CN213798826U - High environmental tolerance film thermal printhead is with base plate that generates heat - Google Patents
High environmental tolerance film thermal printhead is with base plate that generates heat Download PDFInfo
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- CN213798826U CN213798826U CN202022666636.3U CN202022666636U CN213798826U CN 213798826 U CN213798826 U CN 213798826U CN 202022666636 U CN202022666636 U CN 202022666636U CN 213798826 U CN213798826 U CN 213798826U
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Abstract
The utility model belongs to the technical field of the thermal print head makes, especially, relate to a high environmental tolerance film thermal print head is with base plate that generates heat, this film thermal print head includes with the base plate that generates heat: the insulation substrate, the heat storage glaze coating, the heating resistor layer, the first electrode lead layer, the second electrode lead layer, the first protective layer, the organic silicon coating and the second protective layer are arranged in a superposed manner; wherein, the material of the first electrode lead layer is aluminum, and a first opening part is formed on the first electrode lead layer; the material of the second electrode lead layer is tungsten-titanium alloy, a second opening part is formed on the second electrode lead layer, and the area of the heating resistor layer clamped by the second opening part forms a heating resistor; the organic silicon coating is provided with a third opening part, and the opening width of the third opening part is smaller than that of the first opening part and larger than that of the second opening part. The utility model provides a film thermal printer head is with base plate that generates heat can use in the humid environment of high temperature for a long time, has good environment tolerance.
Description
Technical Field
The utility model belongs to the technical field of the thermal print head makes, especially, relate to a high environmental tolerance film thermal print head is with base plate that generates heat.
Background
Thermal printheads are constructed from a row of heating elements having the same resistance, arranged very closely. When a current is passed through the components, the components rapidly develop high temperatures, and when the dielectric coating encounters these components, the temperature also rapidly increases, whereupon the dielectric coating chemically reacts and colors and patterns appear. The quality of the heat-generating substrate, which is used as a core component of the thermal print head, directly affects the working performance and product quality of the thermal print head.
The thin film technology has the advantages of good line resolution, finer line definition, better wire bonding property, homogeneous materials, higher requirement on plating solution purity and the like, is one of the processes adopted for preparing the heating substrate for the thermal printing head at present, and the specific process route of the thin film technology substantially comprises the following steps: firstly, coating a layer of resistance material on the surface of the ceramic circuit board provided with the glaze coating in a sputtering or chemical vapor coating mode; then plating a layer of conductor material, usually aluminum; etching an electrode lead structure on the conductor material layer, wherein the electrode lead structure is provided with a notch at a position corresponding to the glaze coating, and a resistance material area clamped by the notch forms a heating part for generating joule heat; finally, the heating part and the electrode part are covered with ceramic material protective layers with the functions of wear resistance and corrosion resistance.
However, the process level of the existing film technology is limited, the ceramic material protective layer is easy to have structural defects such as holes, and the like, so that the aluminum electrode structure of the heating substrate is easy to corrode, and the thermal printing head is caused to lose efficacy, and the problem is particularly obvious in a high-temperature and humid environment.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model aims at providing a high environmental tolerance film thermal printhead is with base plate that generates heat, the utility model provides a film thermal printhead is with base plate that generates heat can use in the humid environment of high temperature for a long time, has good environmental tolerance.
The utility model provides a high environmental tolerance film temperature sensing beats printer head with base plate that generates heat, include:
an insulating substrate;
the heat storage glaze coating is arranged on the surface of the insulating substrate;
the heating resistor layer is arranged on the surface of the heat storage glaze coating layer and the surface of the insulating substrate in a region where the heat storage glaze coating layer is not arranged;
the first electrode lead layer is arranged on the surface of the heating resistor body and consists of a first electrode lead, and the first electrode lead comprises a bonding electrode pattern; a first opening is formed in the first electrode lead layer at a position corresponding to the heat storage glaze coating, and the first electrode lead layer is made of aluminum;
the second electrode lead layer is arranged on the heating resistor layer and the surface of the first lead layer and consists of a second electrode lead; a second opening is formed in the second electrode lead layer at a position corresponding to the heat storage glaze coating layer, a region of the heating resistor layer sandwiched by the second opening forms a heating resistor for generating joule heat, and the second electrode lead layer is made of a tungsten-titanium alloy;
a first protective layer covering the heating resistor body, the first electrode wire not including a bonding electrode pattern region and the second electrode wire;
the organic silicon coating is arranged on the surface of the first protection layer, a third opening part is formed on the organic silicon coating at a position corresponding to the heat storage glaze coating, and the opening width of the third opening part is smaller than that of the first opening part and larger than that of the second opening part;
and the second protective layer is arranged on the surface of the organic silicon coating and covers the third opening part.
