CN213878032U

CN213878032U - Quick cooling control device of semiconductor wafer

Info

Publication number: CN213878032U
Application number: CN202022997728.XU
Authority: CN
Inventors: 冯嘉荔
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-12-12
Filing date: 2020-12-12
Publication date: 2021-08-03
Anticipated expiration: 2030-12-12

Abstract

The utility model relates to the technical field of semiconductor wafer cooling, in particular to a semiconductor wafer rapid cooling control device, which comprises a box body, a transmission device, a central controller, a cooling bin and a pre-cooling bin, the box body is provided with a workbench, a water tank and a liquid nitrogen tank, the workbench is arranged at the upper end of the box body, the water tank and the liquid nitrogen tank are both arranged in the tank body, the water tank is provided with a water inlet pipe and a water return pipe, the water inlet pipe is provided with a water delivery pump, the liquid nitrogen box is provided with a liquid nitrogen delivery pipe, the cooling bin and the pre-cooling bin are both arranged at the upper end of the workbench, a condenser pipe is arranged on the precooling bin, an air cooler and a liquid nitrogen controller are arranged on the cooling bin, the semiconductor wafer is transported through the conveying device, the precooling bin has a precooling effect through the condenser pipe, and the cooling bin has a rapid cooling effect through the air cooler and the liquid nitrogen controller.

Description

Quick cooling control device of semiconductor wafer

Technical Field

The utility model relates to a semiconductor wafer cooling technology field specifically is a semiconductor wafer cools off controlling means fast.

Background

As is well known, a semiconductor wafer plays a crucial role in an electrical device, and the surface cleanliness and product quality directly determine the service life of the electrical device.

If the patent with the publication number of ' CN207503922U ' is named as ' a semiconductor wafer rapid cooling control device ', the patent discloses ' the utility model discloses a semiconductor wafer rapid cooling control device, which comprises a cooling box, three motors are arranged on the top of the cooling box, a control box is arranged on the front side of the cooling box, an operation keyboard and a display are arranged on the control box, a conveyor belt penetrates through the middle part of the cooling box from right to left, a protective sleeve is arranged on a motor shaft of each motor, an air outlet is arranged inside the protective sleeve, and because the air outlet is arranged on each motor shaft, cold air can directly aim at the semiconductor wafer to blow, thereby rapidly reducing the temperature of the semiconductor wafer, and simultaneously, the three motors are arranged to reduce the temperature in gradient, thereby ensuring good cooling effect and avoiding negative harm caused by rapid cooling of the semiconductor wafer, because set up the cooling temperature that the operation keyboard cooperation display can directly perceived accurate control cooler bin in, and then realized effective control, accurate control sets up the conveyer belt in addition thereby make the device can lower the temperature in batches, and then be worth promoting.

The existing semiconductor wafer rapid cooling control device is found to have a complex structure and a slow cooling speed when in use, thereby causing low production efficiency.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a simple structure, the practicality is strong to the not enough of prior art, the utility model provides a semiconductor wafer cools off controlling means fast that cooling rate is fast.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor wafer rapid cooling control device comprises a box body, a conveying device, a central controller, a cooling bin and a pre-cooling bin, wherein the box body is provided with a workbench, a water tank and a liquid nitrogen box, the workbench is installed at the upper end of the box body, the water tank and the liquid nitrogen box are both installed inside the box body, the water tank is provided with a water inlet pipe and a water return pipe, the water inlet pipe is provided with a water transfer pump, the liquid nitrogen box is provided with a liquid nitrogen conveying pipe, the cooling bin and the pre-cooling bin are both installed at the upper end of the workbench, the pre-cooling bin is installed at one side of the cooling bin, the pre-cooling bin is provided with a condenser pipe, the condenser pipe is installed on the inner wall of the pre-cooling bin, one end of the condenser pipe is connected with the water inlet pipe, the other end of the condenser pipe is connected with the water return pipe, the cooling bin is provided with an air cooler and a liquid nitrogen controller, one end of the liquid nitrogen controller is connected with the liquid nitrogen box through the liquid nitrogen pipe, be equipped with the wire between the other end and the well accuse ware and be connected, the upper end in the cooling chamber is all installed to air-cooler and liquid nitrogen controller, and be equipped with the cold wind mouth on the air-cooler, be equipped with the liquid nitrogen export on the liquid nitrogen controller, just the inside at the cooling chamber is all installed to cold wind mouth and liquid nitrogen export, well accuse ware is located one side of box to be connected with being equipped with the wire between the air-cooler, be equipped with display screen and control button on the well accuse ware, conveyer is equipped with two to the structure is the same, and is located the both sides of box respectively, conveyer includes motor and drive wheel, the drive wheel is installed on the motor, and be equipped with the conveyer belt between the drive wheel and.

