CN213988832U - Cleaning brush for semiconductor element and cleaning device thereof - Google Patents
Cleaning brush for semiconductor element and cleaning device thereof Download PDFInfo
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- CN213988832U CN213988832U CN202022951158.0U CN202022951158U CN213988832U CN 213988832 U CN213988832 U CN 213988832U CN 202022951158 U CN202022951158 U CN 202022951158U CN 213988832 U CN213988832 U CN 213988832U
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Abstract
The application provides a cleaning brush for a semiconductor element and a cleaning device thereof. The cleaning brush has a rotation center, and in the direction of the rotation center, the cleaning brush is formed with an intermediate segment and an edge segment adjoining the intermediate segment, and the maximum outer diameter of the cross section of the edge segment is larger than the maximum outer diameter of the cross section of the intermediate segment. According to the cleaning brush for the semiconductor element and the cleaning device of the cleaning brush, the maximum outer diameter of the cross section of the edge section of the cleaning brush is larger than the maximum outer diameter of the cross section of the middle section of the cleaning brush, so that the uniformity of the cleaning effect of the cleaning brush on the semiconductor element can be effectively improved.
Description
Technical Field
The application relates to the technical field of semiconductor manufacturing, in particular to a cleaning brush for a semiconductor element and a cleaning device of the cleaning brush.
Background
In semiconductor manufacturing technology, a Chemical Mechanical Polishing (CMP) process is often used to planarize the surface of a semiconductor device, such as a wafer or a substrate, however, after the CMP process, surface contaminants, such as compounds, particles, and metal impurities, often remain on the surface of the semiconductor device, and these surface contaminants will affect the next process for processing the semiconductor device, and thus affect the performance and reliability of the semiconductor product. For this reason, the semiconductor element needs to be brushed after the CMP process to remove surface contaminants.
In the prior art, a cleaning brush is generally used for cleaning the semiconductor element, and during the cleaning process, the linear velocity of the central area of the semiconductor element is smaller than that of the edge area, so that the central area of the semiconductor element is frequently contacted with the cleaning brush, and the central area of the semiconductor element is excessively cleaned relative to the edge area.
SUMMERY OF THE UTILITY MODEL
In view of the above, it is desirable to provide a cleaning brush for a semiconductor element and a cleaning device thereof, so as to solve the problem of over-cleaning a central area of the semiconductor element relative to an edge area.
In order to achieve the above object, an aspect of the embodiments of the present application provides a cleaning brush for cleaning a semiconductor element in rotation, characterized in that the cleaning brush has a rotation center, and is formed with an intermediate segment and edge segments adjacent to both ends of the intermediate segment in a direction of the rotation center, and a maximum outer diameter of a cross section of the edge segments is larger than a maximum outer diameter of a cross section of the intermediate segment.
Further, the diameter of the cross section of the edge section is gradually increased from one end close to the middle section to the outside.
Further, the cleaning brush includes a cleaning brush body and a convex body formed on the cleaning brush body, the convex body being used for cleaning the semiconductor element.
Furthermore, the included angle between the common tangent plane of the maximum section and the minimum section of the cleaning brush body of the edge section and the rotation center is alpha, and alpha is more than or equal to 5 degrees and less than or equal to 60 degrees; and/or the presence of a gas in the gas,
the radius difference value of the maximum section and the minimum section of the cleaning brush body of the edge section is D, and D is larger than or equal to 1mm and smaller than or equal to 15 mm; and/or the presence of a gas in the gas,
the convex body is cylindrical, truncated cone-shaped or polygonal.
Further, the cleaning brush body includes the pivot and cup joints in the epaxial sleeve of pivot, the convex body forms on the sleeve.
Further, the maximum outer diameter of the section of the edge section of the rotating shaft is larger than the maximum outer diameter of the section of the middle section.
The cleaning brush provided by the embodiment of the application can effectively ensure the uniformity of the cleaning effect of the cleaning brush on the semiconductor element by setting the maximum outer diameter of the section of the edge section to be larger than the maximum outer diameter of the section of the middle section, so that the surface of the semiconductor element is more uniform.