Preferably, the heating substrate for the high-environmental-tolerance thin-film thermal printing head further comprises an organic resin coating; the organic resin coating is arranged on a partial area of the surface layer of the heating substrate for the thin-film thermal printing head and is used for performing supplementary protection on the electrode lead.
Preferably, the thickness of the organic silicon coating is 0.1-10 μm.
Preferably, the material of the first protective layer is silicon nitride, silicon oxide or a silicon nitride-silicon oxide composite material.
Preferably, the thickness of the first protective layer is 0.2-10 μm.
Preferably, the material of the second protective layer is silicon nitride, silicon oxide or a silicon nitride-silicon oxide composite material.
Preferably, the thickness of the second protective layer is 0.01 to 10 μm.
Preferably, the material of the heating resistor layer is cermet.
Compared with the prior art, the utility model provides a high environmental tolerance film temperature sensing beats printer head with base plate that generates heat. The utility model provides a film thermal printer head is with base plate that generates heat includes: an insulating substrate; the heat storage glaze coating is arranged on the surface of the insulating substrate; the heating resistor layer is arranged on the surface of the heat storage glaze coating layer and the surface of the insulating substrate in a region where the heat storage glaze coating layer is not arranged; the first electrode lead layer is arranged on the surface of the heating resistor body and consists of a first electrode lead, and the first electrode lead comprises a bonding electrode pattern; a first opening is formed in the first electrode lead layer at a position corresponding to the heat storage glaze coating, and the first electrode lead layer is made of aluminum; the second electrode lead layer is arranged on the heating resistor layer and the surface of the first lead layer and consists of a second electrode lead; a second opening is formed in the second electrode lead layer at a position corresponding to the heat storage glaze coating layer, a region of the heating resistor layer sandwiched by the second opening forms a heating resistor for generating joule heat, and the second electrode lead layer is made of a tungsten-titanium alloy; a first protective layer covering the heating resistor body, the first electrode wire not including a bonding electrode pattern region and the second electrode wire; the organic silicon coating is arranged on the surface of the first protection layer, a third opening part is formed on the organic silicon coating at a position corresponding to the heat storage glaze coating, and the opening width of the third opening part is smaller than that of the first opening part and larger than that of the second opening part; and the second protective layer is arranged on the surface of the organic silicon coating and covers the third opening part. The utility model discloses the structure of film is the heating substrate for the thermal print head has carried out the optimal design, sets up the organic silicon coating between first protective layer and second protective layer, on the one hand, the setting of organic silicon coating can be fine separation air and steam, avoids the corruption of electrode structure; on the other hand, before the second protective layer is abraded and damaged, the problem that the protective effect is influenced due to the fact that the organic silicon coating is abraded and removed does not exist, and therefore the service life of the heating substrate for the thin-film thermal printing head in a high-temperature and humid environment is prolonged. And simultaneously, the utility model discloses an electrode wire and the opening of design electrode wire and organosilicon coating that adopt different materials, both guaranteed that the easy aluminium electrode wire region that is corroded can cover the organosilicon coating, avoided the organosilicon coating again in the heating resistor body that is difficult to be destroyed by the corruption and the extra cover in tungsten titanium electrode wire place region to avoided because the organosilicon coating that near heating region high temperature leads to is heated and is decomposed, the problem that the outside protective layer was peeled off, the job stabilization nature and the life of the base plate that generates heat have further been improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic cross-sectional structure view of a heat-generating substrate for a thin-film thermal printhead with high environmental tolerance according to an embodiment of the present invention;
FIG. 2 is a schematic plan view of a heat-generating substrate for a thin film thermal printhead with high environmental tolerance according to an embodiment of the present invention before a first protective layer is applied;
fig. 3 is a perspective plan view of a heat-generating substrate silicone coating for a high environmental tolerance thin-film thermal printhead according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides a high environmental tolerance film temperature sensing beats printer head with base plate that generates heat, include:
an insulating substrate;
the heat storage glaze coating is arranged on the surface of the insulating substrate;
the heating resistor layer is arranged on the surface of the heat storage glaze coating layer and the surface of the insulating substrate in a region where the heat storage glaze coating layer is not arranged;
the first electrode lead layer is arranged on the surface of the heating resistor body and consists of a first electrode lead, and the first electrode lead comprises a bonding electrode pattern; a first opening is formed in the first electrode lead layer at a position corresponding to the heat storage glaze coating, and the first electrode lead layer is made of aluminum;
the second electrode lead layer is arranged on the heating resistor layer and the surface of the first lead layer and consists of a second electrode lead; a second opening is formed in the second electrode lead layer at a position corresponding to the heat storage glaze coating layer, a region of the heating resistor layer sandwiched by the second opening forms a heating resistor for generating joule heat, and the second electrode lead layer is made of a tungsten-titanium alloy;
a first protective layer covering the heating resistor body, the first electrode wire not including a bonding electrode pattern region and the second electrode wire;
the organic silicon coating is arranged on the surface of the first protection layer, a third opening part is formed on the organic silicon coating at a position corresponding to the heat storage glaze coating, and the opening width of the third opening part is smaller than that of the first opening part and larger than that of the second opening part;
and the second protective layer is arranged on the surface of the organic silicon coating and covers the third opening part.
