CN213835532U - Silicon wafer processing equipment - Google Patents

Abstract

The utility model provides a silicon chip treatment facility, silicon chip treatment facility includes: the silicon chip processing assembly is provided with an input end and an output end, the input end is suitable for receiving the support plate, and the output end is suitable for outputting the support plate; support plate conveying assembly, support plate conveying assembly includes: the two ends of the guide rail are respectively connected with the input end and the output end; the transmission device is arranged on the guide rail and can move along the guide rail, and a cavity is arranged on the transmission device; and after the carrier plate output by the output end is stored in the cavity, the carrier plate is conveyed to the input end through the conveying device. Through setting up the carrier plate conveying subassembly of constituteing by guide rail and transmission device, banned band conveyer, simplified silicon chip processing apparatus's structure on the one hand, reduced the shared space of carrier plate conveying subassembly. The cavity is arranged on the conveying device, so that the structure of the silicon wafer processing equipment can be further simplified from the sealing structure.

Description

Silicon wafer processing equipment

Technical Field

The utility model relates to a photovoltaic equipment technical field particularly, relates to a silicon chip treatment facility.

Background

In a photovoltaic plate type PECVD (plasma Enhanced Chemical Vapor deposition) process, after the film coating of a silicon wafer is finished, the silicon wafer needs to be unloaded, the silicon wafer flows into the next working procedure, and the silicon wafer does not exist on a carrier plate at the moment and needs to be conveyed to a feeding end of PECVD equipment. In the conventional plate-type PECVD carrier plate return device, a plurality of sections of belt conveyors are arranged below a cavity, and empty carrier plates are conveyed to a feeding end of PECVD equipment. The belt conveyor can occupy the space below the cavity, and the maintenance and the overhaul are inconvenient when the belt conveyor below the cavity or other components and parts below the cavity are in fault. In addition, with the stricter and stricter coating processes, especially in the heterojunction technology, in order to avoid the pollution of the carrier plate in the process of returning, the carrier plate needs to be sealed in the process of returning, if a set of sealing device is added on the periphery of the belt conveyor, the space below the cavity is further occupied, and the maintenance difficulty of the belt conveyor is increased due to the added sealing shell.

Therefore, how to design a silicon wafer processing device which has a simple structure, is convenient to maintain, and can ensure that the carrier plate is not polluted by air becomes a technical problem to be solved urgently.

SUMMERY OF THE UTILITY MODEL

The present invention aims at least solving one of the technical problems existing in the prior art or the related art.

Therefore, the utility model discloses a silicon chip treatment facility is proposed.

In view of this, the utility model provides a silicon chip treatment facility includes: the silicon chip processing assembly is provided with an input end and an output end, the input end is suitable for receiving the support plate, and the output end is suitable for outputting the support plate; support plate conveying assembly, support plate conveying assembly includes: the two ends of the guide rail are respectively connected with the input end and the output end; the transmission device is arranged on the guide rail and can move along the guide rail, and a cavity is arranged on the transmission device; and after the carrier plate output by the output end is stored in the cavity, the carrier plate is conveyed to the input end through the conveying device.

In the technical scheme, the silicon wafer processing equipment is limited and used for performing film coating processing on the surface of a silicon wafer, in the processing process, the silicon wafer is placed on a support plate, and the support plate is used as a carrier for bearing the silicon wafer to complete process processing. The silicon wafer processing equipment comprises a silicon wafer processing assembly and a carrier plate conveying assembly. The silicon wafer processing assembly is process processing equipment, a silicon wafer is subjected to film coating treatment in the silicon wafer processing assembly, an input end and an output end are arranged on the silicon wafer processing assembly, a support plate for placing the silicon wafer to be processed enters the silicon wafer processing assembly from the input end to complete processing, and after the processing is completed, the support plate bears a finished product silicon wafer and is transmitted out of the silicon wafer processing assembly from the output end. The carrier plate conveying assembly is a carrier plate return device in the silicon wafer processing equipment and is used for returning the carrier plate transmitted from the output end to the input end, so that the circulation of the carrier plate is completed by combining the silicon wafer processing assembly. The carrier plate conveying assembly comprises a guide rail and a conveying device, two ends of the guide rail are respectively connected with an input end and an output end of the silicon wafer processing assembly, the conveying device is arranged on the guide rail and is matched and connected with the guide rail, and when the silicon wafer on the carrier plate transmitted by the output end is taken out, the conveying device receives the carrier plate and conveys the carrier plate to the output end along the guide rail. The transmission device is provided with a cavity, and the carrier plate transmitted from the output end is received by the transmission device and then stored in the cavity.

