CN213931539U - Non-circulation forced vaporization portable fast cooling refrigerating device - Google Patents
Non-circulation forced vaporization portable fast cooling refrigerating device Download PDFInfo
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- CN213931539U CN213931539U CN202022005805.9U CN202022005805U CN213931539U CN 213931539 U CN213931539 U CN 213931539U CN 202022005805 U CN202022005805 U CN 202022005805U CN 213931539 U CN213931539 U CN 213931539U
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Abstract
The application provides a portable rapid cooling refrigerating plant of non-circulation forced vaporization includes: the semiconductor refrigeration sheet, the radiator and the control circuit board; the radiator is provided with a water storage/adhesion structure for storing liquid, and the heat radiation effect of the radiator is accelerated by absorbing heat in the processes of liquid temperature rise and vaporization. Therefore, before work, the temperature of the radiator is easily lower than the room temperature under the influence of the temperature of the liquid stored in the water storage/adhesion water structure, and the refrigerating effect of the non-circulating forced vaporization portable rapid cooling refrigerating device during initial work can be enhanced. During formal work, liquid stored in the water storage/adhesion water structure is continuously heated and vaporized, so that the heat dissipation effect and the refrigeration effect are enhanced. The application provides what the device adopted is that open non-circulation formula forces water vaporization radiator, and in open space, the specific heat capacity of utilizing water is big, and the vaporization heat absorption is bigger, stabilizes the temperature of radiator to reduce the temperature of semiconductor refrigeration piece cold junction.
Description
Technical Field
The application relates to the technical field related to refrigeration equipment and the technical field related to medical cooling instruments, in particular to a non-circulating forced vaporization portable rapid cooling refrigeration device.
Background
With the progress of science and technology, semiconductor refrigeration devices have become one of the most important refrigeration equipments in the past due to their advantages such as simple structure and miniaturization.
When the body is heated, the temperature is reduced by a physical method so as to avoid the damage of the body caused by high fever. The refrigerating device is used for cooling the patient, and is an effective physical cooling means.
However, in the actual use of the semiconductor refrigeration device, the refrigeration capacity of the semiconductor refrigeration device is affected by the hot end temperature of the semiconductor refrigeration device. With the use of the semiconductor refrigerating device, the temperature of the hot end rises rapidly, and then the effect of the cold end of the semiconductor refrigerating device is influenced. Therefore, the semiconductor refrigeration device is limited in practical use for personal portability, mainly due to the fact that the actual temperature difference is small (20 ℃ for single-stage cold and hot ends), the cold end temperature continuity is poor (the temperature of the cold end rises greatly along with time), and the volume is relatively large (relative to a handheld product).
SUMMERY OF THE UTILITY MODEL
In view of the above, an object of the present application is to provide a semiconductor refrigeration device, so as to solve at least to some extent the problems of non-ideal refrigeration effect of a cold end of the semiconductor refrigeration device, short refrigeration effect persistence, large volume, complex system, and high cost.
The application provides a pair of portable rapid cooling refrigerating plant of non-circulation forced vaporization, includes: the semiconductor refrigerating sheet and the radiator are arranged at the hot end of the semiconductor refrigerating sheet;
the radiator is provided with a water storage/adhesion water structure for storing liquid, improving the contact area of the liquid and the radiator, and accelerating the heat radiation effect of the radiator by absorbing heat in the processes of temperature rise and vaporization of the liquid.
Optionally, the method further comprises: a fan disposed at one side of the heat sink;
the fan blows and sucks air towards the water storage/adhesion water structure, so that the local humidity is changed, and the vaporization of the liquid is accelerated.
Optionally, the method further comprises: and the metal connecting sheet is arranged at the cold end of the semiconductor refrigerating sheet.
Optionally, the liquid is water.
Optionally, the heat sink is a heat sink.
Optionally, the water storage/adhering structure includes: a bifurcated burr disposed on the heat sink;
the bifurcated burr provides a space for the liquid to adhere to.
Optionally, the water storage/adhering structure comprises: the hydrophilic material arranged on the surface of the radiating fin enhances the adsorption effect of the radiating fin on liquid and improves the contact area of water and the radiator.