Another aspect of the embodiments of the present application provides a cleaning apparatus, including:
a support assembly for supporting the semiconductor element, the semiconductor element being rotatable;
the cleaning brush according to any of the above embodiments, wherein the cleaning brush is provided on both side surfaces of the semiconductor element, and a holding force of the edge section of the cleaning brush to the semiconductor element on both sides is larger than a holding force of the intermediate section to the semiconductor element; and
the first driving assembly is used for driving the cleaning brush to rotate.
Further, each of the semiconductor elements corresponds to at least one pair of the cleaning brushes, and the rotation centers of each pair of the cleaning brushes are parallel to each other.
Further, the supporting assembly comprises a second driving assembly and a roller, the second driving assembly drives the roller to rotate, and the roller is in contact with the outer edge of the semiconductor element to drive the semiconductor element to rotate.
Furthermore, a groove is formed on the roller, and the semiconductor element is clamped in the groove; and/or the presence of a gas in the gas,
the number of the rollers is at least two.
According to the cleaning device provided by the embodiment of the application, the maximum diameter of the middle section of the cleaning brush is smaller than the maximum diameter of the edge section, so that when the semiconductor element is clamped between the cleaning brushes, the received clamping force of the central area is smaller than the received clamping force of the edge area, and the uniformity of the cleaning effect of the cleaning brush on the semiconductor element is effectively improved.
Drawings
FIG. 1 is a front view of one direction of a washing brush according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of a cleaning apparatus according to an embodiment of the present application; and
fig. 3 is a front view of an orientation of a cleaning device according to an embodiment of the present disclosure.
Description of reference numerals:
1. cleaning brushes; 11. a middle section; 12. an edge segment; 13. a cleaning brush body; 131. a rotating shaft; 132. a sleeve; 14. a convex body; 15. a center of rotation;
2. a support assembly; 21. a roller; 211. a groove; 3. a first drive assembly; 4. a cleaning liquid supply assembly; 41. a liquid spraying pipe;
100. a semiconductor device is provided.
Detailed Description
It should be noted that, in the present application, technical features in examples and embodiments may be combined with each other without conflict, and the detailed description in the specific embodiment should be understood as an explanation of the gist of the present application and should not be construed as an improper limitation to the present application.
The directional terms in the description of the present application are used for convenience in describing the present application and for simplicity in description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present application.
In the prior art, in a CMP process, after a polishing process of a semiconductor element, such as a wafer, is completed, the semiconductor element often needs to be cleaned to wash away residues of substances, such as polishing solution, on the surface of the semiconductor element, so as to prevent the residues from corroding the surface of the semiconductor element in a subsequent process, and meanwhile, through a cleaning effect of a cleaning brush, the surface height of the semiconductor element can be more uniform, so that the subsequent related process can be conveniently and normally performed. However, in the cleaning brush in the related art, since the linear velocity of the area of the semiconductor element close to the rotation axis is small relative to the edge area and the number of times of contact with the cleaning brush is large during the cleaning, when the cleaning of the edge area of the semiconductor element is completed, there is a problem of over-cleaning of the surface of the area of the semiconductor element close to the rotation axis, and charges are likely to accumulate, causing a problem that the center position of the semiconductor element is higher than the edge position.
In view of the above, referring to fig. 1 to 3, an aspect of the present invention provides a cleaning brush for cleaning a rotating semiconductor device 100. The brush 1 has a rotation center 15, and the brush 1 is formed with an intermediate segment 11 and edge segments 12 adjacent to both ends of the intermediate segment 11 in the direction of the rotation center 15, the maximum outer diameter of the cross section of the edge segment 12 being larger than the maximum outer diameter of the cross section of the intermediate segment 11.