Through setting up the carrier plate conveying subassembly of constituteing by guide rail and transmission device, banned band conveyer, simplified silicon chip processing apparatus's structure on the one hand, reduced the shared space of carrier plate conveying subassembly. On the other hand, the carrier plate conveying assembly consisting of the guide rail and the conveying device is simple to disassemble and assemble, low in maintenance difficulty and convenient for user operation when parts are overhauled and replaced. In addition, the power device on the conventional belt conveyor easily interferes with the belt and the carrier plate in the working process, the clamping plate problem easily occurs, the interference probability is effectively reduced through the arrangement of the guide rails and the conveying device, and the clamping plate phenomenon is prevented. Through set up the cavity on conveyer, can follow the structure of further retrenching silicon chip treatment facility on the seal structure, set up sealed cavity on conveyer and can remove from and set up large-area sealing device in the extension region of whole support plate conveying subassembly, reduce silicon chip treatment facility occupation space on the one hand, on the other hand has reduced manufacturing cost. Therefore, the structure of the silicon wafer processing equipment is optimized, the occupied space of the silicon wafer processing equipment is reduced, the maintenance difficulty and the fault rate of the carrier plate conveying assembly are reduced, and the technical effect of the use experience of a user is improved.

Additionally, the utility model provides an above-mentioned silicon chip treatment facility can also have following additional technical characterstic:

in the above technical solution, preferably, the transmission device includes: the first substrate is connected with the guide rail and can move along the guide rail; the cover body is buckled on the first substrate and connected with the first substrate, and a carrier plate inlet and a carrier plate outlet are formed in the cover body; the first door body is connected with the cover body and can open or close the inlet of the support plate; and the second door body is connected with the cover body and can open or close the outlet of the support plate.

In the technical scheme, the structure of the conveying device is specifically limited, and the conveying device comprises a first substrate, a cover body, a first door body and a second door body. The first substrate is a main body structure of the transmission device and is used for positioning and supporting other structures on the transmission device, and the first substrate is matched and connected with the guide rail so as to enable the first substrate to move in the extending direction of the guide rail. The cover body is buckled on the first base plate and connected with the first base plate, the first base plate and the cover body enclose a cavity, a support plate inlet and a support plate outlet are arranged on the cover body, and the support plate inlet and the support plate outlet are oppositely arranged at two ends of the cover body. The first door body is connected with the cover body and used for opening or closing the inlet of the support plate, and the second door body is connected with the cover body and used for opening or closing the outlet of the support plate. In the working process, when the transmission device is connected with the output end, the first door body is controlled to open the inlet of the carrier plate, the carrier plate is transmitted into the cavity on the transmission device from the output end, then the first door body is controlled to close the inlet of the carrier plate, when the transmission device moves to a preset position through the guide rail and is connected with the input end, the second door body is controlled to open the outlet of the carrier plate, and the carrier plate enters the input end through the outlet of the carrier plate. Through setting up the cover body, the first door body and the second door body make first base plate and cover body can enclose and close out the cavity that is used for placing the support plate, and further through the switch of the first door body and the second door body control cavity, thereby make the support plate can keep in clean environment at the passback in-process, avoid the support plate to be contaminated by the impurity in the air in each structure conveying and transportation process, and then realize the reliability of optimizing transmission device, promote the support plate cleanliness factor, guarantee silicon chip processing effect, promote the technological effect of finished product silicon chip quality.

Specifically, the first door body and the second door body are movably connected with the cover body, a driving cylinder is arranged on the cover body or the first substrate, and a moving end of the driving cylinder is connected with the first door body or the second door body, so that the first door body and the second door body are driven to move relative to the cover body through the driving cylinder to open or close the inlet and the outlet of the support plate.

In any of the above technical solutions, preferably, the transmission device further includes: the driven wheel is rotationally connected with the first substrate; the first driving device is arranged on the first substrate; the first driving wheel is connected with the first driving device, and the first driving device drives the first driving wheel to rotate; the conveying belt is sleeved on the first driving wheel and the driven wheel.

In the technical scheme, the structure of the transmission device is further limited, and the transmission device is also provided with a driven wheel, a first driving device, a first driving wheel and a conveying belt. The driven wheel and the first driving wheel are rotatably connected with the first base plate, preferably connected with the first base plate through a bearing seat. The first driving device is arranged on the first base plate, a power output end of the first driving device is connected with the first driving wheel so as to drive the first driving wheel to rotate through the first driving device, the conveying belt is sleeved on the first driving wheel and the driven wheel so as to transmit power, the driven wheel is driven to rotate along with the first driving wheel, and the belt can drive the support plate to move through friction so as to realize the transmission and the transmission of the support plate. Through setting up above-mentioned structure can construct the power structure that drives the relative transmission device motion of support plate on transmission device to make transmission device possess the ability of initiatively loading the support plate, compare in receiving the support plate passively and set up the scheme that the outer structure snatched the support plate, this structure has promoted the loading accuracy when promoting loading efficiency, reduces the cardboard probability when promoting production efficiency.

In the technical scheme, the transmission device is further provided with a coupler and a belt driving shaft, the first driving wheels on two sides of the first substrate are respectively connected with the coupler through the belt driving shaft, and after the first driving device drives any one belt driving shaft to rotate, the coupler transmits power to other belt driving shafts to realize synchronous rotation, so that the stability and the stability of the transmission of the carrier plate are ensured, and the clamping plate is prevented from being deviated due to the transmission of the carrier plate.

In any of the above technical solutions, preferably, the carrier plate transfer assembly further includes: the guide rail is arranged on the base; the rack is arranged on the base; the second driving device is arranged on the transmission device; and the gear is connected with the power output end of the second driving device and is meshed with the rack.