Optionally, the water storage/adhering structure comprises: a water storage material disposed on the heat sink.
The water storage material is sponge.
Optionally, the base part of the cooling fin is provided with an inward inclination of 1 degree towards the center, and banks with the height of 2mm are arranged around the base to facilitate water storage to form a water storage unit.
Optionally, the method further comprises: an intelligent control circuit;
the intelligent control circuit automatically controls the temperature of the cold end based on information fed back by a temperature sensor arranged at the cold end of the semiconductor refrigerating sheet;
and the circuit connection part on the non-circulating forced vaporization portable rapid cooling refrigerating device is subjected to waterproof treatment.
Among the technical scheme that this application provided, portable rapid cooling refrigerating plant of non-circulation forced vaporization includes: the semiconductor refrigerating sheet and the radiator are arranged at the hot end of the semiconductor refrigerating sheet; the radiator is provided with a water storage/adhesion water structure for storing volatile liquid, so that the liquid absorbs heat in the volatilization process, and the heat dissipation effect of the radiator is accelerated. So set up, before semiconductor refrigeration piece work, receive the influence of the liquid heat-up that the water storage/adhesion water structure was stored, vaporization, the temperature of radiator can be less than the room temperature, so can strengthen the refrigeration effect of portable rapid cooling refrigerating plant of non-circulation forced vaporization when initial work. Furthermore, when the non-circulating forced vaporization portable rapid cooling refrigeration device works formally, the liquid stored in the water storage/adhesion water structure is heated and vaporized continuously, so that the heat dissipation effect of the radiator is enhanced, the temperature of the hot end of the semiconductor refrigeration sheet is reduced, and the refrigeration effect of the non-circulating forced vaporization portable rapid cooling refrigeration device is further enhanced. To sum up, the portable rapid cooling refrigerating plant of non-circulation forced vaporization that this application provided, before the liquid that stores in the water storage/adhesion water structure totally vaporizes, compare the scheme among the prior art, inside semiconductor refrigeration piece refrigeration efficiency is better. Therefore, the portable rapid cooling refrigerating plant of non-circulation forced vaporization that this application provided compares in refrigerating plant among the prior art, and the actual difference in temperature is bigger, and cold junction temperature persistence is strong, and the volume can be done littleer, portable more. So, when the patient high fever, can use refrigerating plant to cool down for the patient.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a non-circulating forced-vaporization portable rapid-cool refrigeration apparatus according to an embodiment of the present application;
FIG. 2 is a schematic diagram of the temperature relationships among the various locations of a non-circulating forced vaporization portable rapid cooling refrigeration device in accordance with an embodiment of the present application;
FIG. 3 is a graph illustrating a change in cold end temperature of a refrigeration unit in accordance with an embodiment of the present application;
fig. 4 is a schematic structural diagram of a water storage/adhesion structure of a non-circulating forced vaporization portable rapid cooling refrigeration device according to an embodiment of the present application.
In fig. 1-4:
the device comprises a semiconductor refrigerating sheet-1, a radiator-2, a water storage unit-21, forked burrs-22, a sponge-23, a fan-3 and a metal connecting sheet-4.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail below. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the examples given herein without making any creative effort, shall fall within the protection scope of the present application.
First, an application scenario of the embodiment of the present application will be described, and with the progress of science and technology, a semiconductor refrigeration device becomes an important one of the refrigeration apparatuses at present due to its many advantages such as simple structure and miniaturization, especially in a use scenario of performing cold compress using the semiconductor refrigeration device, for example: cooling of patients, cold compress of forehead when fever occurs, cold compress of skin when beauty treatment, cold compress of injured position when sports injury, and other cooling scenes insensitive to water. However, in the use of the semiconductor refrigeration device, the refrigeration capacity of the semiconductor refrigeration device is affected by the hot end temperature of the semiconductor refrigeration device. With the use of the semiconductor refrigerating device, the temperature of the hot end rises rapidly, and then the effect of the cold end of the semiconductor refrigerating device is influenced. An object of the present embodiment is to provide a portable and handheld semiconductor refrigeration device, which solves the problems of unsatisfactory refrigeration effect of a cold end of the semiconductor refrigeration device, short duration of the refrigeration effect, large volume, complex system, inapplicability to a 5V power supply, and high cost.
