CN213880736U - Heat-dissipation fin slow-heating positioning PIN - Google Patents
Heat-dissipation fin slow-heating positioning PIN Download PDFInfo
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- CN213880736U CN213880736U CN202023112270.1U CN202023112270U CN213880736U CN 213880736 U CN213880736 U CN 213880736U CN 202023112270 U CN202023112270 U CN 202023112270U CN 213880736 U CN213880736 U CN 213880736U
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Abstract
The utility model discloses a fin slow-heating location PIN, include: the outer surface of the fixed plate is fixedly provided with a plurality of groups of radiating fins, and the outer surface of the lower end of the fixed plate is provided with a plurality of groups of mounting holes; the upper end of the pin is fixedly arranged in the mounting hole, and a pin limiting device is arranged on the outer surface of the pin; the pin comprises a main body, a nickel plating layer and a tin plating layer, wherein the nickel plating layer is electroplated on the outer surface of the main body, and the tin plating layer is electroplated on the outer surface of the nickel plating layer. A fin slow-heating location PIN, heat conduction speed when can reducing soldering tin for the PIN has abundant soldering tin time, and the soldering tin is more even, improves the installation stability of fin slow-heating location PIN, need not follow-up modification, disposable soldering tin, the speed of production is fast, the efficiency of production is high, can directly inject the position of PIN moreover, avoids the PIN to rock, thereby makes things convenient for people to go up tin, has better use prospect.
Description
Technical Field
The utility model relates to a fin field, in particular to fin slow-heating location PIN.
Background
The radiating fin is a device for radiating heat of an easily-generated electronic element in an electrical appliance, and is made of aluminum alloy, brass or bronze into a plate shape, a sheet shape or a multi-sheet shape.
The existing cooling fin slow-heating location PIN has certain defects when in use, the existing cooling fin slow-heating location PIN is cooled rapidly when in heat dissipation during welding, a through hole is easily formed, tin is not easy to feed, PIN tin soldering tin is pulled to be sharp, and a soldering and repairing process of a luo-bar is difficult and troublesome, so that the use requirements of people cannot be met, and therefore, the cooling fin slow-heating location PIN is provided.
SUMMERY OF THE UTILITY MODEL
A primary object of the present invention is to provide a PIN with slow-heating positioning function for heat dissipation fins, which can effectively solve the problems in the background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a heat sink slow heat location PIN comprising:
the outer surface of the fixed plate is fixedly provided with a plurality of groups of radiating fins, and the outer surface of the lower end of the fixed plate is provided with a plurality of groups of mounting holes; and
the pin, the upper end fixed mounting of pin is in the inside of mounting hole, the surface of pin is provided with pin stop device.
Preferably, the pin comprises a body, a nickel plating layer and a tin plating layer, wherein the nickel plating layer is electroplated on the outer surface of the body, and the tin plating layer is electroplated on the outer surface of the nickel plating layer.
Preferably, the main body is made of stainless steel, the main body is cylindrical, and a limiting ring integrally formed with the main body is arranged on the outer surface of the main body.
Preferably, the radiating fins are aluminum alloy radiating fins, and a plurality of groups of aluminum alloy radiating fins are symmetrically arranged at two ends of the fixing plate.
Preferably, the pin limiting device comprises a plurality of groups of supporting elastic sheets and a plurality of groups of grooves, the grooves are formed in the outer surfaces of the pins, and one ends of the supporting elastic sheets are fixedly installed on the inner walls, far away from the limiting rings, of the grooves.
Preferably, the supporting elastic sheet is arc-shaped, and the size of the supporting elastic sheet is the same as that of the groove.
Compared with the prior art, the utility model provides a fin slow-heating location PIN has following beneficial effect:
1. through the arranged PINs, the main bodies of the PINs are made of stainless steel, so that the heat conduction speed during soldering can be reduced, the PINs have sufficient soldering time, the soldering is more uniform, the mounting stability of the heat-dissipation sheet slow-heating positioning PIN is improved, subsequent modification is not needed, the PINs are soldered at one time, the production speed is high, and the production efficiency is high;
2. through the PIN stop device who sets up, back in the installation hole site on the PIN inserted the circuit board, the support shell fragment on the PIN resumes deformation, supports shell fragment and circuit board lower extreme contact, and the card is on the circuit board to can directly inject the position of PIN, avoid the PIN to rock, thereby make things convenient for people to go up tin, whole fin slow-heating location PIN's structure is fairly simple moreover, and it is more convenient to use, comparatively practical.
The parts of the device not involved are the same as or can be implemented using prior art.
Drawings
Fig. 1 is an overall structure diagram of a heat sink slow-heating positioning PIN of the present invention;
fig. 2 is a partial structure diagram of a heat sink slow-heating location PIN of the present invention;
FIG. 3 is a structural diagram of a PIN in a heat sink slow heat location PIN of the present invention;
fig. 4 is a partial structure view of the PIN limiting device in the heat sink slow heat location PIN of the present invention;
fig. 5 is a cross-sectional view of a PIN in the heat sink slow-heating location PIN of the present invention.
