CN213988841U

CN213988841U - Batch type wet etching equipment

Info

Publication number: CN213988841U
Application number: CN202120138106.3U
Authority: CN
Inventors: 吴镐硕; 朴灵绪
Original assignee: Suzhou Enteng Semiconductor Technology Co ltd
Current assignee: Suzhou Enteng Semiconductor Technology Co ltd
Priority date: 2021-01-19
Filing date: 2021-01-19
Publication date: 2021-08-17
Anticipated expiration: 2031-01-19

Abstract

The utility model provides a batch wet etching device, which comprises a tank body, a liquid supply pipeline, an inert gas pipeline, a bracket and a bearing; one end of the liquid supply pipeline is communicated with the etching liquid source, and the other end of the liquid supply pipeline is communicated with the groove body; the inert gas pipeline is positioned in the tank body and at the lower part of the tank body and communicated with an inert gas source, and an air inlet hole is arranged on the inert gas pipeline to supply inert gas into the etching liquid so as to bubble the etching liquid upwards; the bracket is positioned outside the tank body, the bearing is fixed on the bracket, and the inert gas pipeline is connected with the bearing; when the driving bearing rotates, the bearing drives the inert gas pipeline to move so as to change the position of the inert gas pipeline. The utility model discloses under the condition that need not equipment and shut down, it is internal that the staff need not to enter the groove, can adjust the position of the inert gas pipeline in the cell body outside the cell body to distribution of distribution adjustment etching liquid through improving inert gas improves sculpture homogeneity and equipment output rate and improves occupational environment security.

Description

Batch type wet etching equipment

Technical Field

The utility model relates to a silicon wafer preparation technical field especially relates to a batch type wet etching equipment.

Background

In the wafer preparation process, damaged layers (Damage layers) with different depths generated in the mechanical processing processes of cutting, grinding and the like are removed through etching. Because the wafer is subjected to cutting, edge grinding, plane grinding and other steps, a processing deteriorated layer is generated on the surface and the edge of the wafer, and the etching process is to prevent impurities such as slag and the like from remaining on the wafer. If the damaged layer remains on the wafer, the subsequent device preparation quality is greatly influenced, so that the damaged layer needs to be removed, and most of the damaged layer is removed by adopting a chemical etching method. KOH, NaOH or HF/HNO3 and additives are used in the chemical etching, and the device mainly used in the chemical etching comprises a nozzle and an etching groove.

Acid etching is one of the etching processes, which is isotropic etching, i.e., the etching rate is equal along each crystal direction during etching. The etchant commonly used in wafer etching mainly consists of HNO3, HF and additive, or CH3COOH or H3PO and surfactant. The acid etching substantially proceeds through two stages, the first stage is to generate an oxide film on the wafer surface due to the oxidation of the HNO3, and the second stage is to remove the oxide film by HF, i.e., the HNO3 is to generate an oxide film and HF is to be used as a solvent to dissolve the oxide film. The typical removal amount of the acid etching is 20-30 μm, which determines the surface flatness of the wafer. If the flatness after acid etching is not good, it has a direct influence on the quality of the final product, so the flatness after acid etching and the wafer-to-wafer uniformity in batch type (50 wafers per batch) etching are important in process management.

The etching equipment mainly comprises an etching tank and a cleaning tank, wherein a tank barrel (barrel) capable of conveying 50 wafers at one time is arranged in the etching tank, and an N2 bubble tube is arranged at the bottom of the tank. To ensure uniformity of surface flatness, all chemical components were metered in a predetermined amount, and to ensure the same amount of etching at the center and periphery of the wafer, bubbles were bubbled up from the bottom of the etching tank through an N2 bubble vial. The distance, diameter, number, etc. of the bottom and the holes will have a decisive influence on the flatness of the wafer surface.

