JP2009137284A - Thermal head, manufacturing method for thermal head, and printer - Google Patents

Thermal head, manufacturing method for thermal head, and printer Download PDF

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Publication number
JP2009137284A
JP2009137284A JP2008272916A JP2008272916A JP2009137284A JP 2009137284 A JP2009137284 A JP 2009137284A JP 2008272916 A JP2008272916 A JP 2008272916A JP 2008272916 A JP2008272916 A JP 2008272916A JP 2009137284 A JP2009137284 A JP 2009137284A
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Prior art keywords
protective layer
thermal head
bonding pad
layer
etching
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JP2008272916A
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Japanese (ja)
Inventor
Kazuhito Uchida
Hiroshi Yamada
和仁 内田
寛 山田
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Tdk Corp
Tdk株式会社
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Abstract

A highly reliable thermal head free from bubbles in a resin layer covering an end portion of a protective layer on the bonding pad side, a method for manufacturing the thermal head, and a printing apparatus are provided.
A heating resistor 24, a wiring pattern 27 for applying power to the heating resistor 24, and a bonding pad portion 52 are provided on a substrate. The wiring pattern 27 is covered with a protective layer 50 and a resin layer 51. The cross-sectional shape of the end portion 50a on the bonding pad portion 52 side of the protective layer 51 is a tapered shape.
[Selection] Figure 6

Description

  The present invention relates to a thermal head, a manufacturing method of a thermal head, and a printing apparatus, and more particularly, a thermal head mounted in various business and consumer printer devices, a manufacturing method of the thermal head, and a printing apparatus including the thermal head. About.

  There are thermal heads used for thermal recording of various printing apparatuses such as rewrite printers, card printers, video printers, barcode printers, label printers, facsimiles, and ticket vending machines. This type of thermal head prints on a medium or erases printed information by heating to a predetermined temperature. More specifically, the thermal head prints characters and pictures on media that reacts with the obtained thermal energy by selectively applying a potential to a single or multiple heating resistors that are linearly provided to generate heat. Or erase what is printed.

  In a conventional thermal head, a protective layer is provided on a wiring pattern, and a resin that covers the protective layer is provided (for example, see Patent Document 1). FIG. 20 is a cross-sectional view of a substrate on which a heating resistor for a thermal head is mounted. The thermal head 100 includes a glaze 102 formed on a substrate 101, and a heating resistor 103 formed on the glaze 102 so as to be discretely arranged at a predetermined interval in a direction perpendicular to the paper surface. Yes. The thermal head 100 is formed discretely arranged at predetermined intervals in the length direction of the thermal head (perpendicular to the paper surface of FIG. 20), and a partial region of the heating resistor 103 is exposed. Thus, a wiring pattern 104 and a bonding pad portion 105 formed by removing the conductive layer are provided. Further, in the thermal head 100, a protective layer 106 is provided on the wiring pattern 104, and the resin layer 108 covers the protective layer 106 and the end 107 on the bonding pad portion 105 side of the protective layer 106.

The reason why the protective layer 106 is covered with the resin layer 108 as described above is as follows. Deposition defects such as pinholes and cracks may be formed in the protective layer 106. When moisture in the atmosphere, Na + ions contained in thermal paper, etc. come into contact with the wiring pattern 104 through the film formation defect, the wiring pattern 104 is corroded to significantly increase the wiring resistance of the wiring pattern 104. The heating resistor 103 cannot be supplied with a predetermined power.

Therefore, since the resin layer 108 is deposited on the surface of the protective layer 106, even if many film formation defects such as pinholes are formed in the protective layer 106, these film formation defects are improved by the resin layer 108. Inconveniently, it is possible to effectively prevent the inconvenience that the moisture in the atmosphere, Na + ions contained in the thermal paper, etc. contact the wiring pattern 104 and corrode them. Accordingly, the wiring resistance of the wiring pattern 104 can be kept substantially constant for a long time, and the reliability of the thermal head can be improved.
JP 2002-356001 A

  In the conventional thermal head, when the protective layer 106 covering the bonding pad portion 105 is removed by etching, dry etching is performed with a resist applied so that the protective layer 106 covering the bonding pad portion 105 is exposed. Therefore, the end 107 on the bonding pad portion 105 side of the protective layer 106 had a cross-sectional shape substantially perpendicular to the substrate surface. Therefore, when forming the resin layer 108, when the protective layer 106 is covered with a resin before curing, the resin before curing has fluidity, so that bubbles are not formed in close contact with the end 107. There is. When bubbles are generated, film peeling or resin layer defects occur, resulting in an influence on the wiring pattern.