Hereinafter, embodiments will be described with reference to the drawings. In addition, the embodiments shown below do not limit the scope of the claims to respond to the present invention.
Referring to fig. 1-4, the present application provides a non-circulating forced vaporization portable rapid cooling refrigeration device, comprising: the refrigerating device comprises a semiconductor refrigerating sheet 1 and a radiator 2 arranged at the hot end of the semiconductor refrigerating sheet 1;
the radiator 2 is provided with a water storage/adhesion water structure for storing liquid, the contact area of the liquid and the radiator 2 is increased, and the heat radiation effect of the radiator 2 is accelerated by absorbing heat in the heating and vaporizing processes of the liquid.
So set up, before semiconductor refrigeration piece 1 work, receive the volatile influence of the liquid temperature that stores in the water storage/adhesion water structure (the liquid that is less than the air temperature is easily obtained), the temperature of radiator 2 is less than the room temperature, so can strengthen the refrigeration effect of portable rapid cooling refrigerating plant of non-circulation forced vaporization when initial work. Further, when the non-circulating forced vaporization portable rapid cooling refrigeration device works formally, liquid stored in the water storage/adhesion water structure is heated and vaporized continuously, the heat dissipation effect of the radiator 2 is enhanced, the temperature of the hot end of the semiconductor refrigeration sheet 1 is reduced, and the refrigeration effect of the non-circulating forced vaporization portable rapid cooling refrigeration device is further enhanced. To sum up, the portable rapid cooling refrigerating plant of non-circulation forced vaporization that this application provided, before the liquid that stores in the water storage/adhesion water structure vaporizes completely, compare the scheme among the prior art, inside semiconductor refrigeration piece 1 refrigeration efficiency is better, and this effect is unlimited continuation of journey basically, because liquid is easier to obtain.
Specifically, in the case of continuous replenishment of water, the heat sink 2 can continuously absorb heat during the heating and vaporization of water, and the cold application endurance is infinite, which is one of its main advantages.
It should be noted that the current heat dissipation method includes: a. natural convection heat dissipation of air; b. forced ventilation and heat dissipation; c. water cooling for heat dissipation; d. circulating heat dissipation; e. heat dissipation is carried out by utilizing the melting latent heat of the substance; the application provides an open non-circulation forced water evaporation heat dissipation mode that forces among the portable rapid cooling refrigerating plant of non-circulation forced evaporation that adopts. In the open space, water is used as a working medium, the specific heat capacity of the water is large, the vaporization heat absorption is larger, and the temperature of the radiator 2 is stabilized, so that the temperature of the cold end of the semiconductor refrigerating sheet is reduced. Under the condition of not changing the figure of merit Z of the semiconductor and the same size of the radiator, the practical application temperature of the single-stage semiconductor cold end can reach (-20 ℃) and can not be influenced by the air temperature, which is far lower than the current a and b radiating modes, especially the ring temperature is higher than 10 ℃. Further improving the utility of the semiconductor in the personal care. Compared with the c and d modes, the structure is simple, the volume is small, and the price is low; compared with the e mode, the working medium is easy to obtain, safe and simple in implementation mechanism.
The heat dissipation mode provided by the application has better characteristics of heat dissipation efficiency, unlimited cruising performance, simple structure, small volume and low cost; the heat dissipation mode is suitable for the situation insensitive to humidity. The open non-circulating forced water vaporizing radiator may be used widely in portable equipment with hot end power lower than 100W and radiator 2 and relevant equipment volume lower than 2000cm3Provided is a device. Compared with the scheme in the prior art, before the liquid stored in the water storage/adhering structure is completely volatilized, the internal semiconductor refrigerating sheet 1 has better refrigerating efficiency, simple structure, small volume and low cost, can enhance endurance through continuous water addition and even can achieve infinite endurance. In addition, due to the reversibility of the cold end and the hot end of the semiconductor, the method is also favorable for improving the cold absorption capacity of the semiconductor, thereby improving the heat production efficiency.
