CN219008302U

CN219008302U - SMD component heat-seal packaging machine

Info

Publication number: CN219008302U
Application number: CN202223405397.1U
Authority: CN
Inventors: 石敏; 冯磊
Original assignee: Anhui Qide Electronic Technology Co ltd
Current assignee: Anhui Qide Electronic Technology Co ltd
Priority date: 2022-12-19
Filing date: 2022-12-19
Publication date: 2023-05-12
Anticipated expiration: 2032-12-19

Abstract

The utility model discloses an SMD element heat-sealing packaging machine, which comprises a base, a heat-sealing part and a smoothing part, wherein the smoothing part comprises: vertical plate: the two vertical plates are fixed on the outer wall of the top of the base, and the same sliding rod is fixed between the two vertical plates through a pin; and (3) sliding blocks: the sliding rod is movably connected to the circumferential outer wall of the sliding rod; a splice plate: the connecting plate is welded on the outer wall of one side of the sliding block, and the inner wall of the through hole formed in the surface of the connecting plate is movably connected with a T-shaped rod II; and a second spring: the two ends of the spring II are respectively welded on the inner wall of the top of the T-shaped rod II and the outer wall of the top of the connecting plate; and (3) mounting blocks: the device is fixed at the bottom of the T-shaped rod II through a pin, and a crimping roller is movably connected with the outer wall of one side of the mounting block. The utility model can guide the SMD braid and the heat sealing film when the SMD element is heat-sealed and packaged by the crimping roller, and can better attach the SMD braid and the heat sealing film by using the elasticity of the spring II.

Description

SMD component heat-seal packaging machine

Technical Field

The utility model relates to the technical field of heat seal packaging, in particular to an SMD element heat seal packaging machine.

Background

In the prior art, an SMD component means a surface mounted device, which is used for processing and producing a circuit board, and can be used for placing some simple pin components, after the SMD component is produced, the SMD component needs to be packaged, in the packaging process, the SMD component needs to be placed on a tape, then a heat sealing film is covered on the tape, and finally, the packaging of the SMD component is realized by carrying out hot pressing between the tape and the heat sealing film;

at present, when the SMD component is packaged, when the heat-seal film covers on the braid, the laminating degree between the heat-seal film and the braid can not be effectively improved by the existing equipment, and the heat-seal film is in a state of no smoothing, folds are easily generated on the surface, so that the heat-seal film is influenced in beauty after heat sealing, and meanwhile, the waste of the heat-seal film is easily caused, and the quality of packaging is influenced.

Disclosure of Invention

The utility model aims to solve the defects in the prior art and provides an SMD element heat-sealing packaging machine.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

an SMD component heat sealing packaging machine comprising a base, a heat sealing portion and a smoothing portion, the smoothing portion comprising:

vertical plate: the two vertical plates are fixed on the outer wall of the top of the base, and the same sliding rod is fixed between the two vertical plates through a pin;

and (3) sliding blocks: the sliding rod is movably connected to the circumferential outer wall of the sliding rod;

a splice plate: the connecting plate is welded on the outer wall of one side of the sliding block, and the inner wall of the through hole formed in the surface of the connecting plate is movably connected with a T-shaped rod II;

and a second spring: the sleeve is sleeved on the outer wall of the circumference of the T-shaped rod II;

and (3) mounting blocks: the device is fixed at the bottom of the T-shaped rod II through a pin, and a crimping roller is movably connected with the outer wall of one side of the mounting block.

As still further aspects of the utility model: the outer wall of the top of the base is fixedly provided with a support, the outer wall of the top of the support is fixedly provided with a cylinder, and the output end of the cylinder is fixedly provided with a mounting frame through a pin.

As still further aspects of the utility model: the mounting bracket inner wall swing joint has the connecting rod, the one end swing joint that the mounting bracket was kept away from to the connecting rod is in the slider inner wall.

As still further aspects of the utility model: the heat-seal part comprises an elbow, a mounting plate and a heat-seal plate, wherein the elbow is fixed on the outer wall of one side of the mounting frame, the mounting plate is welded at the bottom of the elbow, and the heat-seal plate is fixed at the bottom of the mounting plate.

As still further aspects of the utility model: the through hole inner wall swing joint that the mounting panel surface was seted up has T type pole one, a circumference outer wall of T type pole has cup jointed spring one.

As still further aspects of the utility model: and a pressing strip is fixed on the outer wall of the bottom of the T-shaped rod through a pin.

