CN213845263U - Miniaturized broadband matching structure for micro-strip board gold wire bonding interconnection - Google Patents
Miniaturized broadband matching structure for micro-strip board gold wire bonding interconnection Download PDFInfo
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- CN213845263U CN213845263U CN202022771753.6U CN202022771753U CN213845263U CN 213845263 U CN213845263 U CN 213845263U CN 202022771753 U CN202022771753 U CN 202022771753U CN 213845263 U CN213845263 U CN 213845263U
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Abstract
The utility model relates to a towards miniaturized broadband matching structure of microstrip board gold wire bonding interconnection, include: a first microstrip line; the first microstrip line and the second microstrip line are fixedly arranged on the top of the dielectric slab and are positioned on the same straight line; the broadband matching device comprises a plurality of broadband matching components, wherein each broadband matching component comprises a first broadband matching structure, a second broadband matching structure and a connecting piece, the first broadband matching structure and the second broadband matching structure are respectively connected with a first microstrip line and a second microstrip line, and the first broadband matching structure and the second broadband matching structure are connected through the connecting pieces. The utility model discloses well broadband matching structure is based on piece type structure, and the complicated topological structure of nimble realization has overcome traditional gold wire bonding matching circuit topological structure and has fixed, matches the few problem of festival, realizes microstrip line broad bandwidth, high performance, low-loss microwave signal transmission, and has miniaturized advantage.
Description
Technical Field
The utility model belongs to the technical field of microwave multi-chip module (MMCM) technique and specifically relates to interconnection matching of polylith microstrip board concatenation based on gold wire bonding interconnection based on microstrip line interconnection.
Background
With the rapid development of active phased array radar and communication technology, the design requirements of high performance, high integration and high reliability of microwave multi-chip modules (MMCM) applied to radio frequency front ends are increasing. The microwave multi-chip module generally adopts a bare chip integration and micro-assembly process, and uses a microstrip line to communicate the discrete microwave chip with the microstrip board. The connection is usually connected by a gold wire bonding micro-assembly process. The microstrip line is a broadband transmission line, but parasitic parameters and insertion loss introduced by gold wire bonding structures between chips and between spliced microstrip boards become bottlenecks which restrict the broadband transmission performance of microwave signals of the assembly.
In a single-layer microstrip board circuit, a matching structure facing gold wire bonding is generally arranged at a gold wire bonding point, and microwave matching performance is realized by performing targeted design on a topological structure of the matching structure. Since Steve Nelson et al put forward a gold wire bonding structure equivalent circuit model and pertinently put forward an airfoil section matching structure in 1991, researchers have continuously studied the gold wire bonding matching structure, and many theoretical achievements have been applied and popularized in engineering practice.
Although the traditional wing section matching structure is widely used, the defects of fixed circuit topological structure, less matching adjustable parameters and less matching sections of the traditional wing section matching structure cause that the matching performance can not well meet the design requirement in the application scene of high frequency band and wide frequency band. In addition, the design difficulty of the matching structure is further increased due to the requirement of high-integration plate distribution.
The wing section structure is optimized and improved by Nanjing Rich Engineer university Licheng and the like and by Nannan university millimeter wave national focus laboratory Zhang hongying and the like respectively based on a 5-order bandpass filter principle and a microstrip branch line structure, but the wing section structure has defects in the aspects of matching bandwidth, structure size, insertion loss and the like.
In 2018, Huixian et al, the fifty-fourth research institute of Chinese electronic technology group corporation, proposed a semicircular gold wire bonded broadband matching structure, which realizes 0-6GHz broadband matching, but based on the topological structure of regular graphs, the adjustable parameters are few, and fine adjustment and multi-section matching cannot be achieved. When the operating frequency band and bandwidth are further increased, such as in the 6-18GHz band, the design of the matching structure based on the regular pattern becomes very difficult.
In summary, in the field of microwave multi-chip components, in the application scenarios of high frequency band, wide bandwidth, and miniaturization, the existing gold wire bonding structure design scheme still cannot make up for parasitic parameters well, and meets increasingly stringent matching design requirements.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that solve lies in overcoming under high frequency channel, wide bandwidth, miniaturized design demand, the difficulty of compensation spun gold bonded structure parasitic parameter improves the problem of microwave signal transmission performance.
