CN213795991U - 一种用于为硅片的研磨设备供应研磨液的系统 - Google Patents
一种用于为硅片的研磨设备供应研磨液的系统 Download PDFInfo
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- CN213795991U CN213795991U CN202023037193.8U CN202023037193U CN213795991U CN 213795991 U CN213795991 U CN 213795991U CN 202023037193 U CN202023037193 U CN 202023037193U CN 213795991 U CN213795991 U CN 213795991U
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- 238000000227 grinding Methods 0.000 title claims abstract description 41
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 25
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 25
- 239000010703 silicon Substances 0.000 title claims abstract description 25
- 239000012530 fluid Substances 0.000 title claims abstract description 22
- 238000005498 polishing Methods 0.000 claims abstract description 60
- 238000002360 preparation method Methods 0.000 claims abstract description 48
- 239000002002 slurry Substances 0.000 claims abstract description 45
- 239000007788 liquid Substances 0.000 claims abstract description 32
- 239000002994 raw material Substances 0.000 claims abstract description 31
- 238000002156 mixing Methods 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 26
- 239000008367 deionised water Substances 0.000 claims description 24
- 229910021641 deionized water Inorganic materials 0.000 claims description 24
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 7
- 238000002425 crystallisation Methods 0.000 claims description 4
- 230000008025 crystallization Effects 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 238000010926 purge Methods 0.000 claims description 2
- 238000005303 weighing Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 19
- 238000004140 cleaning Methods 0.000 description 5
- 238000010924 continuous production Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
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CN202023037193.8U CN213795991U (zh) | 2020-12-15 | 2020-12-15 | 一种用于为硅片的研磨设备供应研磨液的系统 |
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CN202023037193.8U CN213795991U (zh) | 2020-12-15 | 2020-12-15 | 一种用于为硅片的研磨设备供应研磨液的系统 |
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Publication Number | Publication Date |
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CN213795991U true CN213795991U (zh) | 2021-07-27 |
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CN202023037193.8U Active CN213795991U (zh) | 2020-12-15 | 2020-12-15 | 一种用于为硅片的研磨设备供应研磨液的系统 |
Country Status (1)
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CN (1) | CN213795991U (zh) |
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- 2020-12-15 CN CN202023037193.8U patent/CN213795991U/zh active Active
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220810 Address after: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Patentee after: Xi'an yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |