CN213692088U - LED device and module - Google Patents
LED device and module Download PDFInfo
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- CN213692088U CN213692088U CN202023165647.XU CN202023165647U CN213692088U CN 213692088 U CN213692088 U CN 213692088U CN 202023165647 U CN202023165647 U CN 202023165647U CN 213692088 U CN213692088 U CN 213692088U
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Abstract
The utility model discloses a LED device and module, wherein the LED device includes: the LED chip comprises a metal substrate layer, at least one LED chip, a light refraction layer and a protective outer layer; the LED chip is arranged on the metal substrate layer and is electrically connected with the metal substrate layer; the protective outer layer is arranged on the upper edge of the metal substrate layer in a surrounding mode to form a concave portion, and the light refraction layer is arranged in the concave portion; the light refraction layer is arranged in the protective outer layer and is coated on the LED chip; the light refraction layer comprises a convex protection layer in a semi-elliptical shape, and the convex protection layer is a part of the light refraction layer higher than the protection outer layer; the utility model discloses a LED device increases the light-emitting of LED side through the refraction of light, has increased the luminous angle of light source.
Description
Technical Field
The utility model belongs to the technical field of the LED shows, concretely relates to LED device and module.
Background
The dynamic dimming technology of the LED backlight source has high contrast and excellent display effect, and is gradually a new favorite in the market of LED related products. Dynamic dimming requires multiple zones to control multiple light sources, thereby causing a sharp increase in product cost, making the terminal prohibitively expensive. By increasing the light emitting angle of a single backlight source, the number of LEDs can be reduced, so that the cost of the terminal can be greatly reduced. Therefore, how to increase the light emitting angle of a single backlight source is a problem to be solved at present.
SUMMERY OF THE UTILITY MODEL
In order to overcome the technical defect, the utility model provides a LED device and module, the LED device passes through the refraction of light and increases the light-emitting of LED side, has increased the luminous angle of light source.
In order to solve the above problem, the utility model discloses realize according to following technical scheme:
in a first aspect, the present invention provides a LED device, including: the LED chip comprises a metal substrate layer, at least one LED chip, a light refraction layer and a protective outer layer;
the LED chip is arranged on the metal substrate layer and is electrically connected with the metal substrate layer; the protective outer layer is arranged on the upper edge of the metal substrate layer in a surrounding mode to form a concave portion, and the light refraction layer is arranged in the concave portion; the light refraction layer is arranged in the protective outer layer and is coated on the LED chip; the light refraction layer comprises a convex protection layer in a semi-elliptical shape, and the convex protection layer is a part of the light refraction layer higher than the outer protection layer.
Further, the protective outer layer comprises a first outer layer, a second outer layer, a third outer layer and a fourth outer layer which are connected in sequence; the first outer layer, the second outer layer, the third outer layer and the fourth outer layer form a square structure.
Further, the projection profiles of the parts of the convex protective layer higher than the protective outer layer along the thickness direction of the first outer layer, the second outer layer, the third outer layer or the fourth outer layer respectively satisfyWherein a > b > 0, y>0, a is the major semi-axis of the projected contour, and b is the minor semi-axis of the projected contour.
Further, the ratio b/a of the minor axis to the major axis is between 0.4 and 0.8.
Furthermore, filling particles are arranged in the convex protection layer.
Further, the refractive index of the light refraction layer is between 1.3 and 1.57.
Further, the metal base layer comprises a positive electrode metal base and a negative electrode metal base which are not connected with each other.
In a second aspect, the present invention provides a LED module, which comprises a plurality of LED devices and PCB board, IC driver, diffusion sheet, white light conversion layer and brightness enhancement sheet.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses a LED device and module, wherein, in the LED device, light refraction layer cladding is on the LED chip, when playing the guard action to the LED chip, convex protective layer on the light refraction layer can refract light, make the luminous angle of LED device not present lambert's distribution, realize increasing luminous angle's effect, the protection skin plays the effect of protection LED chip, light refraction layer, reflection light, change the spatial distribution of LED device, be favorable to improving the homogeneity of LED module.
