CN201971894U - A PCB board sinking copper wire micro-etching potion recycling device - Google Patents
A PCB board sinking copper wire micro-etching potion recycling device Download PDFInfo
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- CN201971894U CN201971894U CN2011200289615U CN201120028961U CN201971894U CN 201971894 U CN201971894 U CN 201971894U CN 2011200289615 U CN2011200289615 U CN 2011200289615U CN 201120028961 U CN201120028961 U CN 201120028961U CN 201971894 U CN201971894 U CN 201971894U
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 20
- 238000005530 etching Methods 0.000 title claims abstract description 14
- 238000004064 recycling Methods 0.000 title claims abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 76
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000007788 liquid Substances 0.000 claims abstract description 14
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052802 copper Inorganic materials 0.000 claims abstract description 11
- 239000010949 copper Substances 0.000 claims abstract description 11
- 239000010936 titanium Substances 0.000 claims abstract description 11
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 11
- 239000003814 drug Substances 0.000 claims abstract description 9
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 230000008929 regeneration Effects 0.000 claims description 3
- 238000011069 regeneration method Methods 0.000 claims description 3
- 230000001172 regenerating effect Effects 0.000 claims 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract description 9
- 229910001431 copper ion Inorganic materials 0.000 abstract description 9
- 238000005868 electrolysis reaction Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000002351 wastewater Substances 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 11
- 239000010865 sewage Substances 0.000 description 7
- BESJRHHIPGWPTC-UHFFFAOYSA-N azane;copper Chemical class N.[Cu] BESJRHHIPGWPTC-UHFFFAOYSA-N 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Water Treatment By Electricity Or Magnetism (AREA)
Abstract
Description
技术领域technical field
本实用新型涉及污水处理设备,特别涉及一种PCB板沉铜线微蚀药水循环再生装置;是PCB板沉铜工序中含大量的铜离子、铜氨络合物的废水专用处理装置。The utility model relates to sewage treatment equipment, in particular to a PCB board sinking copper wire micro-etching potion circulation regeneration device; it is a special treatment device for waste water containing a large amount of copper ions and copper ammonia complexes in the PCB board copper sinking process.
背景技术Background technique
PCB板在制造过程中,需要对其基材进行沉铜处理,在沉铜过程中,将产生大量含大量的铜离子、铜氨络合物的废水,该废水直接排放到污水收集池。传统方法不但要去除溶液中的铜离子,还要对溶液中的微蚀药水进行中和,造成水资源浪费和药水利用率低。During the manufacturing process of PCB boards, the substrate needs to be copper-precipitated. During the copper-precipitation process, a large amount of wastewater containing a large amount of copper ions and copper ammonia complexes will be generated, and the wastewater will be directly discharged to the sewage collection tank. The traditional method not only removes copper ions in the solution, but also neutralizes the micro-etching potion in the solution, resulting in waste of water resources and low utilization rate of the potion.
实用新型内容Utility model content
本实用新型的目的在于提供一种PCB沉铜线微蚀药水循环再生装置,以解决生产过程中水资源、药水利用率低和污水处理效率低的问题。The purpose of the utility model is to provide a PCB sinking copper wire micro-etching potion recycling device to solve the problems of low utilization rate of water resources and potion and low efficiency of sewage treatment in the production process.