In this solution, a power mechanism is defined for driving the transmission means in a movement relative to the guide, which power mechanism comprises a base, a rack, a second drive means and a gear. The base is a positioning support structure of the carrier plate transmission device and is used for bearing and positioning the guide rail. The rack is arranged on the base, and the extending direction of the rack is consistent with the extending direction of the guide rail. The second driving device is arranged on the transmission device, the power output end of the second driving device is connected with the gear, the second driving device drives the gear to rotate, and after assembly is completed, the gear is meshed with the rack. In the working process, the second driving device drives the gear to rotate, and the rotating gear moves on the rack, so that the transmission device is driven to move on the guide rail. The rack and the gear have the advantages of high matching precision and strong transmission stability, the gear and the rack structure are arranged, the working reliability of the transmission device can be improved, and the noise of the carrier plate transmission assembly is reduced.

In any one of the above technical solutions, preferably, the silicon wafer processing apparatus further includes: and two ends of the storage device are respectively connected with the input end and the guide rail, and the storage device is suitable for storing a plurality of carrier plates.

In the technical scheme, the carrier plate conveying assembly is further provided with a storage device, and the storage device is arranged between the input end and the guide rail and used for temporarily storing a plurality of carrier plates on the storage device when the silicon wafer processing assembly has a clamping plate fault. Through the arrangement of the storage device, when the clamping plate faults occur locally in the silicon wafer processing assembly, the silicon wafer processing assembly and the conveying assembly of the part without faults of the support plate continue to work, so that the support plate in the silicon wafer processing assembly is conveyed into the storage device through the guide rail. Therefore, the technical problem that the silicon wafer processing assembly can only be stopped for maintenance when the clamping plate fails is solved, the silicon wafer processing assembly can continue to work within a certain time when the clamping plate fails, buffer time is provided for maintenance personnel, and then production efficiency is improved, and loss caused by the clamping plate failure is reduced.

In any of the above technical solutions, preferably, the storage device includes: the two ends of the rack are respectively connected with the input end and the guide rail; the bracket is arranged on the rack; the sliding rail is arranged on the bracket; the lifting plate is connected with the slide rail, a plurality of positioning parts are arranged on the lifting plate, and the positioning parts are suitable for positioning the carrier plate; and the third driving device is arranged on the support and is connected with the lifting plate, and the third driving device drives the lifting plate to ascend or descend along the sliding rail relative to the rack.

In this technical solution, the structure of the storage device is specifically defined. The storage device comprises a rack, a support, a sliding rail, a lifting plate and a third driving device. The rack is a positioning and supporting structure of the storage device and is used for supporting and positioning other structures on the storage device. The support sets up in the frame for the location installation slide rail, the slide rail extends towards vertical direction. The lifting plate is used for clamping and carrying the carrier plate, and a plurality of positioning parts arranged on the lifting plate can position the carrier plates on the lifting plate, wherein the positioning parts are distributed on the lifting plate along the vertical direction. The third driving device is arranged on the support and connected with the lifting plate and used for driving the lifting plate to move on the sliding rail. In the working process, the carrier plate is conveyed to the second carrier plate by the guide rail and is fixed by the positioning part on the lifting plate, then the third driving device drives the lifting plate to ascend so as to lift the carrier plate, and after a subsequent carrier plate enters the storage device, the subsequent carrier plate is positioned on the positioning part below the positioning part for fixing the previous carrier plate, so that a plurality of carrier plates are stacked in the storage device. And then the buffer memory of support plate is realized, and the silicon chip processing equipment is prevented from stopping after the cardboard failure occurs.

In any one of the above technical solutions, preferably, the storage device further includes: the bearing block is arranged on the frame; the wheel shaft penetrates through the bearing seat, and two ends of the wheel shaft are respectively connected with the roller and the belt wheel; the fourth driving device is arranged on the rack; the second driving wheel is connected with the fourth driving device, and the fourth driving device drives the second driving wheel to rotate; the belt is sleeved on the second driving wheel and the belt wheel.

In the technical scheme, a power mechanism used for driving the carrier plate to horizontally move on the storage device is specifically limited, and the power mechanism comprises a bearing seat, a wheel shaft, a roller, a belt wheel, a second driving wheel and a fourth driving device. The wheel shaft is fixed on the frame through a bearing seat, the two ends of the wheel shaft are respectively connected with the roller and the belt wheel, and the second driving wheel is connected with the belt wheel through a belt. In the working process, the fourth driving device drives the second driving wheel to rotate, the belt transmits the rotation trend to the belt wheel so as to drive the wheel shaft and the roller wheel to synchronously rotate, and the rotating roller wheel drives the support plate to horizontally move on the storage device through friction. Through the structure, the storage device can have the capability of actively loading and unloading the carrier plate, so that the probability of clamping plates of the carrier plate on the storage device is reduced on the basis of improving the transmission accuracy of the carrier plate, and the reliability and the stability of the silicon wafer processing equipment are improved.