In order to improve the practicality of this structure, the utility model discloses an improvement has, the inside in cooling storehouse is equipped with temperature sensor, temperature sensor's inside is equipped with wireless transmitter to through the well accuse ware of wireless signal connection, be equipped with on the conveyer belt and hold the box, case fixed mounting is on the conveyer belt, be equipped with the division board between water tank and the liquid nitrogen case, conveyer's bottom and the bottom of box all are equipped with the return pulley, be equipped with the observation sight glass on the cooling storehouse.

Blow impurity on holding the box in order to prevent the cold wind mouth, the utility model discloses an improvement has, be equipped with the filter screen on the cold wind mouth, be equipped with bolted connection between filter screen and the cold wind mouth.

In order to prevent the box inside from being damped, the utility model discloses an improvement has, the inside of box is equipped with the layer that absorbs water.

(III) advantageous effects

Compared with the prior art, the utility model provides a semiconductor wafer cools off controlling means fast possesses following beneficial effect:

the semiconductor wafer rapid cooling control device comprises a box body, a conveying device, a central controller, a cooling bin and a pre-cooling bin, wherein the box body is provided with a workbench, a water tank and a liquid nitrogen box, the workbench is installed at the upper end of the box body, the water tank and the liquid nitrogen box are both installed inside the box body, the water tank is provided with a water inlet pipe and a water return pipe, the water inlet pipe is provided with a water delivery pump, the liquid nitrogen box is provided with a liquid nitrogen conveying pipe, the pre-cooling bin is provided with a condenser pipe, the condenser pipe is installed on the inner wall of the pre-cooling bin, the cooling bin is provided with an air cooler and a liquid nitrogen controller, the pre-cooling bin has a pre-cooling effect by being provided with the condenser pipe and the water tank, the semiconductor wafer is prevented from being damaged due to sudden low temperature, the cooling effect of the cooling bin is improved by being provided with the air cooler, and the liquid nitrogen box and the liquid nitrogen controller are arranged, make the cooling express delivery in cooling storehouse improve, the one end of liquid nitrogen controller is passed through liquid nitrogen transport pipe and is connected the liquid nitrogen case, is equipped with the wire between the other end and the well accuse ware and is connected, is equipped with the wire through being connected between liquid nitrogen controller and the well accuse ware, prevents that the liquid nitrogen from intaking excessive and causing the harm to semiconductor wafer.

Drawings

FIG. 1 is a schematic view of the present invention;

fig. 2 is a side view of the present invention;

fig. 3 is a side view of the pre-cooling bin in the structure schematic diagram 1 of the present invention;

in the figure: 1. a box body; 2. a cooling bin; 3. a pre-cooling bin; 4. a conveying device; 5. a driving wheel; 6. a conveyor belt; 7. a containing box; 8. a temperature sensor; 9. an air cooler; 10. a cold air port; 11. a filter screen; 12. a liquid nitrogen controller; 13. a liquid nitrogen outlet; 14. a condenser tube; 15. a water tank; 16. a water inlet pipe; 17. a water delivery pump; 18. a water return pipe; 19. a liquid nitrogen tank; 20. a liquid nitrogen transport pipe; 21. a central controller; 22. a display screen; 23. a control key;