Accordingly, when the washing brush 1 is brought into contact with the surface of the semiconductor element 100 by the pushing force, since the maximum outer diameter of the cross section of the peripheral section 12 of the washing brush 1 is larger than the maximum outer diameter of the cross section of the intermediate section 11, the holding force of the peripheral section 12 of the washing brush 1 to the peripheral area of the semiconductor element 100 is larger than the holding force of the intermediate section 11 to the central area of the semiconductor element 100, so that although the number of times the surface of the semiconductor element 100 near the rotation axis area is in contact with the intermediate section 11 of the washing brush 1 is larger than the number of times the peripheral area of the semiconductor element 100 is in contact with the peripheral section 12 of the washing brush 1 during the rotation of the semiconductor element 100 relative to the washing brush 1, under the same external force, since the holding force received by the central area of the semiconductor element 100 is smaller than the holding force received by the peripheral area, by rationally setting the number of the maximum outer diameters of the intermediate section 11 and the peripheral section 12 of the washing brush 1, and selecting an appropriate positive pressure between the cleaning brush 1 and the semiconductor element 100 makes it possible to effectively balance the number of times of contact between the areas of the surface to be cleaned of the semiconductor element 100 and the clamping force to ensure uniformity of the cleaning action of the cleaning brush 1 on the surface to be cleaned of the semiconductor element 100, so that the height of the surface of the semiconductor element 100 is made more uniform.
According to the cleaning brush 1 of the embodiment of the present application, by setting the maximum outer diameter of the cross section of the edge section 12 to be larger than the maximum outer diameter of the cross section of the intermediate section 11, so that the clamping force applied to the central area of the semiconductor element 100 is smaller than the clamping force applied to the edge area, and by appropriately setting the numerical values of the maximum outer diameters of the edge section 12 and the intermediate section 11 of the cleaning brush 1, the uniformity of the cleaning action of the cleaning brush 1 on the semiconductor element 100 can be effectively ensured, thereby making the surface of the semiconductor element 100 more uniform.
It should be noted that the shape of the semiconductor element 100 may be circular, rectangular or other irregular shape as long as the surface to be cleaned of the semiconductor element 100 can be rotated with respect to the brush 1 so that the semiconductor element 100 is continuously contacted with the brush 1 along the area of the semiconductor element 100 near the rotation axis toward the peripheral area, and at this time, if the holding force of the brush 1 to each area of the semiconductor element 100 is the same, the cleaning action of the brush 1 to the area of the semiconductor element 100 near the center is always greater than the cleaning action to the peripheral area during the cleaning.
Further, in one embodiment, referring to FIG. 1, the present application provides a washing brush in which the diameter of the cross-section of the rim section 12 gradually increases from the end near the middle section 11 to the outside. Specifically, the generatrix of the edge segment 12 may be in various shapes such as a straight line, a convex curve or a concave curve, and the generatrixes with different shapes correspond to different surface shapes of the edge segment 12. It can be understood that by providing the diameter of the edge section 12 to be gradually increased so that the outer diameter of the edge section 12 is more smoothly transited, when the washing brush 1 is brought into contact with the semiconductor element 100 under a certain positive pressure, the holding force of the washing brush 1 to the surface of the semiconductor element 100 is more smoothly transited from the edge section 12 to the intermediate section 11 of the washing brush 1 so that the washing action of the washing brush 1 to the semiconductor element 100 is more uniform.
Further, referring to fig. 1 to 3, in one embodiment, the present application provides a washing brush including a washing brush body 13 and a convex body 14 formed on the washing brush body 13, the convex body 14 being used for washing the semiconductor element 100. It can be understood that by providing the convex bodies 14, the convex bodies 14 are brought into contact with the semiconductor element 100 during the rotation of the washing brush 1 relative to the semiconductor element 100, thereby further facilitating the removal of the contaminants remaining on the surface of the semiconductor element 100.
Preferably, the convex bodies 14 are made of PVA (polyvinyl Alcohol) material, and since PVA has unique strong adhesiveness, film flexibility, smoothness, oil resistance, solvent resistance, protective colloid property, gas barrier property, abrasion resistance, and water resistance by special treatment, by manufacturing the convex bodies 14 using PVA, residues on the surface of the semiconductor element 100 can be sufficiently washed away without scratching the surface of the semiconductor element 100.