Drawings
The following detailed description of embodiments of the invention is provided with reference to the accompanying drawings, in which:
fig. 1 is a side view of an LED device in example 1;
FIG. 2 is a side view of another angle of the LED device of example 1;
FIG. 3 is a schematic view of increasing the light emitting angle of the convex protective layer in example 1;
FIG. 4 is a side view of an LED module of example 2;
fig. 5 is a schematic view of the connection between the PCB board and the LED device in embodiment 2.
Description of the labeling: 1. an LED device; 2. a metal base layer; 21. a positive electrode metal substrate; 22. a negative electrode metal substrate; 3. an LED chip; 4. a light refracting layer; 41. a convex protective layer; 5. an outer protective layer; 100. a PCB board; 200. an IC driver; 300. a diffusion sheet; 400. a white light conversion layer; 500. a brightness enhancement film.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.
Example 1
In a first aspect, the present embodiment discloses that the present embodiment discloses an LED device 1, and with reference to fig. 1-2, the LED device includes: the LED light source comprises a metal substrate layer 2, at least one LED chip 3, a light refraction layer 4 and a protective outer layer 5;
the metal base layer 2 comprises a positive electrode metal base 21 and a negative electrode metal base 22 which are not connected with each other; the LED chip 3 is arranged on the metal substrate layer 2, and the LED chip 3 is electrically connected with the metal substrate layer 2; the protective outer layer 5 surrounds the upper edge of the metal substrate layer 2 to form a concave part, a light refraction layer 4 is arranged in the concave part, and the light refraction layer 4 is coated on the LED chip 3; the light refraction layer 4 includes a convex protection layer 41 having a semi-elliptical shape, and the convex protection layer 41 is a portion of the light refraction layer 4 higher than the protection outer layer 5.
Specifically, the LED chip 3 is disposed on the metal substrate layer 2, and the anode of the LED chip 3 is connected to the anode metal substrate 21, and the cathode of the LED chip 3 is connected to the cathode metal substrate 22.
In the above embodiment, the protective outer layer 5 includes a first outer layer, a second outer layer, a third outer layer, and a fourth outer layer, which are connected in sequence; the first outer layer, the second outer layer, the third outer layer and the fourth outer layer form a square structure in a surrounding mode. The projection profiles of the parts of the convex protective layer 41 higher than the protective outer layer along the thickness direction of the first outer layer, the second outer layer, the third outer layer or the fourth outer layer respectively satisfyWherein a > b > 0, y>0, a is a major semi-axis of the projection profile, namely, a half of the width of the convex protection layer 41 in the projection profile, and b is a minor semi-axis of the projection profile, namely, a height of the convex protection layer 41 in the projection profile. The ratio b/a of the minor half axis to the major half axis is between 0.4 and 0.8, if the ratio is too small, the light is refracted inside the LED, and if the ratio is too large, the light is concentrated, so that the aim of making the light uniform cannot be achieved. Referring to fig. 3, the structure of the convex protection layer 41 can refract light, so that light at the middle part of the LED device 1 is reduced, the light emitting angle of the LED device is not lambertian, light at two sides of the middle part is increased, the light emitting angle is increased, and the distance in the LED module can be increased while the uniformity of brightness and color temperature is maintained.
Specifically, the convex protective layer 41 is made of silicone resin, and the protective outer layer 5 is made of SMC material.
In the above embodiment, there are 4 projected outlines in the thickness direction of the first outer layer, the second outer layer, the third outer layer or the fourth outer layer at the portion where the convex protective layer 41 is higher than the protective outer layer, respectively. In the embodiment, in the 2 opposite projection profiles, the ratio b/a of the semiaxis minor to the semiaxis major is 0.51, and in the other 2 opposite projection profiles, the ratio b/a of the semiaxis minor to the semiaxis major is 0.64.
In the above embodiment, the convex protective layer 41 is provided with filler particles, and the filler particles have a light scattering effect. The refractive index of the light refracting layer 4 is 1.3.
