CN213866452U - Electrodeposition waste copper dissolving device - Google Patents
Electrodeposition waste copper dissolving device Download PDFInfo
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- CN213866452U CN213866452U CN202022806997.3U CN202022806997U CN213866452U CN 213866452 U CN213866452 U CN 213866452U CN 202022806997 U CN202022806997 U CN 202022806997U CN 213866452 U CN213866452 U CN 213866452U
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- electrodeposition
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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Abstract
The utility model relates to an electrodeposition waste copper dissolving device, which comprises a copper dissolving tank (1), a copper electrodeposition tank (7) and an electrodeposition liquid circulating tank (8), wherein the copper dissolving tank (1) is provided with a liquid inlet pipeline (2) and an overflow pipeline (3); the liquid inlet pipeline (2) is communicated with a liquid collecting pipeline (4) overflowing from the copper electrodeposition tank (7); the overflow pipeline (3) is arranged at the upper part of the copper dissolving tank (1) and is communicated to the electrolyte solution circulating tank (8); the copper dissolving groove is positioned between the height difference (H) of the copper electrodeposition groove and the electrolyte solution circulating groove. The utility model discloses utilize the position difference in height of electrodeposition overflow liquid and oxygen source, groove, single copper tank day dissolves copper volume more than 300 kilograms, does not consume power, does not consume steam and compressed air.
Description
Technical Field
The utility model belongs to the technical field of wet process copper metallurgy electrodeposition, concretely relates to electrodeposition copper scrap dissolving device.
Background
In the wet copper smelting and electrodeposition production process, unqualified copper plates with appearance and the like are inevitably generated, a certain amount of copper scraps, copper nodules, copper strips and the like are recovered in the production process, the copper plates are dissolved before being recycled for electrodeposition production of qualified cathode copper, the traditional copper scrap dissolving method references an immersion type copper dissolving process, a spray type copper dissolving process and the like, air is blown in by using power equipment such as an air compressor and the like, even the copper dissolving process needs to be heated, not only is the energy consumption large, but also oil stains and the like of a copper dissolving liquid need to be purified, and the process method is complex.
SUMMERY OF THE UTILITY MODEL
The utility model provides an electrodeposition copper scrap dissolving device, the technical problem who solves is: the problems of high energy consumption, complex process such as purification of the copper dissolving liquid and the like in the existing copper dissolving process are solved, and the problems of various pollutants such as oil stain and the like in the whole copper dissolving process are also solved.
In order to solve the technical problem, the utility model provides an electrodeposition copper scrap dissolving device, its characterized in that: the device comprises a copper dissolving tank (1), a copper electrodeposition tank (7) and an electric accumulated liquid circulation tank (8), wherein the copper dissolving tank (1) is provided with a liquid inlet pipeline (2) and an overflow pipeline (3); the liquid inlet pipeline (2) is communicated with a liquid collecting pipeline (4) overflowing from the copper electrodeposition tank (7); the overflow pipeline (3) is arranged at the upper part of the copper dissolving tank (1) and is communicated to the electrolyte solution circulating tank (8); the copper dissolving groove is positioned between the height difference (H) of the copper electrodeposition groove and the electrolyte solution circulating groove.
Has the advantages that: the utility model discloses utilize the position difference in height of electrodeposition overflow liquid and oxygen source, groove, single copper tank day dissolves copper volume more than 300 kilograms, does not consume power, does not consume steam and compressed air.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Detailed Description
In order to make the objects, contents and advantages of the present invention clearer, the following description will be made in further detail with respect to the embodiments of the present invention.
The utility model provides an electrodeposition waste copper dissolving device, which comprises a copper dissolving tank (1), wherein the copper dissolving tank (1) is provided with a liquid inlet pipeline (2) and an overflow pipeline (3); the liquid inlet pipeline (2) is communicated with a liquid collecting pipeline (4) overflowing from the copper electrodeposition tank (7); the overflow pipeline (3) is arranged at the upper part of the copper dissolving tank (1) and is communicated to the electrolyte solution circulating tank (8); the liquid inlet pipeline (2) is provided with a control valve (5) and a self-suction type air supplement pipe (6); the copper dissolving groove is positioned between the height difference (H) of the copper electrodeposition groove and the electrolyte solution circulating groove.