  In view of the above-described problems, an object of the present invention is to provide a thermal head with high reliability with less bubbles in the resin layer covering the end of the protective layer on the bonding pad side, a method for manufacturing the thermal head, and a printing apparatus. is there.

One embodiment of the present invention relates to a thermal head. The thermal head has a heating resistor on a substrate, a wiring pattern for applying power to the heating resistor, and a bonding pad portion, and the wiring pattern is covered with a protective layer and a resin layer. The cross-sectional shape of the end of the protective layer on the bonding pad portion side is a tapered shape.
In addition, the tapered region of the protective layer may be covered with the resin layer.
Further, the resin layer may be covered by including a component electrically connected to the wiring pattern together with the tapered region of the protective layer.
The taper shape of the protective layer may be formed in a plurality of stages.
The protective layer may be formed of a plurality of layers, and an uppermost layer of the plurality of layers may have a tapered shape.
The protective layer may be formed of a plurality of layers, and the upper layer may be a material having higher etching rate characteristics than the lower layer.
Another aspect of the present invention relates to a printing apparatus, and the printing apparatus includes the above-described thermal head.
Yet another embodiment of the present invention relates to a method for manufacturing a thermal head. The manufacturing method includes a step of forming a heating resistor on a substrate, a step of forming a wiring pattern for applying electric power to the heating resistor together with a bonding pad portion, and protecting the wiring pattern and the bonding pad portion. Forming a protective layer-covered substrate covered with a layer; and drying the protective layer of the bonding pad portion in a state where the protective layer-covered substrate is covered with a mask so that the protective layer covering the bonding pad portion is exposed. An etching step of etching, and a step of covering the protective layer with a resin layer up to the bonding pad portion side end of the protective layer.
Further, the etching step of dry etching the protective layer may include a step of moving the mask in a direction in which a region to be etched in the protective layer is enlarged.
In the step of forming the protective layer-coated substrate, a plurality of layers of the protective layer may be formed using a material having a higher etching rate as the upper layer is formed.
Still another embodiment of the present invention also relates to a method for manufacturing a thermal head. The manufacturing method includes a step of forming a heating resistor on a substrate, a step of forming a wiring pattern for applying power to the heating resistor together with a bonding pad portion, and a state in which the bonding pad portion is covered with a mask. A step of covering the wiring pattern with a protective layer, an etching step of dry-etching the protective layer on the bonding pad portion in a state covered with a mask so that the protective layer on the bonding pad portion is exposed, and the protective layer And a step of covering the protective layer with the resin layer up to the end of the protective layer on the bonding pad portion side.
The etching process for dry etching the protective layer may include a process of moving the mask from outside to inside during the process.
In the step of covering the wiring pattern with a protective layer, a plurality of layers may be formed with a material having a higher etching rate as the upper layer of the protective layer.

  According to the present invention, since the cross-sectional shape of the end portion on the bonding pad portion side of the protective layer is a taper shape, bubbles generated in the resin layer covering the end portion can be reduced. Thereby, a highly reliable thermal head and printing apparatus can be obtained.

  FIG. 1 is a schematic view of a printing apparatus 10 equipped with a thermal head according to an embodiment of the present invention. A printing apparatus 10 shown in FIG. 1 has a hexahedral casing 11, and a liquid crystal display panel 12, an input key 13, and a paper discharge port 14 are provided on the front surface of the casing 11. In addition, a thermal paper 15 as a medium is stored in a roll 11 in the casing 11, and the leading end portion of the thermal paper 15 is supported by a plurality of transport rollers 16 so that it can be It is positioned at the front. Further, a thermal head unit 20 for mounting a thermal head is positioned and incorporated in the casing 11 on the upper side of the thermal paper 15. The thermal head unit 20 prints images such as characters and images on the thermal paper 15 by heating the thermal paper 15 to cause color development. The printed thermal paper 15 is discharged from the paper discharge port 14.

  2 is a plan view of the thermal head unit 20 as seen from the lower surface side, and FIG. As shown in FIGS. 2 and 3, the thermal head unit 20 includes a first substrate 21. A heat sink 22 and a connector 23 are attached to the upper surface side of the first substrate 21. A second substrate 25 having a plurality of heating resistors 24 and an integrated circuit (IC) 26 are attached to the lower surface side of the first substrate 21. Further, on the second substrate 25, a wiring pattern 27 and a bonding pad portion 52 connected to the heating resistor 24 are provided. A protective layer 50 and a resin layer 51 are provided so as to cover the wiring pattern 27. The wiring pattern 27 and the integrated circuit 26 are electrically connected by connecting a bonding wire 28 to a terminal of the integrated circuit 26 and the bonding pad portion 52.

