CN213905330U

CN213905330U - Wafer bearing device

Info

Publication number: CN213905330U
Application number: CN202120023014.0U
Authority: CN
Inventors: 裴坤羽; 武卫; 刘建伟; 由佰玲; 刘园; 孙晨光; 王彦君; 祝斌; 刘姣龙; 常雪岩; 杨春雪; 谢艳; 袁祥龙; 张宏杰; 刘秒; 吕莹; 徐荣清
Original assignee: Tianjin Zhonghuan Advanced Material Technology Co Ltd; Zhonghuan Advanced Semiconductor Materials Co Ltd
Current assignee: Zhonghuan Leading Semiconductor Technology Co ltd; Tianjin Zhonghuan Advanced Material Technology Co Ltd
Priority date: 2021-01-06
Filing date: 2021-01-06
Publication date: 2021-08-06
Anticipated expiration: 2031-01-06

Abstract

The utility model provides a wafer piece bears device has: the device comprises a box body for bearing a wafer, a base capable of being grabbed and matched, a mounting seat matched with a detection machine and a cover body matched with the box body; the base and the mounting seat are respectively arranged on the outer side of the box body and are arranged in an aligned mode; and the base and the mounting seat are placed in parallel with the wafer. The utility model is particularly suitable for placing large-size wafer, has high structural strength and stable placement of the wafer, can cover the wafer and reduce the fragment rate; can cooperate manual operation or manipulator clamp to get the operation, but also can make the wafer level or vertical placing, application range is wide, and the practicality is strong, guarantees the wafer quality, improves production efficiency.

Description

Wafer bearing device

Technical Field

The utility model belongs to the technical field of semiconductor silicon chip production auxiliary assembly, especially, relate to a wafer piece bears device.

Background

To increase the chip size and reduce the production cost of a single wafer, the size of semiconductor wafers has been developed from the existing 6 inches and 8 inches to 12 inches and 18 inches, and there is a desire to develop semiconductor wafers of larger diameter and thinner thickness. However, the bearing device of the large-size wafer is a key device for ensuring the quality of the wafer, and particularly, when the wafer is produced, transported or shipped, the wafer is easy to generate fragments and is easy to be polluted by the field environment; for the transportation between the working procedures, the personnel and the automatic manipulator can carry out the operation in a crossed way; in addition, for different environments, the silicon wafers are required to be placed at different angles, so that the silicon wafers can be horizontally and stably placed and can be vertically and stably placed.

SUMMERY OF THE UTILITY MODEL

The utility model provides a wafer bears device, especially the transportation that is applicable to jumbo size wafer bears and places, has solved reduction piece rate in the transportation, has improved the technical problem that transfer efficiency and application scope are wide.

In order to solve the technical problem, the utility model discloses a technical scheme is:

a wafer carrier device comprises: the device comprises a box body for bearing a wafer, a base capable of being grabbed and matched, a mounting seat matched with a detection machine and a cover body matched with the box body; the base and the mounting seat are respectively arranged on the outer side of the box body and are arranged in an aligned mode; and the base and the mounting seat are placed in parallel with the wafer.

Furthermore, the box body is provided with a plurality of rows of groove sets for inserting the wafers; a cover slot group corresponding to the body slot group is arranged on one side of the cover body close to the box body; the wafer is placed in a gap clamping groove formed by the body groove group and the cover groove group.

Furthermore, the cover body is embedded in the box body and covered, and the cover groove group is arranged along the length of the cover body and in the middle of the length of the cover body; the cover groove group comprises a plurality of clamping strips arranged at intervals; and a plurality of Z-shaped grooves arranged at intervals are arranged on each clamping strip.

Further, the Z-shaped grooves are arranged in the same direction and/or in the opposite direction along the length direction of the clamping strip; the Z-shaped grooves in the adjacent clamping strips are arranged side by side or in a staggered manner.

Furthermore, two groove handles for operating the cover body are arranged on one side of the cover body, which is far away from the box body, and the groove handles are symmetrically arranged relative to the cover groove group.