In order to accelerate the volatilization of liquid for the radiating effect of radiator 2 is better, the portable rapid cooling refrigerating plant of non-circulation forced vaporization that this application provided still includes: a fan 3 provided on one side of the heat sink;
the fan 3 blows and sucks air towards the water storage/adhesion water structure, changes local humidity and accelerates vaporization of the liquid.
The fan 3 is used for forcing the air in the end radiator 2 to flow, accelerating the volatilization of the liquid, accelerating the vaporization process of the liquid in the water storage/adhesion structure and enhancing the vaporization and heat dissipation capability of the liquid.
In particular, the liquid may be, but is not limited to, water. In the scheme that this application provided, to the demand of liquid is volatile heat absorption, and safe harmless. It is of course more convenient if the liquid is a readily available liquid.
In the scheme provided by the application, the liquid can be water, alcohol solution and the like. Water is preferably selected in view of the readily available nature of the liquid.
To better illustrate, in the solution provided in the present application, the effect of water on improving the cooling effect of the non-circulating forced vaporization portable rapid cooling refrigeration device is provided. Referring to fig. 2 and 3, the following description is made: in both figures 2 and 3, a comparison of the two curves is included, one with water (shown by the dotted line) and one without water (shown by the solid line). The simulation under the condition of adding water is the normal working state of the scheme provided by the application, and the simulation under the condition of not adding water is the normal working state of the existing semiconductor refrigerating chip 1. Through the comparison of the two, the refrigeration equipment provided by the application has better refrigeration effect and is further explained.
FIG. 2 is a graph comparing the temperatures at various points for a refrigeration setting provided by the present application with and without added water at a given time.
Referring to fig. 2: in the formal operation process of the non-circulating forced vaporization portable rapid cooling refrigeration device, the temperature of the whole external environment is unchanged;
between the fan 3 and the heat sink, the temperature is lower when water is added than when water is not added due to the flow of wind and the vaporization of water; specifically, under the condition of adding water, the temperature of water is slightly lower than the temperature of air at normal times, so that the temperature at the tail end of the radiator 2 may be lower than that at the meeting fan 3 at the beginning.
In the range of the radiator 2, the closer to the hot end, the higher the temperature is as a whole; specifically, the influence of the flow of wind and the vaporization of water makes the radiating effect better under the condition of adding water, the temperature rising trend is slower, and the temperature rising trend under the condition of not adding water is steeper. Which in turn results in a lower temperature in the range of the radiator 2 with water addition than in the range of the radiator 2 without water addition. Generally, the heat sink 2 is made of aluminum or other metals, the specific heat capacity of water is much greater than that of metal, and the water temperature of water rises to the ambient temperature, so that a large amount of energy needs to be absorbed (because the specific heat capacity of water is high), the temperature curve of the heat dissipation end can be delayed, and under the condition of infiltration, the tail end of the heat sink 2 can be quickly lowered to the water temperature due to the high thermal conductivity of water. Specifically, the heat dissipation effect of water vaporization is about 100 times of natural cooling, and the heat dissipation effect of forced air cooling is 10 times.
At the position of the semiconductor refrigerating sheet 1, the temperature change trend is the same under the condition of adding water and not adding water under the influence of the self characteristics of the semiconductor refrigerating sheet 1. However, since the starting temperature of the hot end of the semiconductor chilling plate 1 is different in the two cases, the temperature curves are different. The temperature of the semiconductor refrigerating sheet 1 under the condition of adding water is always lower than that of the semiconductor refrigerating sheet 1 under the condition of not adding water.
In conclusion, the temperature of the cold end of the semiconductor refrigeration piece 1 under the condition of adding water is always lower than the temperature of the cold end of the semiconductor refrigeration piece 1 under the condition of not adding water.
Further, fig. 3 is a graph illustrating a temperature change of a cold end of a refrigeration device according to an embodiment of the present disclosure; specifically, FIG. 3 is a graph comparing the temperature profile of the cold end of a refrigeration unit over time with and without added water.