  In order to protect the integrated circuit 26 and the bonding wire 28, both are covered with a protective resin 29 formed of a hard resin such as an epoxy resin. The protective resin 29 is covered so as to straddle the step 30. An IC cover 31 is attached on the first substrate 21 with screws 32. 2 and 3, the thermal paper 15 is indicated by a two-dot chain line, and is guided by the roller 2 of FIG. Further, the thermal paper 15 is pressed against the thermal head by the roller 3, and an image such as a character or an image is printed on the thermal paper 15 by the heat from the heating resistor 24.

  FIG. 4 is a plan view of a part of the first substrate 21 and the second substrate 25 shown with the IC cover 31 removed, as viewed from below.

  As shown in FIG. 4, the wiring pattern 27 on the second substrate 25 includes a plurality of individual electrodes 40 and a common electrode 41 so that each of them is alternately arranged in parallel to the sub-scanning direction. Is formed. The individual electrode 40 is provided with a ratio of two common electrodes 41 to one. In other words, the pattern in which the individual electrodes 40 are formed on both sides of the common electrode 41 is continuous.

  The individual electrodes 40 and the common electrode 41 are formed through a conductive film forming process, an exposure process (patterning), and the like. Here, the individual electrodes 40 can be formed so that the line width is, for example, about 30 to 70 μm. The common electrode 41 can be formed so that the line width is, for example, about 30 to 70 μm.

  A bonding pad portion 52 having an electrode pad 43 connected to the lead terminal 42 of the integrated circuit 26 disposed on the first substrate 21 is formed at the base end of each individual electrode 40. A common electrode portion 41 </ b> A provided along the main scanning direction is formed at the base end of each common electrode 41. The lead terminal 42 and the electrode pad 43 are connected by a bonding wire 28. A protective layer 50 and a resin layer 51 are provided so as to cover the wiring pattern 27. The resin layer 51 is made of an epoxy-based or photosensitive resin. Moreover, as the resin layer 51, polyimide resin, silicon resin, fluorine resin, or the like can be used in addition to the epoxy resin.

  Further, the heating resistors 24 are formed along the main scanning direction on the distal end side of each individual electrode 40 and common electrode 41 in a state of being insulated from each other. Here, the heating resistor 24 is exposed such that the line width in the sub-scanning direction is, for example, about 30 to 200 μm.

  FIG. 5 is an enlarged view of a portion B in FIG. The first individual electrode 40-1 is connected to one end of the first heating resistor 24-1. The other end of the first heating resistor 24-1 is connected to the first electrode 47-1. One end of the second heating resistor 24-2 is connected to the first electrode 47-1, and the other end is connected to the first common electrode 41-1. Furthermore, the first common electrode 41-1 is connected to one end of the third heating resistor 24-3. The other end of the third heating resistor 24-3 is connected to the second electrode 47-2. One end of the fourth heating resistor 24-4 is connected to the second electrode 47-2, and the other end is connected to the second individual electrode 40-2. The third individual electrode 40-3 is connected to one end of the fifth heating resistor 24-5. The other end of the fifth heating resistor 24-5 is connected to the third electrode 47-3. One end of the sixth heating resistor 24-6 is connected to the third electrode 47-3, and the other end is connected to the second common electrode 41-2. Furthermore, the second common electrode 41-2 is connected to one end of the seventh heating resistor 24-7. The other end of the seventh heating resistor 24-7 is connected to the fourth electrode 47-4. One end of the eighth heating resistor 24-8 is connected to the fourth electrode 47-4, and the other end is connected to the fourth individual electrode 40-4. First and second heating resistors 24-1 and 24-2, third and fourth heating resistors 24-3 and 24-4, and fifth and sixth heating resistors 24-5 and 24-6 Each of the seventh and eighth heating resistors 24-7 and 24-8 constitutes one dot. Such a common electrode is generally called a U-turn common electrode.

  In the configuration shown in FIG. 5, for example, when a voltage is applied to the first individual electrode 40-1 and the first common electrode 41-1, the first individual electrode 40-1 and the first heating resistor 24 are applied. -1 and the first electrode 47-1, the second heating resistor 24-2, and the first common electrode 41-1, current flows. Thereby, the first and second heating resistors 24-1 and 24-2 generate heat.