Referring to fig. 1, fig. 1 is a schematic cross-sectional structure diagram of a heat-generating substrate for a high environmental tolerance thin film thermal printhead provided by an embodiment of the present invention, fig. 2 is a schematic plan view of a state before a first protective layer of a heat-generating substrate for a high environmental tolerance thin film thermal printhead provided by an embodiment of the present invention is implemented, and fig. 3 is a perspective plan view of a heat-generating substrate organic silicon coating for a high environmental tolerance thin film thermal printhead provided by an embodiment of the present invention. In fig. 1 to 3, 01 denotes a heat generating substrate for a thin film thermal head, 10 denotes an insulating substrate, 20 denotes a heat storage glaze layer, 30 denotes a heat generating body resistance layer, 31 denotes a heat generating resistor body, 32 denotes a heat generating resistor unit, 40 denotes a first electrode lead layer, 41 denotes a first electrode lead, 41a denotes an individual lead electrode, 41b denotes a common lead electrode, 41c denotes a common electrode pattern, 41d denotes a fill pattern, 41f denotes a bonding electrode pattern, 50 denotes a second electrode lead layer, 51 denotes a second electrode lead, 51a denotes an individual bridge electrode, 51b denotes a common bridge electrode, 51e denotes a serial electrode, 60 denotes a first protective layer, 70 denotes an organic silicon coating, 80 denotes a second protective layer, 90 denotes an organic resin layer, K1 denotes a 1 st opening, K2 denotes a second opening, and K3 denotes a third opening.
The utility model provides a film thermal printer head is with base plate that generates heat includes insulating substrate 10, heat accumulation glaze coating 20, heating resistor body layer 30, first electrode wire layer 40, second electrode wire layer 50, first protective layer 60, organosilicon coating 70 and second protective layer 80. The insulating substrate 10 is a substrate of a heat-generating substrate for a thin film thermal printhead, and its main component includes, but is not limited to, aluminum oxide.
In the present invention, the heat storage glaze layer 20 is provided on a part or all of the surface of the insulating substrate 10, and functions to prevent the heat generated by the heating resistor 31 from being dissipated through the insulating substrate 10 too quickly. In the present invention, the thermal storage glaze layer 20 is preferably formed by printing glass glaze slurry and then sintering.
In the present invention, the heating resistor body layer 30 is disposed on the surface of the heat storage glaze layer 20 and the surface of the insulating substrate 10 in the region where the heat storage glaze layer is not disposed, and the material thereof is preferably a cermet, including but not limited to a composite material formed of tantalum and a silica material. In the present invention, the heating resistor layer 30 is preferably formed by magnetron sputtering.
