CN213881185U - Special insulating layer of oyster mushroom fungus package - Google Patents
Special insulating layer of oyster mushroom fungus package Download PDFInfo
- Publication number
- CN213881185U CN213881185U CN202022721570.3U CN202022721570U CN213881185U CN 213881185 U CN213881185 U CN 213881185U CN 202022721570 U CN202022721570 U CN 202022721570U CN 213881185 U CN213881185 U CN 213881185U
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- oyster mushroom
- heat insulation
- mushroom fungus
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- 240000001462 Pleurotus ostreatus Species 0.000 title claims abstract description 79
- 238000009413 insulation Methods 0.000 claims abstract description 72
- 230000000712 assembly Effects 0.000 claims abstract description 30
- 238000000429 assembly Methods 0.000 claims abstract description 30
- 235000001603 Pleurotus ostreatus Nutrition 0.000 claims abstract description 28
- 238000003780 insertion Methods 0.000 claims description 10
- 230000037431 insertion Effects 0.000 claims description 10
- 238000009434 installation Methods 0.000 claims description 8
- 238000004073 vulcanization Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000008878 coupling Effects 0.000 abstract description 2
- 238000010168 coupling process Methods 0.000 abstract description 2
- 238000005859 coupling reaction Methods 0.000 abstract description 2
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 241000233866 Fungi Species 0.000 description 8
- 238000009423 ventilation Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 3
- 235000017491 Bambusa tulda Nutrition 0.000 description 3
- 241001330002 Bambuseae Species 0.000 description 3
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 3
- 239000011425 bamboo Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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- Mushroom Cultivation (AREA)
Abstract
The utility model relates to a special heat-insulating layer of oyster mushroom fungus package, include 2-3 heat-insulating assemblies that are arranged on the oyster mushroom fungus package side by side and are parallel to each other, have the clearance and connect through the detachable coupling assembling between these 2-3 heat-insulating assemblies, the heat-insulating assembly includes the loading board used for bearing the oyster mushroom fungus package, establishes below this loading board and the bottom plate the same as loading board size, bottom plate and loading board pass through the connecting plate perpendicular to this bottom plate and loading board, connecting plate and bottom plate structure as an organic whole; the formed special heat insulation layer for the oyster mushroom bag can completely diffuse heat released in the oyster mushroom bag, so that the period of oyster mushroom growing in the oyster mushroom bag is effectively prolonged, the yield of oyster mushroom is increased, and great economic value is brought; the heat that the oyster mushroom fungus package produced when growing the oyster mushroom can not exert an influence to special insulating layer, and this special insulating layer can carry out reuse, has saved the expense that the oyster mushroom fungus was cultivateed.
Description
Technical Field
The utility model relates to an oyster mushroom production technical field, specificly relate to a special insulating layer of oyster mushroom fungus package.
Background
The oyster mushroom fungus package frame is the support body that is used for the fungus package to cultivate, and when the scale was planted, traditional oyster mushroom fungus package cultivation mode was hung oyster mushroom fungus package directly on the fungus package frame, regularly gives fungus package humidification, perhaps places oyster mushroom fungus package on bamboo shelf, but because fungus package growth needs certain humidity and all is required to the temperature, the final output and the quality that the fungus package can all be influenced to the high or low excessively of temperature.
Present oyster mushroom fungus package adopts bamboo shelf to place, nevertheless because the oyster mushroom fungus package is moist in the growing environment to can release the heat, especially summer or winter make traditional fungus package frame can't make fungus package normal growth develop in sultry moist environment, and the bamboo frame needs often to be replaced, consequently, it solves above-mentioned technical problem to need to provide special insulating layer of oyster mushroom fungus package.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model aims at providing an in-process is planted to oyster mushroom can get up the effectual separation of oyster mushroom fungus package for the heat dissipation has been degraded the heat that oyster mushroom fungus package produced, the effectual special insulating layer of oyster mushroom fungus package that improves the period of oyster mushroom fungus package production oyster mushroom fungus.