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention relates to a semiconductor wafer rapid cooling control device, which comprises a box body 1, a conveying device 4, a central controller 21, a cooling chamber 2 and a pre-cooling chamber 3, wherein the box body 1 is provided with a worktable, a water tank 15 and a liquid nitrogen tank 19, the worktable is installed at the upper end of the box body 1, the water tank 15 and the liquid nitrogen tank 19 are both installed inside the box body 1, the water tank 15 is provided with a water inlet pipe 16 and a water return pipe 18, the water inlet pipe 16 is provided with a water pump 17, the liquid nitrogen tank 19 is provided with a liquid nitrogen transport pipe 20, the cooling chamber 2 and the pre-cooling chamber 3 are both installed at the upper end of the worktable, the pre-cooling chamber 3 is installed at one side of the cooling chamber 2, the pre-cooling chamber 3 is provided with a condenser pipe 14, the condenser pipe 14 is installed on the inner wall of the pre-cooling chamber 3, and one end of the condenser pipe 14 is connected with the water inlet pipe 16, the other end of the cooling bin 2 is connected with a water return pipe 18, an air cooler 9 and a liquid nitrogen controller 12 are arranged on the cooling bin 2, one end of the liquid nitrogen controller 12 is connected with a liquid nitrogen box 19 through a liquid nitrogen conveying pipe 20, a wire is arranged between the other end of the liquid nitrogen controller and a central controller 21 for connection, the air cooler 9 and the liquid nitrogen controller 12 are both arranged at the upper end of the cooling bin 2, a cold air port 10 is arranged on the air cooler 9, a liquid nitrogen outlet 13 is arranged on the liquid nitrogen controller 12, the cold air port 10 and the liquid nitrogen outlet 13 are both arranged inside the cooling bin 2, the central controller 21 is arranged at one side of the box body 1 and is connected with the air cooler 9 through a wire, a display screen 22 and control keys 23 are arranged on the central controller 21, two conveying devices 4 are arranged and have the same structure and are respectively arranged at two sides of the box body 1, each conveying device 4 comprises a motor and a driving wheel 5, the transmission wheels 5 are arranged on the motor, and the transmission wheels 5 are connected through a transmission belt 6.

The utility model discloses a semiconductor wafer rapid cooling controlling means is when using, box 1 plays the effect of bearing water tank 15 and liquid nitrogen case 19, at first put the semiconductor wafer on conveyer 4, the motor drives the drive wheel 5 and rotates, drive wheel 5 drives conveyer belt 6 and transports, the workstation plays the effect of supporting precooling storehouse 3 and cooling storehouse 2, the semiconductor wafer on conveyer belt 6 can get into precooling storehouse 3 at first, here, water pump 17 transports water from water tank 15 to condenser pipe 14 through inlet tube 16, the water in condenser pipe 14 passes through return pipe 18 and then gets into in the middle of water tank 15, thereby the purpose of precooling has been played, through carrying out the precooling, prevent that the semiconductor wafer from meeting sudden low temperature and taking place the damage, after the precooling, the semiconductor wafer can get into cooling storehouse 2 next, then liquid nitrogen controller 12 can pass through liquid nitrogen transport pipe 20, "take out" in following liquid nitrogen box 19 with the liquid nitrogen, "emit" from liquid nitrogen export 13 department to "this process of emitting" liquid nitrogen, whole journey is controlled through well accuse ware 2121, operate through control button 23, thereby prevent that the liquid nitrogen from putting into too much damage semiconductor wafer, later air-cooler 9 starts, cold wind mouth 10 department can blow into cold wind in to cooling storehouse 2, maintain the inside temperature in cooling storehouse 2 through cold wind, thereby reached quick refrigerated effect.

In order to improve the practicability of the structure, the improvement of the present invention is that the inside of the cooling chamber 2 is provided with a temperature sensor 8, the inside of the temperature sensor 8 is provided with a wireless transmitter, and is connected with a central controller 21 through a wireless signal, the conveyor 6 is provided with a containing box 7, the containing box is fixedly installed on the conveyor 6, a separation plate is arranged between the water tank 15 and the liquid nitrogen tank 19, the bottom end of the conveyor 4 and the bottom end of the box body 1 are both provided with bottom wheels, the cooling chamber 2 is provided with an observation mirror, the temperature inside the cooling chamber 2 can be detected through the temperature sensor 8, and the detected temperature is transmitted to the central controller 2121 through a wireless signal, the air cooler 9 is further adjusted through the central controller 2121, and the temperature inside the cooling chamber 2 is displayed through a display screen 22, so as to maintain the temperature inside the cooling chamber 2, through being equipped with and holding box 7, exerted a spacing effect for semiconductor wafer, through being equipped with the return pulley, made things convenient for the removal of conveyer 4 and box 1, through being equipped with the division board, kept apart water tank 15 and liquid nitrogen case 19, through being equipped with the observation mirror, can survey the inside condition in cooling bin 2 constantly, when special circumstances, the convenient in time of handling.