Furthermore, handles which are symmetrically arranged are arranged on the side surfaces of the box body, and the handles are arranged on the two side surfaces adjacent to the base.

Further, the base with the box can be dismantled and be connected the setting, just the base with the mount pad is kept away from box one side is level and smooth plane.

Furthermore, the base is of a square structure and comprises a plurality of insertion holes for clamping, and the insertion holes are horizontally and/or vertically arranged along the base.

Furthermore, the mounting base comprises a plurality of clamping holes matched with the detector and connecting holes matched with the box body; the figure formed by connecting the clamping holes in a surrounding way is triangular; the connecting hole is arranged close to one side of the upper end face of the box body and is adjacent to the two clamping holes.

Furthermore, the mounting seat is also provided with a plurality of through hole circles used for contacting with the probe needles on the detection machine and an outer edge groove which is arranged along the outer edge of the through hole circles and has an outward opening.

Compared with the prior art, the bearing device designed by the utility model is especially suitable for transferring and placing large-size wafer, and has reasonable structural design, high strength, easy assembly and convenient operation; the turnover of the wafer is stable and safe; the yield is improved, the quality of the wafer is ensured, the transfer efficiency is high, the application range is wide, and the practicability is high.

The pattern grooves are formed in the top of the inner side of the cover body, so that the upper end of each wafer is embedded, the shaking of the wafers in the transfer and transportation process is reduced, and the occurrence of fragments is reduced; the bearing device which can be covered not only prevents the wafer from being polluted, but also can reduce the wafer from cracking in the process of transferring and transporting, improve the yield and ensure the product quality.

The handle that bears the device and set up through the symmetry can be suitable for manual handling operation, to special environment or short distance turnover, not only convenient but also saving operating time, also need not supporting facility installation, reduction in production cost.

Meanwhile, the other side surface of the bearing device is provided with a base which is convenient for the mechanical arm to clamp, the structure is simple, and the base can enable the wafer to be horizontally and stably placed on the table-board; the base and the box body structure of the bearing device are detachable structures, so that the maintenance and the processing are convenient.

The lower bottom surface of box is for leveling the plane and being equipped with the arc platform post that four openings all set up outwards, is convenient for cooperate with the stand that sets up on placing the platform, prevents to bear the weight of and slides or rock when device is vertical places, avoids the risk of falling to make the silicon chip put immediately, with the needs that adapt to different operating mode conditions, guarantee wafer quality, improve conveying efficiency.

The bearing device is also provided with a mounting seat matched with the detection machine, so that the bearing device can be accurately placed on the upper bearing platform of the detection machine, and the wafer can be stably and horizontally placed; the mounting seat is detachably matched with the box body, and the structure is simple to match and easy to process.

Drawings

Fig. 1 is a perspective view of a wafer carrier according to an embodiment of the present invention;

fig. 2 is a side view of a load bearing device according to an embodiment of the present invention;

fig. 3 is a bottom view of a carrier according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a box according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of a base according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of a mounting seat according to an embodiment of the present invention;

fig. 7 is a schematic back structure view of a cover according to an embodiment of the present invention;

fig. 8 is a schematic front view of a cover according to an embodiment of the present invention;

fig. 9 is a schematic structural diagram of the distribution of Z-shaped grooves in the cover groove group according to the first embodiment of the present invention;

fig. 10 is a schematic structural view of the distribution of Z-shaped grooves in the cover groove group according to the second embodiment of the present invention.

In the figure:

10. box body 11, body groove group 111 and groove group I

112. Groove group two 12, pillar 13 and handle

14. Insert post 20, lid 21, lid groove group

22. Clamping strip 23, Z-shaped groove 24 and groove handle

30. Base 31, stub 32, center hole

33. Plug hole 34, side groove 40 and mounting seat

41. Clamping hole 42, outer edge groove 43 and through hole circle

44. Connecting hole

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

The embodiment provides a wafer bearing device, as shown in fig. 1-3, which has a box 10 for bearing a wafer and a cover 20 detachably engaged with the box 10, wherein the box 10 and the cover 20 are both independently disposed, the cover 20 is embedded and fixed on the upper end surface of the box 10, and the cover 20 is operated to close or open. Wherein, a plurality of rows of cell slot groups 11 for inserting wafers are arranged in the box body 10; a cover slot group 21 corresponding to the body slot group 11 is arranged on one side of the cover body 20 close to the box body 10; the wafer is placed in a gap clamping groove formed by the body groove group 11 and the cover groove group 21; meanwhile, a base 30 which can be grabbed and matched is arranged on one side surface of the box body 10; the side of the base 30 away from the housing 10 and the bottom of the housing 10 are flat and planar.