In order to achieve the purpose, the utility model adopts the following technical scheme that the special heat insulation layer for the oyster mushroom fungus bag comprises 2-3 heat insulation components which are arranged on the oyster mushroom fungus bag side by side and are parallel to each other, and the 2-3 heat insulation components are provided with gaps and are connected through a detachable connection component;
the heat insulation assembly comprises a bearing plate for bearing the oyster mushroom bag, a bottom plate which is arranged below the bearing plate and has the same size with the bearing plate, the bottom plate and the bearing plate are fixedly connected through a plurality of connecting plates which are vertical to the bottom plate and the bearing plate, the connecting plates and the bottom plate are of an integrated structure.
The distance between two adjacent heat insulation assemblies is 6-8 cm.
The height of the heat insulation assembly is 0.8-1.2 cm; the distance between adjacent connecting plates in the heat insulation assembly is 3-5 cm.
The middle part of the connecting plate is provided with a plurality of through holes which penetrate through the connecting plate.
The bearing plate, the connecting plate and the bottom plate are of an integrated structure through vulcanization.
The detachable connecting component connecting block comprises a first connecting body connecting block and a second connecting body connecting block, and the first connecting body connecting block and the second connecting body connecting block are respectively and fixedly arranged on two sides of the bearing plate connecting block or two sides of the bottom plate connecting block; the end face of the first connecting body connecting block is provided with a connecting hole connecting block extending into the first connecting body connecting block, the end face of the second connecting body connecting block is provided with a connecting block matched with the connecting hole connecting block, the upper end face of the first connecting body connecting block is provided with a jack connecting block, and the jack connecting block extends into the connecting hole connecting block from top to bottom and is communicated with the connecting hole connecting block; when two adjacent heat insulation assembly connecting blocks are connected, a connecting block in a second connecting body connecting block on one heat insulation assembly connecting block is inserted into a connecting hole connecting block in a first connecting body connecting block on the other heat insulation assembly connecting block, and the connecting block is fixedly connected with the connecting hole connecting block through an inserting block connecting block inserted into an inserting hole connecting block, so that the two adjacent heat insulation assembly connecting blocks are connected.
The end face of the connecting block is provided with a tooth groove connecting block, and the end face of the inserting block connecting block is provided with a rack connecting block matched with the tooth groove connecting block.
Be equipped with the installation cavity connecting block on the lateral wall of jack connecting block, the circular port connecting block that communicates with the jack connecting block is seted up to the tip of this installation cavity connecting block, be equipped with a ball connecting block in the installation cavity connecting block, the radius of this ball is greater than the radius of circular port connecting block, be equipped with on the lateral wall of jack connecting block with ball connecting block complex semicircle groove connection piece.
And a semicircular shell connecting block for placing a ball connecting block is arranged in the mounting groove connecting block, and the semicircular shell connecting block is connected with the bottom of the mounting cavity connecting block through an elastic component connecting block.
And the end surface of the inserting block connecting block is provided with a convex connecting block.
The utility model has the advantages that: 1. the formed special heat insulation layer for the oyster mushroom bags is placed among the oyster mushroom bags, so that the circulation of air is accelerated, the heat released from the oyster mushroom bags is completely diffused, the period of oyster mushroom growing of the oyster mushroom bags is effectively prolonged, the yield of oyster mushrooms is increased, the risk of oyster mushroom investment is reduced, and the income of oyster mushroom planting is increased;
2. the heat that the oyster mushroom fungus package produced when growing the oyster mushroom can not exert an influence to special insulating layer, and this special insulating layer can carry out reuse, has saved the expense that the oyster mushroom fungus was cultivateed.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the heat shield assembly of the present invention;
FIG. 3 is a schematic structural view of the detachable module of the present invention;
FIG. 4 is an enlarged view of the portion A of FIG. 3;
fig. 5 is an enlarged schematic view of the part B of fig. 4.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings and examples.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present invention.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; in the description of the present invention, "a plurality" means two or more unless otherwise specified.