The utility model discloses a following technical means realizes solving above-mentioned technical problem:
a miniaturized broadband matching structure for microstrip panel gold wire bonding interconnection, comprising:
a dielectric plate;
the first microstrip line is fixedly arranged on the top of the dielectric slab;
the second microstrip line is fixedly arranged on the top of the dielectric slab, the second microstrip line and the first microstrip line are positioned in the same straight line, and a gap is reserved at one end, close to each other, of the first microstrip line and the second microstrip line;
the broadband matching device comprises a plurality of broadband matching components, wherein each broadband matching component comprises a first broadband matching structure, a second broadband matching structure and a connecting piece, the first broadband matching structure and the second broadband matching structure are respectively connected with a first microstrip line and a second microstrip line, and the first broadband matching structure and the second broadband matching structure are connected through the connecting pieces.
The first broadband matching structure and the second broadband matching structure are arranged at the bonding points on the two sides of the bonding of the connecting piece connected with the first microstrip line and the second microstrip line and are used for compensating parasitic parameters introduced by the bonding of the connecting piece, so that the microwave signal transmission with wide bandwidth, high performance and low loss among the microstrip lines is realized.
As a further aspect of the present invention: the first broadband matching structure and the second broadband matching structure are arranged in the rectangular area.
The rectangular areas of the first broadband matching structure and the second broadband matching structure are divided into the planar fragment structures of the plurality of squares, copper is selectively coated on the fragment structures, the topological design of the matching structures is completed, the matching design of refinement and flexibility and high-performance miniaturized broadband microwave matching performance are realized, the defects that the traditional gold wire matching structure is few in adjustable parameters and cannot achieve refinement adjustment, multi-section matching and the like are overcome, and the application requirements of wide bandwidth, high performance and miniaturization are met.
As a further aspect of the present invention: the rectangular area is divided into a plurality of grids, and in the grids, partial grids are covered with copper.
As a further aspect of the present invention: the rectangular area is 2.2mm × 1.1mm, and the rectangular area is divided into 50 grids of 10 × 5.
As a further aspect of the present invention: when copper is simultaneously coated between the adjacent grids, an overlapping area is arranged between the copper foils.
By providing the overlapping region between the copper foils, connection reliability can be ensured.
As a further aspect of the present invention: the dielectric plate is a Rogers 6002 single-layer microstrip dielectric plate Sub, the dielectric constant is 2.94, the loss tangent is 0.0012, the thickness is 0.254mm, the back surface of the dielectric plate is a large-area copper foil, and the front surface of the dielectric plate is a microstrip line wiring layer.
As a further aspect of the present invention: the number of the first microstrip line and the second microstrip line is respectively one, the width of the first microstrip line and the width of the second microstrip line are 0.64mm, a gap is reserved at one end close to each other, and the distance between the gaps is 0.3 mm.
As a further aspect of the present invention: the connecting piece quantity is two, the connecting piece is the gold wire of diameter 25 um.
As a further aspect of the present invention: the first broadband matching structure comprises R1, R3; the second broadband matching structure comprises R2 and R4, and R1 and R3, R2 and R4 respectively leave a space with the first microstrip line and the second microstrip line.
The utility model has the advantages that:
1. the utility model discloses a set up first broadband matching structure, second broadband matching structure in the both sides bonding point department of the connecting piece bonding of connecting first microstrip line, second microstrip line for the parasitic parameter that compensating connection piece bonding introduced, when realizing the microstrip line interconnection, broadband width, high performance, low-loss microwave signal transmission.
2. The utility model discloses in, first broadband matching structure, second broadband matching structure place region set up to the rectangle, conveniently define in advance and control the structure size, realize miniaturized design.
3. The utility model discloses in, the planar piece structure of a plurality of square is divided into in first broadband matching structure, second broadband matching structure place rectangle region, to the copper that covers of piece structure selectivity, accomplishes matching structure's topological design, has realized the matching design and the miniaturized broadband microwave matching performance of high performance of becoming more meticulous and flexibility, has overcome that traditional gold wire matching structure adjustable parameter is few, can't accomplish not enough such as regulation and multisection match become more meticulous, reach the application demand of broad bandwidth, high performance, miniaturization.
