CN221149962U - Carrier and carrier box for accommodating semiconductor products - Google Patents
Carrier and carrier box for accommodating semiconductor products Download PDFInfo
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- CN221149962U CN221149962U CN202322749955.4U CN202322749955U CN221149962U CN 221149962 U CN221149962 U CN 221149962U CN 202322749955 U CN202322749955 U CN 202322749955U CN 221149962 U CN221149962 U CN 221149962U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 43
- 230000000149 penetrating effect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 26
- 230000008569 process Effects 0.000 description 26
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 239000000969 carrier Substances 0.000 description 6
- 239000010410 layer Substances 0.000 description 5
- 239000003292 glue Substances 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 238000012790 confirmation Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000010330 laser marking Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000012939 laminating adhesive Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- NGVDGCNFYWLIFO-UHFFFAOYSA-N pyridoxal 5'-phosphate Chemical compound CC1=NC=C(COP(O)(O)=O)C(C=O)=C1O NGVDGCNFYWLIFO-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Abstract
The utility model provides a carrier for receiving a semiconductor product, comprising: the semiconductor device comprises a body, a first side and a second side, wherein the body is used for bearing a semiconductor product in a bearing box and is provided with a center point, a first side and a virtual center line penetrating through the center point and the first side when seen from a top view, and the body is asymmetric relative to the virtual center line; the first limiting structure is arranged on the first side and located on the first side of the virtual center line, and the first limiting structure is used for being clamped with the bearing box. The utility model also provides a bearing box for bearing round products and square products. According to the embodiment of the utility model, the first limiting structure is formed on the bearing piece, and the body is of an asymmetric structure, so that the problem that the directivity of the bearing piece is difficult to judge is solved.
Description
Technical Field
The utility model relates to a bearing piece and a bearing box for containing semiconductor products.
Background
Fig. 1-8 illustrate a process for making a semiconductor product 10, including encapsulating an Ultraviolet (UV) adhesive 1 in the process shown in fig. 1; back side lamination (back side lamination, BSL) of the glue layer 2 in the process shown in fig. 2; placing the semiconductor product 10 onto a frame (frame) 4in the process shown in fig. 3; removing the adhesive tape 3 in the process shown in fig. 4, and completing the processes of fig. 1 to 4 on the same machine, namely four-in-one (4 in 1); backside curing (back side cure) is performed in the process shown in fig. 5; using laser marking to the semiconductor product 10 in the process shown in fig. 6 to score information such as model number; a singulation process is performed on successive semiconductor products 10 in the process shown in fig. 7; the singulated semiconductor products 10 are repackaged with UV glue in the process shown in fig. 8; the singulated semiconductor products 10 are placed (PICK AND PLACE, P & P) in other positions in the process shown in fig. 9. In the Back end process of fig. 3-8, the semiconductor product 10 is located on the chase 4, and the chase 4 carries the semiconductor product 10 into the apparatus for the process. Since the semiconductor product 10 is firmly mounted on the iron frame 4, and the iron frame 4 and the product are symmetrical, the iron frame 4 can be manually taken and placed only by manpower when being placed in the square carrying box-front opening wafer transfer box (Front Opening Unified Pod, FOUP) -and can be manually checked whether to be reversed or not, no engineering confirmation means is found, and when the semiconductor product 10 is placed in the FOUP in the opposite direction during self-inspection, the door of the FOUP can be normally closed, but if the iron frame 4 is placed in the FOUP in the form of being faced downwards upwards, the machine can cause damage such as scratch and the like to the semiconductor product 10 when the semiconductor product 10 is taken out from the FOUP, and the yield of the semiconductor product 10 is reduced.
In the future, large-sized Fan-out (Fan out) panel products will gradually develop, and rectangular panel-level thinned products with 600mm and 300mm are not popular in the semiconductor industry, and the problem of low use universality exists in the process equipment, jigs (such as FOUP, metal bearing box and the like) used correspondingly by the equipment, and materials are required to be customized and developed and evaluated.
Disclosure of utility model
In view of the problems in the related art, an object of the present utility model is to provide a carrier and a carrier box for accommodating semiconductor products, so as to at least solve the problem that the orientation of the carrier is not easy to determine.