In one embodiment, referring to fig. 1, the present application provides a washing brush in which an angle α between a common tangent plane of the largest cross section and the smallest cross section of the washing brush body 13 of the edge segment 12 and the rotation center 15 is 5 ° or more and 60 ° or less, for example, α may be 5 °, 10 °, 15 °, 20 °, 30 °, 45 °, 50 °, 60 °, or the like. It is understood that the larger the value of α, the larger the ratio of the pressing force received by the peripheral area to the pressing force received by the central area of the surface of the semiconductor element 100 at the same positive pressure between the washing brush 1 and the semiconductor element 100, and that the uniformity of the washing action of the washing brush 1 on the surface of the semiconductor element 100 can be effectively improved by appropriately selecting the value of α in accordance with the size of the semiconductor element 100 and its own rotation speed.
In one embodiment, referring to figure 1, the application provides a washing brush in which the difference between the radius of the maximum section and the radius of the minimum section of the washing brush body 13 of the edge segment 12 is D, and D is more than or equal to 1mm and less than or equal to 15mm, for example, D can be 1mm, 3mm, 5mm, 7mm, 9mm, 10mm, 12mm or 15mm, etc. It will be understood that the greater the value of D, the longer the corresponding length of the edge section 12, at the same included angle α, and that in practical applications the values of α and D can be chosen according to the size of the semiconductor element 100 and the overall size of the washing brush 1, so as to make the washing action of the washing brush 1 on the surface of the semiconductor element 100 more uniform.
In one embodiment, the present application provides a washing brush in which the shape of the convex bodies 14 is a cylindrical shape, a truncated cone shape, or a polygonal prism shape, as shown in fig. 1, which is a schematic view in which the convex bodies 14 are all cylindrical. Specifically, the shapes of the projections 14 of the same brush 1 may be the same, or may be a mixture of a plurality of shapes. The shape of the convex body 14 is set to improve the fatigue resistance of the convex body 14, thereby improving the service life thereof.
Further, in an embodiment, referring to fig. 1 and 2, the present application provides a washing brush, wherein the washing brush body 13 includes a rotation shaft 131 and a sleeve 132 sleeved on the rotation shaft 131, and the convex body 14 is formed on the sleeve 132. It is understood that the washing brush 1 is subjected to various degrees of abrasion of the bosses 14 of the washing brush 1 due to the frictional action between the bosses 14 and the semiconductor element 100 during the washing of the semiconductor element 100, and when the abrasion is worn to a certain degree, the washing brush 1 needs to be replaced in order to satisfy the normal washing action. For this reason, by dividing the washing brush body 13 into the rotation shaft 131 and the sleeve 132 and disposing the convex body 14 on the sleeve 132, when the convex body 14 is worn to a certain extent and needs to be replaced, only the sleeve 132 needs to be replaced without replacing the whole washing brush 1, and the utilization rate of the material is improved. In addition, the sleeve 132 is a wearing part, and the sleeve 132 is sleeved on the rotating shaft 131, so that only the sleeve 132 needs to be replaced each time of replacement, and the cost of the wearing part is reduced.
Further, in one embodiment, the present application provides a washing brush in which the maximum outer diameter of the section of the rim section 12 of the rotation shaft 131 is larger than the maximum outer diameter of the section of the middle section 11. At this time, the thickness of the sleeve 132 may be uniform, and the shape of the inner surface thereof may be matched with the shape of the outer surface of the rotation shaft 131. As shown in fig. 1, the edge sections 12 of the spindle 131 and the sleeve 132 are both conically arranged. When the sleeve 132 is made of a material having a certain elasticity, such as PVA material, the inner surface of the sleeve 132 may be cylindrical, and the thickness of the sleeve 132 may be uniform. The machining of the sleeve 132 is facilitated by providing a variation of the section of the edge segment 12 of the washing brush 1 on the spindle 131.