Example 1
As shown in fig. 1, the special heat insulation layer for the oyster mushroom bag comprises 2-3 heat insulation assemblies 1 which are arranged on an oyster mushroom bag 2 side by side and are parallel to each other, wherein gaps are formed among the 2-3 heat insulation assemblies 1 and are connected through a detachable connection assembly 4;
when the heat insulation assembly is used, the oyster mushroom fungus bags 2 are stacked on a heat insulation layer formed by 2-3 heat insulation assemblies 1 as shown in figure 1, two adjacent heat insulation assemblies 1 are detachably connected through the detachable assemblies 3, the number of the heat insulation assemblies 1 is selected according to the size of the oyster mushroom fungus bags, and the heat insulation assemblies are connected through the detachable assemblies 3, so that the heat insulation assemblies are convenient to connect and install; the formed heat insulation layer can stably support the oyster mushroom fungus bag 2, and the gaps can accelerate the ventilation of the whole oyster mushroom fungus bag, improve the heat dissipation function of the oyster mushroom fungus bag, prevent the oyster mushroom fungus bag from growing, a great deal of heat is generated to damage the fungus bags, each heat insulation group is formed by butting a plurality of heat insulation assemblies 1, the heat insulation assembly 1 comprises a bearing plate 101 for bearing the oyster mushroom fungus bag 2, a bottom plate 102 which is arranged below the bearing plate 101 and has the same size with the bearing plate 101 as shown in figure 2, the bottom plate 102 and the loading plate 101 pass through a connecting plate 103 perpendicular to the bottom plate 102 and the loading plate 101, the connecting plate 103 and the bottom plate 102 are of an integral structure, a support can be arranged among the plurality of heat insulation assemblies for supporting the heat insulation assemblies, and the plurality of heat insulation assemblies can also be fixedly connected together through a connecting assembly to form a special heat insulation layer with the length conforming to the length of supporting the oyster mushroom bag; adopt the two-layer design of loading board 1 and bottom plate 2, can guarantee when planting the oyster mushroom fungus package, make its ventilation effect better, can be quick distribute out the heat that the oyster mushroom fungus package produced when planting, avoid the heat can not distribute out as early as possible, cause the condition that the oyster mushroom fungus package takes place to rot, offer the through-hole that passes this connecting plate 3 at the middle part of connecting plate 3. The circulation of air can be accelerated, and the strength of the whole special heat-insulating layer can be enhanced and the weight of the whole special heat-insulating layer can be reduced;
the distance between two adjacent heat insulation assemblies 1 is 6-8cm, so that the oyster mushroom fungus bags can be stably supported, and meanwhile, enough heat dissipation space can be ensured; in the selection process, two ends of the oyster mushroom bags placed on the 2-3 groups of heat insulation assemblies are ensured to extend out of the heat insulation layer; the heat insulation assembly can be ensured not to influence the growth of the oyster mushrooms, and meanwhile, the picking is more convenient;
the method comprises the following steps of; the oyster mushroom fungus bag is unstably supported by too high height, the heat dissipation of the oyster mushroom fungus bag can be affected by relatively poor ventilation effect due to too low height, and the height selected by the heat insulation assembly 1 in the embodiment is 0.8-1.2 cm;
the distance between the connection plates 103 ensures the strength of the whole insulation assembly 1 while affecting the ventilation performance, and the distance between adjacent connection plates 103 in the insulation assembly 1 is 3-5cm in the embodiment.
Further, in order to ensure better stability of the whole device, the bearing plate 101, the connecting plate 103 and the bottom plate 102 are integrally vulcanized, or are made of materials such as glass fiber reinforced plastics or rigid plastics which are light in weight, high in strength and free from deformation at high temperature.
