CN213936164U - Chip packaging shell - Google Patents
Chip packaging shell Download PDFInfo
- Publication number
- CN213936164U CN213936164U CN202022351523.4U CN202022351523U CN213936164U CN 213936164 U CN213936164 U CN 213936164U CN 202022351523 U CN202022351523 U CN 202022351523U CN 213936164 U CN213936164 U CN 213936164U
- Authority
- CN
- China
- Prior art keywords
- chip
- casing
- mounting groove
- chip package
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
The utility model relates to a chip packaging casing, including the casing body, the surface of casing body is equipped with the mounting groove that is used for installing the chip, and the protective groove around the mounting groove setting is seted up on the surface of casing, still is equipped with metal pin on the casing body. The utility model discloses a chip package casing resistance to corrosion is strong.
Description
Technical Field
The utility model relates to an encapsulation casing especially relates to a chip encapsulation casing.
Background
A package body is a device for packaging various chips, such as a sensor chip, to protect them. When the existing packaging shell is used for packaging the sensor, a protective gel is generally coated on the front surface of the chip to prevent the front surface of the chip from being corroded by the compound. However, after a long time of use, small gaps may be generated between the inner wall of the case and the protective gel, and between the surface of the chip and the protective gel due to the effects of thermal expansion and contraction. At this point, if the chip is exposed to corrosive compounds, the compounds may penetrate along the interface between the inner wall of the housing and the gel and onto the chip, thereby corroding the chip and, in the worst case, rendering the chip useless.
In view of this, the present designer is actively making research and innovation to create a chip package casing with a novel structure, so as to enhance the protection capability of the chip against corrosive substances and prolong the service life of the chip.
SUMMERY OF THE UTILITY MODEL
In order to solve the above technical problem, an object of the present invention is to provide a chip package casing with high corrosion resistance.
The utility model discloses a chip package casing, including casing body, casing body's surface is equipped with the mounting groove that is used for installing the chip, its characterized in that: the surface of casing is seted up the protective tank that sets up around the mounting groove, still is equipped with metal pin on the casing body.
Further, the utility model discloses a chip package casing, the surface of casing is equipped with the air vent with the mounting groove intercommunication.
Further, the utility model discloses a chip package casing, the surface of casing body be equipped with the inner chamber with the air cock of air vent intercommunication.
Further, the utility model discloses a chip package casing, the surface of casing is equipped with winds the excessive gluey groove that the guard slot set up.
Further, the utility model discloses a chip package casing, be provided with the flange on the medial surface of mounting groove.
Further, the utility model discloses a chip package casing, casing body is made by high low temperature resistant, corrosion resistance material.
Borrow by above-mentioned scheme, the utility model discloses at least, have following advantage: the utility model discloses a chip package casing, the surface of its casing body is equipped with the protective housing around the mounting groove setting, and the protective housing forms labyrinth seal, and like this, even the chip is after long-time the use, produces small clearance between gel and the casing, corrosive compound also is difficult to cross this protective housing and produce the corruption to the chip to improve its anticorrosion effect, increased the life of chip. The metal pins are used for connecting the chip and the peripheral circuit. During concrete implementation, the chip sets up in the mounting groove, and the chip passes through the lead wire to be connected with the metal pin on the casing body, and operating personnel packs the protection gel to the mounting groove intussuseption afterwards, fills mounting groove and protective groove up to the protection gel, later operating personnel alright with this chip package casing together with its inside chip mounting on the circuit board can.
To sum up, the utility model discloses a chip package casing resistance to corrosion is strong.
The above description is only an overview of the technical solution of the present invention, and in order to make the technical means of the present invention clearer and can be implemented according to the content of the description, the following detailed description is made with reference to the preferred embodiments of the present invention and accompanying drawings.
Drawings
Fig. 1 is a schematic structural diagram of a chip package housing according to the present invention;
in the figure, a shell body 1, a mounting groove 2, a protective groove 3, a metal pin 4, a chip 5, an air vent 6, an air faucet 7, a PCB 8, a perforation 9, protective glue 10, a glue overflow groove 11, a flange 12, a glue stop fence 13 and gel 14.
Detailed Description
The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.
Referring to fig. 1, the chip package casing of the preferred embodiment of the present invention includes a casing body 1, a mounting groove 2 for mounting a chip is disposed on the surface of the casing body, a protection groove 3 disposed around the mounting groove is disposed on the surface of the casing body, and a metal pin 4 is further disposed on the casing body.
The utility model discloses a chip package casing, the surface of its casing body is equipped with the protective housing around the mounting groove setting, and the protective housing forms labyrinth seal, and like this, even the chip is after long-time the use, produces small clearance between gel 14 and the casing, corrosive compound also is difficult to cross this protective housing and produce the corruption to the chip to improve its anticorrosion effect, increased the life of chip. The metal pins are used for connecting the chip and the peripheral circuit. During concrete implementation, chip 5 sets up in the mounting groove, and the chip passes through the lead wire to be connected with the metal pin on the casing body, and operating personnel packs the protection gel to the mounting groove intussuseption afterwards, and until protection gel fills up mounting groove and protection groove, later operating personnel alright with this chip package casing together with its inside chip mounting on the circuit board can. The mounting groove is a groove with an inverted convex cross section, and can also be a rectangular groove, wherein the inverted convex cross section is preferred to facilitate the connection of the metal pin and the chip. In specific implementation, one end of the metal pin in the shell body is arranged on the step surface of the inverted convex-shaped groove. Furthermore, the height of the inner wall of the guard tank may be lower than the height of the outer wall thereof, which forms a glue barrier 13 for blocking the gel.