As still further aspects of the utility model: and one end and the other end of the spring are respectively welded on the inner wall of one top of the T-shaped rod and the outer wall of the top of the mounting plate.

As still further aspects of the utility model: and two ends of the second spring are respectively welded on the inner wall of the second top of the T-shaped rod and the outer wall of the top of the connecting plate.

Compared with the prior art, the utility model provides the SMD element heat-sealing packaging machine, which has the following beneficial effects:

1. when the SMD component is subjected to heat sealing packaging, the compression roller can guide the SMD braid and the heat sealing film, and the spring II can be used for better attaching the SMD braid and the heat sealing film.

2. The crimping roller can be arranged to move along the transverse direction, so that the crimping roller can roll along the surface of the heat-sealing film when the SMD component is subjected to heat-sealing packaging, the heat-sealing film can be tensioned, the heat-sealing film is prevented from being wrinkled in the heat-sealing process, and the heat-sealing effect is affected.

3. Can play the effect of a location when carrying out the heat-seal to between SMD braid and the heat-seal membrane through being provided with the layering to guarantee the stability of SMD braid and heat-seal membrane when carrying out the heat-seal.

None of the parts of the device are the same as or can be implemented using prior art.

Drawings

Fig. 1 is a schematic diagram of the overall structure of an SMD component heat-seal packaging machine according to the present utility model;

fig. 2 is a schematic side view of an SMD component heat-seal packaging machine according to the present utility model;

fig. 3 is a schematic view of a heat seal part structure of an SMD component heat seal packaging machine according to the present utility model;

fig. 4 is a schematic diagram of a press-connection portion of an SMD component heat-seal packaging machine according to the present utility model.

In the figure: 1-base, 2-riser, 3-return bend, 4-cylinder, 5-support, 6-connecting rod, 7-slide bar, 8-mounting bracket, 9-slider, 10-crimping roller, 11-spring one, 12-mounting plate, 13-layering, 14-heat seal board, 15-T type pole one, 16-joint board, 17-T type pole two, 18-spring two, 19-mounting block.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

In the description of the present utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Example 1:

in order to improve the quality of heat-sealed packages, an SMD component heat-sealing packaging machine, as shown in fig. 1-4, comprises a base 1, a heat-sealing portion and a smoothing portion, the smoothing portion comprising:

riser 2: the two vertical plates 2 are fixed with the same slide bar 7 through pins;

slide 9: the sliding rod is connected with the outer wall of the circumference of the sliding rod 7 in a sliding way;

the splice plate 16: the connecting rod is welded on the outer wall of one side of the sliding block 9, and the inner wall of a through hole formed in the surface of the connecting plate 16 is connected with a T-shaped rod II 17 in a sliding manner;

spring two 18: the two ends of the second spring 18 are respectively welded on the inner wall of the top of the second T-shaped rod 17 and the outer wall of the top of the connecting plate 16;

mounting block 19: the device is fixed at the bottom of a T-shaped rod II 17 through a pin, and the outer wall of one side of a mounting block 19 is rotationally connected with a crimping roller 10;

utilize crimping roller 10 can be when carrying out heat-seal package to the SMD component, can lead between SMD braid and the heat-seal film, can utilize its elasticity to laminate better between SMD braid and the heat-seal film through being provided with second spring 18, simultaneously through setting up crimping roller 10 to can be along transversely moving, thereby make crimping roller 10 can roll along the heat-seal film surface when carrying out heat-seal package to the SMD component, thereby can play the effect of a tensioning to the heat-seal film, smooth the heat-seal film surface, avoid the heat-seal film to produce the fold at the in-process of heat-seal, thereby influence the effect of heat-seal.

The outer wall of the top of the base 1 is fixedly provided with a bracket 5 through a bolt, the outer wall of the top of the bracket 5 is fixedly provided with a cylinder 4 through a bolt, the output end of the cylinder 4 is fixedly provided with a mounting frame 8 through a pin, the inner wall of the mounting frame 8 is rotationally connected with a connecting rod 6, and one end of the connecting rod 6 far away from the mounting frame 8 is rotationally connected with the inner wall of a sliding block 9;

the mounting frame 8 can be driven to move downwards through the cylinder 4, and the vertical movement of the mounting frame 8 can be converted into the transverse movement of the sliding block 9 by utilizing the adjusting function of the connecting rod 6, so that the two crimping rollers 10 can roll along the surface of the heat-sealing film.

