CN213878065U

CN213878065U - Wafer partition adsorption structure

Info

Publication number: CN213878065U
Application number: CN202023042382.4U
Authority: CN
Inventors: 何淑英
Original assignee: Guangzhou Honghao Optoelectronic Semiconductor Co ltd
Current assignee: Guangzhou Honghao Optoelectronic Semiconductor Co ltd
Priority date: 2020-12-15
Filing date: 2020-12-15
Publication date: 2021-08-03
Anticipated expiration: 2030-12-15

Abstract

The utility model relates to the technical field of wafer processing, in particular to a wafer partition adsorption structure, which comprises a machine body, a base, a discharging device, a feeding device and a rotating machine, wherein the base is arranged at the lower end of a workbench, the machine body comprises a first suction fan, a workbench, a second suction fan, a lifter and a processing bin, the workbench is arranged at the upper end of the machine body, the processing bin is arranged at the upper end of the workbench, a wafer processing place is provided through the workbench and the processing bin, the first suction fan is provided with a lower suction plate, the second suction fan is provided with an upper suction plate, wafer pieces are respectively adsorbed through the lower suction plate and the upper suction plate, the discharging device and the feeding device are respectively arranged at two sides of the processing bin and are connected with a connecting rod arranged between the machine body, the discharging device and the feeding device both comprise a motor and a driving wheel, and unprocessed wafers are transported through the feeding device, and conveying the processed wafer through a discharging device.

Description

Wafer partition adsorption structure

Technical Field

The utility model relates to a wafer processing technology field specifically is a wafer subregion adsorption structure.

Background

As is well known, wafer stitching is required during the processing of wafers, and the wafer bonding technique refers to the technique of tightly bonding two polished wafers together, and has been widely used in semiconductor manufacturing.

For example, the patent of publication number "CN 206733378U" patent name "a wafer adsorbs year dish", and the patent discloses "the utility model provides a wafer adsorbs year dish for adsorb the wafer, the wafer adsorbs year dish contains: the tray body comprises a bottom surface and a top surface which are opposite, a surrounding surface which extends from the periphery of the bottom surface to the periphery of the top surface, and a groove which is formed on one side of the surrounding surface and extends to the top surface so as to form a notch on the top surface; and a plurality of suction holes penetrating through the bottom surface and the top surface of the tray body. The utility model discloses at least, have following advantage: the grooves of the tray body can be used for overflowing viscose to flow in, so that the situation that the viscose leaks between the wafer and the tray body to block the suction holes of the tray body to cause the reduction of the adsorption force is avoided, and the wafer is prevented from shaking to crack due to insufficient adsorption force.

The existing wafer adsorption structure is found in use that manual emptying and unloading are needed, automation cannot be realized, the existing wafer adsorption structure cannot keep up with the steps of the times, the processing efficiency is low, and the productivity is low.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides an automatic wafer subregion adsorption structure that machining efficiency is high.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: a wafer partition adsorption structure comprises a machine body, a base, a discharging device, a feeding device and a rotating machine, wherein the base is installed at the lower end of a workbench, the machine body comprises a first suction fan, a workbench, a second suction fan, a lifter and a processing bin, the workbench is installed at the upper end of the machine body, the processing bin is installed at the upper end of the workbench, the first suction fan is installed inside the machine body, a lower suction plate is arranged on the first suction fan, the lower suction plate is installed at the bottom end of the processing bin, the second suction fan is installed above the processing bin, an upper suction plate is arranged on the second suction fan, the upper suction plate is installed at the lower end of the second suction fan, suction holes are formed in the lower suction plate and the upper suction plate, the lifter is installed at the upper end of the second suction fan and connected with a lifting rod arranged between the second suction fan, the rotating machine is installed at one side of the machine body, and the discharging device and the feeding device are respectively arranged at two sides of the processing bin and connected with a connecting rod arranged between the machine bodies, the discharging device and the feeding device respectively comprise a motor and a driving wheel, the driving wheel is arranged at the front end of the motor, a conveying belt is arranged between the driving wheels for connection, and a storage disc is arranged on the conveying belt.

In order to improve the practicality of this structure, the utility model discloses an improvement has, first suction fan is connected with being equipped with first aspiration channel down between the suction plate, be equipped with the second aspiration channel between second suction fan and the last suction plate and be connected, be equipped with first regulator on the first aspiration channel, be equipped with the second regulator on the second aspiration channel, be equipped with the revolving door on the organism, be equipped with the sight glass on the processing storehouse.

In order to improve the wafer bonding effect, the utility model discloses an improve and have, the hole of induced drafting includes first inlet scoop and second inlet scoop, the mid portion at last suction disc and lower suction disc is installed to first inlet scoop, the second inlet scoop is installed at last suction disc and the peripheral part of lower suction disc.