Blow to holding on the box 7 in order to prevent that the cold wind mouth 10 from holding impurity, the utility model discloses an improvement has, be equipped with filter screen 11 on the cold wind mouth 10, be equipped with bolted connection between filter screen 11 and the cold wind mouth 10.

In order to prevent that box 1 is inside to be dampened, the utility model discloses an improvement has, box 1's inside is equipped with the layer that absorbs water, and the layer that absorbs water can adsorb the inside moisture of box 1.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The quick cooling control device for the semiconductor wafer is characterized by comprising a box body (1), a conveying device (4), a central controller (21), a cooling bin (2) and a pre-cooling bin (3), wherein a workbench, a water tank (15) and a liquid nitrogen tank (19) are arranged on the box body (1), the workbench is arranged at the upper end of the box body (1), the water tank (15) and the liquid nitrogen tank (19) are both arranged inside the box body (1), the water tank (15) is provided with a water inlet pipe (16) and a water return pipe (18), the water inlet pipe (16) is provided with a water delivery pump (17), the liquid nitrogen tank (19) is provided with a liquid nitrogen conveying pipe (20), the cooling bin (2) and the pre-cooling bin (3) are both arranged at the upper end of the workbench, the pre-cooling bin (3) is arranged on one side of the cooling bin (2), and the pre-cooling bin (3) is provided with a condensing pipe (14), the condenser pipe (14) is installed on the inner wall of the pre-cooling bin (3), one end of the condenser pipe (14) is connected with the water inlet pipe (16), the other end of the condenser pipe is connected with the water return pipe (18), the cooling bin (2) is provided with the air cooler (9) and the liquid nitrogen controller (12), one end of the liquid nitrogen controller (12) is connected with the liquid nitrogen box (19) through the liquid nitrogen transport pipe (20), the other end of the liquid nitrogen box is connected with the central controller (21) through a wire, the air cooler (9) and the liquid nitrogen controller (12) are both installed at the upper end of the cooling bin (2), the air cooler (9) is provided with the cold air port (10), the liquid nitrogen controller (12) is provided with the liquid nitrogen outlet (13), the cold air port (10) and the liquid nitrogen outlet (13) are both installed inside the cooling bin (2), and the central controller (21) is located on one side of the box body (1), and be equipped with the wire between with air-cooler (9) and be connected, be equipped with display screen (22) and control button (23) on well accuse ware (21), conveyer (4) are equipped with two to the structure is the same, and is located the both sides of box (1) respectively, conveyer (4) include motor and drive wheel (5), drive wheel (5) are installed on the motor, and be equipped with conveyer belt (6) between drive wheel (5) and connect.

2. The rapid cooling control device for the semiconductor wafer as claimed in claim 1, wherein a temperature sensor (8) is disposed inside the cooling chamber (2), a wireless transmitter is disposed inside the temperature sensor (8), and a central controller (21) is connected through a wireless signal.

3. The control device for rapidly cooling the semiconductor wafer as claimed in claim 1, wherein the conveyor belt (6) is provided with a containing box (7), and the containing box is fixedly arranged on the conveyor belt (6).

4. The rapid cooling control device for semiconductor wafers as claimed in claim 1, wherein a separation plate is provided between the water tank (15) and the liquid nitrogen tank (19).

5. The rapid cooling control device for the semiconductor wafer as claimed in claim 1, wherein a filter screen (11) is disposed on the cooling air port (10).

6. The rapid cooling control device for the semiconductor wafer as claimed in claim 5, wherein a bolt connection is provided between the filter screen (11) and the cold air port (10).

7. The rapid cooling control device for semiconductor wafers as claimed in claim 1, wherein the inside of the box (1) is provided with a water absorbing layer.

8. The control device for rapidly cooling the semiconductor wafer as claimed in claim 1, wherein the bottom end of the conveying device (4) and the bottom end of the box body (1) are provided with bottom wheels.

9. The control device for rapidly cooling the semiconductor wafer according to any one of claims 1 to 8, wherein the cooling chamber (2) is provided with a sight glass.