Specifically, as shown in fig. 1 and 2, the side wall surface of the box body 10 is a rectangular structure, the width of the box body 10 is gradually reduced along the height thereof, the upper part is wide, the lower part is narrow, and the middle part is a vertical section; meanwhile, the inner side of the top end surface of the box body 10 is of a stepped structure, so as to embed the cover body 20 and cover the box body 10, thereby completing the covering with the cover body 20. In this embodiment, the box 10 is a closed structure, and after it is engaged with the cover 20, the wafer is completely sealed in the carrier, and the engaging device with this structure is mainly suitable for carrying during the packing and shipping process, so as to prevent particles and metal from contaminating the surface of the wafer during the transportation process. This structure is intended to ensure that the wafer is smoothly inserted into the housing 10, and the width and length of the upper end surface of the housing 10 are required to be larger than the width of the wafer pocket, that is, the portion of the housing 10 where the wafer pocket is located is connected to the top of the housing 10 in a transitional manner. The cassette 10 may be positioned either vertically or horizontally, but may be used to carry wafers and position the wafers across the width of the cassette 10.

As shown in fig. 3, the outer side surface of the bottom of the box 10 is a flat bottom surface, and may be directly connected to the box 10 as a whole, or may be an increased flat surface, which may be determined according to actual working conditions. In this embodiment, when the carrying device is placed vertically, it needs to be placed on a special placing rack, two symmetrically arranged plate surfaces are specially provided, four arc-shaped table posts 12 are arranged on the outer sides of the periphery of the plate surfaces, and a gap through groove is further arranged between the plate surfaces and is arranged perpendicular to the direction in which the wafer is horizontally placed, that is, along the length direction of the box body 10; the height of the arc-shaped stand columns 12 is higher than that of the position of the plate surface, the openings of the four arc-shaped stand columns 12 are arranged outwards, and the arc shapes of the stand columns 12 are at least semicircular structures; the vertical column is used for being matched with the vertical column arranged on the placing platform, so that the bearing device is prevented from sliding or shaking when vertically placed, and the falling risk is avoided. Of course, the bottom surface of other structures can be adopted, and the protection scope of the scheme is only to ensure that the bottom surface is a flat plane. The lower bottom surface of box is for leveling the plane and being equipped with the arc platform post 12 that four openings all set up outwards, is convenient for cooperate with the stand that sets up on placing the platform, slides or rocks when preventing to bear the device vertical placing, avoids the risk of falling to make the silicon chip put immediately, with the needs that adapt to different operating mode conditions, guarantee the wafer quality, improve conveying efficiency.

As shown in FIG. 4, the cell group 11 includes a first cell group 111 disposed along the height of the chamber 10 and a second cell group 112 disposed along the width of the bottom of the chamber 10, and for manufacturing the first cell group 111 and the second cell group 112, preferably, the first cell group 111 and the second cell group 112 enclose a U-shaped slot disposed discontinuously, and the wafer is placed along the slot.

The first groove group 111 is arranged along the height direction of the box body 10, and the first groove group 111 is more stable and safer for clamping and placing the wafer compared with the second groove group 112, so that the height of the first groove group 111 is required to be smaller than the diameter of the wafer and larger than the radius of the wafer, and the purpose is to ensure that the height of the contact area of the first groove group 111 and the wafer is at least 1/2 of the diameter, so that the stability of clamping and placing two side surfaces of the wafer can be ensured. Preferably, the first groove group 111 is an arc-shaped structure with a wide upper part and a narrow lower part, which is more beneficial to the stability of the wafer matching with the clamping groove, and can prevent the wafer from shaking in the clamping groove and reduce the cracking caused by the shaking.