In order to improve the stability of rotor arm, the utility model discloses an improve and have, be equipped with the bracing piece between rotor arm and the rotating machine and be connected.

(III) advantageous effects

Compared with the prior art, the utility model provides a wafer subregion adsorption structure possesses following beneficial effect:

the wafer partition adsorption structure is characterized in that the lifter is installed at the upper end of the second suction fan and connected with a lifting rod arranged between the second suction fan, the rotating machine is installed on one side of the machine body and connected with a rotating arm arranged between the lifter, the upper suction plate can horizontally rotate through the rotating machine and the rotating arm, the upper suction plate can horizontally lift through the lifter, the unloading device and the feeding device are respectively installed on two sides of the processing bin and connected with a connecting rod arranged between the machine body, the unloading device and the feeding device respectively comprise a motor and a driving wheel, the driving wheel is installed at the front end of the motor, a conveying belt is arranged between the driving wheels for connection, a storage disc is arranged on the conveying belt, wafers are fixed on the conveying belt through the storage disc, and the rotating machine, The mutual cooperation of the discharging device and the feeding device enables the structure to realize automation, saves labor and improves production efficiency, the air suction holes comprise a first air suction opening and a second air suction opening, and stress points of all parts of the wafer body can be controlled by arranging the first air suction opening and the second air suction opening, so that a required processing effect is achieved.

Drawings

FIG. 1 is a schematic view of the present invention;

fig. 2 is a side view of the present invention;

FIG. 3 is a top view of the upper suction cup of FIG. 1 in accordance with the present invention;

in the figure: 1. a body; 2. a base; 3. a discharge device; 4. a connecting rod; 5. a feeding device; 6. storing a disc; 7. a processing bin; 8. a first suction fan; 9. a first air suction pipe; 10. a first regulator; 11. a second suction fan; 12. an upper suction plate; 13. a lifter; 14. a lifting rod; 15. rotating the machine; 16. a rotating arm; 17. a support bar; 18. a first air intake hole; 19. a second air suction hole; 20. a second regulator; 21. a work table; 22. a lower suction plate;

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, a wafer partition adsorption structure of the present invention includes a machine body 1, a base 2, a discharging device 3, a feeding device 5 and a rotating machine 15, wherein the base 2 is installed at a lower end of a workbench 21, the machine body 1 includes a first suction fan 8, the workbench 21, a second suction fan 11, a lifter 13 and a processing bin 7, the workbench 21 is installed at an upper end of the machine body 1, the processing bin 7 is installed at an upper end of the workbench 21, the first suction fan 8 is installed inside the machine body 1, the first suction fan 8 is provided with a lower suction plate 22, the lower suction plate 22 is installed at a bottom end of the processing bin 7, the second suction fan 11 is installed above the processing bin 7, the second suction fan 11 is provided with an upper suction plate 12, the upper suction plate 12 is installed at a lower end of the second suction fan 11, the lower suction plate 22 and the upper suction plate 12 are both provided with suction holes, the utility model discloses a processing bin, including processing bin 7, lifter 13, connecting rod 4, connecting rod, unloading device 3 and material feeding unit 5, lifter 13 installs in the upper end of second suction fan 11 to be equipped with lifter 14 between with the second suction fan 11 and be connected, rotation machine 15 installs in one side of organism 1 to be equipped with rotor arm 16 between with lifter 13 and be connected, unloading device 3 and material feeding unit 5 install the both sides at processing bin 7 respectively to be equipped with connecting rod 4 between with the organism 1 and be connected, unloading device 3 and material feeding unit 5 all include motor and drive wheel, the drive wheel is installed at the front end of motor, and be equipped with the conveyer belt between the drive wheel and connect, be equipped with storage tray 6 on the conveyer belt.

When the wafer partition adsorption structure of the utility model is used, the base 2 plays a role of supporting the machine body 1, wafers are placed on the storage disc 6 and transported through the feeding device 5, the processing bin 7 provides a processing place for the wafers, when the wafers are processed, the first suction fan 8 is used for generating suction on the lower suction plate 22, so that the wafers are adsorbed on the lower suction plate 22 through the suction holes, at the moment, the rotating machine 15 controls the rotating arm 16 to rotate, the rotating arm 16 can rotate the lifter 13, the second suction fan 11 is further rotated, the second suction fan 11 drives the upper suction plate 12 to rotate to the upper end of the feeding device 5, then the lifter 13 is started, the upper suction plate 12 is descended downwards through the lifting rod 14, then the second suction fan 11 is used for generating suction on the upper suction plate 12, after the suction is generated on the upper suction plate 12, the wafers on the storage disc 6 can be firmly adsorbed on the upper suction plate 12 through the suction holes, then, the upper suction plate 12 is moved into the processing bin 7 by the same principle and is aligned with the lower suction plate 22, so that the sewing processing is carried out in the processing bin 7, after the sewing processing is finished, the first suction fan 8 is closed, then the upper suction plate 12 takes the sewed wafer to the unloading device 3 for unloading, and the feeding device 5 and the unloading device 3 work by the principle that a motor drives a driving wheel to rotate, and the driving wheel drives the driving belt to rotate, so that the transportation effect is achieved.