To achieve the above object, the present utility model provides a carrier for accommodating semiconductor products, comprising: the semiconductor device comprises a body, a first side and a second side, wherein the body is used for bearing a semiconductor product in a bearing box and is provided with a center point, a first side and a virtual center line penetrating through the center point and the first side when seen from a top view, and the body is asymmetric relative to the virtual center line; the first limiting structure is arranged on the first side and located on the first side of the virtual center line, and the first limiting structure is used for being clamped with the bearing box.
In some embodiments, the carrier further comprises: the second limiting structure is asymmetrically arranged on the second side of the body with the first limiting structure by taking the virtual center line as a reference.
In some embodiments, the carrier further comprises: the second limiting structure is arranged on the second side of the body by taking the virtual center line as a reference, and the outer contour of the second limiting structure is different from the outer contour of the first limiting structure in geometric contour when the second limiting structure is observed from the overlooking view.
In some embodiments, the outer contour of the second spacing structure is the same shape and different size than the outer contour of the first spacing structure.
In some embodiments, the outer contour of the second limit structure and the outer contour of the first limit structure are different in shape.
In some embodiments, the second spacing structure is disposed on the first side.
In some embodiments, the carrier further comprises: the body comprises a second edge opposite to the first edge, and the third limiting structure is arranged on the second edge.
In some embodiments, the first and second stop structures are grooves recessed from the first edge.
A carrier box for carrying round products and square products, comprising: a third sidewall, a fourth sidewall opposite the third sidewall, a first sidewall between the third sidewall and the fourth sidewall; the support frames are arranged on the third side wall and the fourth side wall and are used for supporting square products; the propping piece is arranged on the first side wall and used for propping the square product; the limiting piece is matched with the square product, is clamped with the square product in a specific direction, and is not clamped with the round product.
In some embodiments, the distance between the stop and the center point of the circular product is greater than or equal to the radius of the circular product.
In some embodiments, the stop is disposed on the third sidewall.
In some embodiments, the rounded product is in contact with the stop.
In some embodiments, the stop is disposed on the first sidewall.
In some embodiments, the limiting member is disposed on the body of the carrying case, and the limiting member and the square product are in a concave-convex structure.
In some embodiments, the distance between the stop and the third sidewall is less than the distance between the abutment and the third sidewall.
In some embodiments, the stop is disposed on the first sidewall and is disposed side-by-side with the abutment.
In some embodiments, the carrying case has a front cover, the front cover has a second side wall facing the first side wall, the limiting member is disposed on the second side wall, and the limiting member and the square product are in a concave-convex structure.
In some embodiments, the front cover may cover the carrying case only at a specific angle.
In some embodiments, the second side wall of the front cover is provided with a concave-convex structure matched with the supporting frame.
In some embodiments, the shape of the abutment and the stop are different.
The beneficial technical effects of the utility model are as follows:
According to the embodiment of the application, the first limiting structure is formed on the bearing piece, and the body is of an asymmetric structure, so that the problem that the directivity of the bearing piece is difficult to judge is solved.
Drawings
FIGS. 1-8 illustrate a process for manufacturing a semiconductor product, including encapsulating UV glue in the process of FIG. 1; the backside laminating adhesive layer in the process shown in fig. 2; placing the semiconductor product onto the chase in the process shown in fig. 3; removing the tape in the process shown in fig. 4; backside curing is performed in the process shown in fig. 5; using laser marking for semiconductor products in the process shown in fig. 6; performing a singulation process on successive semiconductor products in the process shown in fig. 7; re-encapsulating the singulated semiconductor products with UV glue in the process shown in fig. 8; the singulated semiconductor products are placed in other locations in the process shown in fig. 9.
Fig. 10 shows a perspective view of a carrying case according to an embodiment of the present application.
Fig. 11 shows an internal top view of the carrier of fig. 9 and the semiconductor product in the carrier box.
Fig. 12 shows a schematic structural view of the inner side of the front cover of the carrying case.
Fig. 13 shows a schematic structural view of the abutment and the stop member corresponding to the embodiment of fig. 9.
Fig. 14 to 19 show different embodiments from fig. 13, in which a third limit structure of a different shape from fig. 14; the first and second spacing structures of the embodiment of fig. 15 are different in shape; the first and second spacing structures of the embodiment of fig. 16 are differently shaped and asymmetrically positioned; the first and second spacing structures 31, 32 of the embodiment of fig. 17 are different in size; the embodiment of fig. 18 provides only a first limiting structure; the first and second spacing structures of the embodiment of fig. 19 are different in shape.