In the present invention, the first electrode lead layer 40 is provided on the surface of the heating resistor layer 30, and the first electrode lead layer 40 has the first opening K1 formed at a position corresponding to the heat storage glaze layer 20. In the present invention, the first electrode lead layer 40 is composed of the first electrode lead 41, the first electrode lead 41 includes the bonding electrode pattern 41f, preferably further includes the individual extraction electrode 41a, the common extraction electrode 41b, the common electrode pattern 41c and the filling pattern 41d, the bonding electrode pattern 41f and the common electrode pattern 41c are provided on the side of the insulating substrate 10 relatively far from the heat generating resistor body 31 in the x direction, the individual extraction electrode 41a extends in the x direction of the insulating substrate 10 and is connected to the bonding electrode pattern 41f, the common extraction electrode 41b extends in the x direction of the insulating substrate 10 and is connected to the common electrode pattern 41c, the filling pattern 41d is provided on both ends of the insulating substrate 10 in the y direction and on the side adjacent to the serial electrode 41e in the x direction, and the filling pattern 41d does not directly or indirectly include any heat generating resistor body 31 or any heat generating electrode 41e, The individual extraction electrode 41a, the common extraction electrode 41b, the bonding electrode pattern 41f and the common electrode pattern 41c are electrically connected, the filling pattern 41d can be formed by combining a plurality of patterns with regular or irregular shapes and is used for enhancing the adhesion of the protective layer in the area where the filling layer 41d is located, the common electrode pattern 41c and the common extraction electrode 41b are used for connecting an external power supply, and the bonding electrode pattern 41f and the individual extraction electrode 41a are used for connecting an external logic control signal. In the present invention, the material of the first electrode lead layer 40 is aluminum. In the present invention, the first electrode lead 41 is preferably formed by etching the first electrode lead layer 40 provided on the surface of the heating resistor layer 30.
In the present invention, the second electrode lead layer 50 is provided on the surfaces of the heating resistor layer 30 and the first lead layer 40, the second electrode lead layer 50 is formed with the second opening portion K2 at a position corresponding to the heat storage glaze layer 20, and the region of the heating resistor layer 30 sandwiched by the second opening portion K2 constitutes the heating resistor 31 for generating joule heat. In the present invention, the material of the second electrode lead layer 50 is tungsten-titanium alloy. In the present invention, the second electrode lead layer 50 is formed of the second electrode lead 51, the second electrode lead 51 includes the series electrode 51e, the individual bridge electrode 51a, and the common bridge electrode 51b, the series electrode 51e is provided on the side of the insulating substrate 10 adjacent to the heating resistor 31 in the x direction, the series electrode 51e is connected to one end of the heating resistor 31, the two adjacent heating resistors 31 are connected in series to form one heating resistor unit 32, the individual bridge electrode 51a is connected to the heating resistor 31 and the individual extraction electrode 41a on the other side of the insulating substrate 10 opposite to the series electrode 51e in the x direction, and the common bridge electrode 51a is connected to the heating resistor 31 and the common extraction electrode 41b on the other side of the insulating substrate 10 opposite to the series electrode 51e in the x direction. In the present invention, the second electrode lead 51 is preferably formed by etching the second electrode lead layer 50 covering the first opening K1.
In the present invention, the first protective layer 60 covers the heating resistor body 31, the region of the first electrode lead 41 not including the bonding electrode pattern 41f, and the second electrode lead 51, and functions to prevent the heating resistor body 31 and at least a part of the first electrode lead 41 and at least a part of the second electrode lead 51 from being damaged by mechanical damage or chemical action. In the present invention, the material of the first protective layer 60 is preferably silicon nitride, silicon oxide or a silicon nitride-silicon oxide composite material; the thickness of the first protective layer 60 is preferably 0.2 to 10 μm, and specifically may be 0.2 μm, 0.3 μm, 0.4 μm, 0.5 μm, 0.6 μm, 0.7 μm, 0.8 μm, 0.9 μm, 1 μm, 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, 5 μm, 5.5 μm, 6 μm, 6.5 μm, 7 μm, 7.5 μm, 8 μm, 8.5 μm, 9 μm, 9.5 μm, or 10 μm. In the present invention, the first protection layer 60 is preferably formed by rf magnetron sputtering.
In the present invention, the organic silicon coating layer 70 is disposed on the surface of the first protective layer 60, and serves to fill the pinhole defect that may exist in the first protective layer 60, thereby preventing ions from reaching the first electrode wire 41 and the second electrode wire 51 via the pinhole defect of the first protective layer 60, and causing the electrode wires to be damaged by chemical corrosion. In the present invention, the silicone coating 70 is formed with a third opening portion K3 at a position corresponding to the heat storage glaze coating 20, and the opening width of the third opening portion K3 is smaller than the opening width of the first opening portion K1 and is greater than the opening width of the second opening portion K2. In the present invention, the thickness of the silicone coating layer 70 is preferably 0.1 to 10 μm, and specifically may be 0.1 μm, 0.15 μm, 0.2 μm, 0.25 μm, 0.3 μm, 0.35 μm, 0.4 μm, 0.45 μm, 0.5 μm, 0.55 μm, 0.6 μm, 0.65 μm, 0.7 μm, 0.75 μm, 0.8 μm, 0.85 μm, 0.9 μm, 0.95 μm, or 1 μm. In the present invention, the silicone coating layer 70 is preferably formed by coating, curing, and polishing a silicone material liquid.