为实现上述目的,本实用新型主要采取以下技术方案:In order to achieve the above object, the utility model mainly adopts the following technical solutions:
一种PCB板沉铜线微蚀药水循环再生装置,包括入水管、储水槽、电解槽、整流器、控制器、自动加药槽、出水口和水管;入水管与储水槽连接,储水槽通过水管与电解槽连接,电解槽位于储水槽外侧下方,自动加药槽位于储水槽下方,电解槽通过水管与自动加药槽连接,自动加药槽设有出水口;电解槽包括方形水槽和置于水槽上方的阴阳极板,其中钛板为阳极板,铜板为阴极板;整流器的正极通过引线与钛板连接,整流器的负极通过引线与铜板连接;控制器包括依次连接的双氧水电位传感器、信号放大器、调节器、变频器和水泵;双氧水电位传感器设置在自动加药槽中,水泵分别与微蚀药水容器以及自动加药槽连接。A PCB board sinking copper wire micro-etching solution circulation regeneration device, including a water inlet pipe, a water storage tank, an electrolytic tank, a rectifier, a controller, an automatic dosing tank, a water outlet and a water pipe; the water inlet pipe is connected to the water storage tank, and the water storage tank passes through the water pipe It is connected with the electrolytic tank, the electrolytic tank is located under the outside of the water storage tank, the automatic dosing tank is located under the water storage tank, the electrolytic tank is connected with the automatic dosing tank through water pipes, and the automatic dosing tank is provided with a water outlet; the electrolytic tank includes a square water tank and a The cathode and anode plates above the sink, where the titanium plate is the anode plate and the copper plate is the cathode plate; the positive pole of the rectifier is connected to the titanium plate through a lead wire, and the negative pole of the rectifier is connected to the copper plate through a lead wire; the controller includes a hydrogen peroxide potential sensor and a signal amplifier connected in sequence , a regulator, a frequency converter and a water pump; the hydrogen peroxide potential sensor is set in the automatic dosing tank, and the water pump is respectively connected with the micro-erosion liquid medicine container and the automatic dosing tank.
为进一步实现本实用新型的目的,所述水槽优为方形水槽。In order to further realize the purpose of the utility model, the water tank is preferably a square water tank.
所述自动加药槽优选为一方形槽。The automatic dosing tank is preferably a square tank.
所述控制器的信号放大器、调节器和变频器优选设置在储水槽侧壁上。The signal amplifier, regulator and frequency converter of the controller are preferably arranged on the side wall of the water storage tank.
本实用新型的有益效果为:本实用新型针对沉铜工序污水含大量的铜离子、铜氨络合物特点,采用钛阳极的电解方法,保证在去除铜离子同时不会对电解液产生新的污染,且电解时槽压相对低,更节能省电;本实用新型控制器能对电解后污水通过自动加药控制实现微蚀药水的循环使用,有效节约水资源和回收铜离子并实现降低生产成本。The beneficial effects of the utility model are as follows: the utility model aims at the characteristics that the sewage in the copper sinking process contains a large amount of copper ions and copper ammonia complexes, and adopts the electrolysis method of the titanium anode to ensure that the copper ions will be removed without generating new electrolytes. Pollution, and the tank pressure is relatively low during electrolysis, which is more energy-saving and power-saving; the controller of the utility model can realize the recycling of the micro-etching potion through the automatic dosing control of the sewage after electrolysis, effectively save water resources and recover copper ions and reduce production cost.
附图说明Description of drawings
图1为本实用新型结构示意图。Fig. 1 is the structural representation of the utility model.
图2为本实用新型整流器示意图。Fig. 2 is a schematic diagram of the rectifier of the present invention.
图3为本实用新型控制器结构示意图。Fig. 3 is a structural schematic diagram of the controller of the present invention.
具体实施方式Detailed ways
下面结合附图和实施方式对本实用新型作进一步的说明,但本实用新型要求保护的范围并不局限于实施方式表达的范围。The utility model will be further described below in conjunction with the accompanying drawings and embodiments, but the protection scope of the utility model is not limited to the range expressed in the embodiments.