4. The utility model discloses have wide bandwidth, high performance, low good matching performance who inserts the loss, be applicable to application scenes such as high frequency channel, ultra wide band, high integrated microwave multi-chip module (MMCM), in 6GHz-18GHz band, port return loss is less than or equal to-30 dB, and insertion loss is less than or equal to-0.1 dB, is equivalent with the port return loss and the insertion loss of the microstrip line of same length, has good broadband transmission performance. The area occupied by the matching structure on one side is less than or equal to 2.2mm multiplied by 1.1mm, individual copper-clad grids which are not communicated with the microstrip lines are abandoned, the area occupied by the matching structure on one side is less than or equal to 1.34mm multiplied by 1.1mm, and miniaturization is realized.
Drawings
Fig. 1 is a schematic plan view of a surface copper foil of a miniaturized broadband matching structure for micro-strip board gold wire bonding interconnection provided by an embodiment of the present invention;
fig. 2 is a three-dimensional view of a miniaturized broadband matching structure oriented to micro-strip board gold wire bonding interconnection provided by an embodiment of the present invention;
fig. 3 is a schematic diagram of a miniaturized wideband matching structure for micro-strip board gold wire bonding interconnection, and an adjacent copper-clad grid connection mode.
Fig. 4 is a return loss curve diagram of a miniaturized wideband matching structure for micro-strip board gold wire bonding interconnection in 6-18GHz according to an embodiment of the present invention;
fig. 5 is a graph showing the insertion loss at 6-18GHz for a miniaturized wideband matching structure for microstrip board gold wire bonding interconnection provided by an embodiment of the present invention.
In the figure, 101, a first microstrip line; 102. a second microstrip line; 2. a broadband matching component; 201. A first broadband matching structure; 202. a second broadband matching structure; 203. a connecting member.
Detailed Description
To make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the embodiments of the present invention are combined to clearly and completely describe the technical solution in the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Example 1
Referring to fig. 1 and fig. 2, fig. 1 is a plan topological view of a surface copper foil of a miniaturized broadband matching structure facing to micro-strip board gold wire bonding interconnection provided by an embodiment of the present invention; fig. 2 is a three-dimensional view of a miniaturized broadband matching structure oriented to micro-strip board gold wire bonding interconnection provided by an embodiment of the present invention; the method comprises the following steps: a dielectric plate;
the first microstrip line 101 is fixedly arranged on the top of the dielectric slab 101;
the second microstrip line 102 is fixedly arranged on the top of the dielectric slab, the second microstrip line 102 and the first microstrip line 101 are in the same straight line, and a gap is reserved at one end, close to each other, of the first microstrip line 101 and the second microstrip line 102;
the broadband matching components 2 are arranged on the dielectric plate, and the first microstrip line 101 and the second microstrip line 102 are connected through the broadband matching components 2.
Preferably, in the embodiment of the present disclosure, the dielectric slab is a Rogers 6002 single-layer microstrip dielectric slab Sub, the dielectric constant is 2.94, the loss tangent is 0.0012, the thickness is 0.254mm, and the back surface of the dielectric slab is a large-area copper foil serving as a ground of the microstrip line; the front surface is provided with a microstrip line wiring layer.
In the embodiment of the present disclosure, the number of the first microstrip line 101 and the second microstrip line 102 is one, and taking the view angle of fig. 1 as an example, the front and back widths of the first microstrip line 101 and the second microstrip line 102 are 0.64mm, a gap is left at one end close to each other, and the gap distance is 0.3 mm.
Further, the broadband matching component 2 includes a first broadband matching structure 201, a second broadband matching structure 202, and a connecting component 203, where the first broadband matching structure 201 and the second broadband matching structure 202 are respectively connected to the first microstrip line 101 and the second microstrip line 102, and the first broadband matching structure 201 and the second broadband matching structure 202 are connected by the connecting component 203.
The connecting piece 203 quantity is two, the connecting piece 203 is the gold wire of diameter 25um, first broadband matching structure 201, second broadband matching structure 202 pass through the gold wire bonding.