  6 is a cross-sectional view taken along the line CC of FIG. A glaze 48 is formed on the second substrate 25. On the glaze 48, the heating resistors 24 formed so as to be discretely arranged at predetermined intervals in the length direction of the glaze 48 (perpendicular to the paper surface of FIG. 6) are provided. In addition, the conductive layer is formed so as to be discretely arranged at predetermined intervals in the longitudinal direction of the thermal head (perpendicular to the paper surface of FIG. 6), and a partial region of the heating resistor 24 is exposed. Wiring patterns 27 and 47 formed by removing and bonding pad portions 52 are provided. A protective layer 50 is formed on the wiring patterns 27 and 47, and the cross-sectional shape of the end portion 50a on the bonding pad portion 52 side of the protective layer 50 is a taper shape, and the protective layer 50 extends to the end portion 50a. It is covered with a resin layer 51. The resin of the resin layer 51 is made of an epoxy resin.

  As described above, in the thermal head according to the present embodiment, since the cross-sectional shape of the end portion 50a on the bonding pad portion 52 side of the protective layer 50 is a taper shape, the protective layer 50 is cured when the resin layer 51 is formed. When the resin before being cured is covered with resin, even if the resin before curing has fluidity, the resin is in close contact with the end portion 50a having a tapered cross-sectional shape, and bubbles are not easily generated. And a bubble can be reduced to the resin layer 51 which covers the edge part 50a. Thereby, a highly reliable thermal head and printing apparatus can be obtained.

  Next, a method for manufacturing a thermal head according to an embodiment of the present invention will be described with reference to FIGS.

  FIG. 7 is a process diagram showing the method of manufacturing the thermal head according to this embodiment. 8 to 12 are cross-sectional views of the thermal head formed on the second substrate 25. FIG. The manufacturing of the thermal head includes the step of forming the heating resistor 24 on the second substrate 25 (step S11) and the step of forming the wiring pattern 27 for applying power to the heating resistor 24 together with the bonding pad portion 52. (Step S12), a step of forming a protective layer-covered substrate in which the wiring pattern 27 and the bonding pad portion 52 are covered with the protective layer 50 (Step S13), and a protective layer 50 covering the bonding pad portion 52 with the protective layer-covered substrate. An etching step (step S14) for removing the protective layer 50 covering the bonding pad portion 52 by dry etching in a state where the protective layer 50 is covered with a mask so as to be exposed, and an end of the protective layer 50 on the bonding pad portion 52 side. The step of covering the portion 50a with the resin layer 51 (step S15) and, for example, as shown in FIG. 3, the first substrate 1, the second substrate 25 and the integrated circuit 26 are arranged and fixed, the heating resistor 24 and the integrated circuit 26 are electrically connected by the bonding wire 28, and the integrated circuit 26 and the bonding wire 28 are covered. And a step of forming a protective resin 29 by applying a resin such as an epoxy resin and curing the resin (step S16).

  First, in the heating resistor forming process in step S11, the glaze 48 is formed on the second substrate 25 (FIG. 8A) by screen printing or the like (FIG. 8B), and the glaze 48 is formed on the glaze 48. The heating resistor 24 is formed by using a thin film forming technique such as vacuum deposition, CVD (chemical vapor deposition), or sputtering (FIG. 8C). The material of the heating resistor 24 is polysilicon, and the thickness is set to 0.01 to 0.3 μm. For example, the heating resistor 24 is formed on the glaze 48 by LP-CVD (low pressure CVD) or the like. Next, the formed heating resistors 24 are formed by photolithography and etching so that they are discretely arranged at predetermined intervals in the length direction of the glaze 48 (perpendicular to the paper surface of FIG. 8). The

  In the step of forming the wiring patterns 27 and 47 and the bonding pad portion 52 in step S12, a conductive layer having a desired thickness (etched to form the wiring pattern 27 on the entire surface of the second resistor 25 on the heating resistor 24). , 47). The conductive layer may be formed by a thin film forming technique such as sputtering, or may be formed by a screen printing method. Patterned by photolithography and etching to form a desired region, more specifically, as shown in FIG. 4, discretely arranged at predetermined intervals in the length direction (main scanning direction) of the thermal head, In addition, by removing the conductive layer so that a partial region of the heating resistor 24 is exposed, the wiring patterns 27 and 47 and the bonding pad portion 52 are formed (FIG. 9A). The wiring patterns 27 and 47 are made of aluminum or an aluminum alloy and have a thickness of 0.1 to 2.0 μm.

In the step of forming the protective layer-covered substrate 60 in which the wiring patterns 27 and 47 and the bonding pad portion 52 are covered with the protective layer 50 in step S13, an inorganic substance such as SiO 2 is deposited on the wiring patterns 27 and 47 by sputtering or the like. Then, the protective layer 50 is formed (FIG. 9B). The protective layer 50 is made of SiO 2 and has a thickness of 3 to 10 μm.

