CN213991050U

CN213991050U - Temperature difference control glue homogenizing, developing and heating unit

Info

Publication number: CN213991050U
Application number: CN202022451162.0U
Authority: CN
Inventors: 刘晟麟
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-10-29
Filing date: 2020-10-29
Publication date: 2021-08-17
Anticipated expiration: 2030-10-29

Abstract

The utility model discloses a uniform glue development heating unit of difference in temperature control, including the soaking disk body, the soaking disk body divide into tray upper surface board, graphite alkene samming layer, insulating heat conduction baffle, intermediate layer heating circuit and bottom heat preservation clamp plate, tray upper surface board, graphite alkene samming layer, insulating heat conduction baffle, intermediate layer heating circuit set gradually with bottom heat preservation clamp plate from the top down, and the surface of tray upper surface board is the wafer heating surface, and the fixed high accuracy temperature sensor of table department is hidden to tray upper surface board upper surface. This even glue development heating unit of difference in temperature control makes the even heating effect of hot plate show and promotes.

Description

Temperature difference control glue homogenizing, developing and heating unit

Technical Field

The utility model relates to an even gluey developing apparatus technical field in the semiconductor processing procedure specifically is an even gluey development heating unit of difference in temperature control.

Background

Currently, the national economy is rapidly developed, and various advanced devices emerge endlessly, and provide powerful and efficient manufacturing capability for various industries, such as aerospace, aviation, semiconductors, precision manufacturing and other fields. Among other things, these fields have much higher requirements for heating than the general civil industry. Such as, but not limited to, track development equipment in semiconductor equipment. A spin coater is a device used in a pre-bake and a post-bake process before and after a photolithography process in a semiconductor processing process. The baking step is mainly to volatilize the solvent in the developer, increase the adhesiveness of the photoresist, and relax the stress. If the solvent volatilization speeds are inconsistent, the glue surface is uneven and hollow, and the subsequent photoetching quality is seriously affected. With the increasing demands for the productivity and quality of semiconductor devices, wafer surface temperature control has become an important item for controlling the performance of semiconductor devices. Therefore, a temperature difference control spin coating development heating unit is provided.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a uniform gluey development heating unit of difference in temperature control to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a uniform glue development heating unit of temperature difference control, includes the soaking disk body, the soaking disk body divide into tray upper surface board, graphite alkene samming layer, insulating heat conduction baffle, intermediate layer heating circuit and bottom heat preservation clamp plate, tray upper surface board, graphite alkene samming layer, insulating heat conduction baffle, intermediate layer heating circuit and bottom heat preservation clamp plate from the top down set gradually, and the surface of tray upper surface board is wafer heating surface, the fixed high accuracy temperature sensor of tray upper surface board upper surface shallow table department.

Furthermore, the tray upper surface plate, the graphene temperature equalizing layer, the insulating heat-conducting partition plate, the interlayer heating circuit and the bottom heat-insulating pressing plate are pressed into a 'Wumingzhi' structure.

Furthermore, the insulating and heat conducting partition board is a material having insulating properties and good heat conduction, and includes, but is not limited to, hard aluminum oxide material and the like.

Further, the interlayer heating circuit is selected from but not limited to alloy metal films with film thickness <100 uM.

Furthermore, the bottom heat-preservation pressing plate has insulation performance and is sprayed with a heat-insulation coating.

Furthermore, the Wumingzhi one, three and five layers are axially penetrated by process holes, and the graphene temperature equalization layer is also punched.

Furthermore, V-shaped groove air guides with the depth of 0.1-0.2 mm are arranged on the contact surfaces of the upper surface plate of the tray and the insulating heat-conducting partition plate, all V-shaped groove lines penetrate through the whole plate in parallel, and the distance is about 15 mm.

Compared with the prior art, the beneficial effects of the utility model are that: when heating, the circuit is electrified, the temperature rises, and the heat heats the lower surface of the graphene temperature-equalizing layer through the insulating heat-conducting partition plate; after the lower surface receives heat, the uneven heat at each position is transversely and rapidly conducted, and the horizontal permeability 'smearing' diffusion of the temperature is efficiently completed; the upper surface of the graphene temperature-equalizing layer conducts heat with substantially uniform temperature to the upper surface plate of the tray, and the temperature of the lower surface of the upper surface plate of the tray is very uniform; the tray upper surface board transmits the further even heat conduction of temperature to tray upper surface board top surface again, accomplishes soaking conduction process for the even heating effect of hot plate promotes.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

In the figure: 1. a soaking tray body; 11. an upper surface plate of the tray; 12. a graphene temperature equalization layer; 13. an insulating heat-conducting partition plate; 14. an interlayer heating circuit; 15. a bottom heat-preservation pressing plate; 2. high accuracy temperature sensor.