In any of the above technical solutions, preferably, the transmission device is provided with an air inlet communicated with the cavity, and the silicon wafer processing apparatus further includes: the pipeline is connected with the transmission device and communicated with the air inlet; the pump body is connected with the pipeline and pumps clean and dry compressed air or nitrogen into the cavity through the pipeline.

In the technical scheme, the transmission device is also provided with an air inlet communicated with the cavity, and the silicon wafer processing equipment is also provided with a pipeline and a pump body. Under the action of the pump body, dry and clean air is transmitted to the cavity through the pipeline, so that the cavity is kept clean, and impurities in the air are prevented from polluting the carrier plate. Thereby further reducing the possibility of pollution of the carrier plate and improving the quality of the finished silicon wafer.

In any of the above technical solutions, preferably, the silicon wafer processing module includes: a first carrier plate lifter; a second carrier lift; and two ends of the process box are respectively connected with the first support plate lifter and the second support plate lifter, and the process box is suitable for processing silicon wafers.

In the technical scheme, the structure of the silicon wafer processing assembly is further limited. The silicon wafer processing assembly comprises a first carrier plate lifter, a second carrier plate lifter and a process box. The two ends of the process box are respectively connected with a first support plate lifter and a second support plate lifter, the first support plate lifter is an input end of the silicon wafer processing assembly, and the second support plate lifter is an output end of the support plate processing assembly. The first carrier plate lifter is used for receiving the carrier plate on the transmission device and lifting the carrier plate to the height corresponding to the process box for a new round of processing cycle.

In any of the above technical solutions, preferably, the cover body is provided with an observation window through which light can penetrate; the outer surface of the cover body is provided with a handle.

In the technical scheme, the cover body is provided with an observation window which can be penetrated by light, and the outer surface of the cover body is provided with a handle. Through set up the observation window on the cover body, make the user can see through the condition in the observation window observes transmission device to observe the trouble condition when cardboard or other trouble appear. The handle is arranged on the outer surface of the cover body, so that the handle can be conveniently disassembled and assembled, and the cover body can be conveyed in a hanging mode when the handle is disassembled and assembled.

Additional aspects and advantages of the invention will be set forth in part in the description which follows, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 shows a schematic structural view of a silicon wafer processing apparatus according to an embodiment of the present invention;

fig. 2 shows a schematic structural diagram of a transmission device and a storage device according to an embodiment of the present invention;

fig. 3 shows a schematic structural diagram of a transmission device according to an embodiment of the present invention;

FIG. 4 shows a close-up view of the transfer device of the embodiment of FIG. 3 at A;

fig. 5 shows a bottom view of a transfer device according to an embodiment of the invention;

fig. 6 shows a schematic structural diagram of a storage device according to an embodiment of the present invention;

FIG. 7 shows a close-up view of the transfer device of the embodiment of FIG. 6 at B;

fig. 8 shows a schematic structural diagram of a storage device according to another embodiment of the present invention.

Wherein, the correspondence between the reference numbers and the component names in fig. 1 to 8 is:

1 silicon wafer processing equipment, 10 silicon wafer processing components, 12 first carrier plate elevators, 14 second carrier plate elevators, 16 process boxes, 20 carrier plate conveying components, 22 guide rails, 24 transmission devices, 241 first driving devices, 242 first substrates, 244 covers, 245 observation windows, 246 first driving wheels, 247 handles, 248 conveyor belts, 25 gears, 26 bases, 28 racks, 27 second driving devices, 29 storage devices, 290 racks, 291 supports, 292 sliding rails, 293 lifting plates, 294 positioning portions, 295 bearing seats, 296 rollers, 297 pulleys, 298 fourth driving devices, 299 second driving wheels, 230 belts and 231 third driving devices.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention more clearly understood, the present invention will be described in further detail with reference to the accompanying drawings and detailed description. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.

A silicon wafer processing apparatus according to some embodiments of the present invention is described below with reference to fig. 1 to 8.

In view of this, according to an embodiment of the present invention, as shown in fig. 1 and 3, there is provided a silicon wafer processing apparatus 1, the silicon wafer processing apparatus 1 including: the silicon chip processing assembly 10 is provided with an input end and an output end, wherein the input end is suitable for receiving a support plate, and the output end is suitable for outputting the support plate; carrier plate transfer assembly 20, carrier plate transfer assembly 20 includes: the two ends of the guide rail 22 are respectively connected with the input end and the output end; the conveying device 24 is arranged on the guide rail 22, the conveying device 24 can move along the guide rail 22, and a cavity is arranged on the conveying device 24; after the carrier plate output from the output end is stored in the cavity, the carrier plate is conveyed to the input end through the conveying device 24.