In the etching process of step S14, the protective layer 50b covering the bonding pad portion 52 is dry-etched while the protective layer covering substrate 60 is covered with the mask 61 so that the protective layer 50 (50b) covering the bonding pad portion 52 is exposed. (FIG. 10). In this etching, for example, CHF 3 and O 2 are used as the etching gas and the etching pressure is set to 1 Pa. At this time, the cross-sectional shape of the end portion 50a of the protective layer 50 is a tapered shape (FIG. 11). Here, the reason why the taper shape can be obtained is that when dry etching is performed using a resist mask, the taper shape is not obtained. However, since only the mask 61 is placed, the taper shape is obtained by the wraparound of the etching gas. The mask 61 used here is made of a material made of a metal such as alumina, SUS or aluminum, a resin such as polyimide or Teflon (registered trademark), or a composite material thereof, and has a plate-like or film-like shape. Things can be used. In FIG. 10 and FIG. 11, the position of the mask 61 protrudes from the heating element side, but this has a role to prevent the heating element side from being etched by wraparound during etching.

  In step S15, the protective layer 50 is covered with the resin layer 51 up to the end 50a of the protective layer 50 on the bonding pad portion 52 side. Then, the resin is cured by heating at an appropriate temperature, and the resin layer coating step is completed (FIG. 12). The resin layer 51 is made of epoxy, polyimide, fluorine, silicon or the like, and the thickness of the resin layer 51 is 10 to 100 μm.

  In step S <b> 16, the second substrate 25 is attached on the first substrate 21, and the integrated circuit 26 is disposed and fixed on the first substrate 21. Thereafter, the heating resistor 24 and the integrated circuit 26 are electrically connected by a bonding wire 28, and an epoxy resin (protective resin) 29 is applied so as to cover the integrated circuit 26 and the bonding wire 28. In this state, the epoxy resin is applied. (Protective resin) 29 is cured.

Here, the manufacturing operation of the thermal head is completed.
When manufacturing efficiency is considered, a plurality of substrates 60 can be stacked. In this case, the substrate 60 immediately above serves as a mask.

FIG. 13 is a graph showing how bubbles are generated in the resin layer 51 in the thermal head manufactured by the above manufacturing method. The horizontal axis indicates the protective film step (A (μm)), and the vertical axis indicates the taper angle (B degrees), that is, the angle formed with the surface of the wiring pattern 27 of the end portion 50a of the protective layer 50. In the figure, a circle indicates no bubble, and a cross indicates bubble generation. It can be seen that the bubbles disappear when the taper angle decreases. Experimentally, bubbles disappear when B <−0.5 × A-87 holds. In the figure, the straight line is a straight line indicating B = −0.5 × A−87.
Further, the substrate 60 may be tilted during dry etching in order to adjust the taper angle.

  In the thermal head manufactured as described above, the cross-sectional shape of the end portion 50a of the protective layer 50 is tapered, so that bubbles contained in the resin layer 51 can be reduced. Accordingly, peeling of the resin layer 51 and corrosion of the wiring patterns 27 and 47 can be prevented, and a highly reliable thermal head and printing apparatus can be obtained.

  In the above-described embodiment, the configuration in which the resin layer 51 covers the protective layer 50 has been described. However, not only the configuration in which the resin layer 51 covers the protective layer 50 but also the first substrate 21 as shown in FIG. After the second substrate 25 is attached to the first substrate 21 and the third substrate 35 in which the integrated circuit 26 is disposed is fixed on the first substrate 21, the protective resin 29 that protects the integrated circuit 26 and the bonding wire 28 is protected. It can also be set as the structure which covers the taper part of the edge of the layer 50. FIG. As shown in FIG. 14, even when the integrated circuit 26 and the bonding wire 28 are sealed with the protective resin 29, the cross-sectional shape of the protective film end 50 x is tapered, so that resin peeling and bubble entrainment are reduced. In addition, corrosion of the electrode can be prevented. Moreover, since there are few air bubbles generate | occur | produced in the protective resin 29, both adhesiveness can be made favorable.

  Next, another method for manufacturing a thermal head according to an embodiment of the present invention will be described with reference to FIGS.