如图1所示,一种PCB板沉铜线微蚀药水循环再生装置,包括入水管1、储水槽2、电解槽3、整流器4、控制器5、自动加药槽6、出水口和水管8;入水管1与储水槽2连接,储水槽2通过水管8与电解槽3连接,电解槽3位于储水槽2外侧下方,自动加药槽6位于储水槽2下方,电解槽3通过水管8与自动加药槽6连接,自动加药槽6设有出水口7;电解槽2包括方形水槽和置于水槽上方的阴阳极板,水槽优选为方形水槽,其中钛板为阳极板,铜板为阴极板;如图2所示,整流器4由交直流转换的电路组成,通过交流变压,并通过整流桥实现稳定5v直流电压输出。整流器3的正极通过引线与钛板连接,整流器3的负极通过引线与铜板连接。采用钛阳极的电解方法,保证在去除铜离子同时不会对电解液产生新的污染。如图3所示,控制器包括依次连接的双氧水电位传感器11、信号放大器12、调节器13、变频器14和水泵15;双氧水电位传感器11设置在自动加药槽6中,检测自动加药槽6中电解后微蚀药水(由硫酸和双氧水组成)的浓度;水泵15分别与微蚀药水容器16以及自动加药槽6连接,将微蚀药水容器16中的微蚀药水抽入自动加药槽6中,具体过程是,由双氧水电位传感器11检测自动加药槽6中微蚀药水的浓度,将该浓度信息通过信号放大器12输入到调节器13,与调节器13中设定值比较,得到偏差信号,调节器13将偏差信号按工艺要求进行比例、积分运算,其运算结果信号输送给变频器14,变频器14按调节器13输出的调节信号改变水泵15电机工作电源的频率,使水泵电机转速发生变化,改变注入药液剂量,使药水浓度控制在工艺范围内。自动加药槽6优选为一方形槽。控制器5的信号放大器12、调节器13和变频器14优选设置在储水槽2侧壁上。As shown in Figure 1, a PCB board sinking copper wire micro-etching liquid recycling device, including
使用时,生产线污水由入水管1进入储水槽2,储水槽2将水抽入电解槽3内,由整流器4通过变压器变压和交直流转换产生稳定直流电压,并通过钛阳极的电解工艺去除污水中铜离子,让将水放入自动加药槽6进行自动加药。自动加药时,首先由双氧水电位传感器11检测到自动加药槽6中微蚀药水浓度是否在工作浓度(1.5~2%)范围内,将与浓度信息通过信号放大器12输入到调节器13与设定值比较,得到偏差信号,调节器将偏差信号按工艺要求进行比例、积分运算,其运算结果信号输送给变频器14,变频器按调节器输出的调节信号改变水泵电机工作电源的频率,使水泵电机转速发生变化,当微蚀药水重量浓度低于1.5%时,控制器5使水泵15抽取药水实现加药,当微蚀药水重量浓度高于2%时,控制器5使水泵15断开,停止加药,然后将水回用到生产线。控制器通过改变注入药液剂量,使药水浓度控制在工艺范围内。When in use, the sewage from the production line enters the
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| CN2011200289615U CN201971894U (en) | 2011-01-27 | 2011-01-27 | A PCB board sinking copper wire micro-etching potion recycling device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104975295A (en) * | 2014-04-11 | 2015-10-14 | 清英实业有限公司 | Copper-containing microetching waste liquid recovery device and method |
| CN105320162A (en) * | 2015-11-23 | 2016-02-10 | 深圳市深联电路有限公司 | An electroless copper plating line desmearing tank water adding method |
| CN105648518A (en) * | 2016-03-29 | 2016-06-08 | 佛山科学技术学院 | Device and method for copper ion addition in etched foil production line |
| CN106222661A (en) * | 2016-07-26 | 2016-12-14 | 深圳崇达多层线路板有限公司 | The method and system that micro-etched waste liquid recycles |
| CN112744944A (en) * | 2020-11-24 | 2021-05-04 | 中国南方电网有限责任公司超高压输电公司广州局 | Automatic dosing control system and method suitable for reverse osmosis water treatment device |
-
2011
- 2011-01-27 CN CN2011200289615U patent/CN201971894U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104975295A (en) * | 2014-04-11 | 2015-10-14 | 清英实业有限公司 | Copper-containing microetching waste liquid recovery device and method |
| CN105320162A (en) * | 2015-11-23 | 2016-02-10 | 深圳市深联电路有限公司 | An electroless copper plating line desmearing tank water adding method |
| CN105648518A (en) * | 2016-03-29 | 2016-06-08 | 佛山科学技术学院 | Device and method for copper ion addition in etched foil production line |
| CN106222661A (en) * | 2016-07-26 | 2016-12-14 | 深圳崇达多层线路板有限公司 | The method and system that micro-etched waste liquid recycles |
| CN112744944A (en) * | 2020-11-24 | 2021-05-04 | 中国南方电网有限责任公司超高压输电公司广州局 | Automatic dosing control system and method suitable for reverse osmosis water treatment device |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110914 Termination date: 20140127 |