In the embodiment, a silicon wafer processing device 1 is defined, which is used for performing film coating processing on the surface of a silicon wafer, wherein in the processing process, the silicon wafer is placed on a support plate, and the support plate is used as a carrier for carrying the silicon wafer to complete the process processing. The silicon wafer processing apparatus 1 includes a silicon wafer processing module 10 and a carrier plate transfer module 20. The silicon wafer processing assembly 10 is a process processing device, the silicon wafer completes film coating treatment inside the silicon wafer processing assembly 10, wherein an input end and an output end are arranged on the silicon wafer processing assembly 10, a carrier plate for placing the silicon wafer to be processed enters the silicon wafer processing assembly 10 from the input end to complete processing, and after the processing is completed, the carrier plate bears a finished product silicon wafer and is transmitted out of the silicon wafer processing assembly 10 from the output end. The carrier plate conveying assembly 20 is a carrier plate return device in the silicon wafer processing apparatus 1, and is configured to return the carrier plate transmitted from the output end to the input end, so as to complete carrier plate circulation in combination with the silicon wafer processing assembly 10. The carrier plate conveying assembly 20 comprises a guide rail 22 and a conveying device, wherein two ends of the guide rail 22 are respectively connected with an input end and an output end of the silicon wafer processing assembly 10, the conveying device is arranged on the guide rail 22 and is matched and connected with the guide rail 22, and after the silicon wafers on the carrier plate transmitted by the output end are taken out, the conveying device 24 receives the carrier plate and conveys the carrier plate to the output end along the guide rail 22. Wherein, the transmission device 24 is provided with a cavity, and the carrier plate transmitted from the output end is received by the transmission device 24 and then stored in the cavity.

By arranging the carrier plate conveying assembly 20 consisting of the guide rail 22 and the transmission device 24, the belt 230 conveyor is eliminated, so that the structure of the silicon wafer processing equipment 1 is simplified, and the space occupied by the carrier plate conveying assembly 20 is reduced. On the other hand, the carrier plate conveying assembly 20 composed of the guide rail 22 and the conveying device 24 is easy to disassemble and assemble, has low maintenance difficulty, and is convenient for a user to operate when parts are overhauled and replaced. In addition, the power device on the conventional belt 230 conveyor easily interferes with the belt 230 and the carrier plate in the working process, and the problem of clamping plates is easily caused. Through setting up the cavity on conveyer, can follow the structure of further retrenching silicon chip treatment facility 1 on the seal structure, set up sealed cavity on conveyer and can remove from setting up large-area sealing device in the extension region of whole support plate conveying subassembly 20, reduce silicon chip treatment facility 1 occupation space on the one hand, on the other hand has reduced manufacturing cost. Further, the structure of the silicon wafer processing equipment 1 is optimized, the space occupied by the silicon wafer processing equipment 1 is reduced, the maintenance difficulty and the failure rate of the carrier plate conveying assembly 20 are reduced, and the technical effect of the use experience of a user is improved.

In an embodiment of the present invention, preferably, as shown in fig. 3, the transmission device 24 includes: a first substrate 242, the first substrate 242 being connected to the guide rail 22, the first substrate 242 being movable along the guide rail 22; a cover 244 fastened to the first substrate 242, the cover 244 connected to the first substrate 242, the cover 244 having a carrier inlet and a carrier outlet; a first door body connected to the cover 244, the first door body being capable of opening or closing the carrier inlet; and a second door body connected to the cover 244 and capable of opening or closing the carrier outlet.

In this embodiment, the structure of the transfer device 24 is specifically defined, and the transfer device 24 includes a first substrate 242, a cover 244, a first door, and a second door. The first base plate 242 is a main structure of the conveying device 24 and is used for positioning and supporting other structures on the conveying device 24, and the first base plate 242 is cooperatively connected with the guide rail 22 so that the first base plate 242 moves in the extending direction of the guide rail 22. The cover 244 is fastened on the first substrate 242 and connected to the first substrate 242, the first substrate 242 and the cover 244 enclose a cavity, wherein a carrier inlet and a carrier outlet are disposed on the cover 244, and the carrier inlet and the carrier outlet are disposed at two ends of the cover 244 opposite to each other. The first door body is connected to the cover 244 for opening or closing the carrier inlet, and the second door body is connected to the cover 244 for opening or closing the carrier outlet. In the working process, when the transmission device 24 is connected with the output end, the first door body is controlled to open the carrier plate inlet, the carrier plate is transmitted from the output end to the inside of the cavity on the transmission device 24, the first door body is controlled to close the carrier plate inlet, when the transmission device 24 moves to the preset position through the guide rail 22 and is connected with the input end, the second door body is controlled to open the carrier plate outlet, and the carrier plate enters the input end through the carrier plate outlet. Through setting up the cover body 244, the first door body and the second door body make first base plate 242 and cover body 244 enclose out the cavity that is used for placing the support plate, and further control the switch of cavity through the first door body and the second door body, thereby make the support plate can keep in clean environment at the passback in-process, avoid the support plate to be contaminated by the impurity in the air in each structure conveying and transportation process, and then realize the reliability of optimizing transmission device 24, promote the support plate cleanliness factor, ensure silicon chip processing effect, promote the technological effect of finished product silicon chip quality.

Specifically, the first door body and the second door body are movably connected to the cover body 244, a driving cylinder is disposed on the cover body 244 or the first substrate 242, and a moving end of the driving cylinder is connected to the first door body or the second door body, so that the driving cylinder drives the first door body and the second door body to move relative to the cover body 244 to open or close the carrier plate inlet and the carrier plate outlet.