When the heat insulation bag is used, 2-3 heat insulation assemblies are placed on the oyster mushroom bag in parallel, gaps are reserved among the heat insulation assemblies, and the heat insulation assemblies are connected through a detachable connection assembly; when having arranged all thermal-insulated subassemblies on the oyster mushroom fungus package, form the insulating layer, then place one deck oyster mushroom fungus package on to this insulating layer, place the completion back, and then the placing of new round of insulating layer, analogize in proper order and accomplish placing of oyster mushroom fungus package, the ventilation that the oyster mushroom fungus package was piled can be accelerated through the insulating layer of placing, the radiating effect is improved, the risk of investment has been reduced, the income of planting the oyster mushroom has been improved, simultaneously can the stable connection in order to guarantee between the thermal-insulated subassembly, carry out the outrigger to the oyster mushroom fungus package, two adjacent thermal-insulated subassemblies 1 pass through coupling assembling fixed connection.
Example 2
On the basis of the embodiment 1, the heat insulation assembly 1 can be connected conveniently and can be detached as required in practical use;
as shown in fig. 3 and 4, the detachable connection assembly 3 includes a first connection body 301 and a second connection body 302, wherein the first connection body 301 and the second connection body 302 are respectively fixed on two sides of the bearing plate 101 or two sides of the bottom plate 102; a connecting hole 303 extending into the first connecting body 301 is formed in the end face of the first connecting body 301, a connecting block 304 matched with the connecting hole 303 is arranged on the end face of the second connecting body 302, an insertion hole 305 is formed in the upper end face of the first connecting body 301, and the insertion hole 305 extends into the connecting hole 303 from top to bottom to be communicated with the connecting hole 303; when two adjacent heat insulation assemblies 1 are connected, the connecting block 304 in the second connecting body 302 of one heat insulation assembly 1 is inserted into the connecting hole 303 in the first connecting body 301 of the other heat insulation assembly 1, and the connecting block 304 is fixedly connected with the connecting hole 303 through the inserting block 306 inserted into the inserting hole 305, so that the two adjacent heat insulation assemblies 1 are connected.
In practical use, two adjacent heat insulation assemblies 1 are butted, then the connecting block of the second connecting body of one heat insulation assembly 1 is inserted into the connecting hole of the first connecting body of the other heat insulation assembly, after all the connecting blocks are inserted into the connecting holes, the inserting block is inserted into the inserting hole 305, and the connecting blocks are fixedly connected with the connecting holes, so that the whole heat insulation assembly is convenient to connect; in order to facilitate the connection block to be inserted into the connection hole, the end part of the connection hole is a horn guide hole;
further, in order to facilitate the insertion block to stably fix the connection block and the connection hole together, as shown in fig. 4, a tooth groove 308 is provided on an end surface of the connection block 304, and a rack 307 engaged with the tooth groove 308 is provided on an end surface of the insertion block 306. Meanwhile, in order to press the insertion block 306 into the insertion hole conveniently, a protrusion 309 is arranged on the end face of the insertion block 306 and used for preventing slipping.
Further, for stable connection between the plug block and the jack, as shown in fig. 5, an installation cavity 315 is disposed on a side wall of the jack 305, a circular hole 312 communicated with the jack 305 is formed at an end of the installation cavity 315, a ball 310 is disposed in the installation cavity 309, a radius of the ball is greater than a radius of the circular hole 312, and a semicircular groove 311 matched with the ball 310 is disposed on a side wall of the plug block 306.
A semi-circular shell 313 for placing the ball 310 is arranged in the mounting cavity 315, and the semi-circular shell 313 is connected with the bottom of the mounting cavity 315 through an elastic component 314. When the plug is pressed down, the ball 310 enters the semicircular groove 311 to fixedly connect the plug and the jack.
The above embodiments are merely examples of the present invention, and do not limit the protection scope of the present invention, and all designs the same as or similar to the present invention belong to the protection scope of the present invention.
Claims (10)
1. A special heat insulation layer for an oyster mushroom bag is characterized by comprising 2-3 heat insulation assemblies (1) which are arranged on the oyster mushroom bag (2) side by side and are parallel to each other, wherein gaps are formed between the 2-3 heat insulation assemblies (1), and the two adjacent heat insulation assemblies (1) are fixedly connected through a detachable connection assembly (3);
the heat insulation assembly (1) comprises a bearing plate (101) for bearing an oyster mushroom bag (2), and a bottom plate (102) which is arranged below the bearing plate (101) and has the same size with the bearing plate (101), wherein the bottom plate (102) is fixedly connected with the bearing plate (101) through a plurality of connecting plates (103) which are perpendicular to the bottom plate (102) and the bearing plate (101), the connecting plates (103) and the bottom plate (102) are of an integrated structure.