In the state that the non-circulating forced vaporization portable rapid cooling refrigerating device just starts to operate (0S-30S in the figure), the temperature of the radiator 2 is slowly increased under the condition of adding water, so the refrigerating effect of the semiconductor refrigerating sheet 1 is better, and the cooling of the cold end of the refrigerating device is faster; because the temperature of the radiator 2 rises faster under the condition of not adding water, the refrigerating effect of the semiconductor refrigerating sheet 1 is poorer, and the cooling of the cold end of the refrigerating device is slower.
In the state that the non-circulating forced vaporization portable rapid cooling refrigerating device just starts to operate (30S-900S in the figure), along with the rise of the temperature of the radiator 2 (namely the hot end of the semiconductor refrigerating sheet 1), the refrigerating effect of the semiconductor refrigerating sheet 1 at the hot end of the semiconductor refrigerating sheet 1 is influenced, and the temperature of the cold end of the semiconductor refrigerating sheet 1 starts to rise. However, because the temperature of the radiator 2 is slowly increased under the condition of adding water, the refrigerating effect of the semiconductor refrigerating sheet 1 is relatively better, and the temperature of the cold end of the refrigerating device is slowly increased; because the temperature of the radiator 2 rises faster under the condition of no water, the refrigerating effect of the semiconductor refrigerating sheet 1 is poorer, and the temperature rise of the cold end of the refrigerating device is faster.
In conclusion, the temperature of the cold end of the semiconductor refrigeration piece 1 under the condition of adding water is always lower than the temperature of the cold end of the semiconductor refrigeration piece 1 under the condition of not adding water.
Further, set up the metal connecting piece 4 at the refrigerator cold end. The setting of the metal connecting sheet 4 can make the portable rapid cooling refrigerating plant of non-circulation forced vaporization be applicable to the scenes such as cold compress forehead that has a fever, cold compress skin during cosmetic, cold compress injured position when the motion is injured more.
Preferably, the metal connecting piece 4 may be stainless steel. The stainless steel material has the advantages of good plane thermal conductivity, excellent vertical thermal conductivity, rigidity and toughness, stable chemical characteristics, low cost, simple process and good appearance.
Specifically, the heat sink 2 is a heat sink.
Considering that when in actual use, the water is influenced by the placement and the movement of the portable rapid cooling refrigeration device which is forced to vaporize by gravity and non-circulation, and the adhesion and the viscosity of the water on the metal surface are not enough to support enough water. Therefore, a water storage/adhesion structure (reservoir) can be added to the radiator 2 to improve the cruising ability.
The specific functions of the water storage/adhesion structure are various, and as shown in fig. 4, the water storage/adhesion structure may include: a bifurcated burr 22 provided on the heat sink; the bifurcated burr 22 provides a space for the liquid to adhere to. In particular, the bifurcated burr 22 structure increases the weight of the water and increases the water coverage area. The increase of the coverage area of water has improved the heat exchange of water with the fin, has increased the vaporization probability of water, lets the temperature of radiator 2 have great stability, and it is heated the temperature rise curve and is gentle, has just also led to the cold junction temperature value to rise gently. The water storage/adhesion structure enables the water storage capacity to be improved, and the refrigeration equipment has long cruising performance.
Further, the water storage/adhering structure may include: the hydrophilic material arranged on the surface of the radiating fin enhances the adsorption effect of the radiating fin on liquid. Specifically, the hydrophilic material increases the weight of water adsorbed on the heat sink 2, and makes water not easily slide off the surface of the heat sink, so that the water can be spread on the surface of the heat sink 2, and the coverage area of the water is increased. The increase of the coverage area of water has improved the heat exchange of water with the fin, has increased the vaporization probability of water, lets the temperature of radiator 2 have great stability, and it is heated the temperature rise curve and is gentle, has just also led to the cold junction temperature value to rise gently. The water storage/adhesion structure enables the water storage capacity to be improved, and the refrigeration equipment has long cruising performance.
Further, the water storage/adhering structure may include: a water storage material disposed on the radiator 2. Specifically, the water storage material is sponge 23. With this arrangement, the weight of the water adsorbed on the radiator 2 is increased, and the water is not easily slipped off from the surface of the heat sink. The water storage/adhesion structure enables the water storage capacity to be improved, and the refrigeration equipment has long cruising performance.
