CN213902253U - Dimension inspection tool for wafer cutting ring - Google Patents
Dimension inspection tool for wafer cutting ring Download PDFInfo
- Publication number
- CN213902253U CN213902253U CN202120020104.4U CN202120020104U CN213902253U CN 213902253 U CN213902253 U CN 213902253U CN 202120020104 U CN202120020104 U CN 202120020104U CN 213902253 U CN213902253 U CN 213902253U
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- CN
- China
- Prior art keywords
- wafer cutting
- cutting ring
- sliding
- regulating part
- base
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- Expired - Fee Related
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Abstract
The utility model relates to a size inspection frock of wafer cutting ring, including the base, be equipped with the recess on the base, the recess both ends are the inserted hole of wafer cutting ring respectively, and the recess both sides are equipped with locating component, and two sets of locating component set up relatively, locating component includes regulating part, sliding part and spring, the regulating part is equipped with waist shape hole, and the regulating part passes through screw connection with the base, and the screw is worn to establish in waist shape hole, the sliding part is connected with the regulating part, is equipped with the spring between sliding part and the regulating part, the regulating part is equipped with the depressed part, and the sliding part setting is equipped with range finding sensor in the depressed part, the sliding part. The utility model discloses a dimension inspection frock of wafer cutting ring can be convenient for inspect the size of wafer cutting ring, promotes detection efficiency; in addition, the cutting device can be suitable for wafer cutting rings with different sizes, and the applicability is wider.
Description
Technical Field
The utility model relates to a processing equipment technical field of semiconductor, in particular to size inspection frock of wafer cutting ring.
Background
At present, a film pasting process is required in the wafer processing process. In this process, the wafer is attached to the wafer dicing ring with a chip film, thereby holding the wafer in a stable position during dicing and other processes. The existing wafer cutting ring needs to be checked for size after being processed, the size check is usually performed by manually using a measuring tool, and the existing wafer cutting ring is fixed by a clamp and then is checked. However, the above detection method requires workers to operate the instrument and equipment, the measurement steps are complicated, the skill requirement is high, and the measurement efficiency is not high.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a solve prior art's problem, provide one kind and can reduce the requirement to workman's technical ability, promote the size inspection frock of measurement of efficiency's wafer cutting ring.
The specific technical scheme is as follows: the utility model provides a size inspection frock of wafer cutting ring, includes the base, is equipped with the recess on the base, and the recess both ends are the inserted hole of wafer cutting ring respectively, and the recess both sides are equipped with locating component, and two sets of locating component set up relatively, locating component includes regulating part, sliding part and spring, the regulating part is equipped with waist shape hole, and the regulating part passes through screw connection with the base, and the screw is worn to establish in waist shape hole, the sliding part is connected with the regulating part, is equipped with the spring between sliding part and the regulating part, the regulating part is equipped with the depressed part, and the sliding part setting is equipped with range finding sensor in the depressed part on the sliding part.
As preferred scheme, the base is equipped with the mounting hole, is equipped with the apron on the base, and the apron is equipped with the joining in marriage post, and the joining in marriage post corresponds the setting with the mounting hole.
Preferably, the plurality of mounting holes are arranged at intervals.
Preferably, the adjusting portion is provided with a sliding groove, and the sliding block of the sliding portion is inserted into the sliding groove.
Preferably, two ends of the spring are respectively arranged in the first positioning hole of the adjusting part and the second positioning hole of the sliding part.
Preferably, the two ends of the sliding part are provided with inclined planes.
The technical effects of the utility model: the utility model discloses a dimension inspection frock of wafer cutting ring can be convenient for inspect the size of wafer cutting ring, promotes detection efficiency; in addition, the cutting device can be suitable for wafer cutting rings with different sizes, and the applicability is wider.
Drawings
Fig. 1 is a schematic view of a tool for inspecting the size of a wafer cutting ring according to an embodiment of the present invention.
Fig. 2 is a top view of a tool for inspecting the dimension of a wafer cutting ring according to an embodiment of the present invention.
Fig. 3 is a schematic view of a cover plate according to an embodiment of the present invention.
Fig. 4 is a sectional view of the sliding portion according to the embodiment of the present invention.
Detailed Description
The essential features and advantages of the invention will be further explained below with reference to examples, but the invention is not limited to the embodiments listed.