Because the second slot set 112 is only used for supporting the wafer so as to enable the wafer to form a stable structure with three-point contact in the slot, the length of the second slot set 112 is required to be smaller than the radius of the wafer, but the second slot set 112 is required to be an arc-shaped slot with two ends independently arranged, is respectively arranged at the connecting part of the side surface and the bottom surface and is higher than the lowest part of the bottom surface, when the wafer is placed, the second slot set 112 is in contact with two side edges of the lowest part of the wafer, and the lowest part of the wafer is arranged in a suspended manner so as to ensure that the contact depth difference between the second slot set 112 and the wafer is smaller, so that the placing stability of the wafer is further improved, and the wafer is prevented from shaking in the transportation process. Preferably, the groove group I111 and the groove group II 112 are all laths with the same thickness, and the gaps between the adjacent grooves are the same in width, so that the processing is convenient, and the structural consistency is good.

As shown in fig. 1 to 4, handles 13 are symmetrically disposed on the lateral sides of the box 10, and the handles 13 are disposed on two lateral sides adjacent to the base 30, that is, the handles 13 are disposed on two lateral sides in the width direction of the box 10, and the lateral sides are disposed near the side of the slot group 11. Preferably, the handle 13 is detachably mounted to a side surface of the housing 10, and is inclined toward the base 30.

Because the diameter of the wafer is relatively large, and in order to ensure the stable placement of the wafer, the bearing device needs a certain thickness and a shape structure with a size larger than the diameter of the wafer, so the overall weight of the bearing device is relatively heavy. While a certain force is required to extract the wafer carrier or empty carrier, the handle 13, which is disposed at an angle, is more convenient for the operator to handle, especially when the wafer is horizontally disposed. The handle 13, which is detachably disposed, can be applied to an operation process in which a space is limited. The bearing device can be suitable for manual carrying operation through the handles 13 symmetrically arranged, and is convenient and saves operation time for special environment or short-distance turnover, and the installation of matched facilities is not needed, so that the production cost is reduced.

Preferably, as shown in fig. 5, a base 30 is further disposed on either side of the chamber 10 parallel to the wafer, and the base 30 is detachably connected to the chamber 10. In the present embodiment, the side of the base 30 away from the box 10 is a flat plane and has a square structure, but it may also have other structural shapes, and one side of the base close to the box 10 is provided with a short column 31, a center hole 32 is provided at the center of the short column 31, and the short column 31 is clamped in a boss on the outer side wall of the box 10 and is embedded in the center hole 32. A plurality of insertion holes 33 for engaging with a manipulator are further formed on a side of the base 30 away from the box 10, and the insertion holes 33 are formed at the outer edge of the central hole 32, and the specific positions can be determined according to actual conditions.

In order to improve the adjustability of the base 30 in cooperation with the manipulator, four insertion holes 33 are optionally provided, wherein two insertion holes 33 are arranged along the horizontal direction of the base 30, and the other two insertion holes 33 are arranged along the vertical direction of the base 30, i.e. the adjustment can be performed in the horizontal direction or the vertical direction. Of course, four may be provided, each being disposed along the horizontal direction of the base 30, or each being disposed along the vertical direction of the base 30. A plurality of side grooves 34 with different shapes and outward openings are formed in one side of the base 30 away from the box body 10, and the side grooves can also be matched with chucks on the platform to clamp and fix the base 30 so as to meet the requirements of different clamping and fixing modes.

The base 30 can be suitable for long-distance transportation or automatic control processes, and is convenient, stable and safe to operate. Meanwhile, the structural design of the whole base 30 is very simple, and the base 30 can be used as a reference, so that the wafer is horizontally and stably placed on a worktable; the base 30 and the box 10 for carrying the device are detachable, so that the maintenance and the processing are more convenient.