In an embodiment of the present invention, preferably, as shown in fig. 3 and 4, the transmission device 24 further includes: a driven wheel rotatably connected to the first base plate 242; a first driving device 241 disposed on the first substrate 242; the first driving wheel 246 is connected with the first driving device 241, and the first driving device 241 drives the first driving wheel 246 to rotate; the transmission belt 248 is sleeved on the first driving wheel 246 and the driven wheel.

In this embodiment, the structure of the transfer device 24 is further defined, and the transfer device 24 is further provided with a driven wheel, a first driving device 241, a first driving wheel 246 and a transmission belt 248. Driven pulley and first drive pulley 246 are rotatably coupled to first base plate 242, preferably via bearing housing 295. The first driving device 241 is disposed on the first base plate 242, and a power output end of the first driving device 241 is connected to the first driving wheel 246 to drive the first driving wheel 246 to rotate through the first driving device 241, the transmission belt 248 is sleeved on the first driving wheel 246 and the driven wheel to transmit power, so as to drive the driven wheel to rotate along with the first driving wheel 246, and the belt 230 can drive the carrier plate to move through friction, so as to realize the transmission and the transmission of the carrier plate. Through setting up above-mentioned structure can construct the power structure that drives the relative transmission device 24 motion of carrier plate on transmission device 24 to make transmission device 24 possess the ability of initiatively loading the carrier plate, compare in receiving the carrier plate passively and setting up the scheme that the outer structure snatched the carrier plate, this structure has promoted the loading accuracy when promoting loading efficiency, reduces the cardboard probability when promoting production efficiency.

In this embodiment, the transmission device 24 is further provided with a coupler and a belt driving shaft, the first driving wheels 246 on two sides of the first substrate 242 are respectively connected with the coupler through the belt driving shaft, and after the first driving device 241 drives any one belt driving shaft to rotate, the coupler transmits power to other belt driving shafts to realize synchronous rotation, thereby ensuring the stability and stability of carrier plate transmission and avoiding the carrier plate being stuck due to the deviation of carrier plate transmission.

In an embodiment of the present invention, preferably, as shown in fig. 5, the carrier plate transfer assembly 20 further includes: a base 26, the guide rail 22 is arranged on the base 26; a rack 28 disposed on the base 26; a second driving device 27 disposed on the transfer device 24; and a gear 25 connected with the power output end of the second driving device 27, wherein the gear 25 is meshed with the rack 28.

In this embodiment, a power mechanism is defined for driving the transfer device 24 in motion relative to the guide 22, which power mechanism comprises a base 26, a rack 28, a second drive device 27 and a gear wheel 25. The base 26 is a positioning support structure of the carrier transport device 24 for carrying and positioning the guide rails 22. The rack 28 is provided on the base 26, and the extending direction of the rack 28 coincides with the extending direction of the guide rail 22. The second driving device 27 is arranged on the transmission device 24, the power output end of the second driving device 27 is connected with the gear 25, the second driving device 27 drives the gear 25 to rotate, and after assembly is completed, the gear 25 is meshed with the rack 28. In operation, the second drive means 27 drives the gear wheel 25 in rotation, and the rotating gear wheel 25 moves on the gear rack 28, thereby moving the transport device 24 on the guide rail 22. The rack 28 and the gear 25 have the advantages of high matching precision and strong transmission stability, and the arrangement of the gear 25 and the rack 28 can improve the working reliability of the transmission device 24 and reduce the noise of the carrier plate transmission assembly 20.

In an embodiment of the present invention, preferably, as shown in fig. 2 and 6, the silicon wafer processing apparatus 1 further includes: and a storage device 29, wherein two ends of the storage device 29 are respectively connected with the input end and the guide rail 22, and the storage device 29 is suitable for storing a plurality of carrier plates.

In this embodiment, a storage device 29 is further disposed on the carrier plate conveying assembly 20, and the storage device 29 is disposed between the input end and the guide rail 22 for temporarily storing a plurality of carrier plates on the storage device 29 when the silicon wafer processing assembly 10 has a card failure. By arranging the storage device 29, when the chuck plate in the silicon wafer processing assembly 10 is partially failed, the silicon wafer processing assembly 10 and the conveying assembly of the part without the fault of the support plate continue to work, so that the support plate in the silicon wafer processing assembly 10 is conveyed into the storage device 29 through the guide rail 22. Therefore, the technical problem that the silicon wafer processing assembly 10 can only be stopped for maintenance when the clamping plate fails is solved, the silicon wafer processing assembly can continue to work within a certain time when the clamping plate fails, buffering time is provided for maintenance personnel, and then production efficiency is improved, and loss caused by the clamping plate failure is reduced.

In an embodiment of the present invention, preferably, as shown in fig. 6 and 8, the storage device 29 includes: a frame 290, wherein both ends of the frame 290 are respectively connected with the input end and the guide rail 22; a mount 291 disposed on the frame 290; a slide rail 292 disposed on the holder 291; the lifting plate 293 is connected with the slide rail 292, a plurality of positioning parts 294 are arranged on the lifting plate 293, and the positioning parts 294 are suitable for positioning the carrier plate; the third driving device 231 is disposed on the support 291, the third driving device 231 is connected to the lifting plate 293, and the third driving device 231 drives the lifting plate 293 to move up or down along the slide rail 292 relative to the frame 290.