  FIG. 15 is a process diagram showing another example of a method for manufacturing a thermal head according to the present embodiment. 16 and 17 are cross-sectional views of a thermal head formed on the second substrate 25. FIG. In the manufacture of the thermal head, the step of forming the heating resistor 24 on the second substrate 25 (Step S21) and the wiring patterns 27 and 47 for applying power to the heating resistor 24 are formed together with the bonding pad portion 52. A step (step S22), a step of covering the wiring patterns 27 and 47 with the protective layer 50 in a state where the bonding pad portion 52 is covered with the mask 62 (step S23), and the protective layer 50 on the bonding pad portion 52 is exposed. In this manner, the protective layer (50c) on the bonding pad portion 52 is removed by dry etching while being covered with the mask 63 (step S24), and the protective layer 50 is bonded to the end of the protective layer 50 on the bonding pad portion 52 side. The step of covering the portion 50a with the resin layer 51 (step S25), and the second substrate 25 on the first substrate 21; The product circuit 26 is arranged and fixed, the heating resistor 24 and the integrated circuit 26 are electrically connected by a bonding wire 28, and a resin such as an epoxy resin is applied so as to cover the integrated circuit 26 and the bonding wire 28, And a step of forming the protective resin 29 by curing (step S26).

  Step S21, step S22, step S25, and step S26 correspond to step S11, step S12, step S15, and step S16, respectively, described in FIG. Here, step S23 and step S24 will be described.

In the step of covering the wiring patterns 27 and 47 with the protective layer 50 with the bonding pad portion 52 covered with the mask 62 in step S23, the bonding pad portion 52 is covered with the mask 62 and SiO 2 or the like is formed on the wiring patterns 27 and 47. A protective layer 50 is formed by depositing the inorganic material by sputtering or the like (FIG. 16). The protective layer 50 is made of SiO 2 and has a thickness of 3 to 10 μm. At this time, the protective layer 50c is thinly formed on the masked bonding pad portion due to the wraparound of the inorganic substance. Further, a taper shape is formed near the boundary of the mask 62. The mask used here is a material made of a metal such as alumina, SUS or aluminum, a resin such as polyimide or Teflon (registered trademark), or a composite material thereof, and has a plate shape or a film shape. Can be used.

In the etching step of step S24, the protective layer 50c on the bonding pad portion 52 is dry-etched in a state covered with the mask 63 so that the protective layer 50 on the bonding pad portion 52 is exposed (FIG. 17). Etching at this time is performed using, for example, CHF 3 and O 2 as the etching gas and 1 Pa as the etching pressure. Since the protective layer 50c is thin, the etching amount is small, so that the etching time can be shortened. Further, two tapered surfaces are formed, a tapered surface formed during film formation and a tapered surface formed during etching.

  Then, Step S25 and Step S26 are performed, and the manufacturing operation of the thermal head is completed.

  In the thermal head manufactured as described above, since the cross-sectional shape of the end portion 50d of the protective layer 50 is tapered, bubbles generated in the resin layer 51 can be reduced. Accordingly, peeling of the resin layer 51 and corrosion of the wiring patterns 27 and 47 can be prevented, and a highly reliable thermal head and printing apparatus can be obtained.

  In the present embodiment, the resin layer is described as being formed by applying a resin. However, the present invention is not limited thereto, and the resin layer may be formed of a resin film. Moreover, even when providing a resin layer with a resin film, it is preferable that the cross-sectional shape of an edge part is a taper shape.

  In the present embodiment, the printing thermal head has been described, and a case where a plurality of heating resistors are provided is shown. However, in addition to this, the thermal head for erasing composed of a single heating resistor is used. be able to.

  Further, as another manufacturing method for forming a two-step tapered shape as shown in FIG. 17, following the etching process shown in FIG. 11, the mask 61 is arbitrarily placed on the heating resistor 24 side (left side in the drawing). There is also a method in which a mask moving process for moving the distance is added and the etching process is performed again. That is, a step of moving the mask 61 in the direction in which the region to be etched in the protective layer 50 is enlarged may be added.

Next, a modification of the above embodiment will be described.
FIG. 18 is a cross-sectional view of a thermal head according to a modification, and corresponds to the modification of FIG. As in FIG. 6, a glaze 48 is formed on the second substrate 25, and on the glaze 48, discretely at predetermined intervals in the length direction of the glaze 48 (perpendicular to the paper surface of FIG. 18). A heating resistor 24 formed so as to be arranged is provided. Further, the conductive layer is formed so as to be discretely arranged at a predetermined interval in the length direction of the thermal head (perpendicular to the paper surface of FIG. 18), and a part of the heating resistor 24 is exposed. Wiring patterns 27 and 47 formed by removing and bonding pad portions 52 are formed. Unlike the protective layer 50 of FIG. 6, a protective layer 70 having two layers is formed on the wiring patterns 27 and 47. Specifically, a first protective layer 71 is formed as a lower layer, and a second protective layer 72 is formed thereon as an upper layer. The end portion 71a of the first protective layer 71 and the end portion 72a of the second protective layer 72 are tapered like the end portion 50a of the protective layer 50 shown in FIG. The protective layer 70 (71, 72) is covered with the resin layer 51 up to the end portions (71a, 72a).