As shown in fig. 6, a mounting seat 40 for engaging with the inspection machine is further provided on a side surface of the casing 10, and the mounting seat 40 is provided opposite to the base 30. Preferably, the mounting seat 40 is also detachably mounted to the housing 10. The mounting base 40 is further provided with three clamping holes 41 matched with the detector, the three clamping holes 41 are all of long circular hole structures, and the central points of the three clamping holes 41 are connected to form a stable isosceles triangle. Meanwhile, a plurality of outer edge grooves 42 with openings arranged outwards are arranged on the outer edge of the mounting seat 40 and are used for being matched with positioning pins on the detection machine. A plurality of distributed through hole circles 43 are further arranged on the mounting seat 40, and are used for contacting with a probe needle on the detection machine and judging the accuracy of the placement position of the bearing device.

Meanwhile, a plurality of connection holes 44 are further formed in the mounting seat 40 to be matched with the insertion posts 14 disposed on the side surface of the box body 10, preferably, the connection holes 44 are disposed near the clamping holes 41, in this embodiment, two connection holes 44 are provided, and accordingly, the number of the insertion posts 14 is also two. In order to increase the stable fixing and placing state, two inserting columns 14 are arranged close to the upper end face side of the box body 10, so that the mounting base 40 can be stably matched with the box body 10, and the box body 10 can be stably placed on the upper loading platform of the detection machine.

The installation seat 40 can enable the bearing device to be matched with the detection machine, enable the bearing device to be accurately placed on the upper loading platform of the detection machine and enable the wafer to be stably and horizontally placed; the mounting seat 40 is detachably matched with the box body 10, and the structure matching is simple and easy to process.

As shown in fig. 7 and 8, the cover 20 is embedded in the box 10 and covers the box, and the inner side of the cover 20 is also of a stepped structure and is adapted to the upper end surface of the box 10; and the cover groove group 21 is provided along the length of the cover body 20 at a position intermediate the length thereof. The cover groove group 21 includes a plurality of clamping strips 22 arranged at intervals, and a clamping groove for clamping a wafer is arranged between adjacent clamping strips 22. In the embodiment, the length of the card bar 22 is less than 1/2 of the length of the cover 20 and greater than 1/4 of the length of the cover 20, because if the length of the card bar 22 is greater than 1/2, the length of the card bar 22 is increased, and the card slot formed by the card bar 22 only contacts with the top of the wafer, because the thickness of the cover 20 itself limits, the depth of the card slot formed by the card bar 22 is limited, the area of the wafer contacting with the card bar 22 cannot be too large, and the too long card bar 22 wastes material, thereby also affecting the matching accuracy with the wafer. If the length of the clamping strip 22 is less than 1/4 of the length of the cover 20, so that the contact area between the clamping groove formed by the clamping strip 22 and the wafer is too short, the placing stability of the clamping strip cannot be further improved, and preferably, the length of the clamping strip 22 is less than 1/3 of the length of the cover 20 and greater than 1/4 of the length of the cover 20, so that the length of the strip 22 can be reduced to the maximum extent on the premise of ensuring that the wafer is placed stably, so as to reduce the processing cost of the cover 20.

As shown in fig. 9-10, each of the clamping strips 22 is provided with a plurality of Z-shaped grooves 23 arranged at intervals, each of the clamping strips 22 is provided with at least two Z-shaped grooves 23, two adjacent Z-shaped grooves 23 are connected by a rectangular solid block, the Z-shaped grooves 23 on each of the clamping strips 22 are arranged at intervals, and the distances between the adjacent Z-shaped grooves 23 are the same. The Z-shaped grooves 23 in each clamping strip 22 are arranged in the same direction and/or in the opposite direction along the length direction of the clamping strip 22, and the Z-shaped grooves 23 in adjacent clamping strips 22 are arranged side by side or in a staggered manner.

As shown in fig. 9, the Z-shaped grooves 23 are disposed parallel to the card strip 22 along the length direction of the card strip 22, and the Z-shaped grooves 23 in all the card strips 22 are disposed in the same direction and have the same distance. For example, the Z-shaped grooves 23 in the adjacent clamping strips 22 are arranged side by side in the same direction; or the Z-shaped grooves 23 in the adjacent clamping strips 22 are arranged in the same direction in a staggered mode, and the drawing is omitted.