In this embodiment, the structure of the storage device 29 is specifically defined. The storage device 29 includes a frame 290, a holder 291, a rail 292, a lift plate 293, and a third driving device 231. Frame 290 is a positioning support structure for storage device 29 and is used to support other structures on positioning storage device 29. The bracket 291 is disposed on the frame 290 for positioning and mounting the slide rail 292, and the slide rail 292 extends in a vertical direction. The lifting plate 293 is used for clamping and carrying a carrier plate, and a plurality of positioning portions 294 provided on the lifting plate 293 can position a plurality of carrier plates on the lifting plate 293, wherein the plurality of positioning portions 294 are distributed on the lifting plate 293 in a vertical direction. The third driving device 231 is disposed on the support 291, and the third driving device 231 is connected to the lifting plate 293 for driving the lifting plate 293 to move on the slide rail 292. In operation, a carrier is transferred onto a second carrier by the guide rail 22 and fixed by the positioning portion 294 on the lifting plate 293, then the lifting plate 293 is driven by the third driving device 231 to lift the carrier, and after a subsequent carrier enters the storage device 29, the subsequent carrier is positioned on the positioning portion 294 below the positioning portion 294 fixing the previous carrier, so that a plurality of carriers are stacked in the storage device 29. And then the buffer memory of the support plate is realized, and the silicon chip processing equipment 1 is prevented from stopping after the failure of the clamping plate occurs.

In an embodiment of the present invention, preferably, as shown in fig. 6 and 7, the storage device 29 further includes: bearing housing 295 disposed on housing 290; the wheel shaft penetrates through the bearing block 295, and the two ends of the wheel shaft are respectively connected with a roller 296 and a belt wheel 297; a fourth driving device 298 disposed on the rack 290; the second driving wheel 299 is connected with a fourth driving device 298, and the fourth driving device 298 drives the second driving wheel 299 to rotate; the belt 230, the belt 230 is sleeved on the second driving wheel 299 and the belt wheel 297.

In this embodiment, a power mechanism for driving the carrier plate to move horizontally on the storage device 29 is specifically defined, and the power mechanism includes a bearing seat 295, an axle, a roller 296, a pulley 297, a second driving pulley 299 and a fourth driving device 298. The axle is fixed to the frame 290 by bearing housing 295, the two ends of the axle are connected to the roller 296 and the pulley 297 respectively, and the secondary drive pulley 299 is connected to the pulley 297 by the belt 230. In operation, the fourth driving device 298 drives the second driving wheel 299 to rotate, the belt 230 transmits the rotation tendency to the belt wheel 297 to drive the wheel shaft and the roller 296 to rotate synchronously, and the rotating roller 296 drives the carrier plate to move horizontally on the storage device 29 by friction. By adopting the structure, the storage device 29 has the capability of actively loading and unloading the carrier plate, so that the probability of the carrier plate being clamped on the storage device 29 is reduced on the basis of improving the transmission accuracy of the carrier plate, and the reliability and the stability of the silicon wafer processing equipment 1 are improved.

In an embodiment of the present invention, preferably, the transmission device 24 is provided with an air inlet communicated with the cavity, and the silicon wafer processing apparatus 1 further includes a pipeline connected with the transmission device 24 and communicated with the air inlet; the pump body is connected with the pipeline and pumps clean and dry compressed air or nitrogen into the cavity through the pipeline.

In this embodiment, the transmission device 24 is further provided with an air inlet communicated with the cavity, and the silicon wafer processing equipment 1 is further provided with a pipeline and a pump body. Under the action of the pump body, clean air is transmitted to the cavity through the pipeline, so that the cavity is kept clean, and impurities in the air are prevented from polluting the carrier plate. Thereby further reducing the possibility of pollution of the carrier plate and improving the quality of the finished silicon wafer.

In an embodiment of the present invention, preferably, as shown in fig. 1, the silicon wafer processing assembly 10 includes: a first carrier lift 12; a second carrier lift 14; and a process box 16, wherein two ends of the process box 16 are respectively connected with the first carrier plate lifter 12 and the second carrier plate lifter 14, and the process box 16 is suitable for processing silicon wafers.

In this embodiment, the structure of the silicon wafer processing assembly 10 is further defined. The silicon wafer processing assembly 10 includes a first carrier lift 12, a second carrier lift 14, and a process box 16. The two ends of the process box 16 are respectively connected with a first carrier plate lifter 12 and a second carrier plate lifter 14, the first carrier plate lifter 12 constitutes an input end of the silicon wafer processing assembly 10, and the second carrier plate lifter 14 constitutes an output end of the carrier plate processing assembly. The process chamber is used for processing silicon wafers, the second carrier plate lifter 14 is used for lowering the carrier plate output by the process chamber to a height corresponding to the carrier plate transmission assembly and transmitting the carrier plate to the conveying device, and the first carrier plate lifter 12 is used for receiving the carrier plate on the transmission device 24 and lifting the carrier plate to a height corresponding to the process box 16 for a new round of processing cycle.