Detailed Description
For a better understanding of the spirit of embodiments of the present application, a further description of some preferred embodiments of the application is provided below.
Embodiments of the present application will be described in detail below. Throughout the present specification, the same or similar components and components having the same or similar functions are denoted by similar reference numerals. The embodiments described herein with respect to the drawings are of illustrative nature, of diagrammatic nature and are provided for the basic understanding of the present application. The embodiments of the present application should not be construed as limiting the application.
As used herein, the terms "substantially," "substantially," and "about" are used to describe and illustrate minor variations. When used in connection with an event or circumstance, the terms can refer to instances where the event or circumstance occurs precisely and instances where it occurs to the close approximation.
In this specification, unless specified or limited otherwise, relative terms such as: the terms "central," "longitudinal," "lateral," "front," "rear," "right," "left," "interior," "exterior," "lower," "upper," "horizontal," "vertical," "above," "below," "upper," "lower," "top," "bottom," and derivatives thereof (e.g., "horizontally," "downwardly," "upwardly," etc.) should be construed to refer to the directions as described in the discussion or as illustrated in the drawings. These relative terms are for convenience of description only and do not require that the application be constructed or operated in a particular orientation.
For ease of description, "first," "second," "third," etc. may be used herein to distinguish between different components of a figure or series of figures. The terms "first," "second," "third," and the like are not intended to describe corresponding components.
Fig. 9 shows a top view of a carrier 20 and a semiconductor product 10 on the carrier 20 according to an embodiment of the present application, which provides a carrier 20 for receiving the semiconductor product 10, comprising: a body 22 for carrying the semiconductor product 10 within the carrying case 40, the body 22 having a center point 220 and a first side 221, and a virtual center line 228 extending through the center point 220 and the first side 221 in a plan view, the body 22 being asymmetric with respect to the virtual center line 228, that is, the left and right portions of the body 22 located at the virtual center line 228 are asymmetric; the first limiting structure 31 is disposed on the first side 221 and located on a first side (left side as shown in fig. 9) of the virtual center line 228, and the first limiting structure 31 is configured to engage with the carrier box 40. The embodiment of the application solves the problem that the directivity of the carrier 20 is not easy to determine by forming the first limiting structure 31 on the carrier 20 and the body 22 is an asymmetric structure.
Fig. 10 shows a perspective view of the carrier box 40 according to an embodiment of the present application, fig. 11 shows an internal plan view when the carrier 20 shown in fig. 9 and the semiconductor product 10 are located in the carrier box 40, and fig. 12 shows a schematic structural view of the inner side (second side wall 42) of the front cover 80 of the carrier box 40. A carrier box 40 that carries a round product (i.e., semiconductor product) 10 and a square product (i.e., carrier 20) 20, comprising: a third sidewall 43, a fourth sidewall 44 opposite to the third sidewall 43, and a first sidewall 41 between the third sidewall 43 and the fourth sidewall 44; a support frame 50 disposed on the third and fourth side walls 43 and 44, the support frame 50 being for supporting the square product 20; a propping member 60 disposed on the first sidewall 41 for propping the square product 20; the stopper 70 is matched with the square product 20, and the stopper 70 is engaged with the square product 20 in a specific direction (for example, the direction shown in the figure) and is not engaged with the round product 10. The embodiment of the application solves the problem that the directivity is not easy to judge when the square product/bearing piece 20 is put into the bearing box 40 by forming a structure that the square product 20 and the bearing box 40 matched with the square product can be mutually clamped in a specific direction.
Fig. 13 shows a schematic structural view of the propping member 60 and the limiting member 70 corresponding to the embodiment of fig. 9, wherein the propping member 60 is clamped in the first limiting structure 31 and the second limiting structure 32, and the limiting member 70 is clamped in the third limiting structure 33, in this embodiment, the first limiting structure 31 and the second limiting structure 32 may be asymmetric with respect to the virtual center line 228 or may be asymmetric with respect to the virtual center line 228, because the anti-fool design of the third limiting structure 33 located on the left side of the virtual center line 228 ensures the asymmetry of the body 22, and the front cover 80 cannot successfully cover the carrying case 40 when the carrying member 20 is put into the carrying case 40 and the direction is reversed, thereby solving the problem that the directionality of the carrying member 20 is not easy to judge.