As shown in fig. 10, the Z-shaped grooves 23 are also arranged parallel to the card strips 22 along the length direction of the card strips 22, and the Z-shaped grooves 23 in each card strip 22 are arranged in the same direction, but the Z-shaped grooves 23 in some card strips are arranged in the opposite direction to the Z-shaped grooves 23 in fig. 9, that is, the Z-shaped grooves 23 in some card strips 22 are arranged in the opposite direction, and the intervals between adjacent Z-shaped grooves 23 in all the same card strips 22 are the same; the clamping strip 22 where the reverse Z-shaped groove 23 is located and the clamping strip 22 where the forward Z-shaped groove 23 is located are arranged at intervals; of course, the arrangement of the clamping strip 22 where the reverse Z-shaped groove 23 is located and the arrangement of the clamping strip 22 where the forward Z-shaped groove 23 is located may be in other manners, but the invention is within the protection scope of the present application. Such as Z-shaped grooves 23 in adjacent strips 22 arranged side by side; or the Z-shaped grooves 23 in the adjacent clamping strips 22 are arranged in a staggered mode, and the drawing is omitted.

Further, the Z-shaped grooves 23 are arranged along the length direction of the card strip 22, but the Z-shaped groove 23 on each card strip 22 may be arranged in a forward direction or a reverse direction, that is, adjacent Z-shaped grooves 23 in each card strip 22 may be arranged in the forward direction or the reverse direction or in a forward direction and a reverse direction; meanwhile, the Z-shaped grooves 23 in the adjacent clamping strips 22 can be arranged side by side in the same direction, can also be arranged side by side in the reverse direction, or can be arranged side by side in the forward and reverse directions. Of course, for the structure in which the Z-shaped grooves 23 in the adjacent card strips 22 are arranged in a staggered manner, the Z-shaped grooves 23 arranged in a staggered manner may all be in the same direction, may all be in the opposite direction, or both exist in the forward direction and the reverse direction, and the drawings are omitted.

The upper end part of each wafer is embedded and placed by arranging the Z-shaped patterned groove on the inner side of the cover body 20, so that the shaking of the wafers in the transfer and transportation process is reduced, and the generation of fragments is reduced; the bearing device which can be covered not only prevents the wafer from being polluted, but also can reduce the wafer from cracking in the process of transferring and transporting, improve the yield and ensure the product quality.

Furthermore, two circular groove handles 24 for operating the cover body 20 are arranged on one side of the cover body 20 away from the box body 10, the groove handles 24 are symmetrically arranged relative to the cover groove group 21, and when viewed from the outside, the groove handles 24 are two fan-shaped grooves arranged diagonally and two circular arc-shaped holes arranged diagonally. The corresponding side close to the box body 10 is an operation space formed by two rectangular plates which are stacked and are coaxially arranged and have different widths, and a circular groove which is matched with the groove handle 24 is arranged in the middle of the two stacked rectangular plates. The arrangement of the structure does not affect the matching of the wafer and the cover groove group 21, and the matching of the cover body 20 and the box body 10 can be freely operated, so that the structure is safe, reliable, energy-saving and environment-friendly.

1. The carrying device designed by the utility model is especially suitable for transferring and placing large-size wafer slices, and has reasonable structural design, high strength, easy assembly and convenient operation; the turnover of the wafer is stable and safe; the yield is improved, the quality of the wafer is ensured, the transfer efficiency is high, the application range is wide, and the practicability is high. After the box body and the cover body are matched, the wafer is completely sealed in the bearing device, the matching of the structure is more suitable for carrying in the wafer packaging and delivery process, the surface of the wafer is prevented from being polluted by particles and metal in the transportation process, the surface quality of the wafer is ensured, and the bearing efficiency is improved.