In one embodiment of the present invention, preferably, as shown in fig. 3, the cover 244 is provided with a viewing window 245, and light can penetrate through the viewing window 245; a handle 247 is provided on the outer surface of the housing 244.

In this embodiment, the housing 244 is provided with a light-transmissive viewing window 245, and the housing 244 is provided with a handle 247 on its outer surface. By providing the viewing window 245 in the cover 244, a user may view the conditions within the transmission 24 through the viewing window 245 to observe a malfunction condition when a card or other malfunction occurs. By providing the handle 247 on the outer surface of the cover 244, the handle 247 can be easily attached and detached, and when the handle 247 is attached and detached, the cover 244 can be transported by hanging.

In the description of the present invention, the terms "plurality" or "a plurality" refer to two or more, and unless otherwise specifically defined, the terms "upper" and "lower" and the like indicate orientations or positional relationships based on the drawings, which are merely for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention; the terms "connected," "mounted," "secured," and the like are to be construed broadly and include, for example, fixed connections, removable connections, or integral connections; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the description of the present invention, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In the present disclosure, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (11)

1. An apparatus for processing a silicon wafer, comprising:

the silicon chip processing assembly is provided with an input end and an output end, the input end is suitable for receiving a support plate, and the output end is suitable for outputting the support plate;

a carrier plate transfer assembly, the carrier plate transfer assembly comprising:

the two ends of the guide rail are respectively connected with the input end and the output end;

the transmission device is arranged on the guide rail and can move along the guide rail, and a cavity is arranged on the transmission device;

and after the carrier plate output by the output end is stored in the cavity, the carrier plate is conveyed to the input end by the conveying device.

2. The silicon wafer processing apparatus as set forth in claim 1, wherein the transport means comprises:

the first base plate is connected with the guide rail and can move along the guide rail;

the cover body is buckled on the first substrate and connected with the first substrate, and a carrier plate inlet and a carrier plate outlet are formed in the cover body;

the first door body is connected with the cover body and can open or close the carrier plate inlet;

and the second door body is connected with the cover body, and the second door body can open or close the carrier plate outlet.

3. The silicon wafer processing apparatus as set forth in claim 2, wherein the transport means further comprises:

the driven wheel is rotationally connected with the first substrate;

the first driving device is arranged on the first substrate;

the first driving wheel is connected with the first driving device, and the first driving device drives the first driving wheel to rotate;

and the conveying belt is sleeved on the first driving wheel and the driven wheel.

4. The silicon wafer processing apparatus of claim 1, wherein the carrier plate transfer assembly further comprises:

the guide rail is arranged on the base;

the rack is arranged on the base;

the second driving device is arranged on the transmission device;

and the gear is connected with the power output end of the second driving device and is meshed with the rack.

5. The silicon wafer processing apparatus as set forth in claim 1, further comprising:

and two ends of the storage device are respectively connected with the input end and the guide rail, and the storage device is suitable for storing a plurality of carrier plates.

6. The silicon wafer processing apparatus as set forth in claim 5, wherein the storage means comprises:

the two ends of the rack are respectively connected with the input end and the guide rail;

the bracket is arranged on the rack;

the sliding rail is arranged on the bracket;

the lifting plate is connected with the slide rail, a plurality of positioning parts are arranged on the lifting plate, and the positioning parts are suitable for positioning the carrier plate;

and the third driving device is arranged on the support and is connected with the lifting plate, and the third driving device drives the lifting plate to ascend or descend along the slide rail relative to the rack.

7. The silicon wafer processing apparatus as set forth in claim 6, wherein the storage means further comprises:

the bearing block is arranged on the rack;

the wheel shaft penetrates through the bearing seat, and two ends of the wheel shaft are respectively connected with a roller and a belt wheel;

the fourth driving device is arranged on the rack;

the second driving wheel is connected with the fourth driving device, and the fourth driving device drives the second driving wheel to rotate;

the belt is sleeved on the second driving wheel and the belt wheel.

8. The silicon wafer processing apparatus according to any one of claims 1 to 7, wherein the transfer device is provided with an inlet port communicating with the chamber, the silicon wafer processing apparatus further comprising:

the pipeline is connected with the transmission device and communicated with the air inlet;

the pump body is connected with the pipeline and pumps clean and dry compressed air or nitrogen into the cavity through the pipeline.

9. The silicon wafer processing apparatus as claimed in any one of claims 1 to 7, wherein the silicon wafer processing module comprises:

a first carrier plate lifter;

a second carrier lift;

and two ends of the process box are respectively connected with the first carrier plate lifter and the second carrier plate lifter, and the process box is suitable for processing silicon wafers.

10. The silicon wafer processing apparatus as set forth in claim 2 or 3, wherein the cover body is provided with an observation window through which light can pass;

the outer surface of the cover body is provided with a handle.

11. The silicon wafer processing apparatus according to any one of claims 4 to 7, wherein the transport means comprises:

the first base plate is connected with the guide rail and can move along the guide rail;

the cover body is buckled on the first substrate and connected with the first substrate, and a carrier plate inlet and a carrier plate outlet are formed in the cover body;

the cover body is provided with an observation window through which light can penetrate;

the outer surface of the cover body is provided with a handle.

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