Here, the second protective layer 72 formed on the upper side is formed of a material having a higher etching rate than the first protective layer 71 formed on the lower side. More specifically, in the step of forming the protective layer-covered substrate 60 shown in FIG. 9B in step S13, a relatively silicon-poor inorganic substance such as SiO 2 is sputtered on the wiring patterns 27 and 47. The first protective layer 71 is formed by depositing, for example, and a second protective layer 72 is formed thereon by depositing a relatively silicon-rich inorganic material such as SiO 2 by sputtering or the like. In addition, the sum total of the thickness of the edge part 71a of the 1st protective layer 71 and the 2nd protective layer 72 shall be 3-10 micrometers.

  By selecting such materials having different etching rates, the end portions of the protective layer 70 are shown as the end portion 71a of the first protective layer 71 and the end portion 72a of the second protective layer 72 as shown in the figure. As shown, it has a two-stage taper shape. In addition, with the structure having such a two-step tapered shape, the generation of bubbles generated in the resin layer 51 is more effectively suppressed. In addition, when the plurality of protective layers 70 (71, 72) are formed of materials having different etching rates, the patterning accuracy of the lower first protective layer 71 serving as the protective film opening can be improved. The efficiency of the entire etching process is increased.

  In the modification of FIG. 18, the protective layer 70 has a two-layer structure. However, the present invention is not limited to this, and has a three-layer structure of first to third protective layers 71 to 73 as shown in FIG. 19. There may be four or more layers. In any case, by using a material having a higher etching rate for the protective layer formed on the upper side, it is possible to efficiently form a multi-step tapered shape. Further, when the protective layer is formed of a plurality of layers, it is not necessary that the end portions of all the layers have a tapered shape, and if the end portion of the uppermost layer has a tapered shape, the generation of bubbles is suppressed. An effect is obtained.

  The configurations, arrangement relationships, and the like described in the above embodiments are merely examples that can be understood and implemented by the present invention. Therefore, the present invention is not limited to the described embodiments, and can be variously modified without departing from the scope of the technical idea shown in the claims.

  INDUSTRIAL APPLICABILITY The present invention can be widely used for a thermal head mounted on various business and consumer printer devices, a manufacturing method of the thermal head, and a printing apparatus mounted with the thermal head.

1 is a schematic diagram of a printing apparatus according to an embodiment of the present invention. 1 is a plan view showing a thermal head unit of a printing apparatus according to an embodiment of the present invention. 1 is a side view showing a thermal head unit of a printing apparatus according to an embodiment of the present invention. It is a top view showing typically the thermal head concerning the embodiment of the present invention. It is the figure which expanded the B section of FIG. It is CC sectional view taken on the line of FIG. It is process drawing which shows the manufacturing method of the thermal head which concerns on embodiment of this invention. It is sectional drawing of the thermal head formed on the board | substrate in the manufacturing process of the thermal head which concerns on embodiment of this invention. It is sectional drawing of the thermal head formed on the board | substrate in the manufacturing process of the thermal head which concerns on embodiment of this invention. It is sectional drawing which shows a mode that the mask was accumulated so that the protective layer which covers a bonding pad part might be exposed. It is sectional drawing which shows a mode when a mask is accumulated and etched so that the protective layer which covers a bonding pad part may be exposed. It is sectional drawing of the thermal head formed on the board | substrate in the manufacturing process of the thermal head which concerns on embodiment of this invention. It is a graph which shows the mode of the bubble generation | occurrence | production of the resin layer in the thermal head manufactured with the manufacturing method of this invention. It is sectional drawing of an example of the thermal head which concerns on embodiment of this invention. It is process drawing which shows another example of the manufacturing method of the thermal head which concerns on embodiment of this invention. It is sectional drawing which shows a mode that a protective layer is formed in the state which covered the bonding pad part with the mask. It is sectional drawing which shows a mode when a mask is accumulated and etched so that the protective layer which covers a bonding pad part may be exposed. It is sectional drawing of the thermal head which concerns on the modification of embodiment of this invention, and has shown sectional drawing in which the protective layer is formed with two layers. It is sectional drawing of the thermal head which concerns on the modification of embodiment of this invention, and has shown sectional drawing in which the protective layer is formed by three layers. It is sectional drawing of the chip | tip which mounts the heating resistor of the conventional thermal head.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Printing apparatus 11 Casing 12 Display panel 13 Input key 14 Paper discharge port 15 Thermal paper 16 Carrying roller 20 Thermal head unit 21 1st board | substrate 22 Heat sink 23 Connector 24 Heating resistor 25 2nd board | substrate 26 Integrated circuit (IC)
27, 47 Wiring pattern 28 Bonding wire 29 Protective resin 30 Step 31 IC cover 35 Third substrate 40 Individual electrode 41 Common electrode 50 Protective layer 50a, 71a, 72a, 73a End 51 Resin layer 52 Bonding pad 70 Protective layer 71 First protective layer 72 Second protective layer 73 Third protective layer