Furthermore, the base part of fin has 1 degree of interior slope towards the center, and the base has 2mm high dyke to be convenient for the retaining all around.
Of course, the above-described respective water storage/adhering structures may be used in combination. For example: the base part of fin has 1 degree's interior slope towards the center, and the base has the water storage unit 21 that 2mm high embankments are convenient for to impound all around, pastes a layer of sponge 23 on the fin, and the water of the water storage unit 21 of the base of sponge 23 contact fin is pasted to one end. So that the sponge 23 can suck up water on the fins.
It should be noted that before or during the use of the refrigeration device provided by the present application, water needs to be added to the radiator 2. The water adding process can be directly soaking the radiator 2 in water, or spraying or sprinkling water to the radiator 2. Other parts of the refrigeration equipment that may be water-like during the addition of water come into contact with the water. And in consideration of safety, the circuit connection part on the non-circulating forced vaporization portable rapid cooling refrigeration device is subjected to waterproof treatment.
Meanwhile, in order to better control the refrigerating temperature of the non-circulating forced vaporization portable rapid cooling refrigerating device, an intelligent control circuit can be arranged for control; the power of a semiconductor refrigerating sheet in the non-circulating forced vaporization portable rapid cooling refrigerating device further controls the refrigerating efficiency. Specifically, the intelligent control circuit carries out automatic control to the cold junction temperature based on the information that sets up the temperature sensor feedback of semiconductor refrigeration piece cold junction.
In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.
Claims (10)
1. A portable rapid cooling refrigerating plant of non-circulation forced vaporization, characterized by that, include: the semiconductor refrigerating sheet and the radiator are arranged at the hot end of the semiconductor refrigerating sheet;
the radiator is provided with a water storage/adhesion water structure for storing liquid, improving the contact area of the liquid and the radiator, and accelerating the heat radiation effect of the radiator by absorbing heat in the processes of temperature rise and vaporization of the liquid.
2. The non-circulating forced vaporization portable rapid cool down refrigeration unit of claim 1, further comprising: a fan disposed at one side of the heat sink;
the fan blows and sucks air towards the water storage/adhesion water structure, so that the local humidity is changed, and the vaporization of the liquid is accelerated.
3. The non-circulating forced vaporization portable rapid cool down refrigeration unit of claim 1, further comprising: and the metal connecting sheet is arranged at the cold end of the semiconductor refrigerating sheet.
4. The non-circulating forced vaporization portable rapid cool down refrigeration unit of claim 1, wherein said liquid is water.
5. The non-circulating forced vaporization portable rapid cool down refrigeration unit of claim 1, wherein said heat sink is a heat sink.
6. The non-circulating forced vaporization portable rapid cool down refrigeration unit of claim 5, wherein said water storage/adhering water structure comprises: a bifurcated burr disposed on the heat sink;
the bifurcated burr provides a space for the liquid to adhere to.
7. The non-circulating forced vaporization portable rapid cool down refrigeration unit of claim 5, wherein said water storage/adhering water structure comprises: the hydrophilic material arranged on the surface of the radiating fin enhances the adsorption effect of the radiating fin on liquid and improves the contact area of water and the radiator.
8. The non-circulating forced vaporization portable rapid cool down refrigeration unit of claim 5, wherein said water storage/adhering water structure comprises: a water storage material disposed on the heat sink;
the water storage material is sponge.
9. The non-circulating forced vaporization portable rapid cooling refrigeration device of claim 5, wherein the base portion of said heat sink has an inward slope of 1 degree towards the center, and the base has a 2mm height dike around it to facilitate water storage to form a water storage unit.
10. The non-circulating forced vaporization portable rapid cool down refrigeration unit of claim 1, further comprising: an intelligent control circuit;
the intelligent control circuit automatically controls the temperature of the cold end based on information fed back by a temperature sensor arranged at the cold end of the semiconductor refrigerating sheet;
and the circuit connection part on the non-circulating forced vaporization portable rapid cooling refrigerating device is subjected to waterproof treatment.
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| CN114017945A (en) * | 2020-09-14 | 2022-02-08 | 黄宇 | Non-circulation forced vaporization portable fast cooling refrigerating device |
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