CN213934790U

CN213934790U - Cloud infrastructure speed-up server with auxiliary heat dissipation structure

Info

Publication number: CN213934790U
Application number: CN202022807553.1U
Authority: CN
Inventors: 樊志华
Original assignee: Shenzhen Zhonglianda Technology Co ltd
Current assignee: Shenzhen Zhonglianda Technology Co ltd
Priority date: 2020-11-27
Filing date: 2020-11-27
Publication date: 2021-08-10
Anticipated expiration: 2030-11-27

Abstract

The utility model discloses a cloud infrastructure is server for speed improvement with supplementary heat radiation structure, including box, server, connection storehouse, second fan and the door body. This server is used in cloud infrastructure speed increase with supplementary heat radiation structure, during the use, at first place the server in the box, then close a body and make the box closed, when the server moves, this moment through on-off control semiconductor refrigeration piece, first fan and second fan begin to work, the semiconductor refrigeration piece builds cooling environment for connecting the storehouse through first heat conduction grid, second heat conduction grid and first fan begin to dispel the heat for the semiconductor refrigeration piece simultaneously, avoid semiconductor refrigeration piece self high temperature to cause the damage, simultaneously under the effect of second fan, the outside air passes through first ventilative mechanism and gets into the connection storehouse, and enter into the box through connecting the storehouse, the air that enters into the box finally discharges from second ventilative mechanism, form air cycle.

Description

Cloud infrastructure speed-up server with auxiliary heat dissipation structure

Technical Field

The utility model relates to a server field specifically is a cloud infrastructure speed-up uses server with supplementary heat radiation structure.

Background

The term cloud-based is used to describe the components required for cloud computing, including hardware, abstract resources, storage, and network resources. The cloud infrastructure is not considered a tool required to build a cloud. To host services and applications in the cloud. A server is one of computers that runs faster, is more heavily loaded, and is more expensive than a regular computer. The server provides calculation or application services for other clients (such as terminals like PC, smart phone, ATM and the like and even large equipment like train systems and the like) in the network. The server has high-speed CPU computing capability, long-time reliable operation, strong I/O external data throughput capability and better expansibility. Generally, a server has the capability of responding to a service request, supporting a service, and guaranteeing the service according to the service provided by the server. The server is used as an electronic device, and the internal structure of the server is very complex, but the difference with the internal structure of a common computer is not great, such as: cpu, hard disk, memory, system bus, etc.

The cloud infrastructure acceleration server comprises a large number of electronic elements, so that a large amount of heat energy can be generated in the operation process of the cloud infrastructure acceleration server, the temperature of the cloud infrastructure acceleration server can be increased due to accumulation of the heat energy, the operation of the cloud infrastructure acceleration server electronic elements can be influenced by high temperature, and the use of the cloud infrastructure acceleration server is not facilitated.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a cloud infrastructure speed-up uses server with supplementary heat radiation structure to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a cloud infrastructure speed-up uses server with supplementary heat radiation structure, the power distribution box comprises a box body, be equipped with the server in the box, the bilateral symmetry of server is equipped with buffer gear, be equipped with the door body outside one side of box, the one side of the door body is articulated through the outer wall of hinge with the box, the equal fixedly connected with supporting legs in bottom surface four corners of box, the bottom surface middle part fixedly connected with of box rather than the connection storehouse that is linked together, four sides of connecting the storehouse all are equipped with first ventilative mechanism, first ventilative mechanism is including the pipeline, dust filter screen and drier layer, the below of connecting the storehouse is equipped with cooling body, cooling body is including first heat conduction grid, second heat conduction grid, semiconductor refrigeration piece and first fan, the inboard fixedly connected with second fan in top of connecting the storehouse, the outer wall fixed mounting of box has the switch, the inboard symmetry in top of box is equipped with the ventilative mechanism of second.

As a further aspect of the present invention: the buffer mechanism comprises a threaded handle, a pressing plate, a resisting plate, a spring, a guide rod and a guide sleeve.

As a further aspect of the present invention: the screw thread handle is in threaded connection with the box body, one end of the screw thread handle is inserted into the box body and is rotationally connected with the pressing plate, the supporting plate is arranged on one side of the pressing plate, the spring is arranged between the supporting plate and the pressing plate, one end of the spring is fixedly connected with the outer wall of the supporting plate, the other end of the spring is fixedly connected with the outer wall of the pressing plate, the guide sleeves are respectively arranged at four corners of the pressing plate, one end of each guide sleeve is fixedly connected with the outer wall of the pressing plate, the guide sleeves are sleeved on the outer sides of the guide rods in a sliding mode, and one ends of the guide rods are fixedly connected with the inner wall of the box body.