Claims (13)

  1. A thermal head having a heating resistor on a substrate, a wiring pattern for applying power to the heating resistor, and a bonding pad portion, the wiring pattern being a thermal head covered with a protective layer and a resin layer,
    The thermal head according to claim 1, wherein a cross-sectional shape of the end portion of the protective layer on the bonding pad portion side is a taper shape.
  2.   The thermal head according to claim 1, wherein the taper-shaped region of the protective layer is covered with the resin layer.
  3.   The said resin layer is covered including the component electrically connected to the said wiring pattern with the area | region which becomes the said taper shape of the said protective layer, The Claim 1 or 2 characterized by the above-mentioned. Thermal head.
  4.   The thermal head according to any one of claims 1 to 3, wherein the protective layer has a plurality of tapered shapes.
  5.   The thermal head according to any one of claims 1 to 4, wherein the protective layer is formed of a plurality of layers, and an uppermost layer of the plurality of layers has a tapered shape.
  6.   6. The protective layer according to claim 1, wherein the protective layer is formed of a plurality of layers, and the upper layer is a material having higher etching rate characteristics than the lower layer. Thermal head.
  7.   A printing apparatus comprising the thermal head according to claim 1.
  8. Forming a heating resistor on the substrate;
    Forming a wiring pattern for applying power to the heating resistor together with a bonding pad portion;
    Forming a protective layer-covered substrate in which the wiring pattern and the bonding pad portion are covered with a protective layer;
    An etching step of dry-etching the protective layer of the bonding pad portion in a state where the protective layer-covered substrate is covered with a mask so that the protective layer covering the bonding pad portion is exposed;
    And a step of covering the protective layer with a resin layer up to the end of the protective layer on the bonding pad portion side.
  9.   9. The thermal process according to claim 8, wherein the etching step of dry-etching the protective layer includes a step of moving the mask in a direction in which a region to be etched in the protective layer is enlarged. Manufacturing method of the head.
  10.   10. The method of manufacturing a thermal head according to claim 8, wherein in the step of forming the protective layer-coated substrate, a plurality of layers of the protective layer are formed of a material having a higher etching rate as the upper layer.
  11. Forming a heating resistor on the substrate;
    Forming a wiring pattern for applying power to the heating resistor together with a bonding pad portion;
    Covering the wiring pattern with a protective layer in a state where the bonding pad portion is covered with a mask;
    An etching step of dry-etching the protective layer on the bonding pad portion in a state covered with a mask so that the protective layer on the bonding pad portion is exposed;
    And a step of covering the protective layer with a resin layer up to the bonding pad portion side end of the protective layer.
  12.   The method of manufacturing a thermal head according to claim 11, wherein the etching step of dry etching the protective layer includes a step of moving the mask from outside to inside during the step.
  13.   The method for manufacturing a thermal head according to claim 11, wherein the step of covering the wiring pattern with a protective layer forms a plurality of layers of the protective layer with a material having a higher etching rate as the upper layer.
JP2008272916A 2007-11-13 2008-10-23 Thermal head, manufacturing method for thermal head, and printer Pending JP2009137284A (en)

Priority Applications (2)

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JP2008272916A JP2009137284A (en) 2007-11-13 2008-10-23 Thermal head, manufacturing method for thermal head, and printer

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JP2008272916A JP2009137284A (en) 2007-11-13 2008-10-23 Thermal head, manufacturing method for thermal head, and printer

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JP2011131463A (en) * 2009-12-24 2011-07-07 Kyocera Corp Head base body, recording head and recording apparatus
WO2013058264A1 (en) * 2011-10-19 2013-04-25 京セラ株式会社 Thermal head, and thermal printer

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JP2011131463A (en) * 2009-12-24 2011-07-07 Kyocera Corp Head base body, recording head and recording apparatus
WO2013058264A1 (en) * 2011-10-19 2013-04-25 京セラ株式会社 Thermal head, and thermal printer
CN103874583A (en) * 2011-10-19 2014-06-18 京瓷株式会社 Thermal head, and thermal printer
JPWO2013058264A1 (en) * 2011-10-19 2015-04-02 京セラ株式会社 Thermal head and thermal printer
CN103874583B (en) * 2011-10-19 2016-01-20 京瓷株式会社 Thermal head and thermal printer

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