Preferably, the surface of the chip packaging shell of the utility model is provided with an air vent 6 communicated with the mounting groove.
The setting of air vent makes in gaseous can inputing to the mounting groove to realize the sensing to gas pressure. When the chip packaging structure is specifically implemented, the bottom surface of the mounting groove is provided with a ceramic plate, and the chip is arranged above the ceramic plate.
Preferably, the chip package casing of the present invention, the surface of the casing body is provided with an air faucet 7 communicating with the inner cavity and the air vent.
The air tap has set up and has realized the guide effect to gaseous on the one hand, and on the other hand has also realized the location to the casing body in the effect. During specific implementation, an operator penetrates the air nozzle on the shell body through the through hole 9 on the PCB 8 and arranges a protective adhesive 10 between the air nozzle and the PCB.
Preferably, the chip package casing of the present invention, the surface of the casing is provided with an overflow glue groove 11 arranged around the protection groove.
The glue overflow groove is used for receiving redundant protective gel so as to prevent the protective gel from overflowing to the outer side surface of the shell body when the chip is installed.
Preferably, the chip package casing of the present invention is provided with a flange 12 on the inner side surface of the mounting groove.
As previously described, the provision of the flange facilitates the connection of the metal pins to the chip. In a specific implementation, the flange extends from the bottom surface of the mounting groove to the middle upper part of the mounting groove, and is preferably an annular flange, and one end of the metal pin penetrates through the side wall of the shell body and is arranged on the surface of the flange.
Preferably, the chip package casing of the present invention, the casing body is made of high and low temperature resistant and corrosion resistant material.
The shell body is made of high and low temperature resistant and corrosion resistant materials such as polytetrafluoroethylene, so that the protection performance of the shell body can be improved.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that the invention can be implemented in other specific forms by a person skilled in the art without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description.
Furthermore, the above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention. Also, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. The utility model provides a chip package casing, includes casing body (1), casing body's surface is equipped with mounting groove (2) that are used for installing the chip, its characterized in that: the surface of the shell is provided with a protective groove (3) arranged around the mounting groove, and the shell body is also provided with a metal pin (4).
2. The chip package housing according to claim 1, wherein: and the surface of the shell is provided with a vent hole (6) communicated with the mounting groove.
3. The chip package housing according to claim 2, wherein: and an air tap (7) with an inner cavity communicated with the vent hole is arranged on the surface of the shell body.
4. The chip package housing according to claim 1, wherein: and the surface of the shell is provided with an adhesive overflow groove (11) arranged around the protective groove.
5. The chip package housing according to claim 1, wherein: and a flange (12) is arranged on the inner side surface of the mounting groove.
6. The chip package housing according to claim 1, wherein: the shell body is made of high-low temperature resistant and corrosion resistant materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022351523.4U CN213936164U (en) | 2020-10-21 | 2020-10-21 | Chip packaging shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022351523.4U CN213936164U (en) | 2020-10-21 | 2020-10-21 | Chip packaging shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213936164U true CN213936164U (en) | 2021-08-10 |
Family
ID=77224135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022351523.4U Active CN213936164U (en) | 2020-10-21 | 2020-10-21 | Chip packaging shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213936164U (en) |
-
2020
- 2020-10-21 CN CN202022351523.4U patent/CN213936164U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102132640B (en) | Seal structure for electronic equipment | |
| CN101290914A (en) | Semiconductor device and method for manufacturing the same | |
| CN213936164U (en) | Chip packaging shell | |
| US20230197542A1 (en) | Module with Gas Flow-Inhibiting Sealing at Module Interface to Mounting Base | |
| CN103968992B (en) | Pressure sensor device and the pressure cooker with the device | |
| CN107543650A (en) | The manufacture method of pressure sensor and pressure sensor | |
| CN216692385U (en) | Fire-fighting fuse valve for nuclear power plant | |
| CN215677405U (en) | High-precision pressure sensor | |
| CN214010595U (en) | Pressure sensor | |
| JP2011205002A (en) | Electronic controller | |
| JPWO2019064886A1 (en) | Physical quantity detector | |
| CN206362482U (en) | A kind of baroceptor | |
| CN218724085U (en) | Explosion-proof type laser range finder | |
| CN210719139U (en) | Static level gauge with suspended pressure sensor | |
| CN205645549U (en) | Leak -tight electrolytic capacitor structure | |
| CN213548059U (en) | Waterproof sealing structure based on shell | |
| CN219105764U (en) | Memory core box with liquid injection hole with strong protection capability | |
| CN215866573U (en) | Cover plate for packaging micro-nano gas sensor | |
| JPWO2019064933A1 (en) | Physical quantity detector | |
| CN213813658U (en) | Waterproof pneumatic sensor | |
| CN220324447U (en) | Semiconductor power device and semiconductor module | |
| CN218857008U (en) | Waterproof structure of robot | |
| CN215811143U (en) | Waterproof dustproof protection device of cantilever beam load sensor | |
| CN221102045U (en) | Electrostatic chuck and edge protection structure | |
| CN218994339U (en) | Protection box for underwater strain gauge |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230731 Address after: 233010 6 # factory building in the intelligent display industrial park at the west side of H-2 Road, the south side of Xinghua Road, Changqing Township, Yuhui District, Bengbu Free Trade Pilot Zone, Bengbu City, Anhui Province Patentee after: Anhui Jingxin Sensor Technology Co.,Ltd. Address before: 214000 4th floor, No. 58, Feihong Road, Nanhu Avenue, Liangxi District, Wuxi City, Jiangsu Province Patentee before: WUXI BEETECH SENSOR Inc. |