As a further aspect of the present invention: first heat conduction grid fixed connection is in the bottom surface of connecting the storehouse, and the grid of first heat conduction grid inserts in connecting the storehouse, semiconductor refrigeration piece fixed connection is in the bottom surface of first heat conduction grid, second heat conduction grid fixed connection is in the bottom surface of semiconductor refrigeration piece, first fan fixed connection is on the bottom surface grid of second heat conduction grid, the cold side of semiconductor refrigeration piece is towards first heat conduction grid, the hot side of semiconductor refrigeration piece is towards second heat conduction grid, first heat conduction grid and second heat conduction grid are heat conduction material.

As a further aspect of the present invention: the pipeline is fixedly connected with the connecting bin and is connected with the connecting bin, the dust filtering nets are symmetrically and fixedly connected to the inner wall of the pipeline, the drying agent layer is arranged between the dust filtering nets, the second ventilating mechanism is identical to the first ventilating mechanism in structure, the pipeline of the second ventilating mechanism is fixedly connected to the inner side of the top of the box body, and one end of the pipeline penetrates out of the side wall of the box body to be connected with the outside.

As a further aspect of the present invention: the semiconductor refrigeration piece, the first fan and the second fan are electrically connected with the switch through wires, and the switch is externally connected with a power supply.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a box, the door body, the supporting legs, connect the storehouse, first ventilative mechanism, the second fan, cooperation between switch and the ventilative mechanism of second is used, make the box inside can drive through the second fan with the external world and carry out air cycle, use through first heat conduction grid, second heat conduction grid, cooperation between semiconductor refrigeration piece and the first fan, make the air of advancing to connect the storehouse cooled, thereby make this cloud infrastructure speed-raising with server that has supplementary heat radiation structure have cooling's function, avoid cloud infrastructure speed-raising with server because the piling up of heat energy and intensifies.

2. The utility model discloses a cooperation between screw thread handle, clamp plate, support board, spring, guide bar and the uide bushing is used for the server is by the centre gripping between buffer gear, from avoiding causing the server damage in outside striking or box removal, thereby makes this cloud infrastructure speed-raising with server that has supplementary heat radiation structure have the function of buffering.

3. The utility model discloses a cooperation between first ventilative mechanism, pipeline, dust filter screen, drier layer, the ventilative mechanism of second is used, and the box carries out the air that circulates with the external world and is filtered dry, avoids in moisture and the dust gets into the box to play the guard action to the server.

Drawings

Fig. 1 is a schematic structural diagram of a cloud infrastructure acceleration server having an auxiliary heat dissipation structure.

Fig. 2 is a sectional view of a cloud infrastructure acceleration server having an auxiliary heat dissipation structure.

Fig. 3 is an enlarged view of a in a cloud infrastructure acceleration server having an auxiliary heat dissipation structure.

In the figure: the device comprises a box body 1, a server 2, a buffer mechanism 3, a thread handle 4, a pressing plate 5, a resisting plate 6, a spring 7, a guide rod 8, a guide sleeve 9, a door body 10, supporting feet 11, a connecting bin 12, a first ventilation mechanism 13, a cooling mechanism 14, a first heat-conducting grid 15, a second heat-conducting grid 16, a semiconductor refrigerating sheet 17, a first fan 18, a second fan 19, a pipeline 20, a dust filtering net 21, a drying agent layer 22, a switch 23 and a second ventilation mechanism 24.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 to 3, in an embodiment of the present invention, a cloud infrastructure speed-up server with an auxiliary heat dissipation structure includes a box 1, a server 2 is disposed in the box 1, two sides of the server 2 are symmetrically provided with a buffering mechanism 3, a door 10 is disposed outside one side of the box 1, one side of the door 10 is hinged to an outer wall of the box 1 through a hinge, four corners of a bottom surface of the box 1 are fixedly connected with supporting legs 11, a connecting bin 12 is fixedly connected to a middle portion of the bottom surface of the box 1, four sides of the connecting bin 12 are respectively provided with a first ventilation mechanism 13, the first ventilation mechanism 13 includes a pipeline 20, a dust filtering net 21 and a drying agent layer 22, a cooling mechanism 14 is disposed below the connecting bin 12, the cooling mechanism 14 includes a first heat conducting grid 15, a second heat conducting grid 16, a semiconductor refrigeration sheet 17 and a first fan 18, the model of the semiconductor refrigeration sheet 17 is TEC101703, manufactured and sold by Zhejiang maite electronics Limited, the inner side of the top of the connecting bin 12 is fixedly connected with a second fan 19, the outer wall of the box body 1 is fixedly provided with a switch 23, and the inner side of the top of the box body 1 is symmetrically provided with a second ventilation mechanism 24.