In order to improve the practicality of this structure, the utility model discloses an improvement has, be equipped with first aspiration channel 9 between first suction fan 8 and the lower suction plate 22 and be connected, be equipped with the second aspiration channel connection between second suction fan 11 and the last suction plate 12, be equipped with first regulator 10 on the first aspiration channel 9, be equipped with second regulator 20 on the second aspiration channel, be equipped with the revolving door on the organism 1, be equipped with the sight glass on the processing storehouse 7, carry out the wind-guiding through first aspiration channel 9 and second aspiration channel, can adjust the suction of lower suction plate 22 department through first regulator 10, can adjust the suction of last suction plate 12 department through second regulator 20, can see the inside processing condition of processing storehouse 7 clearly through the sight glass.

In order to improve wafer bonding effect, the utility model discloses an improve and have, the hole of induced drafting includes first inlet scoop and second inlet scoop, first inlet scoop is installed at last suction disc 12 and the mid portion of suction disc 22 down, the second inlet scoop is installed at last suction disc 12 and the peripheral part of suction disc 22 down, through being equipped with first inlet scoop and second inlet scoop, can control the stress point of each part of wafer body to reach required processing effect.

In order to improve the stability of rotor arm 16, the utility model discloses an improvement has, be equipped with the bracing piece 17 between rotor arm 16 and the rotating machine 15 and be connected, give rotor arm 16 a holding power through bracing piece 17.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A wafer partition adsorption structure is characterized by comprising a machine body (1), a base (2), a discharging device (3), a feeding device (5) and a rotating machine (15), wherein the base (2) is installed at the lower end of a workbench (21), the machine body (1) comprises a first suction fan (8), the workbench (21), a second suction fan (11), a lifter (13) and a processing bin (7), the workbench (21) is installed at the upper end of the machine body (1), the processing bin (7) is installed at the upper end of the workbench (21), the first suction fan (8) is installed inside the machine body (1), a lower suction plate (22) is arranged on the first suction fan (8), the lower suction plate (22) is installed at the bottom end of the processing bin (7), the second suction fan (11) is installed above the processing bin (7), and an upper suction plate (12) is arranged on the second suction fan (11), the upper suction plate (12) is arranged at the lower end of the second suction fan (11), the lower suction plate (22) and the upper suction plate (12) are both provided with suction holes, the lifter (13) is arranged at the upper end of the second suction fan (11), and is connected with a second suction fan (11) through a lifting rod (14), the rotating machine (15) is arranged on one side of the machine body (1), and is connected with a lifter (13) through a rotating arm (16), the discharging device (3) and the feeding device (5) are respectively arranged at two sides of the processing bin (7), and is connected with a connecting rod (4) arranged between the machine body (1), the discharging device (3) and the feeding device (5) both comprise a motor and a driving wheel, the driving wheel is arranged at the front end of the motor, and the transmission wheels are connected by a transmission belt, and the transmission belt is provided with a storage disc (6).

2. The wafer partition adsorption structure of claim 1, wherein a first air suction pipe (9) is arranged between the first air suction machine (8) and the lower suction plate (22) for connection, and a second air suction pipe is arranged between the second air suction machine (11) and the upper suction plate (12) for connection.

3. The wafer partition adsorption structure of claim 2, wherein a first regulator (10) is disposed on the first air suction pipe (9), and a second regulator (20) is disposed on the second air suction pipe.

4. The wafer partition adsorption structure of claim 1, wherein a rotating door is arranged on the machine body (1), and a viewing mirror is arranged on the processing bin (7).

5. The wafer zone adsorption structure of claim 1, wherein the air suction holes comprise a first air suction opening installed at a middle portion of the upper suction plate (12) and the lower suction plate (22) and a second air suction opening installed at a peripheral portion of the upper suction plate (12) and the lower suction plate (22).

6. A wafer zone adsorption structure according to claim 1, wherein a support rod (17) is provided between the rotation arm (16) and the rotation machine (15).