Specifically, the first broadband matching structure 201 and the second broadband matching structure 202 are arranged in a rectangular area, the rectangular area is 2.2mm × 1.1mm, miniaturization is ensured, the rectangular area is divided into a plurality of grids, for example, the rectangular area is divided into 50 grids, for example, the grid is divided into 10 × 5 grids, each grid is square, and copper is selectively coated on the grids, so that the fragment type structures of the first broadband matching structure 201 and the second broadband matching structure 202 are realized, the high-performance miniaturized broadband microwave matching performance is realized based on the fragment type structures, and parasitic parameters introduced by gold wire bonding can be compensated.
Through the mode, the rectangular areas where the first broadband matching structure and the second broadband matching structure are located are divided into the planar fragment structures of the grids, and copper is selectively coated, so that the matching design of refinement and flexibility and high-performance miniaturized broadband microwave matching performance are realized, the defects that the traditional gold wire matching structure is few in adjustable parameters, cannot achieve refinement adjustment, multi-section matching and the like are overcome, and the application requirements of wide bandwidth, high performance and miniaturization are met.
Referring to fig. 3, fig. 3 is a schematic diagram of a connection mode of adjacent copper-clad grids of a microstrip board according to an embodiment of the present invention, when the adjacent grids are connected, an overlapping region related to the processing accuracy of a microstrip line pattern needs to be provided, the width of copper-clad is 0.02mm wide, so as to ensure that the interconnection of the adjacent copper-clad grids meets the requirements of electromagnetic simulation and production processing, that is, four grids D1, D2, D3 and D4 in fig. 3, the adjacent sides of D1 and D2 are coated with copper, the occupied width of copper-clad is 0.02mm, the length is the same as the length of the grids, and copper is also coated between D1 and D3, D2 and D4, and between D3 and D4.
Further, the first broadband matching structure 201 comprises R1, R3; the second broadband matching structure 202 includes R2 and R4, and R1 and R3, R2 and R4 respectively leave a gap with the first microstrip line 101 and the second microstrip line 102, that is, are not communicated with the first microstrip line 101 and the second microstrip line 102, so as to achieve fine tuning of matching performance.
It should be understood that the selection of the overlapping area can be selected according to actual requirements, and in order to facilitate the subsequent processes to manufacture different requirements, in this embodiment, all adjacent grids are coated with copper, and the width of the coated copper is 0.02 mm; in an application scenario with a high requirement for miniaturization, the copper-clad meshes R1, R2, R3 and R4 which are not communicated with the first microstrip line 101 or the second microstrip line 102 can be omitted, so that the topological structure is miniaturized.
The first broadband matching structure 201 and the second broadband matching structure 202 are located at one end of the first microstrip line 101 and the second microstrip line 102, which are close to each other, and are symmetrically distributed, and the matching structures of the first microstrip line 101 and the second microstrip line 102, which are located at the bonding points at the two ends of the connecting piece 203, are also symmetrically distributed, so that the complexity of simulation design is reduced as much as possible, and the design efficiency is improved.
When the matching structure is used specifically, the square grids in the matching region can be encoded under the condition that the connection point of the connecting piece 203 is ensured to be communicated with the first microstrip line 101 and the second microstrip line 102, and the matching structure meeting the design requirement and manufacturability can be obtained by using machine learning algorithms such as improved genetic algorithms and the like for auxiliary design.
Through the mode, in the surface layer plane topological structure based on the Rogers 6002 single-layer microstrip dielectric slab, the complicated topological structure is realized by utilizing the refinement and the flexibility of the plane fragment structure, and the simulation optimization and the manufacturability are realized. The utility model overcomes traditional gold wire bonding matching circuit topological structure is fixed, matches the problem that the number of festival is few, realizes wide bandwidth, high performance, miniaturized design target, is showing the microwave transmission performance who improves gold wire bonding structure. The utility model is suitable for an application scenes such as high frequency channel, ultra wide band, high integrated microwave multi-chip module (MMCM), single matching structure can cover whole C, X and Ku wave band (6GHz-18GHz) to have the ability to higher frequency band extension.
Meanwhile, a simulation experiment is performed, referring to fig. 4 and 5, fig. 4 shows a return loss curve of a microstrip board port provided by an embodiment of the present invention. In fig. 4, the curves 1 to S11 are return loss curves of the port without the matching structure, and the curves 2 to S11 are return loss curves of the port after the broadband matching structure provided by the present invention is used.