The electrodeposition overflow liquid and the oxygen source of the copper electrodeposition tank (7) come from high-oxygen-content overflow solution generated by an anode plate of the electrodeposition tank in the electrodeposition process.
The position height difference of the groove refers to the height difference of the copper dissolving groove between the electrodeposition groove and the electrodeposition liquid circulating groove, and the height difference range is 2-20 m.
The liquid inlet pipeline is communicated with a liquid collecting pipeline for overflow of the copper electrodeposition tank, and a control valve and a self-suction type air supplementing pipe can be arranged.
The working process is as follows:
s1, starting an electrodeposition tank for copper electrodeposition according to normal production;
s2, after a large amount of oxygen-enriched electrodeposition circulating liquid is stably generated, adding a certain amount of waste copper cleaned by production process water or pure water into the copper dissolving tank (1);
s3, opening a control valve (5) on a liquid inlet pipeline (2) of the copper dissolving tank (1), and controlling the flow rate of the solution in the liquid inlet pipeline (2) to be 10-500m3/h；
And S4, determining whether to open the self-suction air supply pipe (6) to supply air according to the copper dissolving effect, and periodically supplying waste copper according to the copper dissolving effect of the copper dissolving tank.
Adopt the utility model discloses a dissolve copper method, single copper tank dissolves copper volume in a day more than 300 kilograms, does not consume power, does not consume steam and compressed air.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be considered as the protection scope of the present invention.
Claims (4)
1. The utility model provides an electrodeposition copper scrap dissolving device which characterized in that: the device comprises a copper dissolving tank (1), a copper electrodeposition tank (7) and an electric accumulated liquid circulation tank (8), wherein the copper dissolving tank (1) is provided with a liquid inlet pipeline (2) and an overflow pipeline (3); the liquid inlet pipeline (2) is communicated with a liquid collecting pipeline (4) overflowing from the copper electrodeposition tank (7); the overflow pipeline (3) is arranged at the upper part of the copper dissolving tank (1) and is communicated to the electrolyte solution circulating tank (8); the copper dissolving groove is positioned between the height difference (H) of the copper electrodeposition groove and the electrolyte solution circulating groove.
2. The electrodeposition waste copper dissolution apparatus according to claim 1, characterized in that: the electrodeposition overflow liquid and the oxygen source of the copper electrodeposition tank (7) come from high-oxygen-content overflow solution generated by an anode plate of the electrodeposition tank in the electrodeposition process.
3. The electrodeposition waste copper dissolution apparatus according to claim 1, characterized in that: the range of the elevation difference is 2-20 meters.
4. The electrodeposition waste copper dissolution apparatus according to claim 1, characterized in that: a control valve (5) and a self-suction type air supply pipe (6) are arranged between the liquid inlet pipeline and the liquid collecting pipeline overflowing from the copper electrodeposition tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022806997.3U CN213866452U (en) | 2020-11-26 | 2020-11-26 | Electrodeposition waste copper dissolving device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022806997.3U CN213866452U (en) | 2020-11-26 | 2020-11-26 | Electrodeposition waste copper dissolving device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213866452U true CN213866452U (en) | 2021-08-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022806997.3U Active CN213866452U (en) | 2020-11-26 | 2020-11-26 | Electrodeposition waste copper dissolving device |
Country Status (1)
| Country | Link |
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| CN (1) | CN213866452U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112501653A (en) * | 2020-11-26 | 2021-03-16 | 万宝矿产有限公司 | Electrodeposition waste copper dissolving device and copper dissolving method |
-
2020
- 2020-11-26 CN CN202022806997.3U patent/CN213866452U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112501653A (en) * | 2020-11-26 | 2021-03-16 | 万宝矿产有限公司 | Electrodeposition waste copper dissolving device and copper dissolving method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220819 Address after: 100053 No.12, South Guanganmen street, Xicheng District, Beijing Patentee after: North Mining Co.,Ltd. Address before: No.56, nanxianli, Xicheng District, Beijing 100053 Patentee before: WANBAO MINING Ltd. |
|
| TR01 | Transfer of patent right |