CN213752167U

CN213752167U - Heat dissipation device for testing rated power of chip resistor

Info

Publication number: CN213752167U
Application number: CN202022760438.3U
Authority: CN
Inventors: 胡紫阳; 陈丽芳; 李智德
Original assignee: Shenzhen Yezhan Electronics Co ltd
Current assignee: Shenzhen Yezhan Electronics Co ltd
Priority date: 2020-11-25
Filing date: 2020-11-25
Publication date: 2021-07-20
Anticipated expiration: 2030-11-25

Abstract

The utility model relates to a resistance heat dissipation technical field discloses a heat abstractor for chip resistor rated power test, include: aluminum plate, aluminum plate's middle part is equipped with the PCB that is used for installing the PCB and surveys test panel installation position, PCB surveys test panel and is equipped with the paster resistance that waits to detect that is used for carrying out the rated power test, a plurality of mounting groove on the aluminum plate, be equipped with in the mounting groove and be used for carrying out radiating heat dissipation strip. The PCB test board is used for testing the rated power of the chip resistor to be tested, the heat dissipation strip plays a role in heat dissipation, the chip resistor is conveniently dissipated, and the heat dissipation device is simple in structure, easy to operate and capable of saving cost.

Description

Heat dissipation device for testing rated power of chip resistor

Technical Field

The utility model relates to a resistance heat dissipation technical field especially relates to a heat abstractor for chip resistor rated power test.

Background

Because of the use characteristics of the resistor, the rated power of the resistor is a product performance parameter which must be considered in the resistor model selection of engineers, sometimes the power of a theoretically designed product should be so large, but the phenomenon that the product is burnt out or the stability of the resistance value exceeds the requirement can occur when the power is tested according to the theoretical design of the product during the test, which is caused by that the heat generated by the resistor is not dissipated in time, and the problem of how to avoid the heat generated by the product during the conduction from influencing the performance of the resistor is always a problem of industrial research.

In the prior art, the traditional heat dissipation is realized by water cooling, but the traditional heat dissipation is complicated and the cost investment is high when the rated power of a single product is tested,

therefore, how to dissipate heat of the chip resistor during power testing is an urgent technical problem to be solved.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem who solves lies in how to dispel the heat to the chip resistor when power test.

Therefore, according to the first aspect, the embodiment of the utility model discloses a heat abstractor for chip resistor rated power test is disclosed, include: aluminum plate, aluminum plate's middle part is equipped with the PCB that is used for installing the PCB and surveys test panel installation position, PCB surveys test panel and is equipped with the paster resistance that waits to detect that is used for carrying out the rated power test, a plurality of mounting groove on the aluminum plate, be equipped with in the mounting groove and be used for carrying out radiating heat dissipation strip.

The utility model discloses further set up to, PCB surveys test panel's bottom scribbles the heat conduction glue.

The utility model discloses further set up to, PCB survey test panel pass through the screw with aluminum plate fixed connection.

The utility model discloses further set up to, the heat dissipation strip is the copper bar.

The utility model discloses further set up to, the quantity of copper bar is established to a plurality ofly.

The utility model discloses following beneficial effect has: the PCB test board is used for testing the rated power of the chip resistor to be tested, the heat dissipation strip plays a role in heat dissipation, the chip resistor is conveniently dissipated, and the heat dissipation device is simple in structure, easy to operate and capable of saving cost.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a heat dissipation device for a chip resistor rated power test disclosed in this embodiment.

Reference numerals: 1. an aluminum plate; 2. a PCB test board mounting position; 3. and (4) mounting the groove.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.

The embodiment of the utility model discloses heat abstractor for chip resistor rated power test, as shown in figure 1, include: aluminum plate 1, aluminum plate's middle part is equipped with the PCB that is used for installing the PCB and surveys test panel installation position 2, and PCB surveys test panel and is equipped with the paster resistance that waits to detect that is used for carrying out the rated power test, and aluminum plate 1 is last a plurality of mounting groove 3, is equipped with in the mounting groove 3 to be used for carrying on radiating heat dissipation strip.

It should be noted that, the rated power test is carried out on the chip resistor to be detected through the PCB test board, and the heat dissipation strip plays a role in heat dissipation, so that the chip resistor is conveniently cooled.

As shown in FIG. 1, the bottom of the PCB test board is coated with a thermally conductive adhesive.

As shown in fig. 1, the PCB test board is fixedly connected to the aluminum board by screws.

As shown in fig. 1, the heat dissipation bars are copper bars.

As shown in fig. 1, the number of copper bars is set to plural.

The working principle is as follows: the PCB test board is used for testing the rated power of the chip resistor to be tested, the heat dissipation strip plays a role in heat dissipation, the chip resistor is conveniently dissipated, and the heat dissipation device is simple in structure, easy to operate and capable of saving cost.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.

Claims

1. A heat sink for chip resistor power rating testing, comprising: aluminum plate, aluminum plate's middle part is equipped with the PCB that is used for installing the PCB and surveys test panel installation position, PCB surveys test panel and is equipped with the paster resistance that waits to detect that is used for carrying out the rated power test, a plurality of mounting groove on the aluminum plate, be equipped with in the mounting groove and be used for carrying out radiating heat dissipation strip.

2. The heat dissipation device for chip resistor rated power test as recited in claim 1, wherein the bottom of the PCB test board is coated with a thermally conductive adhesive.

3. The heat dissipation device for chip resistor rated power testing as recited in claim 1, wherein the PCB test board is fixedly connected with the aluminum board by screws.

4. The heat dissipation device for chip resistor rated power testing according to any one of claims 1-3, wherein the heat dissipation strip is a copper strip.

5. The heat sink device for chip resistance power rating test according to claim 4, wherein the number of the copper bars is set to be plural.