As can be seen from FIG. 4, when the microstrip line covers all C, X and the Ku wave band (6GHz-18GHz), the return loss of the port is less than or equal to-30 dB (shown by a 2-S11 curve), and the microstrip line has the transmission performance equivalent to that of a section of continuous microstrip line, and shows good broadband matching performance; the return loss curves of the gold wire bonding structure ports without the matching structure (shown by the curves 1-S11) are compared in the same application scenario, and the effectiveness of the matching structure is proved.
Fig. 5 shows an insertion loss curve of a microstrip board according to an embodiment of the present invention. Curves 1-S11 in fig. 5 are insertion loss curves without matching structure, and curves 2-S11 are insertion loss curves after using the broadband matching structure provided by the present invention.
The figure shows that the insertion loss is less than or equal to-0.1 dB (shown by a 2-S21 curve) when the microstrip line covers all C, X and a Ku wave band (6GHz-18GHz), and the microstrip line has equivalent transmission performance with a section of continuous microstrip line and shows good broadband matching performance; the figure compares the insertion loss curve (shown by the curve 1-S21) of the gold wire bonding structure without the matching structure under the same application scene, and proves the effectiveness of the matching structure.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (9)
1. A miniaturized broadband matching structure for microstrip board gold wire bonding interconnection, comprising:
a dielectric plate;
the first microstrip line (101), the said first microstrip line (101) is fixed to the top of the dielectric slab;
the second microstrip line (102) is fixedly arranged on the top of the dielectric slab, the second microstrip line (102) and the first microstrip line (101) are in the same straight line, and a gap is reserved at one end, close to each other, of the first microstrip line (101) and the second microstrip line (102);
the broadband matching device comprises a plurality of broadband matching components (2), wherein each broadband matching component (2) comprises a first broadband matching structure (201), a second broadband matching structure (202) and a connecting piece (203), the first broadband matching structure (201) and the second broadband matching structure (202) are respectively connected with a first microstrip line (101) and a second microstrip line (102), and the first broadband matching structure (201) is connected with the second broadband matching structure (202) through the connecting piece (203).
2. The miniaturized broadband matching structure facing micro-strip board gold wire bonding interconnection of claim 1, wherein the first broadband matching structure (201), the second broadband matching structure (202) are arranged in a rectangular area.
3. The miniaturized broadband matching structure for microstrip board gold wire bonding interconnection of claim 2, wherein the rectangular area is divided into a plurality of grids, and a part of the grids are covered with copper.
4. The miniaturized broadband matching structure for microstrip board gold wire bonding interconnection of claim 2, wherein the rectangular area is 2.2mm x 1.1mm, and the rectangular area is divided into 50 grids of 10 x 5.
5. The miniaturized broadband matching structure for microstrip board gold wire bonding interconnection according to claim 3, wherein an overlapping region is provided between copper foils when copper is simultaneously coated between adjacent grids.
6. The microstrip-board-oriented gold wire bonding interconnection-oriented miniaturized broadband matching structure according to claim 1, wherein the dielectric plate is a Rogers 6002 single-layer microstrip dielectric plate Sub, the dielectric constant is 2.94, the loss tangent is 0.0012, the thickness is 0.254mm, the back surface of the dielectric plate is a large-area copper foil, and the front surface of the dielectric plate is a microstrip line wiring layer.
7. The microstrip-board-gold-wire-bond-interconnection-oriented miniaturized broadband matching structure according to claim 1, wherein the number of the first microstrip line (101) and the second microstrip line (102) is one, the widths of the first microstrip line (101) and the second microstrip line (102) are 0.64mm, a gap is left at one end close to each other, and the gap interval is 0.3 mm.
8. The miniaturized broadband matching structure facing micro-strip board gold wire bonding interconnection of claim 3, wherein the number of the connecting pieces (203) is two, and the connecting pieces (203) are gold wires with a diameter of 25 um.
9. The miniaturized broadband matching structure towards microstrip board gold wire bonding interconnection of claim 1, wherein said first broadband matching structure (201) comprises R1, R3; the second broadband matching structure (202) comprises R2 and R4, and R1 and R3, R2 and R4 respectively leave a space with the first microstrip line (101) and the second microstrip line (102).
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