The heat sealing part comprises an elbow pipe 3, a mounting plate 12 and a heat sealing plate 14, wherein the elbow pipe 3 is fixed on the outer wall of one side of the mounting frame 8 through bolts, the mounting plate 12 is welded at the bottom of the elbow pipe 3, and the heat sealing plate 14 is fixed at the bottom of the mounting plate 12 through bolts;

the provision of the heat seal plate 14 allows the tape to be sealed with the heat seal film at a high temperature after pressing.

Working principle: when the SMD components need to be heat-sealed and packaged, the SMD braid and the heat-sealing film are placed at the bottom of the pressing roller 10, the pressing roller 10 is pressed against the upper surface of the heat-sealing film by the elastic force of the spring two 18, then the cylinder 4 is started, the output end of the cylinder 4 reciprocates along the vertical direction, when the output end of the cylinder 4 moves in a progress manner, the mounting frame 8 drives the heat-sealing plate 14 to move downwards to heat-seal the space between the SMD braid and the heat-sealing film, and meanwhile, the two pressing rollers 10 roll along the surface of the heat-sealing film, so that the bonding degree between the SMD braid and the heat-sealing film can be improved, and the heat-sealing film can be tensioned, so that the heat-sealing effect is ensured.

Example 2:

an SMD component heat-sealing packaging machine, as shown in fig. 3, for ensuring stability at the time of heat-sealing; this example complements the following on the basis of example 1: the inner wall of the through hole formed in the surface of the mounting plate 12 is slidably connected with a first T-shaped rod 15, the circumferential outer wall of the first T-shaped rod 15 is sleeved with a first spring 11, two ends of the first spring 11 are respectively welded on the inner wall of the top of the first T-shaped rod 15 and the outer wall of the top of the mounting plate 12, and the outer wall of the bottom of the first T-shaped rod 15 is fixedly provided with a pressing strip 13 through a pin;

the pressing strip 13 can play a role in positioning when in heat sealing between the SMD braid and the heat sealing film, so that the stability of the SMD braid and the heat sealing film in heat sealing is ensured.

The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims

1. An SMD component heat sealing packaging machine, comprising a base (1), a heat sealing portion and a smoothening portion, characterized in that the smoothening portion comprises:

riser (2): the two vertical plates (2) are fixed on the outer wall of the top of the base (1) and the same sliding rod (7) is fixed between the two vertical plates through a pin;

slider (9): the sliding rod is movably connected with the circumferential outer wall of the sliding rod (7);

a connector plate (16): the connecting plate is welded on the outer wall of one side of the sliding block (9), and the inner wall of a through hole formed in the surface of the connecting plate (16) is movably connected with a T-shaped rod II (17);

spring two (18): the sleeve is sleeved on the circumferential outer wall of the second T-shaped rod (17);

mounting block (19): the device is fixed at the bottom of a T-shaped rod II (17) through a pin, and the outer wall of one side of the mounting block (19) is movably connected with a crimping roller (10).

2. The SMD component heat sealing packaging machine according to claim 1, characterized in that a support (5) is fixed to the top outer wall of said base (1), a cylinder (4) is fixed to the top outer wall of said support (5), and a mounting rack (8) is fixed to the output end of said cylinder (4) by means of a pin.

3. The SMD component heat sealing packaging machine of claim 2, wherein said mounting frame (8) inner wall is movably connected with a connecting rod (6), and one end of said connecting rod (6) far from said mounting frame (8) is movably connected with the inner wall of said slider (9).

4. A SMD component heat sealing packaging machine according to claim 3, characterized in that said heat sealing part comprises an elbow (3), a mounting plate (12) and a heat sealing plate (14), said elbow (3) being fixed to one side outer wall of the mounting frame (8), the mounting plate (12) being welded to the bottom of the elbow (3), and the heat sealing plate (14) being fixed to the bottom of the mounting plate (12).

5. The SMD component heat sealing packaging machine of claim 4, wherein a T-shaped rod (15) is movably connected to an inner wall of a through hole formed in a surface of said mounting plate (12), and a first spring (11) is sleeved on a circumferential outer wall of said T-shaped rod (15).

6. The SMD component heat sealing packaging machine of claim 5, wherein said T-bar one (15) bottom outer wall is fixed with a bead (13) by a pin.

7. The SMD component heat sealing packaging machine of claim 6, wherein said first spring (11) is welded at both ends to the top inner wall of said first T-bar (15) and the top outer wall of said mounting plate (12), respectively.

8. The SMD component heat sealing packaging machine of claim 7, wherein said second spring (18) is welded at both ends to the top inner wall of said second T-bar (17) and the top outer wall of said engagement plate (16), respectively.