In an alternative embodiment, it is also possible to provide the washing brush provided by the present application in which the rotation shaft 131 is cylindrical and the thickness of the border segment 12 provided with the sleeve 132 is gradually increased from the end close to the middle segment 11 outwards, the variation in the size of the cross section of the border segment 12 of the washing brush 1 being represented only by the thickness of the sleeve 132, in which case the uniformity of the washing action of the washing brush 1 on the semiconductor elements 100 is still improved.
In another aspect of the embodiments of the present application, referring to fig. 2 and 3, a cleaning device for semiconductor elements includes a supporting assembly 2, a cleaning brush 1 provided in any one of the embodiments, and a first driving assembly 3. The support assembly 2 is used to support the semiconductor element 100, and the semiconductor element 100 can rotate. Both side surfaces of the semiconductor element 100 are provided with the cleaning brushes 1, and the holding force of the edge sections 12 of the cleaning brushes 1 on both sides to the semiconductor element 100 is larger than the holding force of the middle section 11 to the semiconductor element 100. The first driving assembly 3 is used for driving the washing brush 1 to rotate. It is understood that the semiconductor device 100 may rotate relative to the supporting component 2, or rotate together with the supporting component 2.
Specifically, the first drive assembly 3 drives the brush 1 to rotate about its own rotation center 15 while the semiconductor element 100 rotates about its own rotation axis, and in this process, the holding force between the surface of the semiconductor element 100 near the central area and the brush 1 is small compared with the holding force between the peripheral area and the brush 1, and the number of times the central area of the semiconductor element 100 makes contact with the brush 1 is large compared with the number of times the peripheral area makes contact with the brush 1, and by properly arranging the holding forces, the same cleaning action can be obtained in the central area and the peripheral area of the semiconductor element 100, thereby improving the uniformity of the cleaning action of the brush 1 on the surface of the semiconductor element 100.
Fig. 2 and 3 are schematic structural views showing an example of the cleaning apparatus for a semiconductor element in which the semiconductor element 100 is vertically placed, and at this time, the cleaning brushes 1 are held on both sides of the semiconductor element 100 in the horizontal direction. And in some not-shown embodiments, the semiconductor element 100 may be placed horizontally with the washing brushes 1 held on both sides in the vertical direction of the semiconductor element 100.
In the cleaning apparatus for a semiconductor element according to the embodiment of the present application, by setting the maximum diameter of the intermediate section 11 of the brush 1 to be smaller than the maximum diameter of the rim section 12, when the semiconductor element 100 is held between the brushes 1, the holding force applied to the central area is smaller than the holding force applied to the rim area, so that the problem that the number of times the central area of the semiconductor element 100 is in contact with the brush 1 is increased as compared with the rim area can be effectively balanced, and the uniformity of the cleaning action of the brush 1 on the semiconductor element 100 can be improved.
Further, in an embodiment, referring to fig. 3, the cleaning apparatus provided in the present application further includes a cleaning solution supply assembly 4 for supplying a cleaning solution to between the semiconductor devices 100. By providing the cleaning liquid supply unit 4, the cleaning liquid can be supplied between the brush 1 and the semiconductor element 100 as needed, and the timing and the amount of the supplied cleaning liquid can be controlled.
In a preferred embodiment, referring to fig. 2 and 3, the present application provides a cleaning device, wherein the cleaning solution supply assembly 4 comprises a liquid spraying tube 41 and a liquid supply device (not shown), and the cleaning solution is sprayed between the semiconductor element 100 and the cleaning brush 1 through the liquid spraying tube 41, so as to improve the uniformity of the distribution of the cleaning solution on the surface of the semiconductor element 100, and further improve the cleaning efficiency.
In an embodiment not shown, the present application provides a cleaning apparatus in which each semiconductor element 100 corresponds to at least one pair of cleaning brushes 1, the centers of rotation 15 of each pair of cleaning brushes 1 being parallel to each other. By providing a plurality of pairs of the cleaning brushes 1, the cleaning efficiency of the semiconductor element 100 can be improved, and by providing the rotation centers 15 of each pair of the cleaning brushes 1 in parallel with each other, it is advantageous to stabilize the semiconductor element 100 during the cleaning process and prevent it from being damaged by tilting.