In the present invention, the second protective layer 80 is disposed on the surface of the organic silicon coating 70, and covers the third opening K3, which functions to protect the organic silicon coating and prevent it from being worn. In the present invention, the second protective layer 80 is preferably not disposed on the surface of the silicone coating layer 70 in the region corresponding to the common electrode pattern 40 c. In the present invention, the material of the second protective layer 80 is preferably silicon nitride, silicon oxide or a silicon nitride-silicon oxide composite material; the thickness of the second protective layer 80 is preferably 0.5 to 10 μm, and specifically may be 0.5 μm, 1 μm, 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, 5 μm, 5.5 μm, 6 μm, 6.5 μm, 7 μm, 7.5 μm, 8 μm, 8.5 μm, 9 μm, 9.5 μm, and 10 μm. In the present invention, the second protective layer 80 is preferably formed by sputtering.
The present invention is directed to a thin film thermal head, wherein the thin film thermal head is preferably provided with an organic resin coating 90 on the heat-generating substrate, and the organic resin coating 90 is provided in a partial region (i.e., a setting region) of the heat-generating substrate surface layer for the thin film thermal head, for protection by replenishment of the first protective layer 60 and the second protective layer 80. In the present invention, the organic resin coating 90 is preferably formed by coating and curing an organic resin, including but not limited to an epoxy resin.
The utility model discloses the structure of film is the heating substrate for the thermal print head has carried out the optimal design, sets up the organic silicon coating between first protective layer and second protective layer, on the one hand, the setting of organic silicon coating can be fine separation air and steam, avoids the corruption of electrode structure; on the other hand, before the second protective layer is abraded and damaged, the problem that the protective effect is influenced due to the fact that the organic silicon coating is abraded and removed does not exist, and therefore the service life of the heating substrate for the thin-film thermal printing head in a high-temperature and humid environment is prolonged. And simultaneously, the utility model discloses an electrode wire and the opening of design electrode wire and organosilicon coating that adopt different materials, both guaranteed that the easy aluminium electrode wire region that is corroded can cover the organosilicon coating, avoided the organosilicon coating again in the heating resistor body that is difficult to be destroyed by the corruption and the extra cover in tungsten titanium electrode wire place region to avoided because the organosilicon coating that near heating region high temperature leads to is heated and is decomposed, the problem that the outside protective layer was peeled off, the job stabilization nature and the life of the base plate that generates heat have further been improved.
For the sake of clarity, the following examples are given in detail.
Example 1
The embodiment provides a heating substrate for a thin film thermal printing head with the structure shown in fig. 1-3, which is prepared by the following steps:
1) an insulating substrate 10 having a parallel plate shape and containing alumina as a main component is prepared, and a thermal storage glaze coating 20 is formed on a partial region of the surface of the insulating substrate 10 by using a glass glaze slurry by printing and sintering.
2) Forming a heating resistor body layer 30 on the insulating substrate 10 and the glaze coating layer 20 by using a metal ceramic target material, such as a tantalum/silicon dioxide composite target material, and adopting a magnetron sputtering method; then, a first electrode lead layer was formed on the heating resistor layer 30 by magnetron sputtering using an aluminum target.
3) Patterning the heating resistor layer 30 and the first electrode lead layer 40 by adopting a photo plate making and etching combined means to form a first electrode lead 41; the first electrode lead 41 includes an individual lead 41a, a common lead 41b, a bonding electrode pattern 41f, a common electrode pattern 41c, and a filling pattern 41d, and the first electrode lead 41 has a first opening K1 formed at a position corresponding to the thermal storage glaze layer 20.
4) Forming a second electrode lead layer 50 on the substrate processed in the step 3) comprehensively by using a tungsten-titanium alloy target material and a magnetron sputtering method, and forming a second electrode lead 51 on the second electrode lead layer by using a portrait plate making and etching combined mode; the second electrode lead 51 is positioned at a position corresponding to the first opening K1 on the surface of the heating resistor layer 30 and is connected to the first electrode lead 41, the second electrode lead 51 has a second opening K2 formed at a position corresponding to the heat storage glaze 20, and the region of the heating resistor layer 30 sandwiched by the second openings K2 constitutes the heating resistor 31 for generating joule heat.
