CN213769211U

CN213769211U - SMD packaging machine with full-automatic heat seal function

Info

Publication number: CN213769211U
Application number: CN202022432118.5U
Authority: CN
Inventors: 袁浩; 吴峰; 朱王健; 梁仪军
Original assignee: Kunshan Tongri Robot Intelligent Technology Co Ltd
Current assignee: Kunshan Tongri Robot Intelligent Technology Co Ltd
Priority date: 2020-10-28
Filing date: 2020-10-28
Publication date: 2021-07-23
Anticipated expiration: 2030-10-28

Abstract

The utility model discloses a SMD packagine machine with full-automatic heat seal function, comprises a workbench, the T-slot has been seted up to the upper surface of workstation, the internal surface swing joint in T-slot has first buffer gear, first buffer gear's both sides all are provided with second buffer gear, one side of first buffer gear is provided with the support frame, one side fixedly connected with cylinder of support frame. This SMD packagine machine with full-automatic heat-seal function, through the T-slot, first buffer gear and second buffer gear's setting, carrying out heat-seal during operation, the carrier band receives the pressure of heating mould, at this moment, the briquetting receives the extrusion, the elastic rod produces elastic deformation, first spring shrink, the gyro wheel slides along the upper surface of workstation, the while fixing plate extrudes the second telescopic link, the second spring shrink, carry out effectual buffering to the pressure that cylinder work produced, form effective protection to carrier band and electronic component.

Description

SMD packaging machine with full-automatic heat seal function

Technical Field

The utility model relates to a packagine machine technical field specifically is a SMD packagine machine with full-automatic heat seal function.

Background

SMD means the surface mounting device, SMD packagine machine generally includes that the material is selected the sequencing subassembly, the carrier band drop feed mechanism, the material snatchs the mechanism, hot pressing film drop feed mechanism, hot pressing mechanism, winding mechanism and carrier band feeding mechanism, along with the development of science and technology, the field that SMD packagine machine used is also more and more extensive, and the electron trade also has the promotion along with electronic component's minuteness to SMD braid equipment for packing trade, and the condition that electronic component crushd in the carrier band probably appears in the current SMD packagine machine who has full-automatic heat seal function in the course of the work.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a to prior art not enough, the utility model provides a SMD packagine machine with full-automatic heat seal function has solved the problem that proposes in the above-mentioned background art.

(II) technical scheme

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides a SMD packagine machine with full-automatic heat seal function, includes the workstation, the T-slot has been seted up to the upper surface of workstation, the internal surface swing joint in T-slot has first buffer gear, first buffer gear's both sides all are provided with second buffer gear, one side of first buffer gear is provided with the support frame, one side fixedly connected with cylinder of support frame, one side fixedly connected with heating die of cylinder, the upper end fixedly connected with temperature controller of support frame

Optionally, first buffer gear including first stopper, first telescopic link, first spring, briquetting, elastic rod and gyro wheel, the surface of first stopper and the internal surface sliding connection in T-slot, the first telescopic link of last fixed surface of first stopper is connected with, the surface of first telescopic link is provided with first spring, the upper end fixedly connected with briquetting of first telescopic link, the equal fixedly connected with elastic rod in both sides of briquetting, the one end swing joint of elastic rod has the gyro wheel.

Optionally, the second buffer mechanism comprises a U-shaped groove, a second spring, a second limiting plate, a second telescopic rod and a fixing plate, the lower surface of the U-shaped groove is fixedly connected with the upper surface of the workbench, the inner bottom wall of the U-shaped groove is fixedly connected with the second spring, the upper end of the second spring is fixedly connected with a second limiting plate, the upper surface of the second limiting plate is fixedly connected with a second telescopic rod, and the upper end of the second telescopic rod is fixedly connected with the fixing plate.

Optionally, a heating rod is arranged inside the heating mold.

Optionally, a temperature sensor is disposed on one side of the heating mold.

Optionally, the upper surface of the first buffer mechanism is fixedly connected with a belt carrying groove, and the lower surface of the belt carrying groove is fixedly connected with the upper surface of the fixing plate.