In the figure: 1. a fixing plate; 2. a heat sink; 3. mounting holes; 4. a pin; 5. plating a nickel layer; 6. plating a tin layer; 7. a limiting ring; 8. supporting the spring plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
A heat sink slow heat location PIN, as shown in fig. 1-5, comprising:
the fixing plate comprises a fixing plate 1, wherein a plurality of groups of radiating fins 2 are fixedly arranged on the outer surface of the fixing plate 1, and a plurality of groups of mounting holes 3 are formed in the outer surface of the lower end of the fixing plate 1; and
The pin 4 comprises a main body, a nickel plating layer 5 and a tin plating layer 6, wherein the nickel plating layer 5 is electroplated on the outer surface of the main body, and the tin plating layer 6 is electroplated on the outer surface of the nickel plating layer 5.
The main part adopts the stainless steel, and the shape of main part is cylindrical, and the surface of main part is provided with spacing collar 7 rather than integrated into one piece.
The radiating fins 2 are aluminum alloy radiating fins, and a plurality of groups of aluminum alloy radiating fins are symmetrically arranged at two ends of the fixing plate 1.
The pin limiting device comprises a plurality of groups of supporting elastic sheets 8 and a plurality of groups of grooves, the grooves are formed in the outer surface of the pin 4, and one end of each supporting elastic sheet 8 is fixedly installed on the inner wall, far away from the limiting ring 7, of each groove.
The shape of the supporting elastic sheet 8 is arc-shaped, and the size of the supporting elastic sheet 8 is the same as that of the groove.
It should be noted that, the utility model relates to a heat sink slow-heating location PIN, during the use, PIN 4 is installed in mounting hole 3 on fixed plate 1, during tinning, insert PIN 4 to the corresponding mounting hole site, the support shell fragment 8 resets after the installation, the upper end of support shell fragment 8 and spacing collar 7 contact with the lower extreme and the upper end of circuit board respectively to the position of PIN 4 is injectd, then adopt soldering tin wave-soldering to weld can;
through the arranged PINs 4, the main bodies of the PINs 4 are made of stainless steel, so that the heat conduction speed during soldering can be reduced, the PINs 4 have sufficient soldering time, the soldering is more uniform, the mounting stability of the heat-dissipating fin slow-heating positioning PIN is improved, subsequent modification is not needed, soldering is performed at one time, the production speed is high, and the production efficiency is high;
through the PIN stop device who sets up, back in the installation hole site on PIN 4 inserted the circuit board, 8 deformations are resumeed to the last support shell fragment of PIN 4, support shell fragment 8 and the contact of circuit board lower extreme, block on the circuit board to PIN 4's position can directly be injectd, avoid PIN 4 to rock, thereby make things convenient for people to go up tin, whole fin slow heat location PIN's structure is fairly simple moreover, and it is more convenient to use, comparatively practical.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A heat sink slow heating location PIN, comprising:
the fixing plate comprises a fixing plate (1), wherein a plurality of groups of radiating fins (2) are fixedly arranged on the outer surface of the fixing plate (1), and a plurality of groups of mounting holes (3) are formed in the outer surface of the lower end of the fixing plate (1); and
the pin (4), the upper end fixed mounting of pin (4) is in the inside of mounting hole (3), the surface of pin (4) is provided with pin stop device.
2. The heat sink heat-moderated location PIN of claim 1, wherein: the pin (4) comprises a main body, a nickel plating layer (5) and a tin plating layer (6), wherein the nickel plating layer (5) is electroplated on the outer surface of the main body, and the tin plating layer (6) is electroplated on the outer surface of the nickel plating layer (5).
3. The heat sink heat-moderated location PIN of claim 2, wherein: the main part adopts the stainless steel, the shape of main part is cylindrical, the surface of main part is provided with spacing collar (7) rather than integrated into one piece.
4. The heat sink heat-moderated location PIN of claim 1, wherein: the radiating fins (2) are aluminum alloy radiating fins, and a plurality of groups of aluminum alloy radiating fins are symmetrically arranged at two ends of the fixing plate (1).
5. The heat sink heat-moderated location PIN of claim 1, wherein: the pin limiting device comprises a plurality of groups of supporting elastic sheets (8) and a plurality of groups of grooves, the grooves are formed in the outer surface of the pin (4), and one end of each supporting elastic sheet (8) is fixedly installed on the inner wall, far away from the limiting ring (7), of each groove.
6. The heat sink heat-moderated location PIN of claim 5, wherein: the supporting elastic sheet (8) is arc-shaped, and the size of the supporting elastic sheet (8) is the same as that of the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023112270.1U CN213880736U (en) | 2020-12-22 | 2020-12-22 | Heat-dissipation fin slow-heating positioning PIN |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023112270.1U CN213880736U (en) | 2020-12-22 | 2020-12-22 | Heat-dissipation fin slow-heating positioning PIN |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213880736U true CN213880736U (en) | 2021-08-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023112270.1U Active CN213880736U (en) | 2020-12-22 | 2020-12-22 | Heat-dissipation fin slow-heating positioning PIN |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213880736U (en) |
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2020
- 2020-12-22 CN CN202023112270.1U patent/CN213880736U/en active Active
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No.19 BAOYING South Road, Guangzhou Free Trade Zone, Guangdong 510730 Patentee after: Prime Technology(Guangzhou) Inc. Address before: No.19 BAOYING South Road, Guangzhou Free Trade Zone, Guangdong 510730 Patentee before: PRIME TECHNOLOGY (GUANGZHOU) Inc. |
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| CP01 | Change in the name or title of a patent holder |