5) A composite target material formed by silicon nitride doped with silicon oxide is used, a first protective layer 60 is formed on the surface of an insulating substrate 10 provided with a heating resistor 31, a first electrode lead 41 (not including a bonding electrode pattern 41f area) and a second electrode lead 51 by a radio frequency magnetron sputtering method, and the thickness of the first protective layer 60 is 0.2-10 mu m.
6) The organic silicon material liquid is utilized, the organic silicon material liquid is coated on the first protective layer 60 comprehensively by adopting a rubber roll coating method, and the organic silicon coating 70 is formed after heating and curing; polishing the region of the organic silicon coating 70 corresponding to the heating resistor 31 and a part of the second electrode lead 51, and removing a part of the organic silicon coating 70 to form a third opening K3; the opening width of the third opening portion K3 is smaller than the opening width of the first opening portion K1 and larger than the opening width of the second opening portion K2; the thickness of the organic silicon coating 70 is 0.1-10 μm.
7) A second protective layer 80 is formed in the region of the third opening K3 and in a partial region of the surface of the organic silicon coating 70 excluding a region corresponding to the common electrode pattern 40c by using the same target and sputtering method as the first protective layer 60, and the thickness of the second protective layer 80 is 0.5 to 10 μm.
8) Finally, the organic resin layer 90 is formed on the insulating substrate at least in a partial region where only the first protect layer 60 and the silicone coat layer 70 are covered, by a method of heat curing after printing, using a solder resist material containing an epoxy resin as a main component.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (8)
1. A high environmental tolerance thin film thermal printhead is with base plate that generates heat which characterized in that includes:
an insulating substrate;
the heat storage glaze coating is arranged on the surface of the insulating substrate;
the heating resistor layer is arranged on the surface of the heat storage glaze coating layer and the surface of the insulating substrate in a region where the heat storage glaze coating layer is not arranged;
the first electrode lead layer is arranged on the surface of the heating resistor body and consists of a first electrode lead, and the first electrode lead comprises a bonding electrode pattern; a first opening is formed in the first electrode lead layer at a position corresponding to the heat storage glaze coating, and the first electrode lead layer is made of aluminum;
the second electrode lead layer is arranged on the heating resistor layer and the surface of the first lead layer and consists of a second electrode lead; a second opening is formed in the second electrode lead layer at a position corresponding to the heat storage glaze coating layer, a region of the heating resistor layer sandwiched by the second opening forms a heating resistor for generating joule heat, and the second electrode lead layer is made of a tungsten-titanium alloy;
a first protective layer covering the heating resistor body, the first electrode wire not including a bonding electrode pattern region and the second electrode wire;
the organic silicon coating is arranged on the surface of the first protection layer, a third opening part is formed on the organic silicon coating at a position corresponding to the heat storage glaze coating, and the opening width of the third opening part is smaller than that of the first opening part and larger than that of the second opening part;
and the second protective layer is arranged on the surface of the organic silicon coating and covers the third opening part.
2. The heat generating substrate for a high environmental resistance thin film thermal print head according to claim 1, further comprising an organic resin coating layer; the organic resin coating is arranged on a partial area of the surface layer of the heating substrate for the thin-film thermal printing head and is used for performing supplementary protection on the electrode lead.
3. The heat-generating substrate for a high-environmental-tolerance thin-film thermal print head according to claim 1, wherein the thickness of the silicone coating layer is 0.1 to 10 μm.
4. The heat-generating substrate for a high-environmental-tolerance thin-film thermal print head according to claim 1, wherein the material of the first protective layer is silicon nitride, silicon oxide, or a silicon nitride-silicon oxide composite material.
5. The heat generating substrate for a thin film thermal head having high environmental resistance according to claim 1, wherein the thickness of the first protective layer is 0.2 to 10 μm.
6. The heat-generating substrate for a high-environmental-tolerance thin-film thermal print head according to claim 1, wherein the material of the second protective layer is silicon nitride, silicon oxide, or a silicon nitride-silicon oxide composite material.
7. The heat generating substrate for a thin film thermal print head having high environmental resistance according to claim 1, wherein the thickness of the second protective layer is 0.01 to 10 μm.
8. The heat-generating substrate for a high-environmental-tolerance thin-film thermal print head according to claim 1, wherein a material of the heat-generating resistor layer is a cermet.
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| CN202022666636.3U CN213798826U (en) | 2020-11-17 | 2020-11-17 | High environmental tolerance film thermal printhead is with base plate that generates heat |
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| CN202022666636.3U CN213798826U (en) | 2020-11-17 | 2020-11-17 | High environmental tolerance film thermal printhead is with base plate that generates heat |
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