As shown in fig. 1 to 4, a tool for inspecting the size of a wafer dicing ring according to this embodiment includes a base 1, a groove 11 is formed on the base 1, and two ends of the groove 11 are insertion openings 12 for the wafer dicing ring, respectively. Positioning components 2 are arranged on two sides of the groove 11, and the two groups of positioning components 2 are arranged oppositely. Locating component 2 includes regulating part 21, sliding part 22 and spring 23, regulating part 21 is equipped with waist shape hole 211, and regulating part 21 passes through screw 3 with base 1 and is connected, and screw 3 wears to establish in waist shape hole 211, sliding part 22 is connected with regulating part 21, is equipped with spring 23 between sliding part 22 and the regulating part 21, regulating part 21 is equipped with depressed part 211, and sliding part 22 sets up in depressed part 211, is equipped with range finding sensor 4 on the sliding part. In the above technical solution, when the wafer cutting ring needs to be detected, the wafer cutting ring is inserted into the groove 11 of the base 1 through the insertion opening 12. The dicing ring presses the slide portion 22 to move backward, the spring 23 is compressed, and the slide portion 22 is pressed against the dicing ring by the elastic force of the spring 23. The distance between the sliding portions 22, that is, the size of the dicing ring, can be obtained by connecting the distance measuring sensor 4 to the controller via the distance measuring sensor 4 on the sliding portion 22. The distance measuring sensor of this embodiment can adopt infrared distance measuring sensor, and transmitting terminal and receiving terminal are located two sliding parts respectively to can measure the distance. By providing the waist-shaped hole 211, the distance between the two regulating portions 21 can be adjusted according to the size of the wafer cutting ring. By the technical scheme, the size of the wafer cutting ring can be conveniently checked, and the detection efficiency is improved; in addition, the cutting device can be suitable for wafer cutting rings with different sizes, and the applicability is wider.
In this embodiment, the base 1 is provided with a mounting hole 12, the base 1 is provided with a cover plate 5, the cover plate 5 is provided with a matching column 51, and the matching column 51 corresponds to the mounting hole 12. Through the technical scheme, the cover plate 5 can be arranged on the base 1, so that the positioning component 2 is protected; at the same time, dust accumulation is reduced. In this embodiment, the plurality of mounting holes 12 are provided at intervals. In this embodiment, the adjusting portion 21 is provided with a sliding groove 211, and the sliding block 221 of the sliding portion 22 is inserted into the sliding groove 211, so that the sliding block 221 can slide in the sliding groove 211, and the sliding portion 22 does not disengage from the adjusting portion.
In this embodiment, two ends of the spring 23 are respectively disposed in the first positioning hole 212 of the adjusting portion 21 and the second positioning hole 222 of the sliding portion 22, so as to facilitate the fixed installation of the spring 23. As a modification, the sliding portion 22 is provided with inclined surfaces 223 at both ends thereof, so that the sliding portion can be retreated by contacting the inclined surfaces 223 when the dicing ring is inserted.
The tool for inspecting the size of the wafer cutting ring can be used for conveniently inspecting the size of the wafer cutting ring, and the detection efficiency is improved; in addition, the cutting device can be suitable for wafer cutting rings with different sizes, and the applicability is wider.
It should be noted that the above-mentioned preferred embodiments are only for illustrating the technical concepts and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention accordingly, and the protection scope of the present invention cannot be limited thereby. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (6)
1. The utility model provides a size inspection frock of wafer cutting ring, its characterized in that, includes the base, is equipped with the recess on the base, and the recess both ends are the inserted hole of wafer cutting ring respectively, and the recess both sides are equipped with locating component, and two sets of locating component set up relatively, locating component includes regulating part, sliding part and spring, the regulating part is equipped with waist shape hole, and the regulating part passes through screw connection with the base, and the screw is worn to establish in waist shape hole, the sliding part is connected with the regulating part, is equipped with the spring between sliding part and the regulating part, the regulating part is equipped with the depressed part, and the sliding part setting is equipped with range finding sensor in the depressed part on the sliding part.
2. The tool for inspecting the size of the wafer cutting ring as claimed in claim 1, wherein the base is provided with a mounting hole, the base is provided with a cover plate, the cover plate is provided with a matching post, and the matching post is arranged corresponding to the mounting hole.
3. The tool for inspecting the size of the wafer cutting ring as claimed in claim 2, wherein the plurality of mounting holes are arranged at intervals.
4. The tool for inspecting the size of the wafer cutting ring as claimed in claim 3, wherein the adjusting portion is provided with a sliding groove, and the sliding block of the sliding portion is inserted into the sliding groove.
5. The tool for inspecting the size of the wafer cutting ring as claimed in claim 4, wherein two ends of the spring are respectively arranged in the first positioning hole of the adjusting portion and the second positioning hole of the sliding portion.
6. The tool for inspecting the size of the wafer cutting ring as claimed in claim 5, wherein two ends of the sliding portion are provided with inclined surfaces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120020104.4U CN213902253U (en) | 2021-01-06 | 2021-01-06 | Dimension inspection tool for wafer cutting ring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120020104.4U CN213902253U (en) | 2021-01-06 | 2021-01-06 | Dimension inspection tool for wafer cutting ring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213902253U true CN213902253U (en) | 2021-08-06 |
Family
ID=77108165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120020104.4U Expired - Fee Related CN213902253U (en) | 2021-01-06 | 2021-01-06 | Dimension inspection tool for wafer cutting ring |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213902253U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113532301A (en) * | 2021-09-14 | 2021-10-22 | 润琛液压机械南通有限公司 | A verifying attachment for excavator hydraulic tank mounting hole |
-
2021
- 2021-01-06 CN CN202120020104.4U patent/CN213902253U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113532301A (en) * | 2021-09-14 | 2021-10-22 | 润琛液压机械南通有限公司 | A verifying attachment for excavator hydraulic tank mounting hole |
| CN113532301B (en) * | 2021-09-14 | 2021-11-23 | 润琛液压机械南通有限公司 | A verifying attachment for excavator hydraulic tank mounting hole |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210806 Termination date: 20220106 |