The buffer mechanism 3 comprises a threaded handle 4, a pressure plate 5, a resisting plate 6, a spring 7, a guide rod 8 and a guide sleeve 9.

Threaded handle 4 and box 1 threaded connection, the one end of threaded handle 4 inserts in box 1 and rotates with clamp plate 5 to be connected, support board 6 and establish the one side at clamp plate 5, spring 7 is established between support board 6 and clamp plate 5, the one end of spring 7 and the outer wall fixed connection who supports board 6, the other end of spring 7 and the outer wall fixed connection of clamp plate 5, uide bushing 9 is established respectively in the four corners of clamp plate 5, and the one end of uide bushing 9 and the outer wall fixed connection of clamp plate 5, uide bushing 9 slip cap is established in the outside of guide bar 8, the one end of guide bar 8 and the inner wall fixed connection of box 1.

First heat conduction grid 15 fixed connection is in the bottom surface of connecting storehouse 12, and the grid of first heat conduction grid 15 inserts in connecting storehouse 12, semiconductor refrigeration piece 17 fixed connection is in the bottom surface of first heat conduction grid 15, second heat conduction grid 16 fixed connection is in the bottom surface of semiconductor refrigeration piece 17, first fan 18 fixed connection is on the bottom surface grid of second heat conduction grid 16, the cold side of semiconductor refrigeration piece 17 is towards first heat conduction grid 15, the hot side of semiconductor refrigeration piece 17 is towards second heat conduction grid 16, first heat conduction grid 15 and second heat conduction grid 16 are heat conduction material.

The pipeline 20 and the connecting bin 12 are fixedly connected and interconnected, the dust filtering nets 21 are symmetrically and fixedly connected on the inner wall of the pipeline 20, the drying agent layer 22 is arranged between the dust filtering nets 21, the second ventilating mechanism 24 is identical in structure with the first ventilating mechanism 13, the pipeline 20 of the second ventilating mechanism 24 is fixedly connected on the inner side of the top of the box body 1, and one end of the pipeline 20 penetrates through the side wall of the box body 1 to be connected with the outside.

The semiconductor refrigeration piece 17, the first fan 18 and the second fan 19 are electrically connected with a switch 23 through wires, and the switch 23 is externally connected with a power supply.

The utility model discloses a theory of operation is:

when the refrigerator is used, firstly, the server 2 is placed in the box body 1, then the threaded handle 4 is rotated, the threaded handle 4 drives the pressing plate 5 to move towards the server 2 through the matching of the guide rod 8 and the guide sleeve 9, finally, the pressing plate 5 drives the abutting plate 6 to abut against the outer side of the server 2 through the spring 7, so that the box body 1 clamps the server through the buffer mechanism 3, the damage to the server 2 caused by external impact or the movement of the box body 1 is avoided, then, the door body 10 is closed to close the box body 1, when the server 2 operates, the semiconductor refrigerating sheet 17, the first fan 18 and the second fan 19 are controlled to start to work through the switch 23, the semiconductor refrigerating sheet 17 builds a cooling environment for the connecting bin 12 through the first heat conducting grid 15, meanwhile, the second heat conducting grid 16 and the first fan 18 begin to radiate heat for the semiconductor refrigerating sheet 17, and the damage caused by the overhigh temperature of the semiconductor refrigerating sheet 17 is avoided, meanwhile, under the action of the second fan 19, outside air enters the connecting bin 12 through the first air-permeable mechanism 13 and enters the box body 1 through the connecting bin 12, the air entering the box body 1 is finally discharged from the second air-permeable mechanism 24 to form air circulation, the air passing through the connecting bin 12 in the circulation is cooled by a cooling environment, so that cold air is formed to cool the box body 1, meanwhile, the air entering the first air-permeable mechanism 13 and the second air-permeable mechanism 24 is dried and filtered by the dust filtering net 21 and the drying agent layer 22, so that moisture and dust are prevented from entering the box body 1, and the protection effect on the server 2 is achieved.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. The utility model provides a server is used to cloud infrastructure speed-up with supplementary heat radiation structure, includes box (1), its characterized in that: the server (2) is arranged in the box body (1), the two sides of the server (2) are symmetrically provided with the buffer mechanisms (3), the door body (10) is arranged outside one side of the box body (1), one side of the door body (10) is hinged with the outer wall of the box body (1) through a hinge, supporting legs (11) are fixedly connected with four corners of the bottom surface of the box body (1), the middle of the bottom surface of the box body (1) is fixedly connected with a connecting bin (12) communicated with the connecting bin, four sides of the connecting bin (12) are respectively provided with a first ventilating mechanism (13), each first ventilating mechanism (13) comprises a pipeline (20), a dust filtering net (21) and a drying agent layer (22), a cooling mechanism (14) is arranged below the connecting bin (12), each cooling mechanism (14) comprises a first heat conducting grid (15), a second heat conducting grid (16), a semiconductor refrigerating sheet (17) and a first fan (18), the inner side of the top of the connecting bin (12) is fixedly connected with a second fan (19), a switch (23) is fixedly installed on the outer wall of the box body (1), and second ventilation mechanisms (24) are symmetrically arranged on the inner side of the top of the box body (1).

