within the processing diameter range of the bonding die, the allowable error is +/-4 Nfr, and the error is counteracted with the corresponding error of the substrate die N = +6Nfr, so that the processing parallelism theta of the optical part is ensured.

Furthermore, the base mold has apertures N = +8Nfr and Δ N < 0.5Nfr on the corresponding surface within the range of the bonding mold, and apertures N = -8Nfr ± 4Nfr and Δ N < 0.5Nfr on the surface of the optical component away from the bonding mold.

The invention has the following advantages:

1. the invention realizes the simultaneous processing of a plurality of plane parts, is easy to obtain higher surface precision and parallelism, improves the processing efficiency of a single optical part by 5-30 times according to the size of a mirror disc of the polishing machine, and realizes the difficulty in processing ultra-small diameter parts.

2. The invention uses the adhesive layer of the adhesive component, can realize that the optical parts with non-uniform sizes and wedge shapes are fixed in a plane for processing, in the process, after the parts and the adhesive die are subjected to hot-pressing and gluing, when the temperature is continuously reduced, the adhesive can shrink, so that the adhered parts can not be on the plane, and the high-precision product with the parallelism lower than the existing standard of 0.005mm can be processed and obtained by adding the set temperature and pressure of the invention and the precision of the reference die.

3. Compared with the traditional single-piece processing, the processing by the device and the method greatly saves the use cost of auxiliary materials, can save the use amount of polishing powder by 50 percent compared with the processing of single-piece products with the same amount, and can realize the infinite repeated use of the adhesive.

Drawings

FIG. 1: the device of the invention is a schematic structure;

FIG. 2: the size relation graph of the part arrangement and the mirror disc;

FIG. 3: and the relationship between the aperture and the rise corresponds to a graph.

Detailed Description

The invention is further described with reference to the following figures and specific examples.

Example 1

As shown in figure 1, the device for simultaneously processing a plurality of plane optical parts comprises a polishing machine, a base bottom die 5 and a bonding die 1, wherein the bonding die 1 is connected to the polishing machine, the base bottom die 5 is arranged at the bottom of the bonding die 1, two fixing columns 4 perpendicular to the base die are fixedly connected to the edge of the base die 5, an angle of 30-175 degrees is formed between the two fixing columns and the central point of the base die, and a plurality of optical parts 3 are bonded to the bottom of the bonding die 1 through a bonding agent 2.

The specific processing and manufacturing steps are as follows:

1. and manufacturing a base bottom die, wherein the base bottom die requires that the aperture of a bonding surface is N = +8Nfr and the surface accuracy is delta N less than 0.5Nfr within the diameter range of the bonding die, and two fixing columns vertical to the base die are added at the edge of the base die. The selection of the bonded diaphragm is mainly based on the size of the mirror plate of the polishing machine, the shape and the size of the optical part to be processed, and if the optical part is a negative diaphragm, the base die is a positive diaphragm, the processing diameter range of the bonding die is-8 Nfr +/-4 Nfr delta N < 0.5Nfr, the error of the bonding die and the error of the base die N = +8Nfr are mutually counteracted, the mirror surface processing parallelism is ensured, and the numerical value of the diaphragm N is variable as long as the mutual counteraction can be achieved.

2. The adhesive with the melting temperature of 50-70 ℃ is selected, particularly asphalt can be used, the adhesive is manufactured on one surface of the processed optical part in advance, and the thickness of the adhesive is 6-8 mm.

3. After being wiped clean, a plurality of parts containing the adhesive are uniformly placed on a positioning area of the substrate die according to a perfect circle method, and the interval between the parts is 1-2 mm. Heating the bonding die to 100 ℃, pressing the adhesive to 5mm, carrying out hot-pressing and gluing on the part, applying 100 g of pressure per square millimeter on the part when the temperature of the bonding die is reduced to 70 ℃ until the part is cooled to normal temperature, removing the base die plate, and connecting the part of the bonded part to a polishing machine for subsequent operation.

4. The parts are machined, wherein the general parts require N < 3-5 fr, delta N < 0.5Nfr and theta < 0.005mm, when the diameter of a mirror disc is phi 2=100mm, the single-piece part is phi 1=30mm, and when the aperture N2=8 of the mirror disc is (phi 1/phi 2), 2= N1/N2 results in N1=0.72 fr;

wherein D1: part diameter D2: disk diameter, N1: part aperture N2: a mirror disc aperture. The opposite amount of flatness processing to the flatness of the base mold is the best, the maximum deviation can be N = -8Nfr + -4 Nfr, and the extreme deviation of the mirror disk + -4 Nfr is exemplified by: in general, the range of 1 λ ≈ 2fr, 4fr =2 λ, λ =0.632 μm, 2 λ =1.26 μm, i.e., radius R =47mm, has a parallelism of 1.26 μm. The surface type precision and the surface quality can be achieved according to the requirements of the drawing, and the parallelism obtained according to the aperture control is far superior to the requirement of 0.005mm provided by the drawing.

Examples are: as shown in the following fig. 2, the diameter of the part is phi 1=30mm, 7 parts can be just matched into a machining disc, the diameter of the mirror disc is phi 2=94, the diameter range of the mirror disc is N2=8, and the f-number of the part phi 1 is N1.

From the formula (Φ 1/Φ 2) 2= N1/N2, (30/90) 2= N1/8, N1=0.8148fr can be solved.

As shown in fig. 3, the base aperture is 8fr, the actual processing deviates from the positive 4 or negative 4 apertures, one aperture has a wavelength λ =0.632um, and one wavelength =2fr, then the absolute value of ± 4fr is 0.632 × 2=1.26um, and 1.26 is the difference from the center to the edge of the mirror plate.

Claims

1. The device for simultaneously processing a plurality of plane optical parts comprises a polishing machine and a bonding die, wherein the bonding die is connected to the polishing machine, and is characterized in that a base die block is arranged at the bottom of the bonding die, a plurality of fixing columns vertical to the base die are fixedly connected to the edge of the base die block, and a plurality of optical parts are bonded to the bottom of the bonding die through a bonding agent.

2. The apparatus for simultaneously processing multiple planar optical parts as claimed in claim 1, wherein two fixing posts are fixedly connected to the edge of the base mold and perpendicular to the base mold, and an angle of 30 ° to 175 ° is formed between the two fixing posts and the center point of the base mold.

3. The apparatus for simultaneously processing a plurality of planar optical parts as claimed in claim 1, wherein the pitch between the plurality of optical parts is 1 to 2 mm.

4. The apparatus for simultaneously processing a plurality of planar optical components as claimed in claim 1, wherein the adhesive has a thickness of 5 to 8 mm.

5. The apparatus for simultaneously processing a plurality of planar optical components as claimed in any one of claims 1 to 4, wherein the base mold has a stop N = +4 to 10Nfr and a face shape accuracy Δ N < 0.5Nfr for a corresponding face within a range of the bonding mold, and the stop N = -4 to 10Nfr ± 4Nfr and the face shape accuracy Δ N < 0.5Nfr for a face of the optical component away from the bonding mold cancel out an error between contact faces of the base mold and the optical component.

6. The apparatus for simultaneously processing a plurality of planar optical components as claimed in claim 5, wherein the base mold has apertures N = +8Nfr and Δ N < 0.5Nfr on the corresponding surface within the range of the bonding mold, and the apertures N = -8Nfr ± 4Nfr and Δ N < 0.5Nfr on the surface of the optical component away from the bonding mold.