In the etching process, due to the reasons of abrasion on a structure in an etching tank, external vibration and the like, the flow direction of an etchant is uneven, the etching flatness is possibly reduced, in order to solve the problems, the etchant in the etching tank is discharged and is cleaned by deionized water, workers can enter the etching tank to manually adjust the position of a bubble tube, the time from the adjustment to the restart of equipment is usually more than 12 hours, toxic gas volatilized from the etchant can harm the health of the workers, and meanwhile, the equipment is stopped for a long time to reduce the yield of the equipment.

SUMMERY OF THE UTILITY MODEL

In view of the above shortcoming of the prior art, the utility model aims to provide a batch type wet etching equipment, be arranged in solving current batch type wet etching equipment, because reasons such as structural wearing and tearing and external vibration in the etching groove, can lead to the flow direction of etchant inhomogeneous, can lead to the sculpture flatness to descend, for improving this type of problem, etchant in the etching groove discharges and can send the staff to advance to carry out manual adjustment to the position of bubble tube in the etching groove after deionized water washs, it usually needs more than 12 hours to adjust to equipment restart, the toxic gas that volatilizees in the remaining etchant during this period probably harms staff's health, shut down for a long time simultaneously and cause equipment output rate decline scheduling problem.

In order to achieve the above and other related objects, the present invention provides a batch wet etching apparatus, which comprises a tank, a liquid supply pipeline, an inert gas pipeline, a support and a bearing; one end of the liquid supply pipeline is communicated with an etching liquid source, and the other end of the liquid supply pipeline is communicated with the tank body so as to supply etching liquid into the tank body; the inert gas pipeline is positioned in the tank body, positioned at the lower part of the tank body and communicated with an inert gas source, and is provided with an air inlet hole for supplying inert gas into the etching liquid so as to enable the etching liquid to bubble upwards; the support is located outside the cell body, the bearing is fixed on the support, the inert gas pipeline is connected with the bearing, and when the bearing is driven to rotate, the bearing drives the inert gas pipeline to move so as to change the position of the inert gas pipeline.

Optionally, the inert gas pipeline is connected with the bearing through a connecting rod, and the connecting rod extends to the outside of the tank body from the bottom of the tank body along the side wall of the tank body.

Optionally, the bearing comprises a plastic bearing.

Optionally, the batch-type wet etching apparatus further includes a handle, and the handle is connected to the bearing to drive the bearing to rotate through the handle.

Optionally, the batch-type wet etching apparatus further includes a motor, and the motor is connected to the bearing to drive the bearing to rotate when necessary.

Optionally, the inert gas pipeline is provided with a plurality of gas inlets, and the plurality of gas inlets are uniformly distributed at intervals.

Optionally, the inert gas pipeline is provided with a plurality of inert gas pipelines which are distributed at intervals in parallel.

Optionally, the batch wet etching apparatus further includes a heater and a temperature control device, the heater is located in the tank, and the temperature control device is connected to the heater.

As mentioned above, the utility model provides a batch type wet etching equipment has following beneficial effect: the utility model discloses through the structural design who improves, set up the adjusting device who is connected with the inert gas pipeline outside the cell body to when needs, under the condition that need not equipment shut down, it is internal that the staff need not to enter the cell body, can adjust the position of the inert gas pipeline in the cell body outside the cell body, with the distribution of distribution adjustment etching liquid through improving inert gas, improve etching homogeneity, improve equipment output rate and improve occupational environment security.

Drawings

Fig. 1 is a schematic view of a top view structure of a batch-type wet etching apparatus according to the present invention.

Fig. 2 is a schematic view of the batch-type wet etching apparatus according to the present invention.

Description of the element reference numerals

11 trough body

12 liquid supply pipeline

13 inert gas line

14 support

15 handle

Detailed Description

The following description is provided for illustrative purposes, and other advantages and features of the present invention will become apparent to those skilled in the art from the following detailed description.