2. The cloud infrastructure acceleration server with the auxiliary heat dissipation structure according to claim 1, wherein: the buffer mechanism (3) comprises a threaded handle (4), a pressing plate (5), a resisting plate (6), a spring (7), a guide rod (8) and a guide sleeve (9).

3. The cloud infrastructure acceleration server with the auxiliary heat dissipation structure according to claim 2, wherein: the screw thread handle (4) is connected with the box body (1) in a threaded manner, one end of the screw thread handle (4) is inserted into the box body (1) and is rotationally connected with the pressing plate (5), the supporting plate (6) is arranged on one side of the pressing plate (5), the spring (7) is arranged between the supporting plate (6) and the pressing plate (5), one end of the spring (7) is fixedly connected with the outer wall of the supporting plate (6), the other end of the spring (7) is fixedly connected with the outer wall of the pressing plate (5), the guide sleeves (9) are respectively arranged at four corners of the pressing plate (5), one end of each guide sleeve (9) is fixedly connected with the outer wall of the pressing plate (5), the guide sleeves (9) are sleeved on the outer side of the guide rod (8) in a sliding manner, and one end of each guide rod (8) is fixedly connected with the inner wall of the box body (1).

4. The cloud infrastructure acceleration server with the auxiliary heat dissipation structure according to claim 1, wherein: first heat conduction grid (15) fixed connection is in the bottom surface of connecting storehouse (12), and the grid of first heat conduction grid (15) inserts in connecting storehouse (12), semiconductor refrigeration piece (17) fixed connection is in the bottom surface of first heat conduction grid (15), second heat conduction grid (16) fixed connection is in the bottom surface of semiconductor refrigeration piece (17), first fan (18) fixed connection is on the bottom surface grid of second heat conduction grid (16), the cold side of semiconductor refrigeration piece (17) is towards first heat conduction grid (15), the hot side of semiconductor refrigeration piece (17) is towards second heat conduction grid (16), first heat conduction grid (15) and second heat conduction grid (16) are heat conduction material.

5. The cloud infrastructure acceleration server with the auxiliary heat dissipation structure according to claim 1, wherein: the pipeline (20) is fixedly connected with the connecting bin (12) and is connected with the connecting bin, the dust filtering nets (21) are symmetrically and fixedly connected onto the inner wall of the pipeline (20), the drying agent layer (22) is arranged between the dust filtering nets (21), the second ventilating mechanism (24) is identical to the first ventilating mechanism (13) in structure, the pipeline (20) of the second ventilating mechanism (24) is fixedly connected onto the inner side of the top of the box body (1), and one end of the pipeline (20) penetrates out of the side wall of the box body (1) to be connected with the outside.

6. The cloud infrastructure acceleration server with the auxiliary heat dissipation structure according to claim 1, wherein: the semiconductor refrigeration piece (17), the first fan (18) and the second fan (19) are electrically connected with the switch (23) through wires, and the switch (23) is externally connected with a power supply.