2. The pattern grooves are formed in the top of the inner side of the cover body, so that the upper end of each wafer is embedded, the shaking of the wafers in the transfer and transportation process is reduced, and the occurrence of fragments is reduced; the bearing device which can be covered not only prevents the wafer from being polluted, but also can reduce the wafer from cracking in the process of transferring and transporting, improve the yield and ensure the product quality.

3. The handle that bears the device and set up through the symmetry can be suitable for manual handling operation, to special environment or short distance turnover, not only convenient but also saving operating time, also need not supporting facility installation, reduction in production cost.

4. Meanwhile, the other side surface of the bearing device is provided with a base which is convenient for the mechanical arm to clamp, the structure is simple, and the base can enable the wafer to be horizontally and stably placed on the table-board; the base and the box body structure of the bearing device are detachable structures, so that the maintenance and the processing are convenient.

5. The lower bottom surface of box is for leveling the plane and being equipped with the arc platform post that four openings all set up outwards, is convenient for cooperate with the stand that sets up on placing the platform, prevents to bear the weight of and slides or rock when device is vertical places, avoids the risk of falling to make the silicon chip put immediately, with the needs that adapt to different operating mode conditions, guarantee wafer quality, improve conveying efficiency.

6. The bearing device is also provided with a mounting seat matched with the detection machine, so that the bearing device can be accurately placed on the upper bearing platform of the detection machine, and the wafer can be stably and horizontally placed; the mounting seat is detachably matched with the box body, and the structure is simple to match and easy to process.

The embodiments of the present invention have been described in detail, and the description is only for the preferred embodiments of the present invention, and should not be construed as limiting the scope of the present invention. All the equivalent changes and improvements made according to the application scope of the present invention should still fall within the patent coverage of the present invention.

Claims

1. A wafer carrier device, comprising: the device comprises a box body for bearing a wafer, a base capable of being grabbed and matched, a mounting seat matched with a detection machine and a cover body matched with the box body; the base and the mounting seat are respectively arranged on the outer side of the box body and are arranged in an aligned mode; and the base and the mounting seat are placed in parallel with the wafer.

2. The wafer carrier as claimed in claim 1, wherein the housing has a plurality of rows of slots for receiving the wafers; a cover slot group corresponding to the body slot group is arranged on one side of the cover body close to the box body; the wafer is placed in a gap clamping groove formed by the body groove group and the cover groove group.

3. The wafer carrier as claimed in claim 2, wherein the cover is embedded in the housing and covers the housing, and the cover slot group is disposed along and intermediate the length of the cover; the cover groove group comprises a plurality of clamping strips arranged at intervals; and a plurality of Z-shaped grooves arranged at intervals are arranged on each clamping strip.

4. The wafer carrier device as claimed in claim 3, wherein the Z-shaped grooves are arranged in the same direction and/or in opposite directions along the length direction of the clamping strip; the Z-shaped grooves in the adjacent clamping strips are arranged side by side or in a staggered manner.

5. A wafer carrier as claimed in claim 3 or 4, wherein two recess handles are provided on the side of the cover remote from the housing for operating the cover, the recess handles being symmetrically arranged with respect to the set of recesses.

6. The wafer carrier as claimed in claim 5, wherein symmetrically disposed handles are disposed on the sides of the housing, the handles being disposed on two sides adjacent to the base.

7. The wafer carrier device as claimed in any one of claims 1 to 4 and 6, wherein the base is detachably connected to the housing, and the sides of the base and the mounting seat away from the housing are flat surfaces.

8. The wafer carrier as claimed in claim 7, wherein the base is a square structure including a plurality of holes for snap-fitting, the holes being horizontally and/or vertically disposed along the base.

9. The wafer bearing device as claimed in any one of claims 1 to 4, 6 and 8, wherein the mounting base comprises a plurality of clamping holes matched with the detector and connecting holes matched with the box body; the figure formed by connecting the clamping holes in a surrounding way is triangular; the connecting hole is arranged close to one side of the upper end face of the box body and is adjacent to the two clamping holes.

10. The wafer carrier as claimed in claim 9, wherein the mounting base further has a plurality of through holes for contacting with the probes of the inspection machine and an outer groove along the outer edge thereof with an opening facing outward.