Please refer to fig. 1 and fig. 2. It should be understood that the structure, ratio, size and the like shown in the drawings attached to the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by those skilled in the art, and are not used for limiting the limit conditions that the present invention can be implemented, so that the present invention has no technical essential meaning, and any structure modification, ratio relationship change or size adjustment should still fall within the scope covered by the technical content disclosed in the present invention without affecting the function and the achievable purpose of the present invention. Meanwhile, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for convenience of description, and are not intended to limit the scope of the present invention, and changes or adjustments of the relative relationship thereof may be made without substantial technical changes.

As shown in fig. 1 and 2, the present invention provides a batch wet etching apparatus, which includes a tank 11, a liquid supply pipeline 12, an inert gas pipeline 13, a support 14, and a bearing (not shown); the tank body 11 is used for bearing etching liquid and a substrate to be etched, such as a wafer, and a tank cover can be arranged on the surface of the tank body 11 to reduce the volatilization of acid gas; the liquid supply pipeline 12 is connected with an etching liquid source (not shown) at one end and with the tank 11 at the other end, so as to supply etching liquid into the tank 11, wherein the etching liquid may be acidic etching liquid, including but not limited to HNO3, HF and additive, or liquid composed of CH3COOH or H3PO and surfactant; the inert gas pipeline 13 is positioned in the tank body 11 and at the lower part of the tank body 11 and is communicated with an inert gas source, such as a nitrogen gas source, an air inlet hole is formed in the inert gas pipeline 13, and when inert gas enters etching liquid through the air inlet hole, the etching liquid bubbles upwards so that the etching liquid is uniformly dispersed on the surface of the substrate to be etched, so that the distribution uniformity of the etching liquid is improved, and the etching uniformity is improved; the bracket 14 is positioned outside the tank body 11 and can be fixed on the outer wall of the tank body 11, the bearing is fixed on the bracket 14, and the inert gas pipeline 13 is connected with the bearing; when the bearing is driven to rotate, the bearing drives the inert gas pipeline 13 to move so as to change the position of the inert gas pipeline 13, so that the distribution of inert gas is changed, the distribution (flow direction distribution and concentration distribution) of etching liquid can be adjusted, and the etching uniformity is improved. The utility model discloses through the structural design who improves, set up the adjusting device who is connected with the inert gas pipeline outside the cell body to when needs, shut down and the staff need not to enter under the internal circumstances of groove at need equipment, can adjust the position of the inert gas pipeline in the cell body outside the cell body, distribute with the distribution adjustment etching liquid through improving inert gas, improve etching homogeneity, improve equipment output rate and improve occupational environment security.

In order to avoid corrosion by corrosive gas volatilized by the etching liquid, the bearing needs to have better corrosion resistance. Preferably, the bearing is a plastic bearing.

As an example, the inert gas line 13 is connected to the bearing through a connecting rod extending from the bottom of the tank 11 to the outside of the tank 11 along the sidewall of the tank 11, whereby the inert gas line 13 can be adjusted more flexibly. Of course, in other examples, the inert gas pipe 13 may be connected to the bearing by other suitable mechanical connection methods, and is not limited in particular.

In order to drive the bearing, in one example, the batch type wet etching apparatus further includes a handle 15, and the handle 15 is connected to the bearing so as to drive the bearing to rotate through the handle 15. The handle 15 may be a composite material with a metal surface coated with an anti-corrosion protective layer.

In another example, the batch-type wet etching apparatus further includes a motor connected to the bearing to drive the bearing to rotate when necessary. I.e. by electrically driving the bearings and a remote control may be provided to keep the operator as far away from the etching environment as possible. Of course, in other examples, the handle 15 and the motor may be provided at the same time, and this embodiment is not limited strictly.