It is preferable that the number of the brushes 1 is odd number, the rotation centers 15 of at least one pair of the brushes 1 intersect with the rotation axis of the semiconductor element 100, and the rotation centers 15 of the other brushes 1 are arranged symmetrically with respect to the rotation center 15 of the brush 1 in the middle to prevent the inclination of the semiconductor element 100.
Further, in an embodiment, referring to fig. 2 and 3, the present application provides a cleaning apparatus, wherein the supporting assembly 2 includes a second driving assembly (not shown) and a roller 21, the second driving assembly drives the roller 21 to rotate, and the roller 21 contacts with an outer edge of the semiconductor device 100 to drive the semiconductor device 100 to rotate. It can be understood that the rotation speed of the semiconductor element 100 relative to the washing brush 1 can be increased by driving the rotation of the semiconductor element 100 through the roller 21 so that the semiconductor element 100 is actively rotated relative to the washing brush 1, thereby improving the washing efficiency of the washing brush 1 to the semiconductor element 100.
In an alternative embodiment, the present application provides a cleaning apparatus in which the support member 2 only provides a supporting force for the semiconductor element 100, and the semiconductor element 100 can be rotated relative to the support member 2, and at this time, a moment of rotation in one direction is applied to the edge of the semiconductor element 100 by the rotation of the cleaning brush 1 itself, and the semiconductor element 100 is rotated, for example, the rotation direction of the cleaning brush 1 provided on both sides of the semiconductor element 100 is reversed, so that the cleaning brush 1 can drive the semiconductor element 100 to rotate. This arrangement eliminates the need for a separate drive mechanism for the semiconductor element 100, and simplifies the structure of the cleaning apparatus.
Further, in an embodiment, referring to fig. 2 and fig. 3, in the cleaning apparatus provided in the present application, a groove 211 is formed on the roller 21, and the semiconductor device 100 is clamped in the groove 211. By arranging the groove 211, the contact area between the semiconductor element 100 and the roller 21 is increased, and the friction force between the semiconductor element 100 and the roller 21 is further increased, so that the reliability of the driving function of the semiconductor element 100 by the roller 21 is effectively improved, and the slippage between the semiconductor element 100 and the roller is prevented.
In one embodiment, referring to fig. 2 and 3, the number of the rollers 21 in the cleaning device provided by the present application is at least two. By providing a plurality of rollers 21, the supporting function of the rollers 21 on the semiconductor element 100 can be improved, and the friction force of the rollers 21 on the semiconductor element 100 can be increased, thereby further improving the reliability of the driving function of the rollers 21 on the semiconductor element 100. It is understood that when the semiconductor element 100 is horizontally disposed, in order to prevent the semiconductor element 100 from being tilted, at least three rollers 21 are provided as long as the three rollers 21 are arranged in such a manner as to support the semiconductor element 100, and preferably, the three rollers 21 are uniformly arranged around the semiconductor element 100.
It should be noted that when the semiconductor device 100 is vertically disposed, only a minimum of two rollers 21 are required to support the semiconductor device 100. At this time, the two rollers 21 are both located below the semiconductor device 100 and are arranged horizontally, the center of gravity of the semiconductor device 100 is located on the perpendicular plane of the central connecting line of the two rollers 21, and the rollers 21 can provide a supporting force for the semiconductor device 100 and can drive the semiconductor device 100 to rotate.