(III) advantageous effects

The utility model provides a SMD packagine machine with full-automatic heat-seal function possesses following beneficial effect:

1. this SMD packagine machine with full-automatic heat seal function, through support frame, cylinder, heating mould and temperature controller's setting, when carrying out heat-seal work, the heating rod heats the intensification to heating mould, and temperature sensor detects the temperature of heating mould at any time and gives temperature controller with data transfer, and temperature controller controls the temperature of heating mould, starts the cylinder, and the cylinder drives heating mould intermittent type nature and carries out heat-seal work.

2. This SMD packagine machine with full-automatic heat-seal function, through the T-slot, first buffer gear and second buffer gear's setting, carrying out heat-seal during operation, the carrier band receives the pressure of heating mould, at this moment, the briquetting receives the extrusion, the elastic rod produces elastic deformation, first spring shrink, the gyro wheel slides along the upper surface of workstation, the while fixing plate extrudes the second telescopic link, the second spring shrink, carry out effectual buffering to the pressure that cylinder work produced, form effective protection to carrier band and electronic component.

Drawings

FIG. 1 is a schematic front view of the present invention;

FIG. 2 is a schematic view of the back structure of the present invention;

fig. 3 is a schematic structural view of a second buffer mechanism of the present invention;

fig. 4 is a schematic structural view of the heating mold of the present invention.

In the figure: 1. a work table; 2. a T-shaped slot; 3. a first buffer mechanism; 301. a first stopper; 302. a first telescopic rod; 303. a first spring; 304. briquetting; 305. an elastic rod; 306. a roller; 4. a second buffer mechanism; 401. a U-shaped groove; 402. a second spring; 403. a second limiting plate; 404. a second telescopic rod; 405. a fixing plate; 5. a support frame; 6. a cylinder; 7. heating the mold; 8. a temperature controller; 9. a heating rod; 10. a temperature sensor; 11. the carrier band groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1 to 4, the present invention provides a technical solution: an SMD packaging machine with a full-automatic heat sealing function comprises a workbench 1, wherein a T-shaped groove 2 is formed in the upper surface of the workbench 1, a first buffer mechanism 3 is movably connected to the inner surface of the T-shaped groove 2, the first buffer mechanism 3 comprises a first limiting block 301, a first telescopic rod 302, a first spring 303, a pressing block 304, an elastic rod 305 and a roller 306, the surface of the first limiting block 301 is slidably connected with the inner surface of the T-shaped groove 2, the upper surface of the first limiting block 301 is fixedly connected with the first telescopic rod 302, the surface of the first telescopic rod 302 is provided with the first spring 303, the upper end of the first telescopic rod 302 is fixedly connected with the pressing block 304, two sides of the pressing block 304 are fixedly connected with the elastic rod 305, one end of the elastic rod 305 is movably connected with the roller 306, the upper surface of the first buffer mechanism 3 is fixedly connected with a belt carrying groove 11, the lower surface of the belt carrying groove 11 is fixedly connected with the upper surface of a fixing plate 405, the two sides of the first buffer mechanism 3 are provided with second buffer mechanisms 4, each second buffer mechanism 4 comprises a U-shaped groove 401, a second spring 402, a second limiting plate 403, a second telescopic rod 404 and a fixing plate 405, the lower surface of the U-shaped groove 401 is fixedly connected with the upper surface of the workbench 1, the inner bottom wall of the U-shaped groove 401 is fixedly connected with the second spring 402, the upper end of the second spring 402 is fixedly connected with the second limiting plate 403, the upper surface of the second limiting plate 403 is fixedly connected with the second telescopic rod 404, the upper end of the second telescopic rod 404 is fixedly connected with the fixing plate 405, the carrying belt is pressed by the heating die 7 through the arrangement of the T-shaped groove 2, the first buffer mechanism 3 and the second buffer mechanism 4 when the heat sealing work is carried out, at the moment, the pressing block 304 is pressed, the elastic rod 305 generates elastic deformation, the first spring 303 contracts, the roller 306 slides along the upper surface of the workbench 1, meanwhile, the fixing plate 405 extrudes the second telescopic rod 404, the second spring 402 contracts to effectively buffer the pressure generated by the operation of the air cylinder 6 and effectively protect the carrier tape and the electronic element, the supporting frame 5 is arranged on one side of the first buffer mechanism 3, the air cylinder 6 is fixedly connected to one side of the supporting frame 5, the heating mold 7 is fixedly connected to one side of the air cylinder 6, the heating rod 9 is arranged inside the heating mold 7, the temperature sensor 10 is arranged on one side of the heating mold 7, the temperature controller 8 is fixedly connected to the upper end of the supporting frame 5, the heating mold 7 and the temperature controller 8 are arranged, when the heat sealing operation is carried out, the heating rod 9 heats the heating mold 7, the temperature sensor 10 detects the temperature of the heating mold 7 at any time and transmits data to the temperature controller 8, and the temperature controller 8 controls the temperature of the heating mold 7, and starting the air cylinder 6, wherein the air cylinder 6 drives the heating mould 7 to perform heat sealing work intermittently.