Fig. 14 to 19 show embodiments different from fig. 13, in which the first and second limit structures 31, 32 in fig. 14 may be asymmetrical with respect to the virtual center line 228, or with respect to the virtual center line 228, since the asymmetry of the body 22 is ensured by providing a third limit structure 33 of a different shape located to the left of the virtual center line 228; the embodiment of fig. 15 guarantees an asymmetry of the body 22 by the different shapes of the first and second limit structures 31, 32; the embodiment of fig. 16 ensures the asymmetry of the body 22 by the different shape, position asymmetry of the first and second limit structures 31, 32; the embodiment of fig. 17 ensures the asymmetry of the body 22 by the different sizes of the first and second limit structures 31, 32; the embodiment of fig. 18 ensures asymmetry of the body 22 by providing the first limit structure 31 only to the right of the virtual center line 228; the embodiment of fig. 19 ensures an asymmetry of the body 22 by the different shapes of the first and second limit structures 31, 32.
In the embodiment of fig. 15 to 17, 19, the carrier 20 further comprises: the second limiting structure 32 is disposed on the second side of the body 22 asymmetrically with respect to the first limiting structure 31 based on the virtual center line 228.
In the embodiment of fig. 15 to 16, 19, the carrier 20 further comprises: the second limiting structure 32 is disposed on the second side of the body 22 with reference to the virtual center line 228, and the outer contour of the second limiting structure 32 and the outer contour of the first limiting structure 31 are different in geometric contour when viewed from the top view, and includes: the shape and the size are different; or the same shape but different sizes.
In the embodiment of fig. 17, the outer contour of the second limiting structure 32 is the same as the outer contour of the first limiting structure 31 in shape and different in size.
In the embodiment of fig. 15 to 16 and 19, the outer contour shape of the second limiting structure 32 is different from the outer contour shape of the first limiting structure 31.
In the embodiment of fig. 13-17 and 19, the second stop structure 32 is disposed on the first edge 221.
In the embodiment of fig. 13, the carrier 20 further comprises: the body 22 includes a second edge 222 opposite to the first edge 221, and the third limiting structure 33 is disposed on the second edge 222.
In the embodiment of fig. 13-19, the first and second stop structures 31, 32 are grooves recessed from the first edge 221.
In some embodiments, the distance between the limiting member 70 and the center point of the circular product 10 is greater than or equal to the radius of the circular product/semiconductor product 10, that is, the limiting member 70 does not touch or interfere with the circular product 10, and does not affect the taking and placing of the circular product 10.
In the embodiment of fig. 16, a stop 70 is provided on the third side wall 43. The round product 10 is in contact with the stop 70.
In the embodiment of fig. 14, the stopper 70 is provided on the first side wall 41. The stopper 70 is provided on the first side wall 41 and is provided side by side with the abutting piece 60.
In the embodiment of fig. 13 and 14, the limiting member 70 is disposed on the body 22 of the carrying case 40, and the limiting member 70 and the square product 20 are in a concave-convex structure 82.
In the embodiment of fig. 14, the distance between the stopper 70 and the third side wall 43 is smaller than the distance between the abutment 60 and the third side wall 43.
The carrier box 40 has a front cover 80, the front cover 80 has a second side wall 42 facing the first side wall 41, and in the embodiment corresponding to fig. 13, the limiting member 70 is disposed on the second side wall 42, and the limiting member 70 and the square product 20 are in a concave-convex structure. The front cover 80 can cover the carrier box 40 only at a specific angle, so that each layer of carriers 20 can be further ensured to correspond to the front cover 80 of the carrier box (FOUP) 40, and the direction of each layer of carriers 20 is ensured to be correct. When a plurality of carriers 20 are put into the respective layer accommodating spaces of the carrier box 40, even if only one direction of the carriers 20 is reversed, it is clearly observed that the reversed carrier 20 is not engaged with the stopper 70 when the front cover 80 of the carrier box 40 is covered. However, if all the carriers 20 are reversed, i.e. all the upper surfaces of the carriers 20 are facing downward, the front cover 80 is only likely to be covered if rotated 180 °, and the operator can obviously perceive that the direction is incorrect, the entire product of the carrier case 40 is reversed, and the stop 70 on the front cover 80 and the asymmetric third stop structure 33 are the last line of confirmation defense.
Referring to fig. 12, the second side wall 42 of the front cover 80 has a concave-convex structure 82 cooperating with the supporting frame 50, and when the carrier 20 is accommodated in the carrier box 40, the carrier 20 is located between the concave-convex structures 82. In the embodiment shown in fig. 11 and 12, the stopper 70 is also located between the upper and lower concave-convex structures 82, and has a dimension in the longitudinal direction of 1.5mm, a dimension in the width direction of 1mm, and a depth perpendicular to the longitudinal direction and the width direction of 0.5mm; correspondingly, the dimension of the third limit structure 33 in the length direction is 48mm, the dimension in the depth direction is 3mm, and the dimension in the width direction (i.e., the thickness of the carrier 10) is 1.5mm, that is, the dimension of the third limit structure 33 is larger than the dimension of the limit member 70 as a whole.
In the embodiment of fig. 14, the shape of the abutment 60 and the stop 70 are different.
Embodiments of the present application provide a design of a carrier/square product 20 that carries a semiconductor product 10 (e.g., a panel-level package) as a chase and a carrier box 40 that is mutually restrained. The carrier 20 and carrier box 40 of embodiments of the present application may be used for panel-level packages (PANEL LEVEL PACKAGE, PLP) with a 300 x 300mm size panel, 300 x 300mm size wafer, fan-out, or Fan-in. The embodiment of the application provides the first limiting structure 31 to the third limiting structure 33 with different appearances, numbers and positions, and the propping piece 60 and the limiting piece 70 with different effects. The abutment 60 of the present embodiment conforms to the first spacing structure 31 (or the second spacing structure 32) and further provides a steady support.
The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (10)
1. A carrier for receiving a semiconductor product, comprising:
A body for carrying the semiconductor product within a carrying case, the body having a center point and a first side, and a virtual center line extending through the center point and the first side when viewed from a top view, the body being asymmetric with respect to the virtual center line;
The first limiting structure is arranged on the first side and located on the first side of the virtual center line and is used for being clamped with the bearing box.
2. The carrier for housing semiconductor products of claim 1, further comprising:
The second limiting structure is arranged on the second side of the body in an asymmetric mode with the first limiting structure by taking the virtual center line as a reference.
3. The carrier for housing semiconductor products of claim 1, further comprising:
The second limiting structure is arranged on the second side of the body with the virtual center line as a reference, and the outer contour of the second limiting structure is different from the outer contour of the first limiting structure in geometric contour when seen from the top view.
4. A carrier for receiving semiconductor products according to any one of claims 2 to 3, wherein the second limit structure is provided on the first side.
5. A carrier box for carrying round products and square products, comprising:
a third sidewall, a fourth sidewall opposite the third sidewall, a first sidewall between the third sidewall and the fourth sidewall;
the support frame is arranged on the third side wall and the fourth side wall and is used for supporting the square product;
the propping piece is arranged on the first side wall and used for propping the square product;
And the limiting piece is matched with the square product, is clamped with the square product in a specific direction, and is not clamped with the round product.
6. The carrier box of claim 5, wherein the distance between the limiting member and the center point of the round product is greater than or equal to the radius of the round product.
7. The carrier box for round and square products of claim 6 wherein the stop is disposed on the first side wall.
8. The carrying case for carrying round products and square products according to claim 5, wherein the limiting member is disposed on the body of the carrying case, and the limiting member and the square product are of a concave-convex structure.
9. The carrier box of claim 8, wherein a distance between the stop and the third sidewall is less than a distance between the abutment and the third sidewall.
10. The carrier box of claim 5, wherein the carrier box has a front cover having a second side wall facing the first side wall, the stopper is disposed on the second side wall, and the stopper and the square product are in a concave-convex structure with each other.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202322749955.4U CN221149962U (en) | 2023-10-13 | 2023-10-13 | Carrier and carrier box for accommodating semiconductor products |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202322749955.4U CN221149962U (en) | 2023-10-13 | 2023-10-13 | Carrier and carrier box for accommodating semiconductor products |
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Publication Number | Publication Date |
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CN221149962U true CN221149962U (en) | 2024-06-14 |
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CN202322749955.4U Active CN221149962U (en) | 2023-10-13 | 2023-10-13 | Carrier and carrier box for accommodating semiconductor products |
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CN (1) | CN221149962U (en) |
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2023
- 2023-10-13 CN CN202322749955.4U patent/CN221149962U/en active Active
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