2. The special heat insulation layer for the oyster mushroom fungus bag according to claim 1, wherein the distance between two adjacent heat insulation assemblies (1) is 6-8 cm.
3. The special heat insulation layer for the oyster mushroom fungus bag according to claim 1, wherein the height of the heat insulation component (1) is 0.8-1.2 cm; the distance between adjacent connecting plates (103) in the heat insulation assembly (1) is 3-5 cm.
4. The special heat insulation layer for the oyster mushroom fungus bag according to claim 1 or 3, wherein a plurality of through holes (104) penetrating through the connection plate (103) are formed in the middle of the connection plate (103).
5. The special heat insulation layer for the oyster mushroom fungus bags according to claim 1, wherein the bearing plate (101), the connecting plate (103) and the bottom plate (102) are integrated into a whole through vulcanization.
6. The heat insulation layer special for the oyster mushroom fungus bag as claimed in claim 1, wherein the detachable connection assembly (3) comprises a first connection body (301) and a second connection body (302), and the first connection body (301) and the second connection body (302) are respectively fixedly arranged on two sides of the bearing plate (101) or two sides of the bottom plate (102); a connecting hole (303) extending into the first connecting body (301) is formed in the end face of the first connecting body (301), a connecting block (304) matched with the connecting hole (303) is arranged on the end face of the second connecting body (302), an inserting hole (305) is formed in the upper end face of the first connecting body (301), and the inserting hole (305) extends into the connecting hole (303) from top to bottom to be communicated with the connecting hole (303); when two adjacent heat insulation assemblies (1) are connected, the connecting block (304) in the second connecting body (302) on one heat insulation assembly (1) is inserted into the connecting hole (303) in the first connecting body (301) on the other heat insulation assembly (1), and the connecting block (304) is fixedly connected with the connecting hole (303) through the inserting block (306) inserted into the inserting hole (305), so that the two adjacent heat insulation assemblies (1) are connected.
7. The special heat insulation layer for the oyster mushroom fungus bags according to claim 6, wherein a tooth groove (308) is formed in an end surface of the connecting block (304), and a rack (307) matched with the tooth groove (308) is formed in an end surface of the inserting block (306).
8. The heat insulation layer special for the oyster mushroom fungus bag according to claim 6, wherein a mounting cavity (315) is formed in a side wall of the insertion hole (305), a circular hole (312) communicated with the insertion hole (305) is formed in an end portion of the mounting cavity (315), a ball (310) is arranged in the mounting cavity (315), the radius of the ball is larger than that of the circular hole (312), and a semicircular groove (311) matched with the ball (310) is formed in a side wall of the insertion block (306).
9. The special heat insulation layer for the oyster mushroom fungus bag according to claim 8, wherein a semicircular shell (313) for placing the ball (310) is arranged in the installation cavity (315), and the semicircular shell (313) is connected with the bottom of the installation cavity (315) through an elastic component (314).
10. The special heat insulation layer for the oyster mushroom fungus bags according to claim 6, wherein a protrusion (309) is arranged on the end surface of the insert block (306).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022721570.3U CN213881185U (en) | 2020-11-23 | 2020-11-23 | Special insulating layer of oyster mushroom fungus package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022721570.3U CN213881185U (en) | 2020-11-23 | 2020-11-23 | Special insulating layer of oyster mushroom fungus package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213881185U true CN213881185U (en) | 2021-08-06 |
Family
ID=77121479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022721570.3U Expired - Fee Related CN213881185U (en) | 2020-11-23 | 2020-11-23 | Special insulating layer of oyster mushroom fungus package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213881185U (en) |
-
2020
- 2020-11-23 CN CN202022721570.3U patent/CN213881185U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210806 |
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| CF01 | Termination of patent right due to non-payment of annual fee |