In summary, in the SMD packaging machine with the full-automatic heat sealing function, when in use, through the arrangement of the supporting frame 5, the air cylinder 6, the heating mold 7 and the temperature controller 8, when performing heat sealing operation, the heating rod 9 heats the heating mold 7 to increase the temperature, the temperature sensor 10 detects the temperature of the heating mold 7 at any time and transmits data to the temperature controller 8, the temperature controller 8 controls the temperature of the heating mold 7, the air cylinder 6 is started, the air cylinder 6 drives the heating mold 7 to perform intermittent heat sealing operation, through the arrangement of the T-shaped slot 2, the first buffer mechanism 3 and the second buffer mechanism 4, the carrier tape is pressed by the heating mold 7 during the heat sealing operation, at this time, the press block 304 is pressed, the elastic rod 305 generates elastic deformation, the first spring 303 contracts, the roller 306 slides along the upper surface of the workbench 1, and the fixing plate 405 presses the second telescopic rod 404, the second spring 402 contracts to effectively buffer the pressure generated by the operation of the air cylinder 6, and effectively protect the carrier tape and the electronic components.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The utility model provides a SMD packagine machine with full-automatic heat-seal function, includes workstation (1), its characterized in that: t-shaped groove (2) have been seted up to the upper surface of workstation (1), the internal surface swing joint in T-shaped groove (2) has first buffer gear (3), the both sides of first buffer gear (3) all are provided with second buffer gear (4), one side of first buffer gear (3) is provided with support frame (5), one side fixedly connected with cylinder (6) of support frame (5), one side fixedly connected with heating mould (7) of cylinder (6), upper end fixedly connected with temperature controller (8) of support frame (5).

2. The SMD packaging machine having a full automatic heat-sealing function as claimed in claim 1, wherein: the utility model discloses a buffer structure, including first stopper (301), first telescopic link (302), first spring (303), briquetting (304), elastic rod (305) and gyro wheel (306) of first buffer gear (3), the surface of first stopper (301) and the internal surface sliding connection of T-slot (2), the first telescopic link (302) of last fixed surface of first stopper (301) is connected with, the surface of first telescopic link (302) is provided with first spring (303), the upper end fixedly connected with briquetting (304) of first telescopic link (302), the equal fixedly connected with elastic rod (305) in both sides of briquetting (304), the one end swing joint of elastic rod (305) has gyro wheel (306).

3. The SMD packaging machine having a full automatic heat-sealing function as claimed in claim 1, wherein: second buffer gear (4) include U-shaped groove (401), second spring (402), second limiting plate (403), second telescopic link (404) and fixed plate (405), the lower surface of U-shaped groove (401) is connected with the last fixed surface of workstation (1), the interior diapire fixedly connected with second spring (402) of U-shaped groove (401), the upper end fixedly connected with second limiting plate (403) of second spring (402), the last fixed surface of second limiting plate (403) is connected with second telescopic link (404), the upper end fixedly connected with fixed plate (405) of second telescopic link (404).

4. The SMD packaging machine having a full automatic heat-sealing function as claimed in claim 1, wherein: and a heating rod (9) is arranged in the heating mould (7).

5. The SMD packaging machine having a full automatic heat-sealing function as claimed in claim 1, wherein: and a temperature sensor (10) is arranged on one side of the heating mould (7).

6. The SMD packaging machine having a full automatic heat-sealing function as claimed in claim 1, wherein: the upper surface of the first buffer mechanism (3) is fixedly connected with a belt carrying groove (11), and the lower surface of the belt carrying groove (11) is fixedly connected with the upper surface of the fixing plate (405).