The inert gas pipe 13 is single or multiple, preferably multiple, and when multiple, the multiple inert gas pipes 13 are distributed in parallel at intervals. And more specifically, the length of the inert gas pipe 13 extends parallel to the substrate to be etched, such as the wafer arrangement direction, and a plurality of inert gas pipes 13 are distributed at intervals along the radial direction of the wafer. The inert gas pipeline 13 is provided with a plurality of air inlets which are uniformly distributed at intervals so as to bubble upwards uniformly, so that the etching liquid is uniformly distributed on the surface of the wafer, and the etching uniformity is improved. And when needed, the position of the inert gas pipeline 13 is adjusted through the bearing, the distribution of the inert gas is changed, and therefore the distribution of the etching liquid is changed.

In order to enable the etching solution to work at a suitable temperature, the batch-type wet etching apparatus further includes a heater and a temperature control device (not shown), the heater is located in the tank, and the temperature control device is connected to the heater, so as to flexibly adjust the temperature of the etching solution according to the process requirement.

To sum up, the utility model provides a batch wet etching device, which comprises a tank body, a liquid supply pipeline, an inert gas pipeline, a bracket and a bearing; one end of the liquid supply pipeline is communicated with an etching liquid source, and the other end of the liquid supply pipeline is communicated with the tank body so as to supply etching liquid into the tank body; the inert gas pipeline is positioned in the tank body, positioned at the lower part of the tank body and communicated with an inert gas source, and is provided with an air inlet hole for supplying inert gas into the etching liquid so as to enable the etching liquid to bubble upwards; the support is located outside the cell body, the bearing is fixed on the support, the inert gas pipeline is connected with the bearing, and when the bearing is driven to rotate, the bearing drives the inert gas pipeline to move so as to change the position of the inert gas pipeline. The utility model discloses through the structural design who improves, set up the adjusting device who is connected with the inert gas pipeline outside the cell body to when needs, under the condition that need not equipment shut down, it is internal that the staff need not to enter the cell body, can adjust the position of the inert gas pipeline in the cell body outside the cell body, with the distribution of distribution adjustment etching liquid through improving inert gas, improve etching homogeneity, improve equipment output rate and improve occupational environment security. Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.

The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims

1. A batch type wet etching device is characterized by comprising a tank body, a liquid supply pipeline, an inert gas pipeline, a bracket and a bearing; one end of the liquid supply pipeline is communicated with an etching liquid source, and the other end of the liquid supply pipeline is communicated with the tank body so as to supply etching liquid into the tank body; the inert gas pipeline is positioned in the tank body, positioned at the lower part of the tank body and communicated with an inert gas source, and is provided with an air inlet hole for supplying inert gas into the etching liquid so as to enable the etching liquid to bubble upwards; the bracket is positioned outside the tank body, the bearing is fixed on the bracket, and the inert gas pipeline is connected with the bearing; when the bearing is driven to rotate, the bearing drives the inert gas pipeline to move so as to change the position of the inert gas pipeline.

2. The batch type wet etching equipment as claimed in claim 1, wherein the inert gas pipeline is connected with the bearing through a connecting rod, and the connecting rod extends from the bottom of the tank body to the outside of the tank body along the side wall of the tank body.

3. The batch-type wet etching apparatus of claim 1, wherein the bearing comprises a plastic bearing.

4. The batch type wet etching apparatus of claim 1, further comprising a handle connected to the bearing to drive the bearing to rotate through the handle.

5. The batch type wet etching apparatus according to claim 1, further comprising a motor connected to the bearing to drive the bearing to rotate when necessary.

6. The batch type wet etching equipment according to claim 1, wherein the inert gas pipeline has a plurality of gas inlet holes, and the plurality of gas inlet holes are uniformly distributed at intervals.

7. The batch type wet etching equipment according to claim 1, wherein the inert gas pipeline is a plurality of inert gas pipelines, and the inert gas pipelines are distributed at intervals in parallel.

8. The batch-type wet etching equipment as claimed in claim 1, further comprising a heater and a temperature control device, wherein the heater is located in the tank body, and the temperature control device is connected with the heater.