The drawings are for illustrative purposes only and are not to be construed as limiting the patent; for the purpose of better illustrating the embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1, a temperature difference control glue homogenizing developing and heating unit comprises a soaking tray body 1, wherein the soaking tray body 1 is divided into a tray upper surface plate 11, a graphene temperature equalizing layer 12, an insulating heat conducting partition plate 13, an interlayer heating circuit 14 and a bottom heat preservation pressing plate 15, the tray upper surface plate 11, the graphene temperature equalizing layer 12, the insulating heat conducting partition plate 13, the interlayer heating circuit 14 and the bottom heat preservation pressing plate 15 are sequentially arranged from top to bottom, the bottom heat preservation pressing plate 15 is arranged below the interlayer heating circuit 14, and all plate layers are assembled into a whole. The tray upper surface plate 11, the graphene temperature-equalizing layer 12, the insulating heat-conducting partition plate 13, the interlayer heating circuit 14 and the bottom heat-insulating pressing plate 15 are pressed into a 'five-mingzhi' structure. The five-mingming one, three and five three layers are axially penetrated by process holes, the graphene temperature equalizing layer 12 is also punched, and because the graphite radiating fins are close to the vertical and horizontal heat conduction characteristics of the graphene material, the graphite and the graphene are combined and discussed in the patent, and the process holes and the temperature sampling hole positions are selected to be balanced and symmetrically distributed as much as possible, so that the heat conduction layer can conduct symmetrically and conduct heat uniformly. The surface of the tray upper surface plate 11 is a wafer heating surface, and the tray upper surface plate 11 is made of materials with good heat conduction effect, such as but not limited to copper, aluminum, stainless steel, various alloys and the like, so that the heat conduction speed is increased; at present, the performance of graphene of various manufacturers can reach the horizontal heat conductivity coefficient of 1000W/(mK) -10W/(mK) in the vertical direction, the difference of each direction reaches two orders of magnitude, the graphene is a soaking material with very ideal direction selectivity, and the thickness of the graphene cannot be too thick so as to ensure the heat conduction speed in the vertical direction;

fixing a high-precision temperature sensor 2 on the superficial position of the upper surface of the tray upper surface plate 11 for temperature sampling; the high-precision temperature sensor 2 and the heating circuit 14 are connected to the controller, the controller is used for uniformly controlling the temperature, the heating circuit can be drawn to be fine and uniform as appropriate as possible, process holes are reasonably avoided, and the initial heating source is guaranteed to be uniform as much as possible; the insulating and heat conducting partition plate 13 is made of a material having insulating properties and good heat conduction, and includes, but is not limited to, hard aluminum oxide material and the like. The interlayer heating circuit 14 is selected from, but not limited to, an alloy metal film with a film thickness <100 uM. The bottom heat-preservation pressure plate 15 has insulation performance and is sprayed with a heat-insulation coating so as to reduce heat radiation around the opposite side, simplify boundary conditions and reduce heat waste. Supporting legs are arranged at the edges of the supporting legs to ensure the positioning and the supporting of the tray body. The inner surfaces of the upper surface plate of the tray and the insulating heat-conducting partition plate are required to be very flat and smooth so as to ensure that heat conduction is finished in a seamless, gapless and gapless manner. In order to ensure that no air gap exists, the problem of air bubbles generated when the graphene sheet is crimped on the tray upper surface plate 11 and the insulating heat-conducting partition plate 13 is solved, the contact surface of the tray upper surface plate 11 and the insulating heat-conducting partition plate 13 is provided with 0.1-0.2 mm deep V-shaped groove air guides, all V-shaped groove lines penetrate through the whole plate in parallel, the distance is about 15mm, the parallel lines of the two plates are perpendicular to each other, so that air bubbles stored in the tray can be discharged through the air guide grooves, and meanwhile, the heat transfer guide of the insulating heat-conducting partition plate 13 is perpendicular to the heat transfer guide of the tray upper surface plate 11, so that comprehensive and uniform heat conduction is ensured.

When heating, the circuit is electrified, the temperature rises, and the heat heats the lower surface of the graphene uniform temperature layer 12 through the insulating heat-conducting partition plate 13; after the lower surface receives heat, the uneven heat at each position is transversely and rapidly conducted, and the horizontal permeability 'smearing' diffusion of the temperature is efficiently completed; the upper surface of the graphene temperature-equalizing layer 12 conducts heat with substantially uniform temperature to the tray upper surface plate 11, and the temperature of the lower surface of the tray upper surface plate 11 is very uniform; the tray upper surface plate 11 conducts the heat with further uniform temperature to the top surface of the tray upper surface plate 11 to complete the soaking conduction process.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a temperature difference control is even glued and is developed heating unit, includes soaking disk body (1), its characterized in that: soaking disk body (1) divide into tray upper surface board (11), graphite alkene samming layer (12), insulating heat conduction baffle (13), intermediate layer heating circuit (14) and bottom heat preservation clamp plate (15), tray upper surface board (11), graphite alkene samming layer (12), insulating heat conduction baffle (13), intermediate layer heating circuit (14) set gradually with bottom heat preservation clamp plate (15) from the top down, and the surface of tray upper surface board (11) is the wafer heating surface, and tray upper surface board (11) upper surface shallow table department fixes high accuracy temperature sensor (2).

2. The temperature difference controlled spin coating developing and heating unit according to claim 1, wherein: the tray comprises a tray upper surface plate (11), a graphene temperature equalization layer (12), an insulating heat conduction partition plate (13), an interlayer heating circuit (14) and a bottom heat preservation pressing plate (15) which are pressed into a structure of 'Wumingzhi'.

3. The temperature difference controlled spin coating developing and heating unit according to claim 1, wherein: the interlayer heating circuit (14) is an alloy metal film, and the thickness of the film is less than 100 uM.

4. The temperature difference controlled spin coating developing and heating unit according to claim 1, wherein: the bottom heat-preservation pressing plate (15) has insulation performance and is sprayed with a heat-insulation coating.

5. The temperature difference controlled spin coating developing and heating unit according to claim 2, wherein: the Wumingzhi one, three and five layers are axially penetrated by functional process holes, and the graphene temperature-equalizing layer (12) is also punched.

6. The temperature difference controlled spin coating developing and heating unit according to claim 1, wherein: and V-shaped groove air guides with the depth of 0.1-0.2 mm are arranged on the contact surfaces of the tray upper surface plate (11) and the insulating heat-conducting partition plate (13), all V-shaped groove lines penetrate through the whole plate in parallel, and the distance is about 15 mm.