In a second aspect, the present invention provides an LED module, referring to fig. 4-5, including a plurality of LED devices 1 as in the first aspect, and a PCB board 100, an IC driver 200, a diffusion sheet 300, a white light conversion layer 400 and a brightness enhancement sheet 500.
Specifically, the PCB 100 is used for connecting the LED module, and plays a role in electrical connection and heat dissipation; the IC driver 200 controls the LED module and controls the current passing through the LED module; the diffusion sheet 300 can diffuse light to allow the light to be uniformly emitted; the white light conversion layer 400 functions as light conversion; the brightness of the LED module is increased by the brightness enhancement film 500.
Example 2
This embodiment discloses an LED device 1, which is different from embodiment 1 in that a convex protective layer 41 is made of an epoxy resin. The protective outer layer 5 is made of PCT material. The refractive index of the light refracting layer 4 is 1.4.
In the embodiment, in the 2 opposite projection profiles, the ratio b/a of the semiaxis minor to the semiaxis major is 0.53, and in the other 2 opposite projection profiles, the ratio b/a of the semiaxis minor to the semiaxis major is 0.53.
Example 3
This embodiment discloses an LED device 1, which is different from embodiment 1 in that a convex protective layer 41 is made of silicone rubber. The outer protective layer 5 is made of EMC material. The refractive index of the light refracting layer 4 is 1.57.
In the embodiment, in the 2 opposite projection profiles, the ratio b/a of the minor axis to the major axis is 0.4, and in the other 2 opposite projection profiles, the ratio b/a of the minor axis to the major axis is 0.8.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, so that any modification, equivalent change and modification made by the technical spirit of the present invention to the above embodiments do not depart from the technical solution of the present invention, and still fall within the scope of the technical solution of the present invention.
Claims (8)
1. An LED device, comprising: the LED chip comprises a metal substrate layer, at least one LED chip, a light refraction layer and a protective outer layer;
the LED chip is arranged on the metal substrate layer and is electrically connected with the metal substrate layer; the protective outer layer is arranged on the upper edge of the metal substrate layer in a surrounding mode to form a concave portion, and the light refraction layer is arranged in the concave portion; the light refraction layer is arranged in the protective outer layer and is coated on the LED chip; the light refraction layer comprises a convex protection layer in a semi-elliptical shape, and the convex protection layer is a part of the light refraction layer higher than the outer protection layer.
2. The LED device of claim 1, wherein the protective outer layers comprise a first outer layer, a second outer layer, a third outer layer, a fourth outer layer connected in sequence; the first outer layer, the second outer layer, the third outer layer and the fourth outer layer form a square structure.
3. The LED device according to claim 2, wherein a projection profile of a portion of the convex protective layer higher than the protective outer layer in a thickness direction of the first outer layer, the second outer layer, the third outer layer, or the fourth outer layer, respectively, satisfiesWherein a > b > 0, y>0, a is the major semi-axis of the projected contour, and b is the minor semi-axis of the projected contour.
4. The LED device of claim 3, wherein the ratio b/a of the minor and major semi-axes is between 0.4-0.8.
5. The LED device of claim 1, wherein filler particles are disposed within the convex protective layer.
6. The LED device of claim 1 wherein said light refracting layer has a refractive index between 1.3 and 1.57.
7. The LED device of claim 1, wherein the metal base layer comprises a positive metal base and a negative metal base that are not connected to each other.
8. An LED module comprising a plurality of LED devices as claimed in any one of claims 1 to 7, and a PCB board, an IC driver, a diffusion sheet, a white light conversion layer and a brightness enhancement sheet.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202023165647.XU CN213692088U (en) | 2020-12-24 | 2020-12-24 | LED device and module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202023165647.XU CN213692088U (en) | 2020-12-24 | 2020-12-24 | LED device and module |
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CN213692088U true CN213692088U (en) | 2021-07-13 |
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CN202023165647.XU Active CN213692088U (en) | 2020-12-24 | 2020-12-24 | LED device and module |
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