When the number of the rollers 21 is three or more, the supporting and driving requirements of the vertically arranged semiconductor elements 100 and the supporting and driving requirements of the horizontally arranged semiconductor elements 100 can be met, and the arrangement of the rollers 21 may be various, and the optimal arrangement thereof should be determined according to specific situations. For the horizontally arranged semiconductor elements 100, an embodiment in which the plurality of rollers 21 are uniformly arranged around the semiconductor elements 100 is optimal. Whereas for the semiconductor element 100 arranged vertically, the embodiment in which the plurality of rollers 21 are arranged uniformly around the semiconductor element 100 is the best for the driving effect of the rollers 21 on the semiconductor element 100 alone, and the embodiment in which the plurality of rollers 21 are arranged below the semiconductor element 100 is the best in view of the supporting effect of the rollers 21 on the semiconductor element 100. Therefore, for the vertically arranged semiconductor elements 100, it is necessary to determine the optimum arrangement of the plurality of rollers 21 by comprehensively considering the driving requirements and the supporting requirements of the semiconductor elements 100.
The various embodiments/implementations provided herein may be combined with each other without contradiction.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. A cleaning brush for cleaning a rotating semiconductor element, the cleaning brush having a rotation center, the cleaning brush being formed with an intermediate segment and edge segments adjacent to both ends of the intermediate segment in a direction of the rotation center, a cross section of the edge segments having a maximum outer diameter larger than a maximum outer diameter of a cross section of the intermediate segment.
2. The washing brush according to claim 1, wherein the diameter of the section of the rim section is gradually increased from the end near the middle section to the outside.
3. The washing brush according to claim 1 or 2, wherein the washing brush includes a brush body and a convex body formed on the brush body, the convex body being used for washing the semiconductor element.
4. The washing brush according to claim 3, characterized in that the angle comprised between the common tangent plane of the maximum and minimum sections of said body of the washing brush of the edge section and said rotation center is α, 5 ° ≦ α ≦ 60 °; and/or the presence of a gas in the gas,
the radius difference value of the maximum section and the minimum section of the cleaning brush body of the edge section is D, and D is larger than or equal to 1mm and smaller than or equal to 15 mm; and/or the presence of a gas in the gas,
the convex body is cylindrical, truncated cone-shaped or polygonal.
5. The washing brush according to claim 3, wherein the washing brush body includes a rotation shaft and a sleeve fitted around the rotation shaft, and the convex body is formed on the sleeve.
6. The washing brush according to claim 5, wherein the maximum outer diameter of the section of the rim section of the rotation shaft is larger than the maximum outer diameter of the section of the middle section.
7. An apparatus for cleaning a semiconductor element, comprising:
a support assembly for supporting the semiconductor element, the semiconductor element being rotatable;
the cleaning brush according to any one of claims 1 to 6, wherein the cleaning brush is provided on both side surfaces of the semiconductor element, and a holding force of the edge section of the cleaning brush to the semiconductor element is larger than a holding force of the middle section to the semiconductor element; and
the first driving assembly is used for driving the cleaning brush to rotate.
8. The cleaning apparatus defined in claim 7, wherein at least one pair of said cleaning brushes corresponds to each of said semiconductor elements, and said centers of rotation of each pair of said cleaning brushes are parallel to each other.
9. The cleaning device according to claim 7 or 8, wherein the support assembly comprises a second drive assembly and a roller, the second drive assembly driving the roller to rotate, the roller contacting an outer edge of the semiconductor element to drive the semiconductor element to rotate.
10. The cleaning device of claim 9, wherein the roller has a groove formed therein, the semiconductor element being held in the groove; and/or the presence of a gas in the gas,
the number of the rollers is at least two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202022951158.0U CN213988832U (en) | 2020-12-08 | 2020-12-08 | Cleaning brush for semiconductor element and cleaning device thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202022951158.0U CN213988832U (en) | 2020-12-08 | 2020-12-08 | Cleaning brush for semiconductor element and cleaning device thereof |
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| CN213988832U true CN213988832U (en) | 2021-08-17 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023235424A1 (en) * | 2022-05-31 | 2023-12-07 | Entegris, Inc. | Cleaning brush for semiconductor fabrication process |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023235424A1 (en) * | 2022-05-31 | 2023-12-07 | Entegris, Inc. | Cleaning brush for semiconductor fabrication process |
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